EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel
MPN: EP1S20B672C7N ✗ انتهى عمره الإنتاجيEP1S20B672C7N نظرة عامة
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit in the programmable logic tier of the digital hierarchy, between fixed-function ASICs and software-driven processors, and are valued for parallel computation, deterministic latency, and in-field reconfigurability.
Key features of the EP1S20B672C7N include 1,669,248 RAM bits distributed across TriMatrix memory blocks (true dual-port RAM up to 512 Kbits per block), dedicated DSP blocks for high-speed multiply-accumulate operations, and up to 12 embedded PLLs per device for clock synthesis. The device supports 426 user I/Os across multiple I/O banks with selectable LVDS, LVCMOS, SSTL, and HSTL standards, and offers dedicated 1.5 V core supply operation.
Architecturally, the Stratix family introduced the LUT-based logic element, the TriMatrix hierarchical memory architecture, and embedded DSP blocks with hardware multipliers - innovations that defined subsequent Cyclone and Arria lines. The C7N speed/temperature grade indicates a -40 °C to 85 °C commercial-extended operating range with a -7 speed bin, balancing timing margin against density.
Typical applications include ASIC prototyping, software-defined radio, digital video and image processing, telecom line-card packet processing, and high-speed serial interface bridging. Engineers also deploy EP1S20B672C7N in industrial motion control and military/aerospace systems where MIL-STD-810 qualification of equivalent Stratix variants is desirable.
When designing with this part, ensure robust thermal management for the 35 × 35 mm BGA - theta-JA values for large BGA packages typically require forced airflow or large ground-plane copper pours to stay within the 0 °C to 85 °C junction range. Power sequencing of the 1.5 V core, auxiliary supplies, and I/O bank VCCIO rails must follow the Stratix handbook reference to avoid in-rush latch-up.
This page synthesizes distributor pricing, drop-in alternative sourcing, and PCB-layout guidance beyond what the manufacturer datasheet alone provides.
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الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1S20B672C7N (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Package, Speed Grade, Configuration Method, Family.
EP1S25F672C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S25B672C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S20F672C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S20B672C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S10B672C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1S20B672C7N الحدود القصوى والخصائص الكهربائية
| Series | Stratix |
| Family | Stratix (original) |
| Process Technology | 0.13 µm CMOS |
| Logic Elements (LEs) | 18,460 |
| LABs / CLBs | 1,846 |
| Embedded Memory Bits | 1,669,248 bits |
| Maximum User I/O | 426 |
| Number of Pins / Balls | 672 |
| Package Type | 672-BBGA (Fine-pitch BGA, 35 × 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core, VCCINT) | 1.5 V |
| درجة حرارة التشغيل | 0 °C to 85 °C (Commercial Extended) |
| Speed Grade | -7 |
| نوع التركيب | Surface Mount (BGA) |
| مستوى MSL | 3 (per JEDEC J-STD-020) |
| Logic Family | CMOS |
دليل تكوين أطراف EP1S20B672C7N 672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch)
تكوين الأطراف لـ EP1S20B672C7N (حزمة 672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP1S20B672C7N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP1S20B672C7N مناسب لـ 6 التطبيقs: ASIC Prototyping & Emulation, Software-Defined Radio Baseband, Telecom Line-Card Packet Processing, Digital Video & Image Processing, Industrial Motion Control & Robotics, High-Speed Serial Interface Bridging.
ASIC Prototyping & Emulation
The EP1S20B672C7N's 18,460 logic elements, 1,669,248 bits of TriMatrix block RAM, and 426 user I/O pins make it a capable platform for ASIC prototyping and pre-silicon validation. Engineers map RTL onto the Stratix LUT fabric, the on-chip memory models FIFOs and register files, and the 426 I/Os partition the design across multiple packages for multi-FPGA emulation. Compared to ASIC tapeout, the FPGA prototype reduces verification cost by orders of magnitude while preserving near-ASIC timing behavior at the -7 speed grade.
موصى به
Software-Defined Radio Baseband
The EP1S20B672C7N integrates dedicated DSP blocks with hardware multipliers that accelerate the multiply-accumulate operations central to SDR baseband processing. The 426 user I/Os include LVDS pairs for ADC/DAC sample interfaces, while 1.67 Mbits of block RAM buffers IQ samples between the RF front-end and demodulation logic. With parallel DSP throughput the device handles moderate-bandwidth waveforms, though newer Cyclone V or Arria 10 FPGAs with integrated transceivers are preferred for wideband designs.
موصى به
Telecom Line-Card Packet Processing
The EP1S20B672C7N was widely deployed in telecom line cards for packet classification, queuing, and forwarding at wire speed. Its 1.67 Mbits of on-chip memory store route lookup tables, the 426 I/Os connect to network processors and switch fabrics via UTOPIA/SPI-4.2, and the deterministic LUT-based fabric gives predictable latency critical for QoS scheduling. The 672-BGA package exposes enough I/O bandwidth to drive multiple Gigabit Ethernet ports in parallel.
موصى به
Digital Video & Image Processing
The EP1S20B672C7N's parallel LUT fabric and embedded DSP blocks accelerate real-time video processing pipelines such as motion estimation, deinterlacing, and color-space conversion. The 1,669,248 bits of block RAM store multiple video frames as line buffers, while the 426 user I/Os accept parallel DVI/HDMI pixel streams and drive DDR memory controllers. Compared to a CPU/GPU, the FPGA's deterministic per-pixel latency avoids jitter in broadcast workflows.
موصى به
Industrial Motion Control & Robotics
The EP1S20B672C7N executes multi-axis PID control loops, trajectory generation, and EtherCAT / SERCOS interface logic on a single chip. Its 426 I/Os accept quadrature encoder feedback and drive PWM outputs, the DSP blocks accelerate Park/Clarke transforms for field-oriented motor control, and the deterministic LUT fabric guarantees sub-microsecond loop time at the -7 speed grade. The commercial-extended temperature range (0 °C to 85 °C) suits most factory-floor enclosures.
موصى به
High-Speed Serial Interface Bridging
The EP1S20B672C7N bridges between legacy parallel buses (PCI, UTOPIA, SPI-4.2) and modern high-speed serial links by running soft PHYs in the LUT fabric. The 1.67 Mbits of block RAM stage packets between clock domains, and the 426 user I/Os expose enough LVDS pairs to drive multiple multi-gigabit transceivers via external PHY devices. Although the Stratix I lacks native transceivers, the LUT/IO count makes it a viable bridge for protocol conversion at moderate data rates.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1S20B672C7N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1S25F672C7N | EP1S25B672C7N | EP1S20F672C7N | EP1S20B672C6N | EP1S10B672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (35 × 35 mm, 1.27 mm pitch) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) |
| Logic Elements | 18,460 | 25,660 (+39 %) | 25,660 (+39 %) | 18,460 (same die) | 18,460 (same) | 10,570 (-43 %) |
| Embedded Memory (bits) | 1,669,248 | 1,944,576 (+16 %) | 1,944,576 (+16 %) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45 %) |
| Maximum User I/O | 426 | 426 (same) | 426 (same) | 426 (same) | 426 (same) | 346 (-19 %) |
| Speed Grade | -7 | -7 (same) | -7 (same) | -7 (same) | -6 (slower) | -7 (same) |
| Operating Temperature | 0 °C to 85 °C (commercial extended) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Higher logic density at same package (مقابلEP1S10B672C7N)
- Drop-in density upgrade available (مقابلEP1S25F672C7N)
- Lead-free variant exists in same package (مقابلEP1S20F672C7N)
ملاحظات التصميم
The 672-BGA package measures 35 × 35 mm and typically exhibits theta-JA around 15-20 °C/W with forced airflow. Estimated: at 1.5 V core and 1.2 A core current (≈1.8 W core power) plus I/O bank dissipation, total device power can reach 4-7 W for typical designs. Add a heatsink or thermal pad for sustained high ambient temperatures.
Route 1.5 V core (VCCINT), PLL analog (VCCA_PLL), and I/O bank VCCIO supplies in separate power planes with star-ground returns. Use a 4-layer PCB at minimum with continuous power/ground planes directly beneath the BGA escape region. The 1.27 mm ball pitch requires laser-drilled or 4-mil mechanical micro-vias for inner-row escape to internal layers.
Stratix I requires a specific power-on sequence (VCCINT first, then VCCA_PLL, then VCCIO) - failure to follow this can trigger in-rush latch-up. Configure unused I/O pins as tri-stated inputs with weak pull-up in the Quartus II fitter settings. Configuration via passive serial (PS) mode requires a valid configuration clock on DCLK before CONF_DONE goes high.
The 672-BGA escape pattern uses dog-bone fanout to BGA pads on the top layer with micro-via transition to internal routing layers. Match-length tuning is required for LVDS pairs, SSTL memories, and clock-distribution nets to meet Stratix I timing closure at the -7 speed grade. Use the Quartus II TimeQuest timing analyzer with Synopsys Design Constraints (.sdc) files.
معلومات الامتثال
RoHS and lead-free status not explicitly stated in verified web data; the B (SnPb ball) suffix suggests a non-RoHS component, while F variants are lead-free. AEC-Q100 is not applicable for FPGAs. Always request manufacturer documentation for compliance verification on obsolete parts.
