5M570ZM100C4N - MAX V CPLD, 440 LEs, 100-MBGA | Altera / Intel
MPN: 5M570ZM100C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.25 | $13.25 |
| 10 | $12.41 | $124.10 |
| 100 | $10.96 | $1,096.00 |
| 500 | $9.82 | $4,910.00 |
| 1,000 | $8.74 | $8,740.00 |
Drop-in alternatives for 5M570ZM100C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M570ZM100C5N
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β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5M570ZM100I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
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View Datasheet β5M160ZM100C4N
β Drop-Inβ In Stock
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View Datasheet β5M570ZM100C4N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Series | 5M570Z |
| Macro Cells | 440 |
| Logic Elements (LEs) | 440 |
| Maximum Internal Frequency | 184.1 MHz |
| Pin-to-Pin Delay (tPD) | 9.0 ns |
| Core Voltage | 1.8 V |
| Operating Temperature | 0 C to +85 C (commercial) |
| Package | 100-ball MBGA (Micro BGA), tray |
| Configuration Memory | Non-volatile flash, instant-on |
| User Flash Memory | Yes (8 Kbits) |
| I/O Standards | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V, PCI |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5M570ZM100C4N Pin Configuration
| Pin 1 | I/O β Dual-purpose user I/O bank 1 |
| Pin 2 | I/O β Dual-purpose user I/O bank 1 |
| Pin 3 | I/O β Dual-purpose user I/O bank 1 |
| Pin 4 | I/O β Dual-purpose user I/O bank 1 |
| Pin 5 | GND β Ground |
| Pin 6 | I/O β Dual-purpose user I/O bank 2 |
| Pin 7 | I/O β Dual-purpose user I/O bank 2 |
| Pin 8 | I/O β Dual-purpose user I/O bank 2 |
| Pin 9 | I/O β Dual-purpose user I/O bank 2 |
| Pin 10 | VCCIO2 β I/O bank 2 supply voltage |
| Pin 11 | I/O β Dual-purpose user I/O bank 2 |
| Pin 12 | I/O β Dual-purpose user I/O bank 2 |
| Pin 13 | I/O β Dual-purpose user I/O bank 3 |
| Pin 14 | I/O β Dual-purpose user I/O bank 3 |
| Pin 15 | I/O β Dual-purpose user I/O bank 3 |
| Pin 16 | GND β Ground |
| Pin 17 | I/O β Dual-purpose user I/O bank 3 |
| Pin 18 | I/O β Dual-purpose user I/O bank 3 |
| Pin 19 | I/O β Dual-purpose user I/O bank 3 |
| Pin 20 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 21 | I/O β Dual-purpose user I/O bank 3 |
| Pin 22 | I/O β Dual-purpose user I/O bank 3 |
| Pin 23 | I/O β Dual-purpose user I/O bank 4 |
| Pin 24 | I/O β Dual-purpose user I/O bank 4 |
| Pin 25 | GND β Ground |
| Pin 26 | I/O β Dual-purpose user I/O bank 4 |
| Pin 27 | I/O β Dual-purpose user I/O bank 4 |
| Pin 28 | I/O β Dual-purpose user I/O bank 4 |
| Pin 29 | I/O β Dual-purpose user I/O bank 4 |
| Pin 30 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 31 | I/O β Dual-purpose user I/O bank 4 |
| Pin 32 | I/O β Dual-purpose user I/O bank 4 |
| Pin 33 | I/O β Dual-purpose user I/O bank 4 |
| Pin 34 | I/O β Dual-purpose user I/O bank 5 |
| Pin 35 | I/O β Dual-purpose user I/O bank 5 |
| Pin 36 | GND β Ground |
| Pin 37 | I/O β Dual-purpose user I/O bank 5 |
| Pin 38 | I/O β Dual-purpose user I/O bank 5 |
| Pin 39 | I/O β Dual-purpose user I/O bank 5 |
| Pin 40 | I/O β Dual-purpose user I/O bank 5 |
| Pin 41 | VCCIO5 β I/O bank 5 supply voltage |
| Pin 42 | I/O β Dual-purpose user I/O bank 5 |
| Pin 43 | I/O β Dual-purpose user I/O bank 5 |
| Pin 44 | I/O β Dual-purpose user I/O bank 6 |
| Pin 45 | I/O β Dual-purpose user I/O bank 6 |
| Pin 46 | GND β Ground |
| Pin 47 | I/O β Dual-purpose user I/O bank 6 |
| Pin 48 | I/O β Dual-purpose user I/O bank 6 |
| Pin 49 | I/O β Dual-purpose user I/O bank 6 |
| Pin 50 | I/O β Dual-purpose user I/O bank 6 |
| Pin 51 | VCCIO6 β I/O bank 6 supply voltage |
| Pin 52 | I/O β Dual-purpose user I/O bank 6 |
| Pin 53 | I/O β Dual-purpose user I/O bank 7 |
| Pin 54 | I/O β Dual-purpose user I/O bank 7 |
| Pin 55 | I/O β Dual-purpose user I/O bank 7 |
| Pin 56 | GND β Ground |
| Pin 57 | I/O β Dual-purpose user I/O bank 7 |
| Pin 58 | I/O β Dual-purpose user I/O bank 7 |
| Pin 59 | I/O β Dual-purpose user I/O bank 7 |
| Pin 60 | I/O β Dual-purpose user I/O bank 7 |
| Pin 61 | VCCIO7 β I/O bank 7 supply voltage |
| Pin 62 | I/O β Dual-purpose user I/O bank 7 |
| Pin 63 | I/O β Dual-purpose user I/O bank 8 |
| Pin 64 | I/O β Dual-purpose user I/O bank 8 |
| Pin 65 | GND β Ground |
| Pin 66 | I/O β Dual-purpose user I/O bank 8 |
| Pin 67 | TDI β JTAG Test Data In |
| Pin 68 | TCK β JTAG Test Clock |
| Pin 69 | TMS β JTAG Test Mode Select |
| Pin 70 | TDO β JTAG Test Data Out |
| Pin 71 | nCE β Chip Enable (active low) |
| Pin 72 | nCONFIG β Configuration control (active low) |
| Pin 73 | VCCINT β Core supply voltage 1.8 V |
| Pin 74 | GND β Ground |
| Pin 75 | VCCIO8 β I/O bank 8 supply voltage |
| Pin 76 | I/O β Dual-purpose user I/O bank 8 |
| Pin 77 | I/O β Dual-purpose user I/O bank 8 |
| Pin 78 | I/O β Dual-purpose user I/O bank 8 |
| Pin 79 | I/O β Dual-purpose user I/O bank 8 |
| Pin 80 | GND β Ground |
| Pin 81 | I/O β Dual-purpose user I/O bank 8 |
| Pin 82 | I/O β Dual-purpose user I/O bank 8 |
| Pin 83 | I/O β Dual-purpose user I/O bank 1 |
| Pin 84 | I/O β Dual-purpose user I/O bank 1 |
| Pin 85 | GND β Ground |
| Pin 86 | I/O β Dual-purpose user I/O bank 1 |
| Pin 87 | I/O β Dual-purpose user I/O bank 1 |
| Pin 88 | I/O β Dual-purpose user I/O bank 1 |
| Pin 89 | I/O β Dual-purpose user I/O bank 1 |
| Pin 90 | VCCIO1 β I/O bank 1 supply voltage |
| Pin 91 | I/O β Dual-purpose user I/O bank 1 |
| Pin 92 | I/O β Dual-purpose user I/O bank 1 |
| Pin 93 | I/O β Dual-purpose user I/O bank 1 |
| Pin 94 | I/O β Dual-purpose user I/O bank 2 |
| Pin 95 | I/O β Dual-purpose user I/O bank 2 |
| Pin 96 | GND β Ground |
| Pin 97 | I/O β Dual-purpose user I/O bank 2 |
| Pin 98 | I/O β Dual-purpose user I/O bank 2 |
| Pin 99 | I/O β Dual-purpose user I/O bank 2 |
| Pin 100 | I/O β Dual-purpose user I/O bank 2 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M570ZM100C4N is suitable for 6 applications: Bus Bridge and I/O Expansion, Power-Up Sequencing Controller, Display Interface Bridging, Industrial Control Glue Logic, Legacy Board Revision Glue Logic, Safety-Critical Path Pre-Boot Logic.
Bus Bridge and I/O Expansion
The 5M570ZM100C4N is well suited as a glue-logic bus bridge between microcontrollers, SoCs, and legacy peripherals. With 440 macro cells and a 9.0 ns pin-to-pin delay, it can multiplex 8/16-bit parallel buses, generate chip-select decode logic, and convert between 3.3 V LVCMOS and 1.8 V LVCMOS domains without adding latency. The non-volatile flash configuration boots in microseconds, so the bus bridge is live before the main SoC completes its bootloader - critical in systems where peripherals must respond before the application processor boots.
Recommended
Power-Up Sequencing Controller
The 5M570ZM100C4N's instant-on flash-based configuration makes it ideal for multi-rail power-sequencing in SoC subsystems. The device can drive 3.3 V GPIO outputs within microseconds of VCCINT reaching 1.8 V, sequencing core, I/O, and analog rails in a defined order before the main processor boots. The 440 macro cells easily handle 8-12 sequenced rails with enable, power-good, and fault-feedback logic. Deterministic 9.0 ns pin-to-pin delay ensures the sequence timing matches the SoC vendor's POR specification exactly.
Recommended
Display Interface Bridging
Display interfaces such as DPI/DBI-to-LVDS, RGB-to-MIPI level shifting, and HDMI repeater logic fit naturally in the 5M570ZM100C4N. The 184.1 MHz fMAX handles pixel clocks up to 1080p60 (148.5 MHz), while the multi-voltage I/O banks accept 1.8 V, 2.5 V, and 3.3 V CMOS from the SoC side and drive the appropriate display standard on the panel side. The 100-MBGA package exposes enough I/O for full 24-bit RGB plus control signals, and the non-volatile boot ensures the bridge is operational as soon as power is applied - no waiting for software initialization.
Recommended
Industrial Control Glue Logic
In factory-automation controllers, the 5M570ZM100C4N replaces discrete 74-series TTL for encoder counting, PWM generation, watchdog supervision, and fieldbus (Modbus, Profibus) address decoding. Its deterministic timing (9.0 ns tPD) ensures PWM edge accuracy for motor-control loops, and the 1.8 V core with 3.3 V I/O tolerance connects directly to 3.3 V microcontrollers without level shifters. The non-volatile flash makes it immune to configuration corruption in high-vibration industrial environments - a common failure mode for SRAM-based FPGAs.
Recommended
Legacy Board Revision Glue Logic
When revising an older PCB to replace EOL 74-series or GAL22V10-style logic, the 5M570ZM100C4N consolidates dozens of discrete gates into one part while preserving the original board's pin connections. Quartus Prime allows the original schematic-based logic to be recompiled into the MAX V architecture with deterministic timing, often eliminating the need to re-spin the PCB. The 100-MBGA footprint is small enough to fit into legacy through-hole 74LS board space with a minor re-layout, and the non-volatile flash boots with the same logic on every power cycle.
Recommended
Safety-Critical Path Pre-Boot Logic
In automotive and industrial safety subsystems (ISO 26262, IEC 61508), the 5M570ZM100C4N can implement pre-boot safety logic that must be live before the main MCU/SoC executes any code. Examples include external watchdog strobing, voltage-rail brown-out detection, and fail-safe output clamping. Because the MAX V configuration is non-volatile and boots in microseconds, these safety functions are operational as soon as power is applied - without depending on the main SoC's firmware integrity. The deterministic 9.0 ns tPD allows the safety path to react within 1-2 clock cycles of any fault event.
Recommended
Recommended Products Summary
Engineering reference data for 5M570ZM100C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M570ZM100C5N | 5M570ZM100A5N | 5M570ZM100I5N | 5M240ZM100C4N | 5M160ZM100C4N |
|---|---|---|---|---|---|---|
| Package | 100-MBGA (M100) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | MAX V | MAX V | MAX V | MAX V | MAX II | MAX II |
| Macro Cells | 440 | 440 | 440 | 440 | 240 | 160 |
| Pin-to-Pin Delay (tPD) | 9.0 ns | 10.0 ns | 10.0 ns | 10.0 ns | 10.0 ns (MAX II) | 10.0 ns (MAX II) |
| Max Internal Frequency | 184.1 MHz | 152.5 MHz | 118.3 MHz | 152.5 MHz | 118.3 MHz | 118.3 MHz |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
Key Differentiators
- Highest-density 100-MBGA option in the MAX V family (vs 5M240ZM100C4N (MAX II 240 macro cells))
- Faster C4 speed grade vs C5 and A5 (vs 5M570ZM100C5N (C5 speed grade))
- Non-volatile flash configuration, instant-on (vs Small SRAM FPGAs (Cyclone IV, Lattice ECP5))
Design Notes
The 5M570ZM100C4N requires a clean 1.8 V VCCINT supply with separate 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO rails for each bank. Place a 0.1 uF X7R ceramic decoupling capacitor within 3 mm of each VCCINT and VCCIO ball, with a 10 uF bulk tantalum or ceramic on each supply domain. Estimated: total inrush during flash configuration is approximately 100-200 mA peak; budget the 1.8 V regulator for at least 300 mA continuous load capability for reliable JTAG programming.
The 100-MBGA package uses a 0.8 mm ball pitch (verify exact pitch in the MAX V Device Handbook). Use a 4-layer PCB with a solid ground plane beneath the device; route all MBGA signals on the top layer with microvias-in-pad for the inner balls. Place JTAG pins TCK/TMS/TDI/TDO on accessible test points or a 0.1 inch header to support in-system programming during board bring-up. Estimated: with 0.8 mm pitch, the breakout requires 4 mil traces with 4 mil spacing under the BGA - confirm PCB fab capability before tape-out.
The 100-MBGA package has a typical theta-JA of approximately 35-40 C/W in still air (estimated; consult the MAX V thermal model for the exact value). At 184.1 MHz fMAX with all 440 macro cells switching at full toggle rate, the device may dissipate 0.5-1.0 W internal power. For commercial applications in enclosed housings, provide thermal vias beneath the center GND balls and ensure at least 100 LFM airflow if continuous operation near max density is expected. Industrial variants (5M570ZM100I5N) require derating above +85 C ambient.
Do not assume MAX V pinout is compatible with MAX II or MAX 10 devices - even though they share the MAX family naming, pin assignments for the same package code (M100) differ between families. Always regenerate the Quartus Prime pinout and recompile the design when migrating. Also, do not leave JTAG pins floating - TCK must be pulled low, TMS and TDI pulled high through 10 kohm resistors to prevent spurious JTAG state transitions during power-up.
Compliance Information
RoHS compliant per Altera/Intel MAX V product page. Commercial temperature grade only (0 C to +85 C); industrial-grade variant is 5M570ZM100I5N. Not AEC-Q100 qualified; consult Intel/Altera automotive CPLD lines for AEC-Q100 options.
