EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel
部品番号: EP1S20B672C7N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $501.6 | $501.60 |
| 10 | $481.5 | $4,815.00 |
| 100 | $425 | $42,500.00 |
| 500 | $372 | $186,000.00 |
| 1,000 | $320 | $320,000.00 |
EP1S20B672C7N 概要
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit in the programmable logic tier of the digital hierarchy, between fixed-function ASICs and software-driven processors, and are valued for parallel computation, deterministic latency, and in-field reconfigurability.
Key features of the EP1S20B672C7N include 1,669,248 RAM bits distributed across TriMatrix memory blocks (true dual-port RAM up to 512 Kbits per block), dedicated DSP blocks for high-speed multiply-accumulate operations, and up to 12 embedded PLLs per device for clock synthesis. The device supports 426 user I/Os across multiple I/O banks with selectable LVDS, LVCMOS, SSTL, and HSTL standards, and offers dedicated 1.5 V core supply operation.
Architecturally, the Stratix family introduced the LUT-based logic element, the TriMatrix hierarchical memory architecture, and embedded DSP blocks with hardware multipliers - innovations that defined subsequent Cyclone and Arria lines. The C7N speed/temperature grade indicates a -40 °C to 85 °C commercial-extended operating range with a -7 speed bin, balancing timing margin against density.
Typical applications include ASIC prototyping, software-defined radio, digital video and image processing, telecom line-card packet processing, and high-speed serial interface bridging. Engineers also deploy EP1S20B672C7N in industrial motion control and military/aerospace systems where MIL-STD-810 qualification of equivalent Stratix variants is desirable.
When designing with this part, ensure robust thermal management for the 35 × 35 mm BGA - theta-JA values for large BGA packages typically require forced airflow or large ground-plane copper pours to stay within the 0 °C to 85 °C junction range. Power sequencing of the 1.5 V core, auxiliary supplies, and I/O bank VCCIO rails must follow the Stratix handbook reference to avoid in-rush latch-up.
This page synthesizes distributor pricing, drop-in alternative sourcing, and PCB-layout guidance beyond what the manufacturer datasheet alone provides.
ドロップイン代替品: EP1S20B672C7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1S20B672C7N (同一形状・フットプリント) — 相違点: Operating Temperature, Package, Speed Grade, Configuration Method, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP1S25F672C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$535 / 個
データシートを見る →EP1S25B672C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$620.15 / 個
データシートを見る →EP1S20F672C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$109.2 / 個
データシートを見る →EP1S20B672C6N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$425 / 個
データシートを見る →EP1S10B672C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$67.9 / 個
データシートを見る →EP1S20B672C7N 最大定格&電気的特性
| Series | Stratix |
| Family | Stratix (original) |
| Process Technology | 0.13 µm CMOS |
| Logic Elements (LEs) | 18,460 |
| LABs / CLBs | 1,846 |
| Embedded Memory Bits | 1,669,248 bits |
| Maximum User I/O | 426 |
| Number of Pins / Balls | 672 |
| Package Type | 672-BBGA (Fine-pitch BGA, 35 × 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core, VCCINT) | 1.5 V |
| 動作温度 | 0 °C to 85 °C (Commercial Extended) |
| Speed Grade | -7 |
| 実装タイプ | Surface Mount (BGA) |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| Logic Family | CMOS |
EP1S20B672C7N 672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch) ピン配置ガイド
EP1S20B672C7N (672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1S20B672C7N.
詳細は データシート をご参照ください。
主な用途
EP1S20B672C7N の用途: 6 件s: ASIC Prototyping & Emulation, Software-Defined Radio Baseband, Telecom Line-Card Packet Processing, Digital Video & Image Processing, Industrial Motion Control & Robotics, High-Speed Serial Interface Bridging.
ASIC Prototyping & Emulation
The EP1S20B672C7N's 18,460 logic elements, 1,669,248 bits of TriMatrix block RAM, and 426 user I/O pins make it a capable platform for ASIC prototyping and pre-silicon validation. Engineers map RTL onto the Stratix LUT fabric, the on-chip memory models FIFOs and register files, and the 426 I/Os partition the design across multiple packages for multi-FPGA emulation. Compared to ASIC tapeout, the FPGA prototype reduces verification cost by orders of magnitude while preserving near-ASIC timing behavior at the -7 speed grade.
おすすめ
Software-Defined Radio Baseband
The EP1S20B672C7N integrates dedicated DSP blocks with hardware multipliers that accelerate the multiply-accumulate operations central to SDR baseband processing. The 426 user I/Os include LVDS pairs for ADC/DAC sample interfaces, while 1.67 Mbits of block RAM buffers IQ samples between the RF front-end and demodulation logic. With parallel DSP throughput the device handles moderate-bandwidth waveforms, though newer Cyclone V or Arria 10 FPGAs with integrated transceivers are preferred for wideband designs.
おすすめ
Telecom Line-Card Packet Processing
The EP1S20B672C7N was widely deployed in telecom line cards for packet classification, queuing, and forwarding at wire speed. Its 1.67 Mbits of on-chip memory store route lookup tables, the 426 I/Os connect to network processors and switch fabrics via UTOPIA/SPI-4.2, and the deterministic LUT-based fabric gives predictable latency critical for QoS scheduling. The 672-BGA package exposes enough I/O bandwidth to drive multiple Gigabit Ethernet ports in parallel.
おすすめ
Digital Video & Image Processing
The EP1S20B672C7N's parallel LUT fabric and embedded DSP blocks accelerate real-time video processing pipelines such as motion estimation, deinterlacing, and color-space conversion. The 1,669,248 bits of block RAM store multiple video frames as line buffers, while the 426 user I/Os accept parallel DVI/HDMI pixel streams and drive DDR memory controllers. Compared to a CPU/GPU, the FPGA's deterministic per-pixel latency avoids jitter in broadcast workflows.
おすすめ
Industrial Motion Control & Robotics
The EP1S20B672C7N executes multi-axis PID control loops, trajectory generation, and EtherCAT / SERCOS interface logic on a single chip. Its 426 I/Os accept quadrature encoder feedback and drive PWM outputs, the DSP blocks accelerate Park/Clarke transforms for field-oriented motor control, and the deterministic LUT fabric guarantees sub-microsecond loop time at the -7 speed grade. The commercial-extended temperature range (0 °C to 85 °C) suits most factory-floor enclosures.
おすすめ
High-Speed Serial Interface Bridging
The EP1S20B672C7N bridges between legacy parallel buses (PCI, UTOPIA, SPI-4.2) and modern high-speed serial links by running soft PHYs in the LUT fabric. The 1.67 Mbits of block RAM stage packets between clock domains, and the 426 user I/Os expose enough LVDS pairs to drive multiple multi-gigabit transceivers via external PHY devices. Although the Stratix I lacks native transceivers, the LUT/IO count makes it a viable bridge for protocol conversion at moderate data rates.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1S20B672C7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1S25F672C7N | EP1S25B672C7N | EP1S20F672C7N | EP1S20B672C6N | EP1S10B672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (35 × 35 mm, 1.27 mm pitch) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) |
| Logic Elements | 18,460 | 25,660 (+39 %) | 25,660 (+39 %) | 18,460 (same die) | 18,460 (same) | 10,570 (-43 %) |
| Embedded Memory (bits) | 1,669,248 | 1,944,576 (+16 %) | 1,944,576 (+16 %) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45 %) |
| Maximum User I/O | 426 | 426 (same) | 426 (same) | 426 (same) | 426 (same) | 346 (-19 %) |
| Speed Grade | -7 | -7 (same) | -7 (same) | -7 (same) | -6 (slower) | -7 (same) |
| Operating Temperature | 0 °C to 85 °C (commercial extended) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Higher logic density at same package (vs EP1S10B672C7N)
- Drop-in density upgrade available (vs EP1S25F672C7N)
- Lead-free variant exists in same package (vs EP1S20F672C7N)
設計ノート
The 672-BGA package measures 35 × 35 mm and typically exhibits theta-JA around 15-20 °C/W with forced airflow. Estimated: at 1.5 V core and 1.2 A core current (≈1.8 W core power) plus I/O bank dissipation, total device power can reach 4-7 W for typical designs. Add a heatsink or thermal pad for sustained high ambient temperatures.
Route 1.5 V core (VCCINT), PLL analog (VCCA_PLL), and I/O bank VCCIO supplies in separate power planes with star-ground returns. Use a 4-layer PCB at minimum with continuous power/ground planes directly beneath the BGA escape region. The 1.27 mm ball pitch requires laser-drilled or 4-mil mechanical micro-vias for inner-row escape to internal layers.
Stratix I requires a specific power-on sequence (VCCINT first, then VCCA_PLL, then VCCIO) - failure to follow this can trigger in-rush latch-up. Configure unused I/O pins as tri-stated inputs with weak pull-up in the Quartus II fitter settings. Configuration via passive serial (PS) mode requires a valid configuration clock on DCLK before CONF_DONE goes high.
The 672-BGA escape pattern uses dog-bone fanout to BGA pads on the top layer with micro-via transition to internal routing layers. Match-length tuning is required for LVDS pairs, SSTL memories, and clock-distribution nets to meet Stratix I timing closure at the -7 speed grade. Use the Quartus II TimeQuest timing analyzer with Synopsys Design Constraints (.sdc) files.
コンプライアンス情報
RoHS and lead-free status not explicitly stated in verified web data; the B (SnPb ball) suffix suggests a non-RoHS component, while F variants are lead-free. AEC-Q100 is not applicable for FPGAs. Always request manufacturer documentation for compliance verification on obsolete parts.