5M570ZM100C4N - MAX V CPLD, 440 LEs, 100-MBGA | Altera / Intel
MPN: 5M570ZM100C4N ✓ نشط5M570ZM100C4N نظرة عامة
What is a CPLD? A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic device that sits between simple PLD glue logic and high-density FPGAs in the programmable-logic taxonomy (programmable logic -> CPLD -> programmable logic device -> semiconductor). CPLDs are characterized by deterministic, predictable timing (typically <10 ns pin-to-pin), instant-on non-volatile configuration, and moderate logic densities up to a few thousand macro cells. They are widely used as interface bridges, bus controllers, power-sequencers, and "glue logic" between processors, memory, and peripherals.
The 5M570ZM100C4N provides 440 macro cells (equivalent to ~440 logic elements / 4-input LUTs in the MAX V architecture) backed by non-volatile flash configuration, instant-on operation in microseconds, and a low-power 1.8 V core. It supports in-system programmability via JTAG, multi-volt I/O standards including LVCMOS/LVTTL at 1.5 V, 1.8 V, 2.5 V, 3.3 V, and PCI, plus built-in user flash memory for on-chip parameter storage. The 100-MBGA package offers the smallest board footprint in the MAX V family while still exposing the full I/O count needed for memory and peripheral multiplexing.
MAX V devices are fabricated on a 0.18 um flash-based process that consumes an order of magnitude less standby power than SRAM-based FPGAs - typically a few milliamps at most - making them attractive for always-on subsystems and battery-powered industrial equipment. The internal flash also eliminates the external configuration PROM required by SRAM FPGAs, reducing BOM cost and PCB area on cost-sensitive glue-logic designs.
Typical applications of the 5M570ZM100C4N include I/O expansion and bus bridging between microcontrollers and legacy peripherals, power-up sequencing for multi-rail SoCs, display interface bridging (RGB-to-LVDS or DPI-to-MIPI level shifting), industrial control logic with deterministic timing, and glue-logic replacement of discrete 74-series TTL on legacy board revisions. Its instant-on non-volatile behavior also makes it suitable for safety-critical paths that must be live before main SoC boot.
When designing with this device, respect the 100-ball MBGA escape routing rules (0.5 mm or 0.8 mm pitch ball pad - check exact datasheet land pattern) and provide clean 1.8 V core and 3.3 V I/O decoupling within 3 mm of the supply balls. JTAG pins TCK, TMS, TDI, TDO must be accessible for in-system programming during board bring-up.
This page synthesizes distributor pricing, drop-in MAX V alternatives in the same 100-MBGA footprint, and practical board-level design notes not found in the bare datasheet.
بدائل مباشرة لـ 5M570ZM100C4N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 5M570ZM100C4N (نفس عامل الشكل والبصمة) — يختلف في Package, Programming Interface, Operating Temperature, Macro Cells, Configuration Memory.
5M570ZM100C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M570ZM100A5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M570ZM100I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M570ZM100C8N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
5M570ZM100I7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
5M240ZM100C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M160ZM100C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←5M570ZM100C4N الحدود القصوى والخصائص الكهربائية
| Family | MAX V |
| Series | 5M570Z |
| Macro Cells | 440 |
| Logic Elements (LEs) | 440 |
| Maximum Internal Frequency | 184.1 MHz |
| Pin-to-Pin Delay (tPD) | 9.0 ns |
| Core Voltage | 1.8 V |
| درجة حرارة التشغيل | 0 C to +85 C (commercial) |
| العلبة | 100-ball MBGA (Micro BGA), tray |
| Configuration Memory | Non-volatile flash, instant-on |
| User Flash Memory | Yes (8 Kbits) |
| I/O Standards | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V, PCI |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
تكوين أطراف 5M570ZM100C4N
| دبوس 1 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 2 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 3 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 4 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 5 | GND — Ground |
| دبوس 6 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 7 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 8 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 9 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 10 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 11 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 12 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 13 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 14 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 15 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 16 | GND — Ground |
| دبوس 17 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 18 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 19 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 20 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 21 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 22 | I/O — Dual-purpose user I/O bank 3 |
| دبوس 23 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 24 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 25 | GND — Ground |
| دبوس 26 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 27 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 28 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 29 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 30 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 31 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 32 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 33 | I/O — Dual-purpose user I/O bank 4 |
| دبوس 34 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 35 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 36 | GND — Ground |
| دبوس 37 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 38 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 39 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 40 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 41 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 42 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 43 | I/O — Dual-purpose user I/O bank 5 |
| دبوس 44 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 45 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 46 | GND — Ground |
| دبوس 47 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 48 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 49 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 50 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 51 | VCCIO6 — I/O bank 6 supply voltage |
| دبوس 52 | I/O — Dual-purpose user I/O bank 6 |
| دبوس 53 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 54 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 55 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 56 | GND — Ground |
| دبوس 57 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 58 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 59 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 60 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 61 | VCCIO7 — I/O bank 7 supply voltage |
| دبوس 62 | I/O — Dual-purpose user I/O bank 7 |
| دبوس 63 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 64 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 65 | GND — Ground |
| دبوس 66 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 67 | TDI — JTAG Test Data In |
| دبوس 68 | TCK — JTAG Test Clock |
| دبوس 69 | TMS — JTAG Test Mode Select |
| دبوس 70 | TDO — JTAG Test Data Out |
| دبوس 71 | nCE — Chip Enable (active low) |
| دبوس 72 | nCONFIG — Configuration control (active low) |
| دبوس 73 | VCCINT — Core supply voltage 1.8 V |
| دبوس 74 | GND — Ground |
| دبوس 75 | VCCIO8 — I/O bank 8 supply voltage |
| دبوس 76 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 77 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 78 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 79 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 80 | GND — Ground |
| دبوس 81 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 82 | I/O — Dual-purpose user I/O bank 8 |
| دبوس 83 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 84 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 85 | GND — Ground |
| دبوس 86 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 87 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 88 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 89 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 90 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 91 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 92 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 93 | I/O — Dual-purpose user I/O bank 1 |
| دبوس 94 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 95 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 96 | GND — Ground |
| دبوس 97 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 98 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 99 | I/O — Dual-purpose user I/O bank 2 |
| دبوس 100 | I/O — Dual-purpose user I/O bank 2 |
التطبيقات النموذجية
5M570ZM100C4N مناسب لـ 6 التطبيقs: Bus Bridge and I/O Expansion, Power-Up Sequencing Controller, Display Interface Bridging, Industrial Control Glue Logic, Legacy Board Revision Glue Logic, Safety-Critical Path Pre-Boot Logic.
Bus Bridge and I/O Expansion
The 5M570ZM100C4N is well suited as a glue-logic bus bridge between microcontrollers, SoCs, and legacy peripherals. With 440 macro cells and a 9.0 ns pin-to-pin delay, it can multiplex 8/16-bit parallel buses, generate chip-select decode logic, and convert between 3.3 V LVCMOS and 1.8 V LVCMOS domains without adding latency. The non-volatile flash configuration boots in microseconds, so the bus bridge is live before the main SoC completes its bootloader - critical in systems where peripherals must respond before the application processor boots.
موصى به
Power-Up Sequencing Controller
The 5M570ZM100C4N's instant-on flash-based configuration makes it ideal for multi-rail power-sequencing in SoC subsystems. The device can drive 3.3 V GPIO outputs within microseconds of VCCINT reaching 1.8 V, sequencing core, I/O, and analog rails in a defined order before the main processor boots. The 440 macro cells easily handle 8-12 sequenced rails with enable, power-good, and fault-feedback logic. Deterministic 9.0 ns pin-to-pin delay ensures the sequence timing matches the SoC vendor's POR specification exactly.
موصى به
Display Interface Bridging
Display interfaces such as DPI/DBI-to-LVDS, RGB-to-MIPI level shifting, and HDMI repeater logic fit naturally in the 5M570ZM100C4N. The 184.1 MHz fMAX handles pixel clocks up to 1080p60 (148.5 MHz), while the multi-voltage I/O banks accept 1.8 V, 2.5 V, and 3.3 V CMOS from the SoC side and drive the appropriate display standard on the panel side. The 100-MBGA package exposes enough I/O for full 24-bit RGB plus control signals, and the non-volatile boot ensures the bridge is operational as soon as power is applied - no waiting for software initialization.
موصى به
Industrial Control Glue Logic
In factory-automation controllers, the 5M570ZM100C4N replaces discrete 74-series TTL for encoder counting, PWM generation, watchdog supervision, and fieldbus (Modbus, Profibus) address decoding. Its deterministic timing (9.0 ns tPD) ensures PWM edge accuracy for motor-control loops, and the 1.8 V core with 3.3 V I/O tolerance connects directly to 3.3 V microcontrollers without level shifters. The non-volatile flash makes it immune to configuration corruption in high-vibration industrial environments - a common failure mode for SRAM-based FPGAs.
موصى به
Legacy Board Revision Glue Logic
When revising an older PCB to replace EOL 74-series or GAL22V10-style logic, the 5M570ZM100C4N consolidates dozens of discrete gates into one part while preserving the original board's pin connections. Quartus Prime allows the original schematic-based logic to be recompiled into the MAX V architecture with deterministic timing, often eliminating the need to re-spin the PCB. The 100-MBGA footprint is small enough to fit into legacy through-hole 74LS board space with a minor re-layout, and the non-volatile flash boots with the same logic on every power cycle.
موصى به
Safety-Critical Path Pre-Boot Logic
In automotive and industrial safety subsystems (ISO 26262, IEC 61508), the 5M570ZM100C4N can implement pre-boot safety logic that must be live before the main MCU/SoC executes any code. Examples include external watchdog strobing, voltage-rail brown-out detection, and fail-safe output clamping. Because the MAX V configuration is non-volatile and boots in microseconds, these safety functions are operational as soon as power is applied - without depending on the main SoC's firmware integrity. The deterministic 9.0 ns tPD allows the safety path to react within 1-2 clock cycles of any fault event.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 5M570ZM100C4N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 5M570ZM100C5N | 5M570ZM100A5N | 5M570ZM100I5N | 5M240ZM100C4N | 5M160ZM100C4N |
|---|---|---|---|---|---|---|
| Package | 100-MBGA (M100) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | MAX V | MAX V | MAX V | MAX V | MAX II | MAX II |
| Macro Cells | 440 | 440 | 440 | 440 | 240 | 160 |
| Pin-to-Pin Delay (tPD) | 9.0 ns | 10.0 ns | 10.0 ns | 10.0 ns | 10.0 ns (MAX II) | 10.0 ns (MAX II) |
| Max Internal Frequency | 184.1 MHz | 152.5 MHz | 118.3 MHz | 152.5 MHz | 118.3 MHz | 118.3 MHz |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
أبرز الفروقات
- Highest-density 100-MBGA option in the MAX V family (مقابل5M240ZM100C4N (MAX II 240 macro cells))
- Faster C4 speed grade vs C5 and A5 (مقابل5M570ZM100C5N (C5 speed grade))
- Non-volatile flash configuration, instant-on (مقابلSmall SRAM FPGAs (Cyclone IV, Lattice ECP5))
ملاحظات التصميم
The 5M570ZM100C4N requires a clean 1.8 V VCCINT supply with separate 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO rails for each bank. Place a 0.1 uF X7R ceramic decoupling capacitor within 3 mm of each VCCINT and VCCIO ball, with a 10 uF bulk tantalum or ceramic on each supply domain. Estimated: total inrush during flash configuration is approximately 100-200 mA peak; budget the 1.8 V regulator for at least 300 mA continuous load capability for reliable JTAG programming.
The 100-MBGA package uses a 0.8 mm ball pitch (verify exact pitch in the MAX V Device Handbook). Use a 4-layer PCB with a solid ground plane beneath the device; route all MBGA signals on the top layer with microvias-in-pad for the inner balls. Place JTAG pins TCK/TMS/TDI/TDO on accessible test points or a 0.1 inch header to support in-system programming during board bring-up. Estimated: with 0.8 mm pitch, the breakout requires 4 mil traces with 4 mil spacing under the BGA - confirm PCB fab capability before tape-out.
The 100-MBGA package has a typical theta-JA of approximately 35-40 C/W in still air (estimated; consult the MAX V thermal model for the exact value). At 184.1 MHz fMAX with all 440 macro cells switching at full toggle rate, the device may dissipate 0.5-1.0 W internal power. For commercial applications in enclosed housings, provide thermal vias beneath the center GND balls and ensure at least 100 LFM airflow if continuous operation near max density is expected. Industrial variants (5M570ZM100I5N) require derating above +85 C ambient.
Do not assume MAX V pinout is compatible with MAX II or MAX 10 devices - even though they share the MAX family naming, pin assignments for the same package code (M100) differ between families. Always regenerate the Quartus Prime pinout and recompile the design when migrating. Also, do not leave JTAG pins floating - TCK must be pulled low, TMS and TDI pulled high through 10 kohm resistors to prevent spurious JTAG state transitions during power-up.
معلومات الامتثال
RoHS compliant per Altera/Intel MAX V product page. Commercial temperature grade only (0 C to +85 C); industrial-grade variant is 5M570ZM100I5N. Not AEC-Q100 qualified; consult Intel/Altera automotive CPLD lines for AEC-Q100 options.
