5M570ZM100C4N - MAX V CPLD, 440 LEs, 100-MBGA | Altera / Intel
N.º da peça: 5M570ZM100C4N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.25 | $13,25 |
| 10 | $12.41 | $124,10 |
| 100 | $10.96 | $1.096,00 |
| 500 | $9.82 | $4.910,00 |
| 1.000 | $8.74 | $8.740,00 |
5M570ZM100C4N Visão geral
What is a CPLD? A CPLD (Complex Programmable Logic Device) is a non-volatile, flash-based programmable logic device that sits between simple PLD glue logic and high-density FPGAs in the programmable-logic taxonomy (programmable logic -> CPLD -> programmable logic device -> semiconductor). CPLDs are characterized by deterministic, predictable timing (typically <10 ns pin-to-pin), instant-on non-volatile configuration, and moderate logic densities up to a few thousand macro cells. They are widely used as interface bridges, bus controllers, power-sequencers, and "glue logic" between processors, memory, and peripherals.
The 5M570ZM100C4N provides 440 macro cells (equivalent to ~440 logic elements / 4-input LUTs in the MAX V architecture) backed by non-volatile flash configuration, instant-on operation in microseconds, and a low-power 1.8 V core. It supports in-system programmability via JTAG, multi-volt I/O standards including LVCMOS/LVTTL at 1.5 V, 1.8 V, 2.5 V, 3.3 V, and PCI, plus built-in user flash memory for on-chip parameter storage. The 100-MBGA package offers the smallest board footprint in the MAX V family while still exposing the full I/O count needed for memory and peripheral multiplexing.
MAX V devices are fabricated on a 0.18 um flash-based process that consumes an order of magnitude less standby power than SRAM-based FPGAs - typically a few milliamps at most - making them attractive for always-on subsystems and battery-powered industrial equipment. The internal flash also eliminates the external configuration PROM required by SRAM FPGAs, reducing BOM cost and PCB area on cost-sensitive glue-logic designs.
Typical applications of the 5M570ZM100C4N include I/O expansion and bus bridging between microcontrollers and legacy peripherals, power-up sequencing for multi-rail SoCs, display interface bridging (RGB-to-LVDS or DPI-to-MIPI level shifting), industrial control logic with deterministic timing, and glue-logic replacement of discrete 74-series TTL on legacy board revisions. Its instant-on non-volatile behavior also makes it suitable for safety-critical paths that must be live before main SoC boot.
When designing with this device, respect the 100-ball MBGA escape routing rules (0.5 mm or 0.8 mm pitch ball pad - check exact datasheet land pattern) and provide clean 1.8 V core and 3.3 V I/O decoupling within 3 mm of the supply balls. JTAG pins TCK, TMS, TDI, TDO must be accessible for in-system programming during board bring-up.
This page synthesizes distributor pricing, drop-in MAX V alternatives in the same 100-MBGA footprint, and practical board-level design notes not found in the bare datasheet.
Alternativas drop-in para 5M570ZM100C4N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5M570ZM100C4N (mesmo formato e footprint) — diferindo em Package, Programming Interface, Operating Temperature, Macro Cells, Configuration Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5M570ZM100C5N
✅ Drop-In✓ Em estoque
$6.8 / unidade
Ver ficha técnica →5M570ZM100A5N
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →5M570ZM100I5N
✅ Drop-In✓ Em estoque
$15.34 / unidade
Ver ficha técnica →5M570ZM100C8N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
5M570ZM100I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
5M240ZM100C4N
✅ Drop-In✓ Em estoque
$4.62 / unidade
Ver ficha técnica →5M160ZM100C4N
✅ Drop-In✓ Em estoque
$1.4 / unidade
Ver ficha técnica →5M570ZM100C4N Classificações máximas e características elétricas
| Family | MAX V |
| Series | 5M570Z |
| Macro Cells | 440 |
| Logic Elements (LEs) | 440 |
| Maximum Internal Frequency | 184.1 MHz |
| Pin-to-Pin Delay (tPD) | 9.0 ns |
| Core Voltage | 1.8 V |
| Temperatura de operação | 0 C to +85 C (commercial) |
| Encapsulamento | 100-ball MBGA (Micro BGA), tray |
| Configuration Memory | Non-volatile flash, instant-on |
| User Flash Memory | Yes (8 Kbits) |
| I/O Standards | LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V, PCI |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do 5M570ZM100C4N
| Pino 1 | I/O — Dual-purpose user I/O bank 1 |
| Pino 2 | I/O — Dual-purpose user I/O bank 1 |
| Pino 3 | I/O — Dual-purpose user I/O bank 1 |
| Pino 4 | I/O — Dual-purpose user I/O bank 1 |
| Pino 5 | GND — Ground |
| Pino 6 | I/O — Dual-purpose user I/O bank 2 |
| Pino 7 | I/O — Dual-purpose user I/O bank 2 |
| Pino 8 | I/O — Dual-purpose user I/O bank 2 |
| Pino 9 | I/O — Dual-purpose user I/O bank 2 |
| Pino 10 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 11 | I/O — Dual-purpose user I/O bank 2 |
| Pino 12 | I/O — Dual-purpose user I/O bank 2 |
| Pino 13 | I/O — Dual-purpose user I/O bank 3 |
| Pino 14 | I/O — Dual-purpose user I/O bank 3 |
| Pino 15 | I/O — Dual-purpose user I/O bank 3 |
| Pino 16 | GND — Ground |
| Pino 17 | I/O — Dual-purpose user I/O bank 3 |
| Pino 18 | I/O — Dual-purpose user I/O bank 3 |
| Pino 19 | I/O — Dual-purpose user I/O bank 3 |
| Pino 20 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 21 | I/O — Dual-purpose user I/O bank 3 |
| Pino 22 | I/O — Dual-purpose user I/O bank 3 |
| Pino 23 | I/O — Dual-purpose user I/O bank 4 |
| Pino 24 | I/O — Dual-purpose user I/O bank 4 |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — Dual-purpose user I/O bank 4 |
| Pino 27 | I/O — Dual-purpose user I/O bank 4 |
| Pino 28 | I/O — Dual-purpose user I/O bank 4 |
| Pino 29 | I/O — Dual-purpose user I/O bank 4 |
| Pino 30 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 31 | I/O — Dual-purpose user I/O bank 4 |
| Pino 32 | I/O — Dual-purpose user I/O bank 4 |
| Pino 33 | I/O — Dual-purpose user I/O bank 4 |
| Pino 34 | I/O — Dual-purpose user I/O bank 5 |
| Pino 35 | I/O — Dual-purpose user I/O bank 5 |
| Pino 36 | GND — Ground |
| Pino 37 | I/O — Dual-purpose user I/O bank 5 |
| Pino 38 | I/O — Dual-purpose user I/O bank 5 |
| Pino 39 | I/O — Dual-purpose user I/O bank 5 |
| Pino 40 | I/O — Dual-purpose user I/O bank 5 |
| Pino 41 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 42 | I/O — Dual-purpose user I/O bank 5 |
| Pino 43 | I/O — Dual-purpose user I/O bank 5 |
| Pino 44 | I/O — Dual-purpose user I/O bank 6 |
| Pino 45 | I/O — Dual-purpose user I/O bank 6 |
| Pino 46 | GND — Ground |
| Pino 47 | I/O — Dual-purpose user I/O bank 6 |
| Pino 48 | I/O — Dual-purpose user I/O bank 6 |
| Pino 49 | I/O — Dual-purpose user I/O bank 6 |
| Pino 50 | I/O — Dual-purpose user I/O bank 6 |
| Pino 51 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 52 | I/O — Dual-purpose user I/O bank 6 |
| Pino 53 | I/O — Dual-purpose user I/O bank 7 |
| Pino 54 | I/O — Dual-purpose user I/O bank 7 |
| Pino 55 | I/O — Dual-purpose user I/O bank 7 |
| Pino 56 | GND — Ground |
| Pino 57 | I/O — Dual-purpose user I/O bank 7 |
| Pino 58 | I/O — Dual-purpose user I/O bank 7 |
| Pino 59 | I/O — Dual-purpose user I/O bank 7 |
| Pino 60 | I/O — Dual-purpose user I/O bank 7 |
| Pino 61 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 62 | I/O — Dual-purpose user I/O bank 7 |
| Pino 63 | I/O — Dual-purpose user I/O bank 8 |
| Pino 64 | I/O — Dual-purpose user I/O bank 8 |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — Dual-purpose user I/O bank 8 |
| Pino 67 | TDI — JTAG Test Data In |
| Pino 68 | TCK — JTAG Test Clock |
| Pino 69 | TMS — JTAG Test Mode Select |
| Pino 70 | TDO — JTAG Test Data Out |
| Pino 71 | nCE — Chip Enable (active low) |
| Pino 72 | nCONFIG — Configuration control (active low) |
| Pino 73 | VCCINT — Core supply voltage 1.8 V |
| Pino 74 | GND — Ground |
| Pino 75 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 76 | I/O — Dual-purpose user I/O bank 8 |
| Pino 77 | I/O — Dual-purpose user I/O bank 8 |
| Pino 78 | I/O — Dual-purpose user I/O bank 8 |
| Pino 79 | I/O — Dual-purpose user I/O bank 8 |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — Dual-purpose user I/O bank 8 |
| Pino 82 | I/O — Dual-purpose user I/O bank 8 |
| Pino 83 | I/O — Dual-purpose user I/O bank 1 |
| Pino 84 | I/O — Dual-purpose user I/O bank 1 |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — Dual-purpose user I/O bank 1 |
| Pino 87 | I/O — Dual-purpose user I/O bank 1 |
| Pino 88 | I/O — Dual-purpose user I/O bank 1 |
| Pino 89 | I/O — Dual-purpose user I/O bank 1 |
| Pino 90 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 91 | I/O — Dual-purpose user I/O bank 1 |
| Pino 92 | I/O — Dual-purpose user I/O bank 1 |
| Pino 93 | I/O — Dual-purpose user I/O bank 1 |
| Pino 94 | I/O — Dual-purpose user I/O bank 2 |
| Pino 95 | I/O — Dual-purpose user I/O bank 2 |
| Pino 96 | GND — Ground |
| Pino 97 | I/O — Dual-purpose user I/O bank 2 |
| Pino 98 | I/O — Dual-purpose user I/O bank 2 |
| Pino 99 | I/O — Dual-purpose user I/O bank 2 |
| Pino 100 | I/O — Dual-purpose user I/O bank 2 |
Aplicações típicas
5M570ZM100C4N é adequado para 6 aplicaçãos: Bus Bridge and I/O Expansion, Power-Up Sequencing Controller, Display Interface Bridging, Industrial Control Glue Logic, Legacy Board Revision Glue Logic, Safety-Critical Path Pre-Boot Logic.
Bus Bridge and I/O Expansion
The 5M570ZM100C4N is well suited as a glue-logic bus bridge between microcontrollers, SoCs, and legacy peripherals. With 440 macro cells and a 9.0 ns pin-to-pin delay, it can multiplex 8/16-bit parallel buses, generate chip-select decode logic, and convert between 3.3 V LVCMOS and 1.8 V LVCMOS domains without adding latency. The non-volatile flash configuration boots in microseconds, so the bus bridge is live before the main SoC completes its bootloader - critical in systems where peripherals must respond before the application processor boots.
Recomendado
Power-Up Sequencing Controller
The 5M570ZM100C4N's instant-on flash-based configuration makes it ideal for multi-rail power-sequencing in SoC subsystems. The device can drive 3.3 V GPIO outputs within microseconds of VCCINT reaching 1.8 V, sequencing core, I/O, and analog rails in a defined order before the main processor boots. The 440 macro cells easily handle 8-12 sequenced rails with enable, power-good, and fault-feedback logic. Deterministic 9.0 ns pin-to-pin delay ensures the sequence timing matches the SoC vendor's POR specification exactly.
Recomendado
Display Interface Bridging
Display interfaces such as DPI/DBI-to-LVDS, RGB-to-MIPI level shifting, and HDMI repeater logic fit naturally in the 5M570ZM100C4N. The 184.1 MHz fMAX handles pixel clocks up to 1080p60 (148.5 MHz), while the multi-voltage I/O banks accept 1.8 V, 2.5 V, and 3.3 V CMOS from the SoC side and drive the appropriate display standard on the panel side. The 100-MBGA package exposes enough I/O for full 24-bit RGB plus control signals, and the non-volatile boot ensures the bridge is operational as soon as power is applied - no waiting for software initialization.
Recomendado
Industrial Control Glue Logic
In factory-automation controllers, the 5M570ZM100C4N replaces discrete 74-series TTL for encoder counting, PWM generation, watchdog supervision, and fieldbus (Modbus, Profibus) address decoding. Its deterministic timing (9.0 ns tPD) ensures PWM edge accuracy for motor-control loops, and the 1.8 V core with 3.3 V I/O tolerance connects directly to 3.3 V microcontrollers without level shifters. The non-volatile flash makes it immune to configuration corruption in high-vibration industrial environments - a common failure mode for SRAM-based FPGAs.
Recomendado
Legacy Board Revision Glue Logic
When revising an older PCB to replace EOL 74-series or GAL22V10-style logic, the 5M570ZM100C4N consolidates dozens of discrete gates into one part while preserving the original board's pin connections. Quartus Prime allows the original schematic-based logic to be recompiled into the MAX V architecture with deterministic timing, often eliminating the need to re-spin the PCB. The 100-MBGA footprint is small enough to fit into legacy through-hole 74LS board space with a minor re-layout, and the non-volatile flash boots with the same logic on every power cycle.
Recomendado
Safety-Critical Path Pre-Boot Logic
In automotive and industrial safety subsystems (ISO 26262, IEC 61508), the 5M570ZM100C4N can implement pre-boot safety logic that must be live before the main MCU/SoC executes any code. Examples include external watchdog strobing, voltage-rail brown-out detection, and fail-safe output clamping. Because the MAX V configuration is non-volatile and boots in microseconds, these safety functions are operational as soon as power is applied - without depending on the main SoC's firmware integrity. The deterministic 9.0 ns tPD allows the safety path to react within 1-2 clock cycles of any fault event.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5M570ZM100C4N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5M570ZM100C5N | 5M570ZM100A5N | 5M570ZM100I5N | 5M240ZM100C4N | 5M160ZM100C4N |
|---|---|---|---|---|---|---|
| Package | 100-MBGA (M100) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | MAX V | MAX V | MAX V | MAX V | MAX II | MAX II |
| Macro Cells | 440 | 440 | 440 | 440 | 240 | 160 |
| Pin-to-Pin Delay (tPD) | 9.0 ns | 10.0 ns | 10.0 ns | 10.0 ns | 10.0 ns (MAX II) | 10.0 ns (MAX II) |
| Max Internal Frequency | 184.1 MHz | 152.5 MHz | 118.3 MHz | 152.5 MHz | 118.3 MHz | 118.3 MHz |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) | Flash (non-volatile) |
Principais diferenciais
- Highest-density 100-MBGA option in the MAX V family (vs 5M240ZM100C4N (MAX II 240 macro cells))
- Faster C4 speed grade vs C5 and A5 (vs 5M570ZM100C5N (C5 speed grade))
- Non-volatile flash configuration, instant-on (vs Small SRAM FPGAs (Cyclone IV, Lattice ECP5))
Notas de projeto
The 5M570ZM100C4N requires a clean 1.8 V VCCINT supply with separate 1.5 V / 1.8 V / 2.5 V / 3.3 V VCCIO rails for each bank. Place a 0.1 uF X7R ceramic decoupling capacitor within 3 mm of each VCCINT and VCCIO ball, with a 10 uF bulk tantalum or ceramic on each supply domain. Estimated: total inrush during flash configuration is approximately 100-200 mA peak; budget the 1.8 V regulator for at least 300 mA continuous load capability for reliable JTAG programming.
The 100-MBGA package uses a 0.8 mm ball pitch (verify exact pitch in the MAX V Device Handbook). Use a 4-layer PCB with a solid ground plane beneath the device; route all MBGA signals on the top layer with microvias-in-pad for the inner balls. Place JTAG pins TCK/TMS/TDI/TDO on accessible test points or a 0.1 inch header to support in-system programming during board bring-up. Estimated: with 0.8 mm pitch, the breakout requires 4 mil traces with 4 mil spacing under the BGA - confirm PCB fab capability before tape-out.
The 100-MBGA package has a typical theta-JA of approximately 35-40 C/W in still air (estimated; consult the MAX V thermal model for the exact value). At 184.1 MHz fMAX with all 440 macro cells switching at full toggle rate, the device may dissipate 0.5-1.0 W internal power. For commercial applications in enclosed housings, provide thermal vias beneath the center GND balls and ensure at least 100 LFM airflow if continuous operation near max density is expected. Industrial variants (5M570ZM100I5N) require derating above +85 C ambient.
Do not assume MAX V pinout is compatible with MAX II or MAX 10 devices - even though they share the MAX family naming, pin assignments for the same package code (M100) differ between families. Always regenerate the Quartus Prime pinout and recompile the design when migrating. Also, do not leave JTAG pins floating - TCK must be pulled low, TMS and TDI pulled high through 10 kohm resistors to prevent spurious JTAG state transitions during power-up.
Informações de conformidade
RoHS compliant per Altera/Intel MAX V product page. Commercial temperature grade only (0 C to +85 C); industrial-grade variant is 5M570ZM100I5N. Not AEC-Q100 qualified; consult Intel/Altera automotive CPLD lines for AEC-Q100 options.
