DSPIC33FJ256GP710A-E/PF - 16-bit DSC 40 MIPS 256 KB Flash | Microchip
Référence : DSPIC33FJ256GP710A-E/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.85 | $128,50 |
| 100 | $10.97 | $1 097,00 |
| 500 | $9.62 | $4 810,00 |
| 1 000 | $8.45 | $8 450,00 |
DSPIC33FJ256GP710A-E/PF Présentation
A Digital Signal Controller (DSC) combines the deterministic math throughput of a digital signal processor with the rich peripheral integration of a microcontroller, and it sits in the embedded computing hierarchy between general-purpose MCUs and standalone DSPs. Within Microchip's portfolio the dsPIC33F family specifically targets real-time closed-loop control applications, sitting above the PIC24F/PIC24H MCU families and below the dsPIC33E and dsPIC33C high-performance successors. The GP (General Purpose) sub-family inside dsPIC33F is the all-rounder line optimized for general embedded signal processing and motor / power control rather than audio codec pipelines.
Key features of the dsPIC33FJ256GP710A include a 16-bit dsPIC33F modified Harvard core with single-cycle MAC and DSP engine instructions, 16-channel 10-bit / 12-bit ADC, multiple PWM generators, two analog comparators, two I2C, two SPI, two UART, an ECAN module, and a parallel master port. A-suffix silicon is the current die revision of the original dsPIC33FJ256GP710, with corrected errata and full manufacturer support through MPLAB X IDE and the MPLAB XC-DSC compiler.
Architecturally, the 40 MIPS core pairs a 16-bit ALU with a dedicated DSP engine supporting single-cycle MAC and dual data fetch, enabling real-time control algorithms such as field-oriented motor control, digital filters, and power conversion feedback loops without external co-processors. The GP peripheral set prioritizes general-purpose timers and PWM over the dedicated motor-control PWM of the MC sub-family, and the A revision integrates errata fixes versus the original die.
Typical applications include industrial motor drives (PMSM, BLDC, ACIM), digital power supplies (PFC, LLC, full-bridge converters), solar micro-inverters, and automotive body and convenience ECUs where the H-grade sibling enables AEC-Q100 qualification. The 100-pin TQFP package exposes most of the peripheral I/O for high-pinout designs.
Design consideration: the device operates from a single 3.0 V to 3.6 V supply, so plan level shifting for 5 V peripherals and respect the 40 MIPS core of the dsPIC33F when computing CPU headroom. Always assign PGECx / PGEDx as paired pins for ICSP and route the analog AVdd / AVss rails with separate decoupling from Vdd / Vss to preserve ADC accuracy.
This page synthesizes distributor pricing, drop-in same-package alternatives, extended-temperature substitution guidance, and practical design notes that complement the manufacturer datasheet's full pin-by-pin specification.
Alternatives de remplacement direct pour DSPIC33FJ256GP710A-E/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ256GP710A-E/PF (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, Package, ADC, Maximum CPU Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ256GP710A-I/PF
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →DSPIC33FJ256GP710AT-I/PF
✅ Remplacement direct✓ En stock
$6.9 / unité
Voir la fiche technique →DSPIC33FJ256GP710A-H/PF
✅ Remplacement direct✓ En stock
$8.3 / unité
Voir la fiche technique →DSPIC33FJ128GP710A-E/PF
✅ Remplacement direct✓ En stock
$6.25 / unité
Voir la fiche technique →DSPIC33FJ256GP510A-E/PF
✅ Remplacement direct✓ En stock
$6.9 / unité
Voir la fiche technique →DSPIC33FJ256MC710A-E/PF
✅ Remplacement direct✓ En stock
$8.65 / unité
Voir la fiche technique →DSPIC33FJ256GP710A-E/PF Valeurs maximales et caractéristiques électriques
| Core Architecture | dsPIC33F 16-bit modified Harvard |
| Core Performance | 40 MIPS |
| Program Flash | 256 KB |
| SRAM | 30 KB |
| Supply Voltage (Vdd) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (Extended, -E) |
| Boîtier | 100-pin TQFP (PF), 14x14 mm |
| Nombre de broches | 100 |
| ADC | 10/12-bit SAR, multi-channel |
| PWM Outputs | Multiple PWM channels (GP peripheral set) |
| Communication | 2x UART, 2x SPI, 2x I2C, ECAN |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Programming Interface | ICSP via PGECx/PGEDx pin pairs |
Configuration des broches de DSPIC33FJ256GP710A-E/PF
| Broche 1 | RP15/CN15/PMBE/OCFA — Remappable I/O / PMP enable / OC fault input |
| Broche 2 | RP14/CN13/PMRD — Remappable I/O / PMP read strobe |
| Broche 3 | RP13/CN13 — Remappable I/O |
| Broche 4 | RP12/CN12 — Remappable I/O |
| Broche 5 | RP11/CN11 — Remappable I/O |
| Broche 6 | RP10/CN10 — Remappable I/O |
| Broche 7 | RP9/CN9 — Remappable I/O |
| Broche 8 | RP8/CN8 — Remappable I/O |
| Broche 9 | RP7/CN7 — Remappable I/O |
| Broche 10 | RP6/OCN6 — Remappable I/O / output compare |
| Broche 11 | RP5/OCN5 — Remappable I/O / output compare |
| Broche 12 | RP4/OCN4 — Remappable I/O / output compare |
| Broche 13 | RP2/OCA2 — Remappable I/O / output compare |
| Broche 14 | RP1/OCA1 — Remappable I/O / output compare |
| Broche 15 | RP0/OCA0 — Remappable I/O / output compare |
| Broche 16 | Vdd — Digital supply (3.0-3.6 V) |
| Broche 17 | OSC1/CLKI — Crystal oscillator input / external clock |
| Broche 18 | OSC2/CLKO — Crystal oscillator output |
| Broche 19 | Vss — Digital ground |
| Broche 20 | PGEC1 — ICSP programming clock 1 |
| Broche 21 | PGED1 — ICSP programming data 1 |
| Broche 22 | PGEC2 — ICSP programming clock 2 |
| Broche 23 | PGED2 — ICSP programming data 2 |
| Broche 24 | MCLR — Master clear reset |
| Broche 25 | AN0/AN1 — Analog input / remappable |
| Broche 26 | AN2/AN3 — Analog input / remappable |
| Broche 27 | AN4/AN5 — Analog input / remappable |
| Broche 28 | AVdd — Analog supply |
| Broche 29 | AVss — Analog ground |
| Broche 30 | AN6/AN7 — Analog input / remappable |
| Broche 31 | AN8/AN9 — Analog input / remappable |
| Broche 32 | AN10/AN11 — Analog input / remappable |
| Broche 33 | AN12/AN13 — Analog input / remappable |
| Broche 34 | AN14/AN15 — Analog input / remappable |
| Broche 35 | Vref+/Vref- — ADC voltage reference (per datasheet) |
| Broche 36 | C1RX/C1TX — ECAN1 receive / transmit (per datasheet) |
| Broche 37 | C1TX — ECAN1 transmit |
| Broche 38 | U1RX/U1TX — UART1 receive / transmit (per datasheet) |
| Broche 39 | U1RTS/U1CTS — UART1 RTS / CTS (per datasheet) |
| Broche 40 | U2RX/U2TX — UART2 receive / transmit (per datasheet) |
| Broche 41 | SDI1/SDO1 — SPI1 data in / out (per datasheet) |
| Broche 42 | SCK1/SS1 — SPI1 clock / slave select (per datasheet) |
| Broche 43 | SDI2/SDO2 — SPI2 data in / out (per datasheet) |
| Broche 44 | SCK2/SS2 — SPI2 clock / slave select (per datasheet) |
| Broche 45 | SCL1/SDA1 — I2C1 clock / data (per datasheet) |
| Broche 46 | SCL2/SDA2 — I2C2 clock / data (per datasheet) |
| Broche 47 | PWM1H/PWM1L — PWM1 high-side / low-side (per datasheet) |
| Broche 48 | PWM2H/PWM2L — PWM2 high-side / low-side (per datasheet) |
| Broche 49 | PWM3H/PWM3L — PWM3 high-side / low-side (per datasheet) |
| Broche 50 | PWM4H/PWM4L — PWM4 high-side / low-side (per datasheet) |
| Broche 51 | PWM5H/PWM5L — PWM5 high-side / low-side (per datasheet) |
| Broche 52 | PWM6H/PWM6L — PWM6 high-side / low-side (per datasheet) |
| Broche 53 | T1CK/T2CK — Timer1 / Timer2 clock inputs (per datasheet) |
| Broche 54 | T3CK/T4CK — Timer3 / Timer4 clock inputs (per datasheet) |
| Broche 55 | INT0/INT1 — External interrupt inputs (per datasheet) |
| Broche 56 | INT2/INT3 — External interrupt inputs (per datasheet) |
| Broche 57 | RTCC/RTCC — Real-time clock alarm / output (per datasheet) |
| Broche 58 | OC1/OC2 — Output compare (per datasheet) |
| Broche 59 | IC1/IC2 — Input capture (per datasheet) |
| Broche 60 | IC4/IC5 — Input capture (per datasheet) |
| Broche 61 | PMA0-PMA7 — Parallel master port address lines (per datasheet) |
| Broche 62 | PMA8-PMA15 — Parallel master port address lines (per datasheet) |
| Broche 63 | PMD0-PMD7 — Parallel master port data lines (per datasheet) |
| Broche 64 | PMD8-PMD15 — Parallel master port data lines (per datasheet) |
| Broche 65 | PMCS1/PMCS2 — PMP chip selects (per datasheet) |
| Broche 66 | PMWR/PMRD — PMP write / read strobes (per datasheet) |
| Broche 67 | FLTA/FLTB — PWM fault inputs (per datasheet) |
| Broche 68 | Vdd — Digital supply |
| Broche 69 | Vss — Digital ground |
| Broche 70 | RP21/CN21/PMD0 — Remappable I/O / PMP data |
| Broche 71 | RP22/CN22/PMD1 — Remappable I/O / PMP data |
| Broche 72 | RP23/CN23/PMD2 — Remappable I/O / PMP data |
| Broche 73 | RP24/CN24/PMD3 — Remappable I/O / PMP data |
| Broche 74 | RP25/CN25/PMD4 — Remappable I/O / PMP data |
| Broche 75 | RP26/CN26/PMD5 — Remappable I/O / PMP data |
| Broche 76 | RP27/CN27/PMD6 — Remappable I/O / PMP data |
| Broche 77 | RP28/CN28/PMD7 — Remappable I/O / PMP data |
| Broche 78 | RP29/CN29/PMD8 — Remappable I/O / PMP data |
| Broche 79 | RP30/CN30/PMD9 — Remappable I/O / PMP data |
| Broche 80 | RP31/CN31/PMD10 — Remappable I/O / PMP data |
| Broche 81 | RP32/PMD11 — Remappable I/O / PMP data |
| Broche 82 | RP33/PMD12 — Remappable I/O / PMP data |
| Broche 83 | RP34/PMD13 — Remappable I/O / PMP data |
| Broche 84 | RP35/PMD14 — Remappable I/O / PMP data |
| Broche 85 | RP36/PMD15 — Remappable I/O / PMP data |
| Broche 86 | Vdd — Digital supply |
| Broche 87 | Vss — Digital ground |
| Broche 88 | RP37/PMA16 — Remappable I/O / PMP address |
| Broche 89 | RP38/PMA17 — Remappable I/O / PMP address |
| Broche 90 | RP39/PMA18 — Remappable I/O / PMP address |
| Broche 91 | RP40/PMA19 — Remappable I/O / PMP address |
| Broche 92 | RP41/PMA20 — Remappable I/O / PMP address |
| Broche 93 | RP42/PMA21 — Remappable I/O / PMP address |
| Broche 94 | RP43/PMA22 — Remappable I/O / PMP address |
| Broche 95 | RP44/PMA23 — Remappable I/O / PMP address |
| Broche 96 | C1RX — ECAN1 receive |
| Broche 97 | C1TX — ECAN1 transmit |
| Broche 98 | AVdd — Analog supply |
| Broche 99 | AVss — Analog ground |
| Broche 100 | Vdd — Digital supply |
Applications typiques
DSPIC33FJ256GP710A-E/PF convient pour 6 applications: Field-Oriented Motor Control (PMSM / BLDC), Digital Power Conversion (PFC + LLC / Full-Bridge), Solar Micro-Inverter / String Inverter Control, Industrial Communication Gateway / Protocol Bridge, Automotive Body and Convenience ECU, Uninterruptible Power Supply (UPS) Controller.
Field-Oriented Motor Control (PMSM / BLDC)
The DSPIC33FJ256GP710A-E/PF is well suited to field-oriented control of PMSM, BLDC, and ACIM motors where 40 MIPS of dsPIC33F core throughput and a dedicated DSP engine with single-cycle multiply-accumulate drive the Park/Clarke transforms and PI current loops in real time. Placed as the main controller on a 100-pin TQFP base board, it computes the FOC loop at typical 10 to 20 kHz PWM frequencies with headroom remaining for sensorless observers and CANopen / DeviceNet stacks. The 256 KB Flash accommodates a TCP/IP or CANopen stack plus the FOC library, while 30 KB SRAM holds the Clarke/Park buffers, observer states, and current-loop working set.
Recommandé
Digital Power Conversion (PFC + LLC / Full-Bridge)
The DSPIC33FJ256GP710A-E/PF delivers the deterministic DSP throughput needed for digital PFC plus LLC or phase-shifted full-bridge converters running at 100 kHz to 500 kHz switching frequencies. The 16-bit dsPIC33F core with single-cycle MAC handles voltage-mode and peak-current-mode compensators in real time, while the 256 KB Flash stores the control firmware, soft-start, and fault recovery state machines. The 30 KB SRAM is large enough for two parallel control loops plus input voltage RMS and current reference buffers. With ECAN, the DSP can also participate in a multi-module paralleled power supply's droop / current-sharing bus.
Recommandé
Solar Micro-Inverter / String Inverter Control
For solar micro-inverters and string inverters the DSPIC33FJ256GP710A-E/PF combines real-time DSP throughput with the extended industrial -40 C to +125 C temperature grade, surviving outdoor cabinet mounting. The 40 MIPS core drives MPPT (typically Perturb & Observe or Incremental Conductance), anti-islanding DSP loops, and a grid-tie PLL running in software, while the integrated ECAN supports daisy-chained module communication. The 256 KB Flash stores the MPPT library, grid-tie firmware, and fault event log; 30 KB SRAM buffers the ADC sample stream without CPU intervention.
Recommandé
Industrial Communication Gateway / Protocol Bridge
In a multi-protocol industrial gateway the DSPIC33FJ256GP710A-E/PF can bridge ECAN to UART, SPI, and Modbus RTU simultaneously, while the 40 MIPS DSP engine accelerates any on-line signal conditioning or filtering. The 256 KB Flash holds a Modbus / CANopen stack plus a small protocol-translation table, and 30 KB SRAM buffers incoming / outgoing frames. The 100-pin TQFP exposes both UARTs, both SPIs, both I2C buses, and ECAN, eliminating the need for an external transceiver controller.
Recommandé
Automotive Body and Convenience ECU
While the -E grade is not AEC-Q100 qualified, the -E/PF sibling makes an effective development platform for the -H/PF AEC-Q100-qualified automotive variant in body and convenience ECUs. The same 256 KB Flash holds a CANopen / CAN body stack plus lighting or window-lift control logic; ECAN connects directly to the vehicle CAN bus. Migrating to the -H/PF drop-in gives the same firmware at -40 C to +150 C with full automotive qualification, simplifying the design-reuse chain between industrial prototypes and production automotive ECUs.
Recommandé
Uninterruptible Power Supply (UPS) Controller
In a double-conversion online UPS the DSPIC33FJ256GP710A-E/PF provides real-time DSP-based inverter control, battery management, and grid synchronisation in a single chip. The 40 MIPS core runs a digital PLL locked to the grid, a battery Charger with DC-bus voltage loop, and the output inverter's voltage / current loop in parallel. The 256 KB Flash stores the inverter control law, soft-transfer state machine, and event log; 30 KB SRAM buffers ADC samples at the PWM rate without CPU stalls.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ256GP710A-E/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ256GP710A-I/PF | DSPIC33FJ256GP710AT-I/PF | DSPIC33FJ256GP710A-H/PF | DSPIC33FJ128GP710A-E/PF | DSPIC33FJ256GP510A-E/PF | DSPIC33FJ256MC710A-E/PF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PF) 14x14 mm | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same | TQFP-100 (PF) 14x14 mm - same |
| Core Architecture | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS | dsPIC33F 16-bit, 40 MIPS |
| Program Flash | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM | 30 KB | 30 KB | 30 KB | 30 KB | 16 KB (-47%) | 30 KB | 30 KB |
| Temperature Grade | -40 C to +125 C (E, Extended) | -40 C to +85 C (I, Industrial) | -40 C to +85 C (I, Industrial) | -40 C to +150 C (H, AEC-Q100) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +125 C (E) |
| Sub-Family | GP (General Purpose) | GP (General Purpose) | GP (General Purpose) | GP (General Purpose) | GP (General Purpose) | GP (lower pin count) | MC (Motor Control) |
Principaux différenciateurs
- Largest Flash + SRAM in the GP family in the 100-pin TQFP PF package (vs DSPIC33FJ128GP710A-E/PF)
- Same package and pinout across the GP / MC sub-families for design reuse (vs DSPIC33FJ256MC710A-E/PF)
- Extended temperature grade (-40 C to +125 C) without automotive premium (vs DSPIC33FJ256GP710A-H/PF)
Notes de conception
The DSPIC33FJ256GP710A-E/PF operates from a single 3.0 V to 3.6 V supply on Vdd, with a separate analog AVdd pin that must be tied to the same 3.3 V rail through a ferrite bead or 10 ohm resistor. Decouple each Vdd pin with a 100 nF ceramic placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic near the package. Connect every Vss pin (digital and analog AVss) to a single continuous ground plane; do not route analog AVss through ferrite beads, only AVdd.
Pair PGEC1 with PGED1 and PGEC2 with PGED2 as matched-length traces (less than 50 mm, no stubs) for reliable ICSP programming and in-circuit debugging. Keep analog inputs (AN0..AN15) away from PWM outputs and switching nodes; route the analog ground AVss as a separate pour connected to the digital ground at a single point under the chip. The 100-pin TQFP (PF) at 0.5 mm pitch supports 4-layer PCBs with a solid Vcc / GND sandwich; use 0.2 mm / 8 mil traces between adjacent pads.
Estimated: at 40 MIPS core activity, sustained 3.3 V I/O toggling, the DSPIC33FJ256GP710A-E/PF draws roughly 80 mA from Vdd, peaking above 50 mA during Flash programming. Always specify a regulator rated for at least 200 mA to keep headroom for ADC reference currents. Do not exceed 3.6 V on any pin — the dsPIC33F family is NOT 5 V tolerant. Use level shifters (e.g., TXB0108 or simple resistor dividers) when interfacing to 5 V peripherals. The 100-pin TQFP PF package has a thermal pad that must be soldered to the PCB land for mechanical reliability even though the device itself does not bond to it for heat dissipation.
Informations de conformité
RoHS compliant per Microchip product page. The -E/PF part is the industrial-extended variant; AEC-Q100 qualification is available only on the -H/PF sibling (e.g. DSPIC33FJ256GP710A-H/PF). Lead-free reflow profile per JEDEC J-STD-020 MSL-3 is required for the TQFP-100 package.