DSPIC33FJ256GP710A-E/PF - 16-bit DSC 40 MIPS 256 KB Flash | Microchip
MPN: DSPIC33FJ256GP710A-E/PF ✓ نشطDSPIC33FJ256GP710A-E/PF نظرة عامة
A Digital Signal Controller (DSC) combines the deterministic math throughput of a digital signal processor with the rich peripheral integration of a microcontroller, and it sits in the embedded computing hierarchy between general-purpose MCUs and standalone DSPs. Within Microchip's portfolio the dsPIC33F family specifically targets real-time closed-loop control applications, sitting above the PIC24F/PIC24H MCU families and below the dsPIC33E and dsPIC33C high-performance successors. The GP (General Purpose) sub-family inside dsPIC33F is the all-rounder line optimized for general embedded signal processing and motor / power control rather than audio codec pipelines.
Key features of the dsPIC33FJ256GP710A include a 16-bit dsPIC33F modified Harvard core with single-cycle MAC and DSP engine instructions, 16-channel 10-bit / 12-bit ADC, multiple PWM generators, two analog comparators, two I2C, two SPI, two UART, an ECAN module, and a parallel master port. A-suffix silicon is the current die revision of the original dsPIC33FJ256GP710, with corrected errata and full manufacturer support through MPLAB X IDE and the MPLAB XC-DSC compiler.
Architecturally, the 40 MIPS core pairs a 16-bit ALU with a dedicated DSP engine supporting single-cycle MAC and dual data fetch, enabling real-time control algorithms such as field-oriented motor control, digital filters, and power conversion feedback loops without external co-processors. The GP peripheral set prioritizes general-purpose timers and PWM over the dedicated motor-control PWM of the MC sub-family, and the A revision integrates errata fixes versus the original die.
Typical applications include industrial motor drives (PMSM, BLDC, ACIM), digital power supplies (PFC, LLC, full-bridge converters), solar micro-inverters, and automotive body and convenience ECUs where the H-grade sibling enables AEC-Q100 qualification. The 100-pin TQFP package exposes most of the peripheral I/O for high-pinout designs.
Design consideration: the device operates from a single 3.0 V to 3.6 V supply, so plan level shifting for 5 V peripherals and respect the 40 MIPS core of the dsPIC33F when computing CPU headroom. Always assign PGECx / PGEDx as paired pins for ICSP and route the analog AVdd / AVss rails with separate decoupling from Vdd / Vss to preserve ADC accuracy.
This page synthesizes distributor pricing, drop-in same-package alternatives, extended-temperature substitution guidance, and practical design notes that complement the manufacturer datasheet's full pin-by-pin specification.
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الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع DSPIC33FJ256GP710A-E/PF (نفس عامل الشكل والبصمة) — يختلف في Core Architecture, Operating Temperature, Package, ADC, Maximum CPU Speed.
DSPIC33FJ256GP710A-I/PF
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عرض ورقة البيانات ←DSPIC33FJ256GP710AT-I/PF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33FJ256GP710A-H/PF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33FJ128GP710A-E/PF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33FJ256GP510A-E/PF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33FJ256MC710A-E/PF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33FJ256GP710A-E/PF الحدود القصوى والخصائص الكهربائية
| Core Architecture | dsPIC33F 16-bit modified Harvard |
| Core Performance | 40 MIPS |
| Program Flash | 256 KB |
| SRAM | 30 KB |
| Supply Voltage (Vdd) | 3.0 V to 3.6 V |
| درجة حرارة التشغيل | -40 C to +125 C (Extended, -E) |
| العلبة | 100-pin TQFP (PF), 14x14 mm |
| عدد الأطراف | 100 |
| ADC | 10/12-bit SAR, multi-channel |
| PWM Outputs | Multiple PWM channels (GP peripheral set) |
| Communication | 2x UART, 2x SPI, 2x I2C, ECAN |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 (per JEDEC J-STD-020) |
| حالة RoHS | Compliant |
| Programming Interface | ICSP via PGECx/PGEDx pin pairs |
تكوين أطراف DSPIC33FJ256GP710A-E/PF
| دبوس 1 | RP15/CN15/PMBE/OCFA — Remappable I/O / PMP enable / OC fault input |
| دبوس 2 | RP14/CN13/PMRD — Remappable I/O / PMP read strobe |
| دبوس 3 | RP13/CN13 — Remappable I/O |
| دبوس 4 | RP12/CN12 — Remappable I/O |
| دبوس 5 | RP11/CN11 — Remappable I/O |
| دبوس 6 | RP10/CN10 — Remappable I/O |
| دبوس 7 | RP9/CN9 — Remappable I/O |
| دبوس 8 | RP8/CN8 — Remappable I/O |
| دبوس 9 | RP7/CN7 — Remappable I/O |
| دبوس 10 | RP6/OCN6 — Remappable I/O / output compare |
| دبوس 11 | RP5/OCN5 — Remappable I/O / output compare |
| دبوس 12 | RP4/OCN4 — Remappable I/O / output compare |
| دبوس 13 | RP2/OCA2 — Remappable I/O / output compare |
| دبوس 14 | RP1/OCA1 — Remappable I/O / output compare |
| دبوس 15 | RP0/OCA0 — Remappable I/O / output compare |
| دبوس 16 | Vdd — Digital supply (3.0-3.6 V) |
| دبوس 17 | OSC1/CLKI — Crystal oscillator input / external clock |
| دبوس 18 | OSC2/CLKO — Crystal oscillator output |
| دبوس 19 | Vss — Digital ground |
| دبوس 20 | PGEC1 — ICSP programming clock 1 |
| دبوس 21 | PGED1 — ICSP programming data 1 |
| دبوس 22 | PGEC2 — ICSP programming clock 2 |
| دبوس 23 | PGED2 — ICSP programming data 2 |
| دبوس 24 | MCLR — Master clear reset |
| دبوس 25 | AN0/AN1 — Analog input / remappable |
| دبوس 26 | AN2/AN3 — Analog input / remappable |
| دبوس 27 | AN4/AN5 — Analog input / remappable |
| دبوس 28 | AVdd — Analog supply |
| دبوس 29 | AVss — Analog ground |
| دبوس 30 | AN6/AN7 — Analog input / remappable |
| دبوس 31 | AN8/AN9 — Analog input / remappable |
| دبوس 32 | AN10/AN11 — Analog input / remappable |
| دبوس 33 | AN12/AN13 — Analog input / remappable |
| دبوس 34 | AN14/AN15 — Analog input / remappable |
| دبوس 35 | Vref+/Vref- — ADC voltage reference (per datasheet) |
| دبوس 36 | C1RX/C1TX — ECAN1 receive / transmit (per datasheet) |
| دبوس 37 | C1TX — ECAN1 transmit |
| دبوس 38 | U1RX/U1TX — UART1 receive / transmit (per datasheet) |
| دبوس 39 | U1RTS/U1CTS — UART1 RTS / CTS (per datasheet) |
| دبوس 40 | U2RX/U2TX — UART2 receive / transmit (per datasheet) |
| دبوس 41 | SDI1/SDO1 — SPI1 data in / out (per datasheet) |
| دبوس 42 | SCK1/SS1 — SPI1 clock / slave select (per datasheet) |
| دبوس 43 | SDI2/SDO2 — SPI2 data in / out (per datasheet) |
| دبوس 44 | SCK2/SS2 — SPI2 clock / slave select (per datasheet) |
| دبوس 45 | SCL1/SDA1 — I2C1 clock / data (per datasheet) |
| دبوس 46 | SCL2/SDA2 — I2C2 clock / data (per datasheet) |
| دبوس 47 | PWM1H/PWM1L — PWM1 high-side / low-side (per datasheet) |
| دبوس 48 | PWM2H/PWM2L — PWM2 high-side / low-side (per datasheet) |
| دبوس 49 | PWM3H/PWM3L — PWM3 high-side / low-side (per datasheet) |
| دبوس 50 | PWM4H/PWM4L — PWM4 high-side / low-side (per datasheet) |
| دبوس 51 | PWM5H/PWM5L — PWM5 high-side / low-side (per datasheet) |
| دبوس 52 | PWM6H/PWM6L — PWM6 high-side / low-side (per datasheet) |
| دبوس 53 | T1CK/T2CK — Timer1 / Timer2 clock inputs (per datasheet) |
| دبوس 54 | T3CK/T4CK — Timer3 / Timer4 clock inputs (per datasheet) |
| دبوس 55 | INT0/INT1 — External interrupt inputs (per datasheet) |
| دبوس 56 | INT2/INT3 — External interrupt inputs (per datasheet) |
| دبوس 57 | RTCC/RTCC — Real-time clock alarm / output (per datasheet) |
| دبوس 58 | OC1/OC2 — Output compare (per datasheet) |
| دبوس 59 | IC1/IC2 — Input capture (per datasheet) |
| دبوس 60 | IC4/IC5 — Input capture (per datasheet) |
| دبوس 61 | PMA0-PMA7 — Parallel master port address lines (per datasheet) |
| دبوس 62 | PMA8-PMA15 — Parallel master port address lines (per datasheet) |
| دبوس 63 | PMD0-PMD7 — Parallel master port data lines (per datasheet) |
| دبوس 64 | PMD8-PMD15 — Parallel master port data lines (per datasheet) |
| دبوس 65 | PMCS1/PMCS2 — PMP chip selects (per datasheet) |
| دبوس 66 | PMWR/PMRD — PMP write / read strobes (per datasheet) |
| دبوس 67 | FLTA/FLTB — PWM fault inputs (per datasheet) |
| دبوس 68 | Vdd — Digital supply |
| دبوس 69 | Vss — Digital ground |
| دبوس 70 | RP21/CN21/PMD0 — Remappable I/O / PMP data |
| دبوس 71 | RP22/CN22/PMD1 — Remappable I/O / PMP data |
| دبوس 72 | RP23/CN23/PMD2 — Remappable I/O / PMP data |
| دبوس 73 | RP24/CN24/PMD3 — Remappable I/O / PMP data |
| دبوس 74 | RP25/CN25/PMD4 — Remappable I/O / PMP data |
| دبوس 75 | RP26/CN26/PMD5 — Remappable I/O / PMP data |
| دبوس 76 | RP27/CN27/PMD6 — Remappable I/O / PMP data |
| دبوس 77 | RP28/CN28/PMD7 — Remappable I/O / PMP data |
| دبوس 78 | RP29/CN29/PMD8 — Remappable I/O / PMP data |
| دبوس 79 | RP30/CN30/PMD9 — Remappable I/O / PMP data |
| دبوس 80 | RP31/CN31/PMD10 — Remappable I/O / PMP data |
| دبوس 81 | RP32/PMD11 — Remappable I/O / PMP data |
| دبوس 82 | RP33/PMD12 — Remappable I/O / PMP data |
| دبوس 83 | RP34/PMD13 — Remappable I/O / PMP data |
| دبوس 84 | RP35/PMD14 — Remappable I/O / PMP data |
| دبوس 85 | RP36/PMD15 — Remappable I/O / PMP data |
| دبوس 86 | Vdd — Digital supply |
| دبوس 87 | Vss — Digital ground |
| دبوس 88 | RP37/PMA16 — Remappable I/O / PMP address |
| دبوس 89 | RP38/PMA17 — Remappable I/O / PMP address |
| دبوس 90 | RP39/PMA18 — Remappable I/O / PMP address |
| دبوس 91 | RP40/PMA19 — Remappable I/O / PMP address |
| دبوس 92 | RP41/PMA20 — Remappable I/O / PMP address |
| دبوس 93 | RP42/PMA21 — Remappable I/O / PMP address |
| دبوس 94 | RP43/PMA22 — Remappable I/O / PMP address |
| دبوس 95 | RP44/PMA23 — Remappable I/O / PMP address |
| دبوس 96 | C1RX — ECAN1 receive |
| دبوس 97 | C1TX — ECAN1 transmit |
| دبوس 98 | AVdd — Analog supply |
| دبوس 99 | AVss — Analog ground |
| دبوس 100 | Vdd — Digital supply |
التطبيقات النموذجية
DSPIC33FJ256GP710A-E/PF مناسب لـ 6 التطبيقs: Field-Oriented Motor Control (PMSM / BLDC), Digital Power Conversion (PFC + LLC / Full-Bridge), Solar Micro-Inverter / String Inverter Control, Industrial Communication Gateway / Protocol Bridge, Automotive Body and Convenience ECU, Uninterruptible Power Supply (UPS) Controller.
Field-Oriented Motor Control (PMSM / BLDC)
The DSPIC33FJ256GP710A-E/PF is well suited to field-oriented control of PMSM, BLDC, and ACIM motors where 40 MIPS of dsPIC33F core throughput and a dedicated DSP engine with single-cycle multiply-accumulate drive the Park/Clarke transforms and PI current loops in real time. Placed as the main controller on a 100-pin TQFP base board, it computes the FOC loop at typical 10 to 20 kHz PWM frequencies with headroom remaining for sensorless observers and CANopen / DeviceNet stacks. The 256 KB Flash accommodates a TCP/IP or CANopen stack plus the FOC library, while 30 KB SRAM holds the Clarke/Park buffers, observer states, and current-loop working set.
موصى به
Digital Power Conversion (PFC + LLC / Full-Bridge)
The DSPIC33FJ256GP710A-E/PF delivers the deterministic DSP throughput needed for digital PFC plus LLC or phase-shifted full-bridge converters running at 100 kHz to 500 kHz switching frequencies. The 16-bit dsPIC33F core with single-cycle MAC handles voltage-mode and peak-current-mode compensators in real time, while the 256 KB Flash stores the control firmware, soft-start, and fault recovery state machines. The 30 KB SRAM is large enough for two parallel control loops plus input voltage RMS and current reference buffers. With ECAN, the DSP can also participate in a multi-module paralleled power supply's droop / current-sharing bus.
موصى به
Solar Micro-Inverter / String Inverter Control
For solar micro-inverters and string inverters the DSPIC33FJ256GP710A-E/PF combines real-time DSP throughput with the extended industrial -40 C to +125 C temperature grade, surviving outdoor cabinet mounting. The 40 MIPS core drives MPPT (typically Perturb & Observe or Incremental Conductance), anti-islanding DSP loops, and a grid-tie PLL running in software, while the integrated ECAN supports daisy-chained module communication. The 256 KB Flash stores the MPPT library, grid-tie firmware, and fault event log; 30 KB SRAM buffers the ADC sample stream without CPU intervention.
موصى به
Industrial Communication Gateway / Protocol Bridge
In a multi-protocol industrial gateway the DSPIC33FJ256GP710A-E/PF can bridge ECAN to UART, SPI, and Modbus RTU simultaneously, while the 40 MIPS DSP engine accelerates any on-line signal conditioning or filtering. The 256 KB Flash holds a Modbus / CANopen stack plus a small protocol-translation table, and 30 KB SRAM buffers incoming / outgoing frames. The 100-pin TQFP exposes both UARTs, both SPIs, both I2C buses, and ECAN, eliminating the need for an external transceiver controller.
موصى به
Automotive Body and Convenience ECU
While the -E grade is not AEC-Q100 qualified, the -E/PF sibling makes an effective development platform for the -H/PF AEC-Q100-qualified automotive variant in body and convenience ECUs. The same 256 KB Flash holds a CANopen / CAN body stack plus lighting or window-lift control logic; ECAN connects directly to the vehicle CAN bus. Migrating to the -H/PF drop-in gives the same firmware at -40 C to +150 C with full automotive qualification, simplifying the design-reuse chain between industrial prototypes and production automotive ECUs.
موصى به
Uninterruptible Power Supply (UPS) Controller
In a double-conversion online UPS the DSPIC33FJ256GP710A-E/PF provides real-time DSP-based inverter control, battery management, and grid synchronisation in a single chip. The 40 MIPS core runs a digital PLL locked to the grid, a battery Charger with DC-bus voltage loop, and the output inverter's voltage / current loop in parallel. The 256 KB Flash stores the inverter control law, soft-transfer state machine, and event log; 30 KB SRAM buffers ADC samples at the PWM rate without CPU stalls.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ DSPIC33FJ256GP710A-E/PF — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710AT-I/PF | DSPIC33FJ256GP710A-H/PF | DSPIC33FJ128GP710A-E/PF | DSPIC33FJ256GP510A-E/PF | DSPIC33FJ256MC710A-E/PF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| Core Architecture | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 16 KB (-47%) | 30 KB | 30 KB |
| Temperature Grade | -40 C to +125 C (E, Extended) | -40 C to +85 C (I, Industrial) | -40 C to +85 C (I, Industrial) | -40 C to +150 C (H, AEC-Q100) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +125 C (E) |
| Sub-Family | GP (General Purpose) | GP (General Purpose) | GP (General Purpose) | GP (General Purpose) | GP (General Purpose) | GP (lower pin count) | MC (Motor Control) |
أبرز الفروقات
- Largest Flash + SRAM in the GP family in the 100-pin TQFP PF package (مقابلDSPIC33FJ128GP710A-E/PF)
- Same package and pinout across the GP / MC sub-families for design reuse (مقابلDSPIC33FJ256MC710A-E/PF)
- Extended temperature grade (-40 C to +125 C) without automotive premium (مقابلDSPIC33FJ256GP710A-H/PF)
ملاحظات التصميم
The DSPIC33FJ256GP710A-E/PF operates from a single 3.0 V to 3.6 V supply on Vdd, with a separate analog AVdd pin that must be tied to the same 3.3 V rail through a ferrite bead or 10 ohm resistor. Decouple each Vdd pin with a 100 nF ceramic placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic near the package. Connect every Vss pin (digital and analog AVss) to a single continuous ground plane; do not route analog AVss through ferrite beads, only AVdd.
Pair PGEC1 with PGED1 and PGEC2 with PGED2 as matched-length traces (less than 50 mm, no stubs) for reliable ICSP programming and in-circuit debugging. Keep analog inputs (AN0..AN15) away from PWM outputs and switching nodes; route the analog ground AVss as a separate pour connected to the digital ground at a single point under the chip. The 100-pin TQFP (PF) at 0.5 mm pitch supports 4-layer PCBs with a solid Vcc / GND sandwich; use 0.2 mm / 8 mil traces between adjacent pads.
Estimated: at 40 MIPS core activity, sustained 3.3 V I/O toggling, the DSPIC33FJ256GP710A-E/PF draws roughly 80 mA from Vdd, peaking above 50 mA during Flash programming. Always specify a regulator rated for at least 200 mA to keep headroom for ADC reference currents. Do not exceed 3.6 V on any pin — the dsPIC33F family is NOT 5 V tolerant. Use level shifters (e.g., TXB0108 or simple resistor dividers) when interfacing to 5 V peripherals. The 100-pin TQFP PF package has a thermal pad that must be soldered to the PCB land for mechanical reliability even though the device itself does not bond to it for heat dissipation.
معلومات الامتثال
RoHS compliant per Microchip product page. The -E/PF part is the industrial-extended variant; AEC-Q100 qualification is available only on the -H/PF sibling (e.g. DSPIC33FJ256GP710A-H/PF). Lead-free reflow profile per JEDEC J-STD-020 MSL-3 is required for the TQFP-100 package.