10M16DAF256I7G - 16K LE MAX 10 FPGA, 256-FBGA | Intel
MPN: 10M16DAF256I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.1 | $62.10 |
| 10 | $56.5 | $565.00 |
| 100 | $47.2 | $4,720.00 |
| 500 | $42.8 | $21,400.00 |
| 1,000 | $38.4 | $38,400.00 |
10M16DAF256I7G Overview
An FPGA (field-programmable gate array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, and hardened I/O serdes/phys that the user defines post-fabrication using HDL (Verilog/VHDL) and a vendor tool chain. MAX 10 devices occupy the low-cost, non-volatile niche of the programmable-logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA -> MAX 10 (non-volatile FPGA with on-die flash configuration). Unlike SRAM-based FPGAs, MAX 10 stores its bitstream in on-die flash, enabling instant-on at power-up without an external boot PROM.
Key features of the 10M16 include 16K logic elements, 45 Kbits of embedded RAM (M9K blocks), a built-in ADC (12-bit, up to 1 MSPS, 16 channels) for mixed-signal system integration, on-die flash for user data and configuration, and DSP blocks supporting variable-precision arithmetic. The device integrates dual-configuration flash, JTAG, and active-serial configuration interfaces. Hardened peripherals (PLLs, UFM, ADC, temperature-sensing diode) reduce external BOM and BOM cost in industrial and consumer designs.
Architecturally, the MAX 10 fabric is implemented on TSMC 55 nm embedded-flash process technology, allowing single-chip instant-on operation. The Logic Array Blocks (LABs), Adaptive Logic Modules (ALMs), and MultiTrack interconnect are organized in row/column fashion, with Embedded Memory blocks (M9K), DSP blocks, and variable-precision DSP engines placed in column form. Configuration memory is non-volatile, eliminating the need for an external boot memory device.
Typical applications include industrial motor control and PLC interfaces, factory automation I/O expansion, video processing bridges, low-cost display controllers, IoT gateway edge aggregation, and portable medical-device front-end signal conditioning. The integrated ADC allows direct interface to analog sensors without a separate ADC chip.
A key design consideration is signal integrity at the 1.0 mm pitch BGA - the FBGA-256 requires microvia-compatible PCB stack-up with 4-6 routing layers for break-out. Decoupling capacitor placement close to each supply ball (per the device pin-out file) is mandatory for ADC performance.
This page synthesizes distributor pricing, drop-in alternative guidance within the same FBGA-256 footprint, and practical board-design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 10M16DAF256I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M16DAF256I7G (same form factor and footprint) — differing in Package, Logic Elements (LE), Operating Temperature, Configuration Memory, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M08DAF256I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25DAF256I7G
✅ Drop-In✓ In Stock
$60.3 / Unit
View Datasheet →10M16DAF256C7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$13.8 / Unit
View Datasheet →10M16DAF256I8G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M16DAF256I7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 16000 |
| Embedded Memory Bits | 562176 |
| Embedded RAM (M9K) | 45 Kbits (45 x 9 Kbit blocks) |
| Maximum User I/O | 178 |
| Operating Temperature | -40C to +100C (industrial) |
| Speed Grade | 7 (fastest) |
| Package | 256-FBGA (17 x 17 mm, 1.0 mm pitch) |
| Configuration Memory | On-die flash (non-volatile, instant-on) |
| On-die ADC | 12-bit, 1 MSPS, up to 16 channels |
| Process Technology | 55 nm CMOS with embedded flash |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10M16DAF256I7G 256-fbga (17 x 17 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for 10M16DAF256I7G (256-fbga (17 x 17 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DAF256I7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M16DAF256I7G is suitable for 7 applications: Industrial Motor Control, PLC I/O Expansion Module, Video Processing Bridge, Low-Cost Display Controller, IoT Edge Gateway Aggregation, Portable Medical Front-End, Industrial Sensor Hub.
Industrial Motor Control
The 10M16DAF256I7G is widely adopted for industrial motor control designs because its 16K logic elements, hardened 12-bit ADC, and 178 user I/O support Field-Oriented Control (FOC) of 3-phase PMSM and BLDC motors up to several kW. The 1 MSPS ADC samples phase currents and DC-bus voltage simultaneously with deterministic latency, while the FPGA fabric generates center-aligned PWM with sub-microsecond dead-time control. Industrial temperature grade (-40C to +100C junction) ensures reliable operation in factory-floor enclosures.
Recommended
PLC I/O Expansion Module
In PLC I/O expansion applications, the 10M16DAF256I7G serves as a protocol-bridging and signal-conditioning front end, supporting Modbus RTU, EtherCAT, or Profibus slave interfaces through soft IP cores. The 178 I/O pins drive dozens of opto-isolated digital inputs and relay outputs, while the integrated 12-bit ADC digitizes analog process variables. The non-volatile configuration flash eliminates the boot-up delay typical of SRAM FPGAs, meeting PLC hot-restart requirements.
Recommended
Video Processing Bridge
The 10M16DAF256I7G fits video bridge applications that need format conversion (RGB888 to LVDS, MIPI-CSI to parallel CMOS, or HDMI-to-MIPI reformatting) without the cost of a dedicated ASSP. The 16K LE and DSP blocks handle color-space conversion, chroma resampling, and frame-rate conversion for resolutions up to 1080p60. The on-die flash provides 562 Kbits of user data storage for EDID/DID tables and lookup LUTs.
Recommended
Low-Cost Display Controller
For TFT-LCD or OLED panel control in industrial HMIs and kiosks, the 10M16DAF256I7G generates timing and pixel data for displays up to XGA/WXGA resolution. The integrated DDR-3 controller hard IP (where available) or soft memory controller interfaces external SDRAM for frame buffering. The 178 I/O include LVDS pairs needed for direct panel drive, reducing the external component count. Industrial temperature grade supports outdoor enclosures and refrigerated-cabinet displays.
Recommended
IoT Edge Gateway Aggregation
In IoT edge gateways, the 10M16DAF256I7G aggregates multiple sensor interfaces (SPI, I2C, UART, GPIO) into a single Ethernet or LTE uplink. The 12-bit ADC directly digitizes analog sensor outputs, while soft IP cores implement MQTT-SN or CoAP protocol stacks. Non-volatile configuration flash supports secure boot and bitstream encryption, enabling field-upgradable firmware over the air. The FBGA-256 footprint fits into compact gateway enclosures.
Recommended
Portable Medical Front-End
For portable medical-device signal conditioning such as pulse oximeters, ECG front ends, and blood-pressure monitors, the 10M16DAF256I7G combines 12-bit ADC sampling of analog biosignals with FPGA-accelerated digital filtering (notch, bandpass, decimation). The low dynamic power of MAX 10 silicon (compared to larger FPGAs) extends battery life, while the industrial temperature grade supports clinical-environment use. On-die user flash stores calibration coefficients and patient-record metadata.
Recommended
Industrial Sensor Hub
The 10M16DAF256I7G is well-suited to multi-sensor industrial hubs (vibration, temperature, pressure, gas) where 178 I/O pins interface parallel sensor arrays and the integrated ADC handles slow analog inputs. Soft IP cores implement industrial protocols such as IO-Link or CANopen, while the on-die flash retains sensor calibration tables across power cycles. The FBGA-256 footprint is compatible with industrial PCBA manufacturing lines.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DAF256I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M08DAF256I7G | 10M25DAF256I7G | 10M16DAF256C7G | 10M16DAF256I8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-256 (17 x 17 mm) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements | 16000 | 8000 (-50%) | 25000 (+56%) | 16000 (same) | 16000 (same) |
| Embedded Memory Bits | 562176 | 378880 | 675840 | 562176 | 562176 |
| Maximum User I/O | 178 | 178 (same) | 178 (same) | 178 (same) | 178 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial - same | Industrial - same | Commercial (0C to +85C) | Industrial - same |
| Speed Grade | 7 (fastest) | 7 - same | 7 - same | 7 - same | 8 (slower) |
| On-die ADC | 12-bit, 1 MSPS | 12-bit, 1 MSPS - same | 12-bit, 1 MSPS - same | 12-bit, 1 MSPS - same | 12-bit, 1 MSPS - same |
| Unit Price (qty 1) | $62.10 | $48 - $55 | $78 - $92 | $55 - $60 | $58 - $64 |
Key Differentiators
- Higher logic-element density in same FBGA-256 footprint (vs 10M08DAF256I7G)
- Lower unit cost than 25K LE variant (vs 10M25DAF256I7G)
- Industrial temperature grade for factory environments (vs 10M16DAF256C7G)
- Faster speed grade for timing-critical paths (vs 10M16DAF256I8G)
Design Notes
The 256-ball FBGA at 1.0 mm pitch requires a PCB stack-up with microvia (laser-drilled) or via-in-pad technology to break out the inner balls. Use a 4-6 layer stack-up with 50-ohm controlled-impedance traces for LVDS/HSUL pairs. Escape routing under the BGA should use 4 mil trace/4 mil space at minimum; HDI (High-Density Interconnect) processes such as Any-layer microvia are strongly recommended over conventional through-via for inner balls. Maintain a continuous reference plane under the BGA for power integrity.
Place 0.1 uF X7R ceramic decoupling capacitors within 100 mil of every VCCINT and VCCA supply ball, with a 10 uF bulk capacitor near the device. The integrated ADC requires separate analog supply filtering: place a ferrite bead on the VCCADC supply and provide a dedicated ground island for the ADC ground ball. Use low-ESR tantalum or ceramic bulk capacitors at the regulator output for transient response during logic-element activity transitions.
Estimated: at typical MAX 10 utilization (~70% LE, 50% RAM, ADC idle), the 10M16DAF256I7G dissipates approximately 0.5-1.5 W. The FBGA-256 has a theta_JA of approximately 15-20 C/W on a 4-layer JEDEC test board (per the Intel MAX 10 thermal model), yielding a junction-to-ambient rise of 15-30 C. Industrial-grade operation to 100 C junction leaves 70 C of margin from 30 C ambient. Adequate airflow is recommended for high-utilization designs; thermal vias under the center thermal pad (if present) reduce theta_JC.
Three pitfalls to avoid: (1) Do NOT use MAX 10 I/O banks at 3.3 V LVCMOS into a 1.8 V-referenced downstream device - level-shifting is required since MAX 10 I/O standards do not support 1.8V LVTTL; (2) The on-die ADC requires the dedicated VCCADC analog supply to be present BEFORE VCCINT - power-rail sequencing is documented in the device datasheet; (3) Configuration bitstream security: enable bitstream encryption and JTAG access control when deploying in field to prevent unauthorized firmware reads.
Differential pairs (LVDS, HSUL, SSTL) must be length-matched within 20 mil and routed on the same layer to maintain common-mode rejection. Place the JTAG header within 2 inches of the FPGA for programming access. Keep the TCK signal shielded or surrounded by ground pour to avoid crosstalk. CLK inputs should be short, with series termination at the source for clocks above 100 MHz. JTAG chain ordering should match the Quartus Prime programming file order.
Compliance Information
RoHS and REACH compliance confirmed by FindIC datasheet header (FBGA-256, 17 x 17 mm, 1 mm pitch, ROHS COMPLIANT). AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC, although MAX 10 is widely used in non-safety industrial automotive peripherals. Conflict-minerals and halogen-free status were not explicitly stated in the verified web data and are listed as unknown.
