5M40ZE64I5N - 40 LE MAX V CPLD, 64-EQFP, Industrial | Intel / Altera
MPN: 5M40ZE64I5N ✓ نشط5M40ZE64I5N نظرة عامة
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete 74-series glue logic and higher-density FPGAs. In the broader system hierarchy, CPLDs are glue-logic ICs used for I/O expansion, bus bridging, power-up sequencing, and custom interface logic. They retain configuration in on-chip flash memory, so they behave like dedicated ASICs the moment power is applied, with no external boot memory required.
The MAX V family uses a low-power 1.8 V core with on-chip voltage regulation, and the device supports JTAG (IEEE 1149.1) boundary-scan testing and in-system programmability via the standard Altera / Intel Quartus II toolchain. Multi-voltage I/O banks let the 5M40ZE64I5N interface directly to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and LVTTL/LVCMOS logic without external level shifters.
Typical applications include power-on reset and sequencing controllers, I/O expansion for microcontrollers and SoCs, address decoding for memory buses, and interface bridging between legacy and modern peripherals. Its small footprint and low standby current also suit battery-backed industrial and consumer designs.
When designing with the 5M40ZE64I5N, note that the 64-EQFP package benefits from a small exposed-pad-style thermal pad on the underside for board-level reliability - follow Intel land-pattern guidelines. Quartus II version 13.0 or the corresponding Quartus Prime support must be used to compile the design into a JEDEC programming file.
This page synthesizes verified distributor pricing, same-family drop-in alternatives, and practical design guidance that you will not find on any single distributor or manufacturer page, helping engineers shorten the component-selection cycle.
بدائل مباشرة لـ 5M40ZE64I5N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 5M40ZE64I5N (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Programming Interface, Configuration Memory, Propagation Delay (tPD).
5M40ZE64C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M40ZE64C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M40ZE64A5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M80ZE64I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M160ZE64I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M40ZE64I5N الحدود القصوى والخصائص الكهربائية
| Device Family | MAX V |
| Logic Elements (LE) | 40 |
| Macrocells | 32 |
| Propagation Delay (tPD) | 7.5 ns |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (multi-voltage, LVCMOS / LVTTL) |
| Configuration Technology | Non-volatile flash, instant-on (<= 0.5 ms) |
| Standby Current | 25 µA (typical) |
| درجة حرارة التشغيل | -40 °C to +100 °C (Industrial, I-suffix) |
| العلبة | 64-pin EQFP (EQFP-64), 9 mm x 9 mm, 0.4 mm pitch |
| نوع التركيب | Surface Mount |
| Lead-Free / RoHS | Lead free, plastic, RoHS compliant (per FindIC description) |
| JTAG Support | IEEE 1149.1 boundary-scan, in-system programmability |
| Toolchain | Quartus II (MAX V device support) / Quartus Prime |
دليل تكوين أطراف 5M40ZE64I5N 64-pin eqfp (eqfp-64), 9 mm x 9 mm, 0.4 mm pitch
تكوين الأطراف لـ 5M40ZE64I5N (حزمة 64-pin eqfp (eqfp-64), 9 mm x 9 mm, 0.4 mm pitch). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ 5M40ZE64I5N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
5M40ZE64I5N مناسب لـ 6 التطبيقs: Power-on Reset and Sequencing Controller, I/O Expansion for Microcontrollers, Address Decoding and Memory Bus Bridging, Industrial Interface Bridging (SPI / I2C / UART / Parallel), Motor Control and Drive Glue Logic, Legacy Peripheral Replacement for 74-series Glue Logic.
Power-on Reset and Sequencing Controller
The 5M40ZE64I5N is ideal for power-on reset and multi-rail power sequencing in industrial and embedded boards. Its non-volatile instant-on configuration (≤0.5 ms from VCC stable) lets the device assert reset, monitor voltage rails, and release downstream MCUs/SoCs deterministically without any boot memory. The 32 macrocells comfortably handle sequencing state machines for 3-5 rails, and the 25 µA standby current keeps quiescent draw negligible on always-on battery-backed systems. Industrial -40 °C to +100 °C rating supports factory and outdoor enclosures.
موصى به
I/O Expansion for Microcontrollers
Use the 5M40ZE64I5N to expand GPIO, key-scan, or LED-drive capacity on low-pin-count MCUs. The multi-voltage VCCIO bank (1.2 V to 3.3 V LVCMOS/LVTTL) lets the CPLD bridge a 1.8 V MCU to 3.3 V peripherals without external level shifters. Its 7.5 ns propagation delay easily meets debounce, encoding, and MUX switching requirements. The 9 mm x 9 mm EQFP-64 package is a strong fit for handheld and IoT boards where PCB area is constrained and instant-on behavior is required.
موصى به
Address Decoding and Memory Bus Bridging
The 5M40ZE64I5N is well suited to decode address lines, generate chip-selects, and bridge between legacy and modern memory buses. Its 7.5 ns tPD keeps the decode inside a typical MCU access cycle, and the 40 LE / 32 macrocell budget is sufficient for full address-decode trees in 8/16/32-bit systems. Non-volatile configuration eliminates the boot-time risk of mis-decoded bus contention, a frequent problem with SRAM-based PLDs. Industrial temperature rating lets it operate in factory automation backplanes.
موصى به
Industrial Interface Bridging (SPI / I2C / UART / Parallel)
The 5M40ZE64I5N can convert between SPI, I2C, UART, and parallel interfaces in industrial PLCs and instrumentation. Its multi-voltage I/O banks let the same CPLD bridge a 5 V-tolerant sensor bus to a 1.8 V SoC without external translators. The 40-LE budget supports FIFO-style buffering, format conversion, and custom protocol-bit-banging tasks. Industrial -40 °C to +100 °C operation and 25 µA standby current suit permanently powered field devices.
موصى به
Motor Control and Drive Glue Logic
The 5M40ZE64I5N provides deterministic glue logic for motor-control boards - encoder decoding, Hall-sensor conditioning, PWM fault combining, and brake/coil drivers. Its 7.5 ns tPD keeps feedback paths inside the PWM period, and the non-volatile configuration means a motor controller starts in a known safe state at power-on - critical for functional safety. Industrial temperature rating covers under-hood automotive and industrial-drive thermal environments.
موصى به
Legacy Peripheral Replacement for 74-series Glue Logic
The 5M40ZE64I5N consolidates dozens of 74-series TTL/CMOS glue-logic gates - decoders, multiplexers, flip-flops, and latches - into a single non-volatile IC. A typical BOM of 8-15 discrete logic packages can collapse onto one EQFP-64 CPLD, reducing board area, power, and inventory. Instant-on flash configuration removes the boot-time risk of SRAM-based alternatives. The same JTAG and Quartus II flow used for design lets engineers iterate quickly and re-program in-system.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 5M40ZE64I5N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 5M40ZE64C5N | 5M40ZE64C4N | 5M40ZE64A5N | 5M80ZE64I5N | 5M160ZE64I5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | EQFP-64 (9 mm x 9 mm) | EQFP-64 (9 mm x 9 mm) - same | EQFP-64 (9 mm x 9 mm) - same | EQFP-64 (9 mm x 9 mm) - same | EQFP-64 (9 mm x 9 mm) - same | EQFP-64 (9 mm x 9 mm) - same |
| Logic Elements (LE) | 40 | 40 (identical) | 40 (identical) | 40 (identical) | 80 (+100%) | 160 (+300%) |
| Macrocells | 32 | 32 (identical) | 32 (identical) | 32 (identical) | 64 (+100%) | 128 (+300%) |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | Automotive grade | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) |
| Propagation Delay (tPD) | 7.5 ns | 7.5 ns (identical) | 7.5 ns (identical) | 7.5 ns (identical) | 7.5 ns (identical) | 7.5 ns (identical) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V (identical) | 1.8 V (identical) | 1.8 V (identical) | 1.8 V (identical) | 1.8 V (identical) |
| I/O Voltage Range (VCCIO) | 1.2 V to 3.3 V (LVCMOS / LVTTL) | 1.2 V to 3.3 V (identical) | 1.2 V to 3.3 V (identical) | 1.2 V to 3.3 V (identical) | 1.2 V to 3.3 V (identical) | 1.2 V to 3.3 V (identical) |
| Configuration | Non-volatile flash, instant-on <= 0.5 ms | Non-volatile flash, identical | Non-volatile flash, identical | Non-volatile flash, identical | Non-volatile flash, identical | Non-volatile flash, identical |
أبرز الفروقات
- Smallest-density MAX V CPLD in EQFP-64 with industrial temp rating (مقابل5M40ZE64C5N)
- Pin-compatible upgrade path within the same footprint (مقابل5M80ZE64I5N)
- Non-volatile instant-on configuration eliminates boot memory (مقابلSmall SRAM-based FPGA (e.g. Cyclone family))
ملاحظات التصميم
The 5M40ZE64I5N requires a clean 1.8 V core supply (VCCINT) plus one or more VCCIO rails for each I/O bank. Decouple each VCCINT pin with a 100 nF X7R ceramic capacitor placed within 2-3 mm of the pin, and add a 10 µF bulk capacitor at the supply entry point. If the design uses multiple VCCIO voltages (1.2 V, 1.8 V, 2.5 V, 3.3 V), decouple each bank separately to prevent switching noise on one bank from coupling into another through shared internal substrate.
The 64-EQFP package has a 0.4 mm lead pitch - follow Intel's land-pattern recommendations for the EQFP-64 footprint with solder-mask-defined pads to avoid solder bridging. Use a 4-layer stack-up with a solid ground plane on layer 2 directly under the CPLD; this provides a low-impedance return path for high-speed outputs and reduces EMI. Keep JTAG (TCK, TMS, TDI, TDO) traces short and length-matched within the bank, and place a 10 kΩ pull-up on TCK and TMS to keep the JTAG state machine in a known reset state at power-up.
Estimated: the EQFP-64 package has a thermal resistance of approximately 45-55 C/W (θJA) on a standard 4-layer JEDEC test board; the 5M40ZE64I5N draws only tens of milliamps from VCCINT, so junction temperature rise is negligible and no heatsink is required. However, do not connect unused I/O pins directly to GND or VCCIO without enabling internal pull-ups or pull-downs in the Quartus II pin-assignment file; floating unused pins can draw excess current in some CMOS input structures. Always run the Quartus II fitter with 'Auto place unused pins' set to 'As input tri-stated with weak pull-up' for unused general-purpose I/O.
معلومات الامتثال
Lead-free, plastic, RoHS-compliant EQFP-64 package per FindIC description. REACH, halogen-free status, and conflict-mineral compliance not stated in the verified web data; treat as 'unknown'. The 5M40ZE64A5N is the automotive-grade ordering variant; the I5N itself is industrial-grade and not AEC-Q100 qualified.
