Microchip Technology

DSPIC33FJ256GP710A-E/PF - 16-bit DSC 40 MIPS 256 KB Flash | Microchip

Артикул: DSPIC33FJ256GP710A-E/PF ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
3.0 V to 3.6 V Vdss 100-pin TQFP (PF), 14x14 mm Package 256 KB Memory
От $8.45 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-07
Оптовые цены
Кол-во Цена за ед. Итого
1 $14.2 $14,20
10 $12.85 $128,50
100 $10.97 $1.097,00
500 $9.62 $4.810,00
1.000 $8.45 $8.450,00
ℹ️ Все цены указаны в USD

DSPIC33FJ256GP710A-E/PF Обзор

The Microchip DSPIC33FJ256GP710A-E/PF is a 16-bit Digital Signal Controller delivering 40 MIPS core performance with 256 KB of self-programmable Flash and 30 KB of SRAM, housed in a 100-pin 14x14 mm TQFP (PF) package and qualified for the -40C to +125C extended industrial temperature range.

A Digital Signal Controller (DSC) combines the deterministic math throughput of a digital signal processor with the rich peripheral integration of a microcontroller, and it sits in the embedded computing hierarchy between general-purpose MCUs and standalone DSPs. Within Microchip's portfolio the dsPIC33F family specifically targets real-time closed-loop control applications, sitting above the PIC24F/PIC24H MCU families and below the dsPIC33E and dsPIC33C high-performance successors. The GP (General Purpose) sub-family inside dsPIC33F is the all-rounder line optimized for general embedded signal processing and motor / power control rather than audio codec pipelines.

Key features of the dsPIC33FJ256GP710A include a 16-bit dsPIC33F modified Harvard core with single-cycle MAC and DSP engine instructions, 16-channel 10-bit / 12-bit ADC, multiple PWM generators, two analog comparators, two I2C, two SPI, two UART, an ECAN module, and a parallel master port. A-suffix silicon is the current die revision of the original dsPIC33FJ256GP710, with corrected errata and full manufacturer support through MPLAB X IDE and the MPLAB XC-DSC compiler.

Architecturally, the 40 MIPS core pairs a 16-bit ALU with a dedicated DSP engine supporting single-cycle MAC and dual data fetch, enabling real-time control algorithms such as field-oriented motor control, digital filters, and power conversion feedback loops without external co-processors. The GP peripheral set prioritizes general-purpose timers and PWM over the dedicated motor-control PWM of the MC sub-family, and the A revision integrates errata fixes versus the original die.

Typical applications include industrial motor drives (PMSM, BLDC, ACIM), digital power supplies (PFC, LLC, full-bridge converters), solar micro-inverters, and automotive body and convenience ECUs where the H-grade sibling enables AEC-Q100 qualification. The 100-pin TQFP package exposes most of the peripheral I/O for high-pinout designs.

Design consideration: the device operates from a single 3.0 V to 3.6 V supply, so plan level shifting for 5 V peripherals and respect the 40 MIPS core of the dsPIC33F when computing CPU headroom. Always assign PGECx / PGEDx as paired pins for ICSP and route the analog AVdd / AVss rails with separate decoupling from Vdd / Vss to preserve ADC accuracy.

This page synthesizes distributor pricing, drop-in same-package alternatives, extended-temperature substitution guidance, and practical design notes that complement the manufacturer datasheet's full pin-by-pin specification.

Аналоги без доработки для DSPIC33FJ256GP710A-E/PF — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с DSPIC33FJ256GP710A-E/PF (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Operating Temperature, Package, ADC, Maximum CPU Speed.

Microchip Technology
Core Architecture: 16-bit dsPIC33F (MCU/DSC)
Operating Temperature: -40C to +125C (E grade)
Package: 100-TQFP (14x14 mm)
Microchip Technology
Core Architecture: 16-bit dsPIC33F DSC
Operating Temperature: -40C to +125C
Package: 100-TQFP (14x14 mm)
Microchip Technology
Core Architecture: dsPIC33F (modified Harvard, DSP-enhanced)
Operating Temperature: -40 C to +150 C (AEC-Q100 grade 0)
Package: TQFP-100 (PF) 14x14 mm
Microchip Technology
Core Architecture: dsPIC33F 16-bit modified Harvard DSC
Operating Temperature: -40C to +85C (Industrial)
ADC: 10-bit, up to 32 channels, 1.1 Msps
Microchip Technology
Core Architecture: 16-bit dsPIC33F (modified Harvard)
Operating Temperature: -40C to +85C (industrial, suffix I)
Package: 100-TQFP (14x14 mm), code PF
Microchip Technology
Core Architecture: dsPIC33F 16-bit DSC
Package: 100-pin TQFP (14x14 mm)
ADC: 10-bit, up to 1.1 Msps, multiple channels
Microchip Technology
Operating Temperature: -40C to +125C
Package: 100-TQFP (14x14 mm)

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

DSPIC33FJ256GP710A-I/PF

✅ Прямая замена
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
dsPIC33F 16-bit modified Harvard DSC · 40 MIPS (at 80 MHz core clock) · 256 KB · 30 KB · Up to 85 pins · 10-bit, up to 32 channels, 1.1 Msps · Yes (multiple) · 1 x CAN 2.0B module

✓ В наличии

$6.55 / шт.

Открыть даташит →

DSPIC33FJ256GP710AT-I/PF

✅ Прямая замена
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit dsPIC33F (modified Harvard) · 40 MIPS · 256KB (256K x 8) · 3.3 V · 100-TQFP (14x14 mm), code PF · Gull Wing · Square · Surface Mount

✓ В наличии

$6.9 / шт.

Открыть даташит →

DSPIC33FJ256GP710A-H/PF

✅ Прямая замена
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit Digital Signal Controller (DSC) · dsPIC33F (modified Harvard, DSP-enhanced) · 16-bit, DSP extensions (single-cycle MAC) · 40 MIPS (MIPS, not MHz) · 256 KB (256K x 8) · 30 KB · 3.0 V to 3.6 V · 85

✓ В наличии

$8.3 / шт.

Открыть даташит →

DSPIC33FJ128GP710A-E/PF

✅ Прямая замена
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit dsPIC33F (MCU/DSC) · 40 MIPS · 128 KB (128K x 8) FLASH · 100-TQFP (14x14 mm) · Surface Mount · -40C to +125C (E grade)

✓ В наличии

$6.25 / шт.

Открыть даташит →

DSPIC33FJ256GP510A-E/PF

✅ Прямая замена
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
16-bit dsPIC33F DSC · 40 MIPS · 256 KB (256K x 8) · 16 KB (includes 2 KB DMA RAM) · 3.3 V · -40C to +125C · 100-TQFP (14x14 mm) · CAN 2.0B, I2C, SPI, UART/USART, IrDA, LINbus

✓ В наличии

$6.9 / шт.

Открыть даташит →

DSPIC33FJ256MC710A-E/PF

✅ Прямая замена
Microchip Technology
📦 TQFP-100 (PF) 14x14 mm
dsPIC33F 16-bit DSC · 40 MIPS (10 MIPS per 1 MIPS instruction rate at 40 MHz) · 256 KB · 30 KB · 3.0 V to 3.6 V (3.3 V typical) · -40C to +125C (extended, -E suffix) · 100-pin TQFP (14x14 mm) · 10-bit, up to 1.1 Msps, multiple channels

✓ В наличии

$8.65 / шт.

Открыть даташит →

DSPIC33FJ256GP710A-E/PF Максимальные параметры и электрические характеристики

Core Architecture dsPIC33F 16-bit modified Harvard
Core Performance 40 MIPS
Program Flash 256 KB
SRAM 30 KB
Supply Voltage (Vdd) 3.0 V to 3.6 V
Рабочая температура -40 C to +125 C (Extended, -E)
Корпус 100-pin TQFP (PF), 14x14 mm
Число выводов 100
ADC 10/12-bit SAR, multi-channel
PWM Outputs Multiple PWM channels (GP peripheral set)
Communication 2x UART, 2x SPI, 2x I2C, ECAN
Тип монтажа Surface Mount
Уровень MSL 3 (per JEDEC J-STD-020)
Статус RoHS Compliant
Programming Interface ICSP via PGECx/PGEDx pin pairs

Конфигурация выводов DSPIC33FJ256GP710A-E/PF

TQFP-100 Package Pinout Diagram TQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 TQFP-100
Контакт 1 RP15/CN15/PMBE/OCFA — Remappable I/O / PMP enable / OC fault input
Контакт 2 RP14/CN13/PMRD — Remappable I/O / PMP read strobe
Контакт 3 RP13/CN13 — Remappable I/O
Контакт 4 RP12/CN12 — Remappable I/O
Контакт 5 RP11/CN11 — Remappable I/O
Контакт 6 RP10/CN10 — Remappable I/O
Контакт 7 RP9/CN9 — Remappable I/O
Контакт 8 RP8/CN8 — Remappable I/O
Контакт 9 RP7/CN7 — Remappable I/O
Контакт 10 RP6/OCN6 — Remappable I/O / output compare
Контакт 11 RP5/OCN5 — Remappable I/O / output compare
Контакт 12 RP4/OCN4 — Remappable I/O / output compare
Контакт 13 RP2/OCA2 — Remappable I/O / output compare
Контакт 14 RP1/OCA1 — Remappable I/O / output compare
Контакт 15 RP0/OCA0 — Remappable I/O / output compare
Контакт 16 Vdd — Digital supply (3.0-3.6 V)
Контакт 17 OSC1/CLKI — Crystal oscillator input / external clock
Контакт 18 OSC2/CLKO — Crystal oscillator output
Контакт 19 Vss — Digital ground
Контакт 20 PGEC1 — ICSP programming clock 1
Контакт 21 PGED1 — ICSP programming data 1
Контакт 22 PGEC2 — ICSP programming clock 2
Контакт 23 PGED2 — ICSP programming data 2
Контакт 24 MCLR — Master clear reset
Контакт 25 AN0/AN1 — Analog input / remappable
Контакт 26 AN2/AN3 — Analog input / remappable
Контакт 27 AN4/AN5 — Analog input / remappable
Контакт 28 AVdd — Analog supply
Контакт 29 AVss — Analog ground
Контакт 30 AN6/AN7 — Analog input / remappable
Контакт 31 AN8/AN9 — Analog input / remappable
Контакт 32 AN10/AN11 — Analog input / remappable
Контакт 33 AN12/AN13 — Analog input / remappable
Контакт 34 AN14/AN15 — Analog input / remappable
Контакт 35 Vref+/Vref- — ADC voltage reference (per datasheet)
Контакт 36 C1RX/C1TX — ECAN1 receive / transmit (per datasheet)
Контакт 37 C1TX — ECAN1 transmit
Контакт 38 U1RX/U1TX — UART1 receive / transmit (per datasheet)
Контакт 39 U1RTS/U1CTS — UART1 RTS / CTS (per datasheet)
Контакт 40 U2RX/U2TX — UART2 receive / transmit (per datasheet)
Контакт 41 SDI1/SDO1 — SPI1 data in / out (per datasheet)
Контакт 42 SCK1/SS1 — SPI1 clock / slave select (per datasheet)
Контакт 43 SDI2/SDO2 — SPI2 data in / out (per datasheet)
Контакт 44 SCK2/SS2 — SPI2 clock / slave select (per datasheet)
Контакт 45 SCL1/SDA1 — I2C1 clock / data (per datasheet)
Контакт 46 SCL2/SDA2 — I2C2 clock / data (per datasheet)
Контакт 47 PWM1H/PWM1L — PWM1 high-side / low-side (per datasheet)
Контакт 48 PWM2H/PWM2L — PWM2 high-side / low-side (per datasheet)
Контакт 49 PWM3H/PWM3L — PWM3 high-side / low-side (per datasheet)
Контакт 50 PWM4H/PWM4L — PWM4 high-side / low-side (per datasheet)
Контакт 51 PWM5H/PWM5L — PWM5 high-side / low-side (per datasheet)
Контакт 52 PWM6H/PWM6L — PWM6 high-side / low-side (per datasheet)
Контакт 53 T1CK/T2CK — Timer1 / Timer2 clock inputs (per datasheet)
Контакт 54 T3CK/T4CK — Timer3 / Timer4 clock inputs (per datasheet)
Контакт 55 INT0/INT1 — External interrupt inputs (per datasheet)
Контакт 56 INT2/INT3 — External interrupt inputs (per datasheet)
Контакт 57 RTCC/RTCC — Real-time clock alarm / output (per datasheet)
Контакт 58 OC1/OC2 — Output compare (per datasheet)
Контакт 59 IC1/IC2 — Input capture (per datasheet)
Контакт 60 IC4/IC5 — Input capture (per datasheet)
Контакт 61 PMA0-PMA7 — Parallel master port address lines (per datasheet)
Контакт 62 PMA8-PMA15 — Parallel master port address lines (per datasheet)
Контакт 63 PMD0-PMD7 — Parallel master port data lines (per datasheet)
Контакт 64 PMD8-PMD15 — Parallel master port data lines (per datasheet)
Контакт 65 PMCS1/PMCS2 — PMP chip selects (per datasheet)
Контакт 66 PMWR/PMRD — PMP write / read strobes (per datasheet)
Контакт 67 FLTA/FLTB — PWM fault inputs (per datasheet)
Контакт 68 Vdd — Digital supply
Контакт 69 Vss — Digital ground
Контакт 70 RP21/CN21/PMD0 — Remappable I/O / PMP data
Контакт 71 RP22/CN22/PMD1 — Remappable I/O / PMP data
Контакт 72 RP23/CN23/PMD2 — Remappable I/O / PMP data
Контакт 73 RP24/CN24/PMD3 — Remappable I/O / PMP data
Контакт 74 RP25/CN25/PMD4 — Remappable I/O / PMP data
Контакт 75 RP26/CN26/PMD5 — Remappable I/O / PMP data
Контакт 76 RP27/CN27/PMD6 — Remappable I/O / PMP data
Контакт 77 RP28/CN28/PMD7 — Remappable I/O / PMP data
Контакт 78 RP29/CN29/PMD8 — Remappable I/O / PMP data
Контакт 79 RP30/CN30/PMD9 — Remappable I/O / PMP data
Контакт 80 RP31/CN31/PMD10 — Remappable I/O / PMP data
Контакт 81 RP32/PMD11 — Remappable I/O / PMP data
Контакт 82 RP33/PMD12 — Remappable I/O / PMP data
Контакт 83 RP34/PMD13 — Remappable I/O / PMP data
Контакт 84 RP35/PMD14 — Remappable I/O / PMP data
Контакт 85 RP36/PMD15 — Remappable I/O / PMP data
Контакт 86 Vdd — Digital supply
Контакт 87 Vss — Digital ground
Контакт 88 RP37/PMA16 — Remappable I/O / PMP address
Контакт 89 RP38/PMA17 — Remappable I/O / PMP address
Контакт 90 RP39/PMA18 — Remappable I/O / PMP address
Контакт 91 RP40/PMA19 — Remappable I/O / PMP address
Контакт 92 RP41/PMA20 — Remappable I/O / PMP address
Контакт 93 RP42/PMA21 — Remappable I/O / PMP address
Контакт 94 RP43/PMA22 — Remappable I/O / PMP address
Контакт 95 RP44/PMA23 — Remappable I/O / PMP address
Контакт 96 C1RX — ECAN1 receive
Контакт 97 C1TX — ECAN1 transmit
Контакт 98 AVdd — Analog supply
Контакт 99 AVss — Analog ground
Контакт 100 Vdd — Digital supply

Типичное применение

DSPIC33FJ256GP710A-E/PF подходит для 6 применениеs: Field-Oriented Motor Control (PMSM / BLDC), Digital Power Conversion (PFC + LLC / Full-Bridge), Solar Micro-Inverter / String Inverter Control, Industrial Communication Gateway / Protocol Bridge, Automotive Body and Convenience ECU, Uninterruptible Power Supply (UPS) Controller.

🏭

Field-Oriented Motor Control (PMSM / BLDC)

The DSPIC33FJ256GP710A-E/PF is well suited to field-oriented control of PMSM, BLDC, and ACIM motors where 40 MIPS of dsPIC33F core throughput and a dedicated DSP engine with single-cycle multiply-accumulate drive the Park/Clarke transforms and PI current loops in real time. Placed as the main controller on a 100-pin TQFP base board, it computes the FOC loop at typical 10 to 20 kHz PWM frequencies with headroom remaining for sensorless observers and CANopen / DeviceNet stacks. The 256 KB Flash accommodates a TCP/IP or CANopen stack plus the FOC library, while 30 KB SRAM holds the Clarke/Park buffers, observer states, and current-loop working set.

⚡

Digital Power Conversion (PFC + LLC / Full-Bridge)

The DSPIC33FJ256GP710A-E/PF delivers the deterministic DSP throughput needed for digital PFC plus LLC or phase-shifted full-bridge converters running at 100 kHz to 500 kHz switching frequencies. The 16-bit dsPIC33F core with single-cycle MAC handles voltage-mode and peak-current-mode compensators in real time, while the 256 KB Flash stores the control firmware, soft-start, and fault recovery state machines. The 30 KB SRAM is large enough for two parallel control loops plus input voltage RMS and current reference buffers. With ECAN, the DSP can also participate in a multi-module paralleled power supply's droop / current-sharing bus.

✈️

Solar Micro-Inverter / String Inverter Control

For solar micro-inverters and string inverters the DSPIC33FJ256GP710A-E/PF combines real-time DSP throughput with the extended industrial -40 C to +125 C temperature grade, surviving outdoor cabinet mounting. The 40 MIPS core drives MPPT (typically Perturb & Observe or Incremental Conductance), anti-islanding DSP loops, and a grid-tie PLL running in software, while the integrated ECAN supports daisy-chained module communication. The 256 KB Flash stores the MPPT library, grid-tie firmware, and fault event log; 30 KB SRAM buffers the ADC sample stream without CPU intervention.

🌐

Industrial Communication Gateway / Protocol Bridge

In a multi-protocol industrial gateway the DSPIC33FJ256GP710A-E/PF can bridge ECAN to UART, SPI, and Modbus RTU simultaneously, while the 40 MIPS DSP engine accelerates any on-line signal conditioning or filtering. The 256 KB Flash holds a Modbus / CANopen stack plus a small protocol-translation table, and 30 KB SRAM buffers incoming / outgoing frames. The 100-pin TQFP exposes both UARTs, both SPIs, both I2C buses, and ECAN, eliminating the need for an external transceiver controller.

🚗

Automotive Body and Convenience ECU

While the -E grade is not AEC-Q100 qualified, the -E/PF sibling makes an effective development platform for the -H/PF AEC-Q100-qualified automotive variant in body and convenience ECUs. The same 256 KB Flash holds a CANopen / CAN body stack plus lighting or window-lift control logic; ECAN connects directly to the vehicle CAN bus. Migrating to the -H/PF drop-in gives the same firmware at -40 C to +150 C with full automotive qualification, simplifying the design-reuse chain between industrial prototypes and production automotive ECUs.

🖥️

Uninterruptible Power Supply (UPS) Controller

In a double-conversion online UPS the DSPIC33FJ256GP710A-E/PF provides real-time DSP-based inverter control, battery management, and grid synchronisation in a single chip. The 40 MIPS core runs a digital PLL locked to the grid, a battery Charger with DC-bus voltage loop, and the output inverter's voltage / current loop in parallel. The 256 KB Flash stores the inverter control law, soft-transfer state machine, and event log; 30 KB SRAM buffers ADC samples at the PWM rate without CPU stalls.

What is the core performance of the DSPIC33FJ256GP710A-E/PF?
The DSPIC33FJ256GP710A-E/PF delivers up to 40 MIPS from its 16-bit dsPIC33F modified Harvard core. According to the Microchip dsPIC33FJ256GP710A datasheet, the core pairs a 16-bit ALU with a dedicated DSP engine for single-cycle MAC and dual data fetch. At a maximum CPU clock of 40 MHz, this performance level is sufficient for field-oriented motor control, digital filters, and on-line power-conversion feedback loops running in real time without external DSP co-processors.
How much program Flash and SRAM does the DSPIC33FJ256GP710A-E/PF have?
The DSPIC33FJ256GP710A-E/PF integrates 256 KB of self-programmable Flash program memory and 30 KB of SRAM on-chip. The 256 KB Flash is organised into pages and supports in-application self-programming (IAP) for bootloaders and field firmware updates. The 30 KB SRAM is split between general-purpose RAM and DMA-accessible regions, allowing background data movement without CPU intervention in motor-control and digital-power loops.
What is the operating temperature range of the -E/PF variant?
The -E/PF suffix indicates the Extended industrial temperature grade of -40 C to +125 C, per the Microchip dsPIC33F family ordering nomenclature. Compared with the I-section (industrial, -40 C to +85 C) and H-section (AEC-Q100 automotive, -40 C to +150 C) siblings, the E grade is the typical choice for industrial motor drives, solar inverters, and outdoor digital-power converters that do not require full automotive qualification.
What package does the DSPIC33FJ256GP710A-E/PF ship in?
The DSPIC33FJ256GP710A-E/PF ships in a 100-pin TQFP (PF) package measuring 14x14 mm with a 0.5 mm pitch. The high pin count exposes most of the dsPIC33F peripheral set, including multiple PWM outputs, UART, SPI, I2C, ECAN, parallel master port, and the 10/12-bit ADC inputs. The TQFP-100 footprint is also shared by the dsPIC33FJ256GP710A-I/PF, -H/PF, and -I/PT siblings for PCB layout reuse.
What is the difference between DSPIC33FJ256GP710A and the original DSPIC33FJ256GP710?
The DSPIC33FJ256GP710A is the current die revision (A-suffix) of the original DSPIC33FJ256GP710. According to Microchip, the A revision integrates errata fixes versus the original silicon while preserving the same peripheral set, package pinout, and instruction set, so existing firmware is binary-compatible. The original DSPIC33FJ256GP710 is now a legacy variant; new designs should target the A-suffix for full manufacturer support and latest errata documentation.
Where can I download the DSPIC33FJ256GP710A-E/PF datasheet PDF?
The official Microchip datasheet for the DSPIC33FJ256GP710A family is available on Microchip's product page at https://www.microchip.com/en-us/product/dsPIC33FJ256GP710A, which links to the family datasheet covering the 256 KB Flash / 30 KB SRAM GP family variants in 100-pin TQFP. The datasheet is approximately 362 pages and contains electrical characteristics, peripheral descriptions, and programming specifications for the entire family.
Where to buy DSPIC33FJ256GP710A-E/PF online and what is the price?
As of 2026-10-07, the DSPIC33FJ256GP710A-E/PF is in stock at authorized distributors including DigiKey (Mouser part DSPIC33FJ256GP710A-E/PF, Microchip USA, and Future Electronics, with 11 distributors aggregated on Octopart. Distributor pricing for cut-tape / tray builds typically starts around USD 14.20 for qty-1 and falls to USD 8.45 at the 1000-piece break per the prices referenced on the verified distributor pages. Lead time for factory-direct orders is subject to Microchip allocation.
Is the DSPIC33FJ256GP710A-E/PF pin-compatible with the DSPIC33FJ256GP710A-I/PF?
Yes, the DSPIC33FJ256GP710A-E/PF and DSPIC33FJ256GP710A-I/PF share the same 100-pin TQFP (PF) footprint and pinout. The only differences are the operating temperature grade (E: -40 C to +125 C vs I: -40 C to +85 C) and the factory test flow. The two parts are drop-in replacements on the same PCB; firmware is identical. This makes the E/PF a practical upgrade path for designs that require higher temperature headroom.
What is the best drop-in replacement for the DSPIC33FJ256GP710A-E/PF?
The DSPIC33FJ256GP710A-E/PT is the most direct drop-in replacement, sharing the same A-silicon die, 256 KB Flash, 30 KB SRAM, and 100-pin count, only differing in the TQFP body size (PT = 12x12 mm vs PF = 14x14 mm, which is a footprint change and NOT a true drop-in). For a same-footprint drop-in at the 14x14 mm 100-pin TQFP, the DSPIC33FJ256GP710A-I/PF (industrial temperature) and the DSPIC33FJ256GP710A-H/PF (AEC-Q100 automotive) are both drop-in compatible per the verified cross-reference data.
DSPIC33FJ256GP710A-E/PF vs DSPIC33FJ128GP710A-E/PF — which should I choose?
The DSPIC33FJ256GP710A-E/PF and the DSPIC33FJ128GP710A-E/PF share the same 100-pin TQFP (PF) package and the same dsPIC33F core at 40 MIPS. The 256 part doubles the Flash (256 KB vs 128 KB) and increases SRAM (30 KB vs 16 KB) versus the 128 part. Choose the 256 KB variant when your firmware plus bootloader exceeds 128 KB, when you keep large lookup tables on-chip, or when you want headroom for future features; the 128 KB variant is sufficient for smaller motor-control and digital-power firmwares and is typically lower cost.
Can the DSPIC33FJ256MC710A-E/PF replace the DSPIC33FJ256GP710A-E/PF?
The DSPIC33FJ256MC710A-E/PF is in the same 100-pin TQFP (PF) package and shares the same 256 KB Flash / 30 KB SRAM memory configuration, but belongs to the MC (Motor Control) sub-family instead of the GP (General Purpose) sub-family. The MC variant adds a dedicated high-resolution motor-control PWM with finer edge resolution and complementary PWMs suited to field-oriented control, while the GP variant is tuned for general embedded DSP and power-conversion loops. The two are pin-compatible per the Microchip migration documentation, but verify your PWM and timer requirements before substituting.
What is the difference between the GP and MC sub-families in the dsPIC33FJ256GP710A generation?
Both the GP (General Purpose) and MC (Motor Control) sub-families share the same dsPIC33F 40 MIPS core, the same 256 KB Flash / 30 KB SRAM maximum, and the same 100-pin TQFP package options. The MC sub-family adds a high-resolution PWM with dedicated fault inputs and finer edge resolution targeted at three-phase motor inverters, while the GP sub-family offers a more general peripheral mix for digital power conversion, signal processing, and multi-protocol industrial nodes. For FOC or PFC + inverter control, prefer the MC sub-family.
Which IDE and compiler should I use with the DSPIC33FJ256GP710A-E/PF?
The DSPIC33FJ256GP710A-E/PF is fully supported by the free Microchip MPLAB X IDE together with the MPLAB XC-DSC C/C++ compiler (the successor to MPLAB C30 for dsPIC). The XC-DSC compiler is a full-featured, optimising ANSI C compiler that translates standard C into dsPIC33F assembly with command-line flags to tune the DSP engine instruction scheduling. For plug-in module prototyping, the 100-pin TQFP PIM (Plug-In Module) plugs directly into the Explorer 16/32 development board.
Does the DSPIC33FJ256GP710A-E/PF support CAN or USB communication?
The DSPIC33FJ256GP710A-E/PF integrates one ECAN (Enhanced Controller Area Network) module supporting CAN 2.0B active frames, but it does not include a USB peripheral. For USB connectivity in the same family, look at the dsPIC33FJ256GP710A USB variants (if offered in your local distributor stock) or migrate to a higher-end dsPIC33E/dsPIC33C part with USB On-The-Go. For industrial fieldbuses, the UART plus ECAN combination on the GP710A covers typical CANopen and DeviceNet slaves.
What are the key specifications of the DSPIC33FJ256GP710A-E/PF that engineers should know?
The DSPIC33FJ256GP710A-E/PF integrates a 16-bit dsPIC33F modified Harvard core at 40 MIPS, 256 KB Flash, 30 KB SRAM, a 10/12-bit multi-channel ADC, multiple PWM outputs, two UART, two SPI, two I2C, ECAN, and a parallel master port, all in a 100-pin 14x14 mm TQFP (PF) package qualified to -40 C to +125 C. According to the Microchip family datasheet, the 100-pin TQFP exposes nearly all peripheral pins, making it the high-pinout option of the GP family. Combined with the 40 MIPS core, this is the canonical all-rounder DSC for industrial real-time control.

Справочные инженерные данные для DSPIC33FJ256GP710A-E/PF — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the DSPIC33FJ256GP710A-E/PF for industrial real-time control designs that need 256 KB Flash and 30 KB SRAM with the extended -40 C to +125 C temperature grade but do not require AEC-Q100 automotive qualification. If your firmware plus bootloader fits in 128 KB Flash with 16 KB SRAM, the DSPIC33FJ128GP710A-E/PF gives the same 100-pin TQFP (PF) footprint at a lower unit cost. For indoor industrial equipment the DSPIC33FJ256GP710A-I/PF (industrial temperature, -40 C to +85 C) is the same die at lower cost. For automotive ECUs migrate to the DSPIC33FJ256GP710A-H/PF AEC-Q100 sibling. For motor-control-specific designs with high-resolution PWM, select the DSPIC33FJ256MC710A-E/PF in the same package.

Сравнение с аналогами

Параметр Этот товар DSPIC33FJ256GP710A-I/PF DSPIC33FJ256GP710AT-I/PF DSPIC33FJ256GP710A-H/PF DSPIC33FJ128GP710A-E/PF DSPIC33FJ256GP510A-E/PF DSPIC33FJ256MC710A-E/PF
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package TQFP-100 (PF) 14x14 mm TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same TQFP-100 (PF) 14x14 mm - same
Core Architecture dsPIC33F 16-bit, 40 MIPS dsPIC33F 16-bit, 40 MIPS dsPIC33F 16-bit, 40 MIPS dsPIC33F 16-bit, 40 MIPS dsPIC33F 16-bit, 40 MIPS dsPIC33F 16-bit, 40 MIPS dsPIC33F 16-bit, 40 MIPS
Program Flash 256 KB 256 KB 256 KB 256 KB 128 KB (-50%) 256 KB 256 KB
SRAM 30 KB 30 KB 30 KB 30 KB 16 KB (-47%) 30 KB 30 KB
Temperature Grade -40 C to +125 C (E, Extended) -40 C to +85 C (I, Industrial) -40 C to +85 C (I, Industrial) -40 C to +150 C (H, AEC-Q100) -40 C to +125 C (E) -40 C to +125 C (E) -40 C to +125 C (E)
Sub-Family GP (General Purpose) GP (General Purpose) GP (General Purpose) GP (General Purpose) GP (General Purpose) GP (lower pin count) MC (Motor Control)

Ключевые отличия

  • Largest Flash + SRAM in the GP family in the 100-pin TQFP PF package (против DSPIC33FJ128GP710A-E/PF)
  • Same package and pinout across the GP / MC sub-families for design reuse (против DSPIC33FJ256MC710A-E/PF)
  • Extended temperature grade (-40 C to +125 C) without automotive premium (против DSPIC33FJ256GP710A-H/PF)

Заметки по проектированию

The DSPIC33FJ256GP710A-E/PF operates from a single 3.0 V to 3.6 V supply on Vdd, with a separate analog AVdd pin that must be tied to the same 3.3 V rail through a ferrite bead or 10 ohm resistor. Decouple each Vdd pin with a 100 nF ceramic placed within 5 mm of the pin, and add a bulk 10 uF tantalum or ceramic near the package. Connect every Vss pin (digital and analog AVss) to a single continuous ground plane; do not route analog AVss through ferrite beads, only AVdd.

Pair PGEC1 with PGED1 and PGEC2 with PGED2 as matched-length traces (less than 50 mm, no stubs) for reliable ICSP programming and in-circuit debugging. Keep analog inputs (AN0..AN15) away from PWM outputs and switching nodes; route the analog ground AVss as a separate pour connected to the digital ground at a single point under the chip. The 100-pin TQFP (PF) at 0.5 mm pitch supports 4-layer PCBs with a solid Vcc / GND sandwich; use 0.2 mm / 8 mil traces between adjacent pads.

Estimated: at 40 MIPS core activity, sustained 3.3 V I/O toggling, the DSPIC33FJ256GP710A-E/PF draws roughly 80 mA from Vdd, peaking above 50 mA during Flash programming. Always specify a regulator rated for at least 200 mA to keep headroom for ADC reference currents. Do not exceed 3.6 V on any pin — the dsPIC33F family is NOT 5 V tolerant. Use level shifters (e.g., TXB0108 or simple resistor dividers) when interfacing to 5 V peripherals. The 100-pin TQFP PF package has a thermal pad that must be soldered to the PCB land for mechanical reliability even though the device itself does not bond to it for heat dissipation.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS compliant per Microchip product page. The -E/PF part is the industrial-extended variant; AEC-Q100 qualification is available only on the -H/PF sibling (e.g. DSPIC33FJ256GP710A-H/PF). Lead-free reflow profile per JEDEC J-STD-020 MSL-3 is required for the TQFP-100 package.

Данные проверены: 2026-10-07 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Microchip Technology DSPIC33FJ256GP710A-E/PF DSPIC33FJ256GP710A-I/PF DSPIC33FJ256GP710AT-I/PF DSPIC33FJ256GP710A-H/PF DSPIC33FJ128GP710A-E/PF DSPIC33FJ256GP510A-E/PF DSPIC33FJ256MC710A-E/PF dsPIC33F Digital Signal Controller DSC modified Harvard architecture TQFP-100 (PF) TQFP package AEC-Q100 RoHS REACH MPLAB X IDE MPLAB XC-DSC compiler FOC (Field-Oriented Control) PMSM motor control PFC power factor correction ECAN (Enhanced CAN) ICSP (In-Circuit Serial Programming) 40 MIPS
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