ATSAME54N19A-AUT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
Référence : ATSAME54N19A-AUT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.84 | $9,84 |
| 10 | $8.92 | $89,20 |
| 100 | $7.65 | $765,00 |
| 500 | $6.78 | $3 390,00 |
| 1 000 | $5.94 | $5 940,00 |
ATSAME54N19A-AUT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and configurable peripherals on one die. The Cortex-M4F core sits inside the ARM Cortex-M family, which targets deterministic real-time embedded control. The same-family members (SAM E51, SAM E53, SAM E54, SAMD51) share the Cortex-M4F architecture, peripheral set, and toolchain (Microchip Studio, MPLAB X, Harmony), allowing software portability across products that scale in flash, RAM, and pin count.
Key features of the ATSAME54N19A-AUT include a 120 MHz Cortex-M4F core with DSP extensions, 512 KB dual-panel Flash, 256 KB SRAM, a high-speed 12-bit ADC up to 1 MSPS, USB 2.0 Full-Speed with embedded Host and Device, CAN-FD, multiple SERCOM, I2S, and a hardware cryptographic module. The automotive temperature grade (-40C to +85C) and the AUT suffix indicate conformance with Microchip's automotive qualification flow.
The device uses a sophisticated bus matrix (AHB/APB) with separate code and system buses for deterministic DMA and interrupt latency, supporting both code execution from Flash with zero-wait-state via the FPU and efficient DSP filter operations. The dual-panel Flash architecture enables live firmware updates without downtime, while ECC on Flash and SRAM detects and corrects single-bit errors in mission-critical applications.
Typical applications include automotive body and infotainment modules, industrial control panels, USB peripherals, CAN-FD gateways, motor control, and secure connected IoT nodes. Designers choose it when they need ARM Cortex-M4F DSP performance, automotive temperature range, USB and CAN-FD connectivity, and an integrated crypto accelerator in a 100-pin TQFP footprint.
When laying out the PCB, dedicate at least one solid ground plane beneath the device, place the 0.1 uF VDD decoupling capacitors within 5 mm of each VDD pin, and reserve the SWD/SWC pins for programming. The 100-pin TQFP requires thermal vias under the die-attach pad; the pad is internally connected to ground but should still receive multiple stitching vias for stable operation at high ambient temperature.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet with engineering decision support.
Alternatives de remplacement direct pour ATSAME54N19A-AUT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME54N19A-AUT (même facteur de forme et même empreinte) — différant par USB, ADC, Core, Package, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME54N19A-AU
✅ Remplacement direct✓ En stock
$5.42 / unité
Voir la fiche technique →ATSAME54N19A-AU-EFP
✅ Remplacement direct✓ En stock
$7.28 / unité
Voir la fiche technique →ATSAME54N19A-AF
✅ Remplacement direct✓ En stock
$5.49 / unité
Voir la fiche technique →ATSAME53N20A-AU
✅ Remplacement direct✓ En stock
$10.3 / unité
Voir la fiche technique →ATSAME53N19A-AU
✅ Remplacement direct✓ En stock
$5.4 / unité
Voir la fiche technique →ATSAME51N19A-AU
✅ Remplacement direct✓ En stock
$4.98 / unité
Voir la fiche technique →ATSAME54N19A-AUT Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4F with FPU |
| Maximum Clock Speed | 120 MHz |
| Instruction Set Width | 32-bit |
| Program Memory (Flash) | 512 KB with ECC |
| SRAM | 256 KB with ECC |
| Boîtier | 100-pin TQFP (14x14 mm) |
| Température de fonctionnement | -40C to +85C (automotive grade) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 12-bit |
| USB | USB 2.0 Full-Speed Host and Device |
| CAN | CAN-FD |
| SERCOM | Up to 8 configurable SERCOM (UART/SPI/I2C) |
| Crypto Accelerator | AES, SHA, True RNG |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| Automotive Qualification | AEC-Q100 (AUT suffix) |
Configuration des broches de ATSAME54N19A-AUT
| Broche 1 | PB09 — GPIO/SERCOM pad |
| Broche 2 | PB10 — GPIO/SERCOM pad |
| Broche 3 | PB11 — GPIO/SERCOM pad |
| Broche 4 | PA12 — GPIO/SERCOM pad |
| Broche 5 | PA13 — GPIO/SERCOM pad |
| Broche 6 | PA14 — GPIO/SERCOM pad |
| Broche 7 | PA15 — GPIO/SERCOM pad |
| Broche 8 | PA16 — GPIO/SERCOM pad |
| Broche 9 | PA17 — GPIO/SERCOM pad |
| Broche 10 | PA18 — GPIO/SERCOM pad |
| Broche 11 | PA19 — GPIO/SERCOM pad |
| Broche 12 | PA20 — GPIO/SERCOM pad |
| Broche 13 | PA21 — GPIO/SERCOM pad |
| Broche 14 | PA22 — GPIO/SERCOM pad |
| Broche 15 | PA23 — GPIO/SERCOM pad |
| Broche 16 | PA24 — GPIO/SERCOM pad |
| Broche 17 | PA25 — GPIO/SERCOM pad |
| Broche 18 | PA27 — GPIO/SERCOM pad |
| Broche 19 | NC — Not connected (per datasheet) |
| Broche 20 | GND — Ground |
| Broche 21 | PA28 — GPIO/SERCOM pad |
| Broche 22 | PA29 — GPIO/SERCOM pad |
| Broche 23 | PA30 — GPIO/SERCOM pad |
| Broche 24 | PA31 — GPIO/SERCOM pad |
| Broche 25 | PB00 — GPIO/SERCOM pad |
| Broche 26 | PB01 — GPIO/SERCOM pad |
| Broche 27 | PB02 — GPIO/SERCOM pad |
| Broche 28 | PB03 — GPIO/SERCOM pad |
| Broche 29 | PB04 — GPIO/SERCOM pad |
| Broche 30 | PB05 — GPIO/SERCOM pad |
| Broche 31 | PB06 — GPIO/SERCOM pad |
| Broche 32 | PB07 — GPIO/SERCOM pad |
| Broche 33 | PB08 — GPIO/SERCOM pad |
| Broche 34 | PB12 — GPIO/SERCOM pad |
| Broche 35 | PB13 — GPIO/SERCOM pad |
| Broche 36 | PB14 — GPIO/SERCOM pad |
| Broche 37 | PB15 — GPIO/SERCOM pad |
| Broche 38 | PC00 — GPIO/SERCOM pad |
| Broche 39 | PC01 — GPIO/SERCOM pad |
| Broche 40 | PC02 — GPIO/SERCOM pad |
| Broche 41 | PC03 — GPIO/SERCOM pad |
| Broche 42 | VSS — Ground (decoupling) |
| Broche 43 | VDD — Digital supply 1.62-3.6 V |
| Broche 44 | PC04 — GPIO/SERCOM pad |
| Broche 45 | PC05 — GPIO/SERCOM pad |
| Broche 46 | PC06 — GPIO/SERCOM pad |
| Broche 47 | PC07 — GPIO/SERCOM pad |
| Broche 48 | PC08 — GPIO/SERCOM pad |
| Broche 49 | PC09 — GPIO/SERCOM pad |
| Broche 50 | PC10 — GPIO/SERCOM pad |
| Broche 51 | PC11 — GPIO/SERCOM pad |
| Broche 52 | PC12 — GPIO/SERCOM pad |
| Broche 53 | PC13 — GPIO/SERCOM pad |
| Broche 54 | PC14 — GPIO/SERCOM pad |
| Broche 55 | PC15 — GPIO/SERCOM pad |
| Broche 56 | PC16 — GPIO/SERCOM pad |
| Broche 57 | PC17 — GPIO/SERCOM pad |
| Broche 58 | PC18 — GPIO/SERCOM pad |
| Broche 59 | PC19 — GPIO/SERCOM pad |
| Broche 60 | PC20 — GPIO/SERCOM pad |
| Broche 61 | PC21 — GPIO/SERCOM pad |
| Broche 62 | PC22 — GPIO/SERCOM pad |
| Broche 63 | PC23 — GPIO/SERCOM pad |
| Broche 64 | PC24 — GPIO/SERCOM pad |
| Broche 65 | PC25 — GPIO/SERCOM pad |
| Broche 66 | PC26 — GPIO/SERCOM pad |
| Broche 67 | PC27 — GPIO/SERCOM pad |
| Broche 68 | PC28 — GPIO/SERCOM pad |
| Broche 69 | PD00 — GPIO/SERCOM pad |
| Broche 70 | PD01 — GPIO/SERCOM pad |
| Broche 71 | PD02 — GPIO/SERCOM pad |
| Broche 72 | PD03 — GPIO/SERCOM pad |
| Broche 73 | PD04 — GPIO/SERCOM pad |
| Broche 74 | PD05 — GPIO/SERCOM pad |
| Broche 75 | PD06 — GPIO/SERCOM pad |
| Broche 76 | PD07 — GPIO/SERCOM pad |
| Broche 77 | PD08 — GPIO/SERCOM pad |
| Broche 78 | PD09 — GPIO/SERCOM pad |
| Broche 79 | PD10 — GPIO/SERCOM pad |
| Broche 80 | PD11 — GPIO/SERCOM pad |
| Broche 81 | PD12 — GPIO/SERCOM pad |
| Broche 82 | VSS — Ground (decoupling) |
| Broche 83 | VDD — Digital supply 1.62-3.6 V |
| Broche 84 | VBAT — RTC backup supply |
| Broche 85 | RESETn — Active-low reset input |
| Broche 86 | SWDIO — Serial Wire Debug I/O |
| Broche 87 | SWCLK — Serial Wire Debug clock |
| Broche 88 | PA00 — GPIO/XIN32K |
| Broche 89 | PA01 — GPIO/XOUT32K |
| Broche 90 | PA02 — GPIO/ADC AIN0 |
| Broche 91 | PA03 — GPIO/ADC AIN1 |
| Broche 92 | PA04 — GPIO/ADC AIN2 / VREF |
| Broche 93 | PA05 — GPIO/ADC AIN3 |
| Broche 94 | PA06 — GPIO/ADC AIN4 |
| Broche 95 | PA07 — GPIO/ADC AIN5 |
| Broche 96 | PA08 — GPIO/ADC AIN6 |
| Broche 97 | PA09 — GPIO/ADC AIN7 |
| Broche 98 | PA10 — GPIO/ADC AIN8 |
| Broche 99 | PA11 — GPIO/ADC AIN9 |
| Broche 100 | VSS — Ground |
Applications typiques
ATSAME54N19A-AUT convient pour 6 applications: Automotive Body and Comfort Modules, USB Peripherals and HID Devices, CAN-FD Gateways and Vehicle Networks, Industrial Control Panels, Motor Control and FOC Drives, Secure Connected IoT Nodes.
Automotive Body and Comfort Modules
The ATSAME54N19A-AUT is a strong fit for automotive body control modules such as body controllers, lighting ECUs, seat controllers, and HVAC front-ends. Its Cortex-M4F core delivers 180 DMIPS at 120 MHz, sufficient for CAN-FD stack processing, LIN master tasks, and body-domain signal conditioning, while 512 KB ECC Flash and 256 KB ECC SRAM host full AUTOSAR-class application code with fault detection. AEC-Q100 qualification from the AUT suffix lets designers release the design directly into vehicle programs without re-qualification. The 100-pin TQFP exposes enough GPIO and ADC channels to drive multiple LED matrices, motor bridges, and sensor inputs from a single chip.
Recommandé
USB Peripherals and HID Devices
The ATSAME54N19A-AUT integrates a USB 2.0 Full-Speed controller with on-chip Host and Device, plus an internal 3.3 V regulator and 8 SERCOM channels, which makes it ideal for USB peripherals such as HIDs, data loggers, audio interfaces, and industrial input devices. Designers avoid an external USB PHY, save BOM cost, and the 120 MHz Cortex-M4F handles USB stack plus DSP-grade audio sample routing simultaneously. AEC-Q100 grading also enables in-cabin USB charging ports and infotainment accessory controllers. Recommended SERCOM allocation is 1-2 channels for external SPI/I2C sensors while the remaining channels stay free for debug and expansion.
Recommandé
CAN-FD Gateways and Vehicle Networks
The ATSAME54N19A-AUT is well-suited for automotive gateways that bridge CAN-FD and classical CAN networks between body, chassis, and powertrain domains. Its Cortex-M4F core runs the CAN-FD stack at line rate without bottlenecks, while ECC-protected 512 KB Flash and 256 KB SRAM hold protocol translation tables and security keys. Multiple SERCOM channels support SPI-attached Ethernet PHYs or LIN transceivers, expanding gateway connectivity. The AUT grade and -40C to +85C range cover under-hood and cabin placements.
Recommandé
Industrial Control Panels
For industrial HMI panels, PLCs, and process controllers, the ATSAME54N19A-AUT provides 120 MHz Cortex-M4F performance for real-time control loops, 12-bit 1 MSPS ADC for analog signal acquisition, and CAN-FD for fieldbus communication. 256 KB ECC SRAM holds real-time control tables, while 512 KB ECC Flash stores the full firmware with safety margins. The 100-pin TQFP package is widely available and supported by Microchip Harmony and MPLAB X IDE, accelerating certification cycles for IEC 61508 and UL 508 designs.
Recommandé
Motor Control and FOC Drives
The ATSAME54N19A-AUT drives sensorless and encoder-based BLDC and PMSM motors using field-oriented control algorithms running on the Cortex-M4F core. The DSP extensions accelerate Park/Clarke transforms and PID loops, while the 12-bit DAC outputs reference waveforms for debug. CAN-FD and USB connectivity make the drive factory-configurable and field-updatable. ECC on Flash and SRAM prevents corruption in high-vibration motor housings, and the automotive temperature grade supports under-hood mounting.
Recommandé
Secure Connected IoT Nodes
The ATSAME54N19A-AUT includes a hardware cryptographic accelerator with AES, SHA, and True RNG, allowing secure boot, TLS handshakes, and over-the-air firmware updates without external crypto chips. Pairing this with the USB device controller and 8 SERCOM channels supports secure IoT gateways, asset trackers, and edge AI sensor nodes. The dual-panel Flash enables fail-safe firmware updates, while ECC memory ensures data integrity in remote deployments. The automotive grade extends operational life to industrial and outdoor installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME54N19A-AUT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME54N19A-AU | ATSAME54N19A-AU-EFP | ATSAME54N19A-AF | ATSAME53N20A-AU | ATSAME53N19A-AU | ATSAME51N19A-AU |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14 mm) | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 100 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB |
| CAN-FD | Yes | Yes | Yes | Yes | No | No | No |
| Automotive Grade (AEC-Q100) | Yes (AUT) | No | No | No | No | No | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- AEC-Q100 qualified automotive variant (vs ATSAME54N19A-AU)
- Largest ECC-protected memory in SAM E5x family (vs ATSAME53N19A-AU)
- Full CAN-FD and USB Host/Device stack on-chip (vs ATSAME51N19A-AU)
Notes de conception
Place a 10 uF bulk capacitor plus 100 nF and 1 nF ceramic decoupling capacitors within 5 mm of each VDD pin (TQFP-100 has multiple VDD pairs). The internal DC-DC regulator requires an external inductor on VSW; keep the inductor loop area small (under 0.5 cm^2) to limit EMI. A VBAT pin powers the RTC backup domain and must be tied to a coin cell or main VDD through a 0 ohm jumper if RTC is unused.
Reserve the SWD/SWC pins (typically PA30/PA31 on TQFP-100) for in-circuit programming and dedicate a 10-pin Cortex Debug connector footprint to enable field firmware updates. Avoid routing high-speed signals (USB DP/DM, CAN-FD) across the chip footprint; route on the bottom layer with a continuous ground reference plane to maintain 90 ohm differential impedance.
Estimated: at 120 MHz CPU speed with full peripheral activity the SAM E54 dissipates roughly 80-100 mW; this is well within the TQFP-100 thermal envelope (theta_JA approximately 50 C/W on a 2-layer JEDEC test board). For automotive under-hood placement above +85C ambient, use a 4-layer PCB with a dedicated ground plane to keep junction rise below 10 C.
Do not assume the AUT suffix means extended temperature (-40C to +125C); for under-hood applications above +85C select a part specifically graded to AEC-Q100 Grade 0/1. Also verify that BOOTPROT fuse settings are locked before shipping production units - unlocked fuses allow external flash read-back via SWD. Enable ECC on Flash and SRAM to take advantage of the silicon's built-in single-bit correction.
Informations de conformité
AUT suffix indicates AEC-Q100 automotive qualification per Microchip datasheet. RoHS and REACH compliance stated on Microchip product page.
