10M40DAF256I7G - MAX 10 FPGA 40K LE, 178 I/O, 256-FBGA | Intel
부품 번호: 10M40DAF256I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $96.13 | $96.13 |
| 10 | $88.5 | $885.00 |
| 100 | $78.2 | $7,820.00 |
| 500 | $71.4 | $35,700.00 |
| 1,000 | $65.8 | $65,800.00 |
10M40DAF256I7G 개요
What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that retains its configuration bitstream in on-chip flash memory, eliminating the need for an external boot PROM and enabling instant-on operation within milliseconds of power-up. MAX 10 FPGAs sit at the lowest end of Intel's FPGA portfolio in terms of logic density but offer the highest integration of analog/mixed-signal features (12-bit SAR ADC, temperature sensors, PLLs), making them ideal for I/O expansion, glue-logic replacement, and low-cost control-plane designs. Within the broader taxonomy they belong to: FPGA -> programmable logic -> digital IC -> semiconductor.
Key features of the 10M40DAF256I7G include 40K logic elements (LEs), 1,290,240 bits (M9K + M144K) embedded user RAM, 4 PLLs, 56 (18x18) multipliers for DSP, and an integrated hard IP block set including DDR3 external memory interfaces, 12-bit ADC, and PCIe Gen2 hard IP (x1/x2). The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socket support and on-die termination.
Technically the 10M40DAF256I7G uses Intel's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, providing superior logic packing versus legacy 4-input LUT architectures. The on-chip flash stores two configuration images for fail-safe dual-boot, and the analog block integrates up to 16 channels of 12-bit 1 MSPS SAR ADC plus on-die temperature sensing diodes that connect to the FPGA fabric.
Typical applications include industrial motor control, factory automation I/O concentrators, portable medical device displays, low-cost video bridging, automotive infotainment pre-processing, and PCIe endpoint cards. The 256-FBGA package also fits space-constrained designs requiring a BGA footprint with high pin count and good thermal dissipation via the exposed die paddle.
When designing with this device, route the dedicated configuration/JTAG pins (nCONFIG, nSTATUS, CONF_DONE, TMS, TCK, TDI, TDO) to the board test access points and provide at least one 10 uF + one 100 nF decoupling pair per power rail (VCCINT, VCCA, VCCIO bank). The dual-boot flash allows in-field updates over PCIe or serial protocols, but designers must budget flash update time and provide an external watchdog to recover from corrupted images.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from Intel's MAX 10 family, application-specific design notes, and comparison tables not consolidated in the manufacturer datasheet.
드롭인 대체품: 10M40DAF256I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M40DAF256I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Logic Elements (LE), Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M40DAF256C7G
✅ 드롭인✓ 재고 있음
$46.83 / 개
데이터시트 보기 →10M40DAF256C8G
✅ 드롭인✓ 재고 있음
$55.2 / 개
데이터시트 보기 →10M40DAF256I7P
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M25DAF256I7G
✅ 드롭인✓ 재고 있음
$60.3 / 개
데이터시트 보기 →10M16DAF256I7G
✅ 드롭인✓ 재고 있음
$38.4 / 개
데이터시트 보기 →10M40DCF256C7G
✅ 드롭인✓ 재고 있음
$26.4 / 개
데이터시트 보기 →10M40DAF256I7G 최대 정격 & 전기적 특성
| Series | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 (M9K + M144K blocks) |
| User I/O Count | 178 |
| 패키지 | 256-FBGA (FineLine BGA), 17x17 mm |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V |
| 동작 온도 | -40C to +100C (Industrial, I7) |
| Maximum Internal Frequency | 472.5 MHz |
| Number of PLLs | 4 |
| Embedded Multipliers (18x18) | 56 |
| ADC | 12-bit SAR, up to 16 channels, 1 MSPS |
| Configuration Memory | On-chip dual-configuration flash |
| PCIe Hard IP | PCIe Gen2 x1/x2 (soft IP in 256-FBGA variant) |
| 실장 유형 | Surface Mount (BGA) |
| MSL 레벨 | 3 (168 hours) |
| RoHS 상태 | Compliant |
| 장착 스타일 | SMD/SMT |
| Lead-Free / Halogen-Free | Yes / Yes |
10M40DAF256I7G 256-fbga (fineline bga), 17x17 mm 핀 구성 가이드
10M40DAF256I7G(256-fbga (fineline bga), 17x17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M40DAF256I7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M40DAF256I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Factory Automation I/O Concentrator, Portable Medical Device Display Controller, Low-Cost Video Bridge / Format Converter, Automotive Infotainment Pre-Processor, PCIe Endpoint Card / Industrial Add-In.
Industrial Motor Control
The 10M40DAF256I7G's 4 PLLs, 56 (18x18) hardware multipliers, and integrated 12-bit SAR ADC (up to 16 channels at 1 MSPS) make it ideal for field-oriented control (FOC) of three-phase AC induction and PMSM motors. The 40K logic elements can implement the entire control loop including PID, space-vector modulation, encoder interface (QEI), and commutation logic on a single chip. Designers benefit from the instant-on flash configuration, allowing the motor controller to be operational within 10 ms of power-up - critical for safety-critical industrial drives.
추천
Factory Automation I/O Concentrator
The 178 user I/O pins and 1,290,240-bit embedded memory array let the 10M40DAF256I7G aggregate multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, RS-485) into a single programmable platform. The non-volatile flash configuration eliminates external boot PROMs, reducing BOM cost for distributed I/O nodes mounted in factory cabinets. Hot-socket support and on-die termination simplify live maintenance scenarios typical in 24/7 production lines.
추천
Portable Medical Device Display Controller
The 10M40DAF256I7G drives LCD/TFT panels, processes ECG/spO2 waveforms, and manages USB/HID interfaces in portable patient monitors. Its integrated ADC digitizes sensor signals without an external analog front end, and the non-volatile configuration ensures the device boots correctly after battery-swap events. The 1.2 V core operating voltage keeps total power consumption under 1.5 W typical, extending battery life in handheld diagnostic equipment.
추천
Low-Cost Video Bridge / Format Converter
With 56 (18x18) multipliers and 1.29 Mbits of embedded memory, the 10M40DAF256I7G implements HDMI-to-LVDS, MIPI-to-Parallel, and other video format conversions at resolutions up to 1080p60. The 178 I/O lines accept multiple video input formats simultaneously, and the on-chip DDR3 controller interfaces to external frame buffers. Compared to dedicated video ASSPs, the MAX 10 FPGA offers design flexibility for emerging standards like V-by-One and embedded DisplayPort.
추천
Automotive Infotainment Pre-Processor
The 10M40DAF256I7G handles CAN/LIN bus aggregation, audio DSP pre-processing, and rear-seat entertainment switching before passing data to the main head-unit SoC. Its industrial-grade temperature range (-40C to +100C) tolerates cabin environments, and instant-on flash configuration enables sub-50 ms startup for rear-view camera overlays. Designers pair it with the Cyclone V SoC for higher-tier infotainment stacks requiring ARM Cortex-A9 hard cores.
추천
PCIe Endpoint Card / Industrial Add-In
The 10M40DAF256I7G implements PCIe Gen2 x1 endpoints on industrial PCs, data-acquisition cards, and machine-vision frame grabbers. Its hard IP block accelerates protocol handling while leaving the 40K LE fabric free for custom DMA engines, on-card processing, and I/O expansion. The 256-FBGA package's 17x17 mm footprint fits half-height, half-length PCIe card form factors.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M40DAF256I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M40DAF256C7G | 10M40DAF256C8G | 10M40DAF256I7P | 10M25DAF256I7G | 10M16DAF256I7G | 10M40DCF256C7G |
|---|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 16,000 | 40,000 |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 837,120 | 549,888 | 1,290,240 |
| User I/O Count | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Supply Variant | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Single-supply (1.2 V) |
| Unit Price (qty-1, USD) | 96.13 | 78.20 | 82.40 | 98.50 | 65.00 | 48.50 | 74.80 |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 36 | 24 | 56 |
주요 차별점
- Dual-configuration flash with instant-on support (vs 10M25DAF256I7G)
- Industrial temperature grade with extended I/O count (vs 10M40DAF256C7G)
- Higher density and multiplier count for DSP workloads (vs 10M16DAF256I7G)
설계 노트
The 10M40DAF256I7G requires separate power rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), and VCCIO (1.2 V to 3.3 V per I/O bank). Place a 10 uF tantalum bulk cap plus 100 nF ceramic decoupling per power pin pair. Per the MAX 10 power distribution guidelines, the VCCA rail must be filtered with an LC pi-network (10 uH + 10 uF) to minimize PLL jitter. Estimated: total quiescent current at typical logic utilization (~50%) is approximately 600 mA from VCCINT.
The 256-FBGA package uses a 17x17 mm body with 1.0 mm ball pitch. Per the MAX 10 board design guidelines, route signals on the top layer and breakout the inner balls with micro-via-in-pad (0.2 mm) or dog-bone fanout. Keep all eight I/O bank power pins (VCCIO_x) decoupled with 0.1 uF capacitors placed within 5 mm of the package. Maintain at least four ground vias per square centimeter of copper pour under the exposed die paddle for thermal dissipation.
Estimated: leaving the nCONFIG pin floating during power-up may cause intermittent configuration failures. Tie nCONFIG to VCCIO through a 10 kohm pull-up. The dual-boot flash feature can mask corrupted images if the watchdog timer is not enabled in the Quartus Prime programming file. Verify CONF_DONE timing with at least a 100 ms delay after power-up before accessing user I/O. Do not use I/O bank 8 for high-speed interfaces (LVDS > 800 Mbps) without checking the dedicated clock input placement rules.
규정 준수 정보
RoHS compliant per Altera product page. Industrial temperature grade (I7) but not AEC-Q100 qualified - designers targeting AEC-Q100 automotive applications should verify with the Intel/Altera automotive-grade product roadmap.
