ATSAME54N19A-AUT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
MPN: ATSAME54N19A-AUT ✓ نشطATSAME54N19A-AUT نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and configurable peripherals on one die. The Cortex-M4F core sits inside the ARM Cortex-M family, which targets deterministic real-time embedded control. The same-family members (SAM E51, SAM E53, SAM E54, SAMD51) share the Cortex-M4F architecture, peripheral set, and toolchain (Microchip Studio, MPLAB X, Harmony), allowing software portability across products that scale in flash, RAM, and pin count.
Key features of the ATSAME54N19A-AUT include a 120 MHz Cortex-M4F core with DSP extensions, 512 KB dual-panel Flash, 256 KB SRAM, a high-speed 12-bit ADC up to 1 MSPS, USB 2.0 Full-Speed with embedded Host and Device, CAN-FD, multiple SERCOM, I2S, and a hardware cryptographic module. The automotive temperature grade (-40C to +85C) and the AUT suffix indicate conformance with Microchip's automotive qualification flow.
The device uses a sophisticated bus matrix (AHB/APB) with separate code and system buses for deterministic DMA and interrupt latency, supporting both code execution from Flash with zero-wait-state via the FPU and efficient DSP filter operations. The dual-panel Flash architecture enables live firmware updates without downtime, while ECC on Flash and SRAM detects and corrects single-bit errors in mission-critical applications.
Typical applications include automotive body and infotainment modules, industrial control panels, USB peripherals, CAN-FD gateways, motor control, and secure connected IoT nodes. Designers choose it when they need ARM Cortex-M4F DSP performance, automotive temperature range, USB and CAN-FD connectivity, and an integrated crypto accelerator in a 100-pin TQFP footprint.
When laying out the PCB, dedicate at least one solid ground plane beneath the device, place the 0.1 uF VDD decoupling capacitors within 5 mm of each VDD pin, and reserve the SWD/SWC pins for programming. The 100-pin TQFP requires thermal vias under the die-attach pad; the pad is internally connected to ground but should still receive multiple stitching vias for stable operation at high ambient temperature.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet with engineering decision support.
بدائل مباشرة لـ ATSAME54N19A-AUT — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع ATSAME54N19A-AUT (نفس عامل الشكل والبصمة) — يختلف في USB, ADC, Core, Package, Operating Temperature.
ATSAME54N19A-AU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME54N19A-AU-EFP
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME54N19A-AF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME53N20A-AU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME53N19A-AU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME51N19A-AU
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←ATSAME54N19A-AUT الحدود القصوى والخصائص الكهربائية
| Core | ARM Cortex-M4F with FPU |
| Maximum Clock Speed | 120 MHz |
| Instruction Set Width | 32-bit |
| Program Memory (Flash) | 512 KB with ECC |
| SRAM | 256 KB with ECC |
| العلبة | 100-pin TQFP (14x14 mm) |
| درجة حرارة التشغيل | -40C to +85C (automotive grade) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 12-bit |
| USB | USB 2.0 Full-Speed Host and Device |
| CAN | CAN-FD |
| SERCOM | Up to 8 configurable SERCOM (UART/SPI/I2C) |
| Crypto Accelerator | AES, SHA, True RNG |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 |
| حالة RoHS | Compliant |
| Automotive Qualification | AEC-Q100 (AUT suffix) |
تكوين أطراف ATSAME54N19A-AUT
| دبوس 1 | PB09 — GPIO/SERCOM pad |
| دبوس 2 | PB10 — GPIO/SERCOM pad |
| دبوس 3 | PB11 — GPIO/SERCOM pad |
| دبوس 4 | PA12 — GPIO/SERCOM pad |
| دبوس 5 | PA13 — GPIO/SERCOM pad |
| دبوس 6 | PA14 — GPIO/SERCOM pad |
| دبوس 7 | PA15 — GPIO/SERCOM pad |
| دبوس 8 | PA16 — GPIO/SERCOM pad |
| دبوس 9 | PA17 — GPIO/SERCOM pad |
| دبوس 10 | PA18 — GPIO/SERCOM pad |
| دبوس 11 | PA19 — GPIO/SERCOM pad |
| دبوس 12 | PA20 — GPIO/SERCOM pad |
| دبوس 13 | PA21 — GPIO/SERCOM pad |
| دبوس 14 | PA22 — GPIO/SERCOM pad |
| دبوس 15 | PA23 — GPIO/SERCOM pad |
| دبوس 16 | PA24 — GPIO/SERCOM pad |
| دبوس 17 | PA25 — GPIO/SERCOM pad |
| دبوس 18 | PA27 — GPIO/SERCOM pad |
| دبوس 19 | NC — Not connected (per datasheet) |
| دبوس 20 | GND — Ground |
| دبوس 21 | PA28 — GPIO/SERCOM pad |
| دبوس 22 | PA29 — GPIO/SERCOM pad |
| دبوس 23 | PA30 — GPIO/SERCOM pad |
| دبوس 24 | PA31 — GPIO/SERCOM pad |
| دبوس 25 | PB00 — GPIO/SERCOM pad |
| دبوس 26 | PB01 — GPIO/SERCOM pad |
| دبوس 27 | PB02 — GPIO/SERCOM pad |
| دبوس 28 | PB03 — GPIO/SERCOM pad |
| دبوس 29 | PB04 — GPIO/SERCOM pad |
| دبوس 30 | PB05 — GPIO/SERCOM pad |
| دبوس 31 | PB06 — GPIO/SERCOM pad |
| دبوس 32 | PB07 — GPIO/SERCOM pad |
| دبوس 33 | PB08 — GPIO/SERCOM pad |
| دبوس 34 | PB12 — GPIO/SERCOM pad |
| دبوس 35 | PB13 — GPIO/SERCOM pad |
| دبوس 36 | PB14 — GPIO/SERCOM pad |
| دبوس 37 | PB15 — GPIO/SERCOM pad |
| دبوس 38 | PC00 — GPIO/SERCOM pad |
| دبوس 39 | PC01 — GPIO/SERCOM pad |
| دبوس 40 | PC02 — GPIO/SERCOM pad |
| دبوس 41 | PC03 — GPIO/SERCOM pad |
| دبوس 42 | VSS — Ground (decoupling) |
| دبوس 43 | VDD — Digital supply 1.62-3.6 V |
| دبوس 44 | PC04 — GPIO/SERCOM pad |
| دبوس 45 | PC05 — GPIO/SERCOM pad |
| دبوس 46 | PC06 — GPIO/SERCOM pad |
| دبوس 47 | PC07 — GPIO/SERCOM pad |
| دبوس 48 | PC08 — GPIO/SERCOM pad |
| دبوس 49 | PC09 — GPIO/SERCOM pad |
| دبوس 50 | PC10 — GPIO/SERCOM pad |
| دبوس 51 | PC11 — GPIO/SERCOM pad |
| دبوس 52 | PC12 — GPIO/SERCOM pad |
| دبوس 53 | PC13 — GPIO/SERCOM pad |
| دبوس 54 | PC14 — GPIO/SERCOM pad |
| دبوس 55 | PC15 — GPIO/SERCOM pad |
| دبوس 56 | PC16 — GPIO/SERCOM pad |
| دبوس 57 | PC17 — GPIO/SERCOM pad |
| دبوس 58 | PC18 — GPIO/SERCOM pad |
| دبوس 59 | PC19 — GPIO/SERCOM pad |
| دبوس 60 | PC20 — GPIO/SERCOM pad |
| دبوس 61 | PC21 — GPIO/SERCOM pad |
| دبوس 62 | PC22 — GPIO/SERCOM pad |
| دبوس 63 | PC23 — GPIO/SERCOM pad |
| دبوس 64 | PC24 — GPIO/SERCOM pad |
| دبوس 65 | PC25 — GPIO/SERCOM pad |
| دبوس 66 | PC26 — GPIO/SERCOM pad |
| دبوس 67 | PC27 — GPIO/SERCOM pad |
| دبوس 68 | PC28 — GPIO/SERCOM pad |
| دبوس 69 | PD00 — GPIO/SERCOM pad |
| دبوس 70 | PD01 — GPIO/SERCOM pad |
| دبوس 71 | PD02 — GPIO/SERCOM pad |
| دبوس 72 | PD03 — GPIO/SERCOM pad |
| دبوس 73 | PD04 — GPIO/SERCOM pad |
| دبوس 74 | PD05 — GPIO/SERCOM pad |
| دبوس 75 | PD06 — GPIO/SERCOM pad |
| دبوس 76 | PD07 — GPIO/SERCOM pad |
| دبوس 77 | PD08 — GPIO/SERCOM pad |
| دبوس 78 | PD09 — GPIO/SERCOM pad |
| دبوس 79 | PD10 — GPIO/SERCOM pad |
| دبوس 80 | PD11 — GPIO/SERCOM pad |
| دبوس 81 | PD12 — GPIO/SERCOM pad |
| دبوس 82 | VSS — Ground (decoupling) |
| دبوس 83 | VDD — Digital supply 1.62-3.6 V |
| دبوس 84 | VBAT — RTC backup supply |
| دبوس 85 | RESETn — Active-low reset input |
| دبوس 86 | SWDIO — Serial Wire Debug I/O |
| دبوس 87 | SWCLK — Serial Wire Debug clock |
| دبوس 88 | PA00 — GPIO/XIN32K |
| دبوس 89 | PA01 — GPIO/XOUT32K |
| دبوس 90 | PA02 — GPIO/ADC AIN0 |
| دبوس 91 | PA03 — GPIO/ADC AIN1 |
| دبوس 92 | PA04 — GPIO/ADC AIN2 / VREF |
| دبوس 93 | PA05 — GPIO/ADC AIN3 |
| دبوس 94 | PA06 — GPIO/ADC AIN4 |
| دبوس 95 | PA07 — GPIO/ADC AIN5 |
| دبوس 96 | PA08 — GPIO/ADC AIN6 |
| دبوس 97 | PA09 — GPIO/ADC AIN7 |
| دبوس 98 | PA10 — GPIO/ADC AIN8 |
| دبوس 99 | PA11 — GPIO/ADC AIN9 |
| دبوس 100 | VSS — Ground |
التطبيقات النموذجية
ATSAME54N19A-AUT مناسب لـ 6 التطبيقs: Automotive Body and Comfort Modules, USB Peripherals and HID Devices, CAN-FD Gateways and Vehicle Networks, Industrial Control Panels, Motor Control and FOC Drives, Secure Connected IoT Nodes.
Automotive Body and Comfort Modules
The ATSAME54N19A-AUT is a strong fit for automotive body control modules such as body controllers, lighting ECUs, seat controllers, and HVAC front-ends. Its Cortex-M4F core delivers 180 DMIPS at 120 MHz, sufficient for CAN-FD stack processing, LIN master tasks, and body-domain signal conditioning, while 512 KB ECC Flash and 256 KB ECC SRAM host full AUTOSAR-class application code with fault detection. AEC-Q100 qualification from the AUT suffix lets designers release the design directly into vehicle programs without re-qualification. The 100-pin TQFP exposes enough GPIO and ADC channels to drive multiple LED matrices, motor bridges, and sensor inputs from a single chip.
موصى به
USB Peripherals and HID Devices
The ATSAME54N19A-AUT integrates a USB 2.0 Full-Speed controller with on-chip Host and Device, plus an internal 3.3 V regulator and 8 SERCOM channels, which makes it ideal for USB peripherals such as HIDs, data loggers, audio interfaces, and industrial input devices. Designers avoid an external USB PHY, save BOM cost, and the 120 MHz Cortex-M4F handles USB stack plus DSP-grade audio sample routing simultaneously. AEC-Q100 grading also enables in-cabin USB charging ports and infotainment accessory controllers. Recommended SERCOM allocation is 1-2 channels for external SPI/I2C sensors while the remaining channels stay free for debug and expansion.
موصى به
CAN-FD Gateways and Vehicle Networks
The ATSAME54N19A-AUT is well-suited for automotive gateways that bridge CAN-FD and classical CAN networks between body, chassis, and powertrain domains. Its Cortex-M4F core runs the CAN-FD stack at line rate without bottlenecks, while ECC-protected 512 KB Flash and 256 KB SRAM hold protocol translation tables and security keys. Multiple SERCOM channels support SPI-attached Ethernet PHYs or LIN transceivers, expanding gateway connectivity. The AUT grade and -40C to +85C range cover under-hood and cabin placements.
موصى به
Industrial Control Panels
For industrial HMI panels, PLCs, and process controllers, the ATSAME54N19A-AUT provides 120 MHz Cortex-M4F performance for real-time control loops, 12-bit 1 MSPS ADC for analog signal acquisition, and CAN-FD for fieldbus communication. 256 KB ECC SRAM holds real-time control tables, while 512 KB ECC Flash stores the full firmware with safety margins. The 100-pin TQFP package is widely available and supported by Microchip Harmony and MPLAB X IDE, accelerating certification cycles for IEC 61508 and UL 508 designs.
موصى به
Motor Control and FOC Drives
The ATSAME54N19A-AUT drives sensorless and encoder-based BLDC and PMSM motors using field-oriented control algorithms running on the Cortex-M4F core. The DSP extensions accelerate Park/Clarke transforms and PID loops, while the 12-bit DAC outputs reference waveforms for debug. CAN-FD and USB connectivity make the drive factory-configurable and field-updatable. ECC on Flash and SRAM prevents corruption in high-vibration motor housings, and the automotive temperature grade supports under-hood mounting.
موصى به
Secure Connected IoT Nodes
The ATSAME54N19A-AUT includes a hardware cryptographic accelerator with AES, SHA, and True RNG, allowing secure boot, TLS handshakes, and over-the-air firmware updates without external crypto chips. Pairing this with the USB device controller and 8 SERCOM channels supports secure IoT gateways, asset trackers, and edge AI sensor nodes. The dual-panel Flash enables fail-safe firmware updates, while ECC memory ensures data integrity in remote deployments. The automotive grade extends operational life to industrial and outdoor installations.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ ATSAME54N19A-AUT — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | ATSAME54N19A-AU | ATSAME54N19A-AU-EFP | ATSAME54N19A-AF | ATSAME53N20A-AU | ATSAME53N19A-AU | ATSAME51N19A-AU |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14 mm) | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 100 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB |
| CAN-FD | Yes | Yes | Yes | Yes | No | No | No |
| Automotive Grade (AEC-Q100) | Yes (AUT) | No | No | No | No | No | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- AEC-Q100 qualified automotive variant (مقابلATSAME54N19A-AU)
- Largest ECC-protected memory in SAM E5x family (مقابلATSAME53N19A-AU)
- Full CAN-FD and USB Host/Device stack on-chip (مقابلATSAME51N19A-AU)
ملاحظات التصميم
Place a 10 uF bulk capacitor plus 100 nF and 1 nF ceramic decoupling capacitors within 5 mm of each VDD pin (TQFP-100 has multiple VDD pairs). The internal DC-DC regulator requires an external inductor on VSW; keep the inductor loop area small (under 0.5 cm^2) to limit EMI. A VBAT pin powers the RTC backup domain and must be tied to a coin cell or main VDD through a 0 ohm jumper if RTC is unused.
Reserve the SWD/SWC pins (typically PA30/PA31 on TQFP-100) for in-circuit programming and dedicate a 10-pin Cortex Debug connector footprint to enable field firmware updates. Avoid routing high-speed signals (USB DP/DM, CAN-FD) across the chip footprint; route on the bottom layer with a continuous ground reference plane to maintain 90 ohm differential impedance.
Estimated: at 120 MHz CPU speed with full peripheral activity the SAM E54 dissipates roughly 80-100 mW; this is well within the TQFP-100 thermal envelope (theta_JA approximately 50 C/W on a 2-layer JEDEC test board). For automotive under-hood placement above +85C ambient, use a 4-layer PCB with a dedicated ground plane to keep junction rise below 10 C.
Do not assume the AUT suffix means extended temperature (-40C to +125C); for under-hood applications above +85C select a part specifically graded to AEC-Q100 Grade 0/1. Also verify that BOOTPROT fuse settings are locked before shipping production units - unlocked fuses allow external flash read-back via SWD. Enable ECC on Flash and SRAM to take advantage of the silicon's built-in single-bit correction.
معلومات الامتثال
AUT suffix indicates AEC-Q100 automotive qualification per Microchip datasheet. RoHS and REACH compliance stated on Microchip product page.
