5M40ZE64C5N - MAX V 40 LE CPLD, 7.5ns, 64-EQFP | Intel / Altera
MPN: 5M40ZE64C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.5 | $650.00 |
| 500 | $5.45 | $2,725.00 |
| 1,000 | $4.85 | $4,850.00 |
Drop-in alternatives for 5M40ZE64C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5M40ZE64C5N Maximum Ratings & Electrical Characteristics
| Series | MAX V |
| Device Type | CPLD - Complex Programmable Logic Device |
| Logic Elements (LE) | 40 |
| Macrocells | 32 |
| Maximum User I/Os | 54 |
| Propagation Delay (tPD1) | 7.5 ns |
| Maximum Internal Frequency | 118.3 MHz |
| Configuration Memory | Flash (non-volatile) |
| Supply Voltage - Core | 1.8 V (internal) |
| External Supply Voltage | 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS, LVTTL |
| Programming Interface | JTAG (IEEE 1149.1) - in-system programmable |
| Package | 64-pin EQFP (Plastic Enhanced Thin QFP) with exposed thermal pad |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial) |
| User Flash Memory (UFM) | Yes (on-chip non-volatile) |
5M40ZE64C5N 64-pin eqfp (plastic enhanced thin qfp) with exposed thermal pad Pin Configuration Guide
Complete pinout information for 5M40ZE64C5N (64-pin eqfp (plastic enhanced thin qfp) with exposed thermal pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M40ZE64C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M40ZE64C5N is suitable for 6 applications: Address Decoding and Bus Interface Bridging, I/O Expansion and Level Translation, Industrial Glue Logic Consolidation, Power Sequencing and Reset Distribution, Legacy 5 V System Modernization, State Machine and Protocol Conversion.
Address Decoding and Bus Interface Bridging
The 5M40ZE64C5N fits address decoding and bus-interface bridging because its 7.5 ns pin-to-pin propagation delay (tPD1) and 118.3 MHz internal frequency comfortably decode a 50-100 MHz processor or memory bus without inserted wait states. Its 32 macrocells provide ample product-term capacity for chip-select and byte-enable generation across multiple memory banks. Placed between a CPU and its memory/ASIC peripherals, the CPLD replaces discrete 74-series glue logic with a single Flash-programmable device, reducing board area and BOM cost. The multi-voltage I/O banks (1.5/1.8/2.5/3.3 V) allow direct connection to processors and peripherals running on different supply rails, eliminating external level translators and improving signal integrity on the decoded strobes.
Recommended
I/O Expansion and Level Translation
The 5M40ZE64C5N serves as an I/O expansion and level-translation bridge between mixed-voltage ASICs and processors. Each of its I/O banks supports an independent VCCIO voltage (1.5/1.8/2.5/3.3 V), so a 1.8 V processor GPIO can directly drive a 3.3 V peripheral or vice versa through the CPLD's bidirectional I/O cells. With 54 user I/Os available in the 64-pin EQFP package, it can expand a small microcontroller into a multi-bank mixed-signal system. The instant-on Flash configuration ensures the level-translation paths are active within microseconds of power-up, critical for systems where the MCU is held in reset until the I/O voltages are stable.
Recommended
Industrial Glue Logic Consolidation
The 5M40ZE64C5N consolidates 5 to 15 discrete 74-series logic gates into a single programmable device in industrial PLC and motor-drive controllers. Its 32 macrocells replace latches, flip-flops, monostable multivibrators, and combinational decoders with a Flash-programmable equivalent that fits on a 64-pin EQFP land pattern. The non-volatile configuration eliminates PROM failures common in high-vibration factory-floor environments, and the instant-on behavior lets I/O signals settle before the host MCU boots. Engineers can re-spin logic revisions by re-programming via JTAG on the production line, avoiding board respins and reducing time-to-market for industrial customers.
Recommended
Power Sequencing and Reset Distribution
The 5M40ZE64C5N is ideal for power-sequencing and reset-distribution networks in networking switches and telecom line cards. Its deterministic 7.5 ns timing lets designers build daisy-chained PG (power-good) and RESET signal chains that bring ASICs, FPGAs, and PHYs up in the correct order. Each of the 54 user I/Os can be configured with a weak pull-up, bus-keeper, or open-drain mode, matching the diverse reset-network requirements of multi-rail systems. The on-chip User Flash Memory (UFM) can store board-specific calibration data or MAC addresses alongside the configuration image, eliminating an external EEPROM from the BOM and reducing bill-of-material cost.
Recommended
Legacy 5 V System Modernization
The 5M40ZE64C5N bridges new low-voltage processors to legacy 5 V peripherals in medical instruments and factory automation systems. Its LVCMOS/LVTTL I/O banks interface directly with 3.3 V or 1.8 V modern MCUs while the programmable logic provides the level-shifting behavior to drive 5 V-tolerant signal chains. The 32 macrocells can implement Schmitt-trigger input conditioning and debounce logic for noisy mechanical switches and relays common in industrial control panels. Replacing legacy 74LS/74HC TTL gates with a single CPLD reduces standby current and board area while keeping the legacy 5 V peripheral interface fully functional.
Recommended
State Machine and Protocol Conversion
The 5M40ZE64C5N implements compact finite state machines and lightweight protocol converters such as I2C-to-parallel, SPI-to-GPIO, or UART-to-keyscan. Each of the 40 Logic Elements contains a 4-input LUT and a programmable register, well-suited for Moore or Mealy state machines with 8 to 16 states. The 7.5 ns tPD1 enables bit-rate matching at standard SPI speeds up to 50 MHz. Combined with the on-chip JTAG, designers can add production-testable logic that simplifies board bring-up and boundary-scan coverage without external test fixtures, a useful feature for low-volume medical and industrial products.
Recommended
Recommended Products Summary
Engineering reference data for 5M40ZE64C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M40ZE64C4N | 5M40ZE64A5N | 5M160ZE64C5N | 5M160ZE64C4N | 5M160ZE64A5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 64-pin EQFP | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same |
| Logic Elements | 40 | 40 | 40 | 160 | 160 | 160 |
| Macrocells | 32 | 32 | 32 | 128 | 128 | 128 |
| User I/Os | 54 | 54 | 54 | 54 | 54 | 54 |
| Propagation Delay (tPD1) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
| Max Internal Frequency | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz |
| Series | MAX V | MAX V | MAX V | MAX V | MAX V | MAX V |
Key Differentiators
- Non-volatile Flash configuration eliminates external boot PROM (vs 5M160ZE64C5N)
- Lowest 5M40ZE64 density in the 64-EQFP package (vs 5M160ZE64C5N)
- Independent VCCIO banks for mixed-voltage designs (vs XC9536XL-64VQG64 (Xilinx XC9500XL))
Design Notes
The 5M40ZE64C5N requires a single 3.3 V external supply; the on-chip voltage regulator generates the 1.8 V core voltage internally. Decouple VCCINT and each VCCIO bank with 0.1 uF ceramic capacitors placed within 5 mm of the supply pins, and add a bulk 10 uF tantalum or ceramic capacitor at the regulator input. Each I/O bank has its own VCCIO pin; do not tie VCCIO banks together unless the design specifies the same voltage for the entire bank group.
Use a four-layer PCB with a dedicated ground plane and a power plane cut to avoid crossing noisy signal traces above split power regions. Route JTAG signals (TCK, TMS, TDI, TDO) away from high-speed switching signals; keep TCK trace length under 75 mm to meet IEEE 1149.1 timing. Connect the exposed thermal pad on the 64-pin EQFP package to the ground plane with multiple thermal vias (0.3 mm drill, 0.6 mm pad, 1.0 mm pitch) to improve heat dissipation during high-I/O-toggle operation.
Do not exceed the maximum I/O per bank current limit of approximately 25 mA per pin or 100 mA per bank - distribute high-current loads across multiple banks. Leave JTAG pins unused but pulled to a defined state (TDI/TMS pulled up, TCK pulled down through 10 kohm) if JTAG is not used to prevent spurious configuration events. The User Flash Memory (UFM) shares configuration logic; do not access the UFM during in-system programming without first pausing the JTAG state machine.
Compliance Information
RoHS and REACH compliance not explicitly stated in the verified web data; AEQ-Q100 not applicable for commercial-grade CPLD. Refer to manufacturer datasheet for confirmation.
