EP1S20B672C7N - Stratix FPGA, 18,460 LEs, 672-BGA | Intel
料号： EP1S20B672C7N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $501.6 | $501.60 |
| 10 | $481.5 | $4,815.00 |
| 100 | $425 | $42,500.00 |
| 500 | $372 | $186,000.00 |
| 1,000 | $320 | $320,000.00 |
EP1S20B672C7N 概述
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs sit in the programmable logic tier of the digital hierarchy, between fixed-function ASICs and software-driven processors, and are valued for parallel computation, deterministic latency, and in-field reconfigurability.
Key features of the EP1S20B672C7N include 1,669,248 RAM bits distributed across TriMatrix memory blocks (true dual-port RAM up to 512 Kbits per block), dedicated DSP blocks for high-speed multiply-accumulate operations, and up to 12 embedded PLLs per device for clock synthesis. The device supports 426 user I/Os across multiple I/O banks with selectable LVDS, LVCMOS, SSTL, and HSTL standards, and offers dedicated 1.5 V core supply operation.
Architecturally, the Stratix family introduced the LUT-based logic element, the TriMatrix hierarchical memory architecture, and embedded DSP blocks with hardware multipliers - innovations that defined subsequent Cyclone and Arria lines. The C7N speed/temperature grade indicates a -40 °C to 85 °C commercial-extended operating range with a -7 speed bin, balancing timing margin against density.
Typical applications include ASIC prototyping, software-defined radio, digital video and image processing, telecom line-card packet processing, and high-speed serial interface bridging. Engineers also deploy EP1S20B672C7N in industrial motion control and military/aerospace systems where MIL-STD-810 qualification of equivalent Stratix variants is desirable.
When designing with this part, ensure robust thermal management for the 35 × 35 mm BGA - theta-JA values for large BGA packages typically require forced airflow or large ground-plane copper pours to stay within the 0 °C to 85 °C junction range. Power sequencing of the 1.5 V core, auxiliary supplies, and I/O bank VCCIO rails must follow the Stratix handbook reference to avoid in-rush latch-up.
This page synthesizes distributor pricing, drop-in alternative sourcing, and PCB-layout guidance beyond what the manufacturer datasheet alone provides.
直接替换替代料： EP1S20B672C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1S20B672C7N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Speed Grade, Configuration Method, Family.
快速对比工具——选择替代料号进行并排对比：
EP1S25F672C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$535 / 个
查看数据手册 →EP1S25B672C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$620.15 / 个
查看数据手册 →EP1S20F672C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$109.2 / 个
查看数据手册 →EP1S20B672C6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$425 / 个
查看数据手册 →EP1S10B672C7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$67.9 / 个
查看数据手册 →EP1S20B672C7N 最大额定值与电气特性
| Series | Stratix |
| Family | Stratix (original) |
| Process Technology | 0.13 µm CMOS |
| Logic Elements (LEs) | 18,460 |
| LABs / CLBs | 1,846 |
| Embedded Memory Bits | 1,669,248 bits |
| Maximum User I/O | 426 |
| Number of Pins / Balls | 672 |
| Package Type | 672-BBGA (Fine-pitch BGA, 35 × 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core, VCCINT) | 1.5 V |
| 工作温度 | 0 °C to 85 °C (Commercial Extended) |
| Speed Grade | -7 |
| 安装类型 | Surface Mount (BGA) |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| Logic Family | CMOS |
EP1S20B672C7N 672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch) 引脚配置指南
EP1S20B672C7N（672-bbga (fine-pitch bga, 35 × 35 mm, 1.27 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1S20B672C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1S20B672C7N 适用于 6 应用s: ASIC Prototyping & Emulation, Software-Defined Radio Baseband, Telecom Line-Card Packet Processing, Digital Video & Image Processing, Industrial Motion Control & Robotics, High-Speed Serial Interface Bridging.
ASIC Prototyping & Emulation
The EP1S20B672C7N's 18,460 logic elements, 1,669,248 bits of TriMatrix block RAM, and 426 user I/O pins make it a capable platform for ASIC prototyping and pre-silicon validation. Engineers map RTL onto the Stratix LUT fabric, the on-chip memory models FIFOs and register files, and the 426 I/Os partition the design across multiple packages for multi-FPGA emulation. Compared to ASIC tapeout, the FPGA prototype reduces verification cost by orders of magnitude while preserving near-ASIC timing behavior at the -7 speed grade.
推荐
Software-Defined Radio Baseband
The EP1S20B672C7N integrates dedicated DSP blocks with hardware multipliers that accelerate the multiply-accumulate operations central to SDR baseband processing. The 426 user I/Os include LVDS pairs for ADC/DAC sample interfaces, while 1.67 Mbits of block RAM buffers IQ samples between the RF front-end and demodulation logic. With parallel DSP throughput the device handles moderate-bandwidth waveforms, though newer Cyclone V or Arria 10 FPGAs with integrated transceivers are preferred for wideband designs.
推荐
Telecom Line-Card Packet Processing
The EP1S20B672C7N was widely deployed in telecom line cards for packet classification, queuing, and forwarding at wire speed. Its 1.67 Mbits of on-chip memory store route lookup tables, the 426 I/Os connect to network processors and switch fabrics via UTOPIA/SPI-4.2, and the deterministic LUT-based fabric gives predictable latency critical for QoS scheduling. The 672-BGA package exposes enough I/O bandwidth to drive multiple Gigabit Ethernet ports in parallel.
推荐
Digital Video & Image Processing
The EP1S20B672C7N's parallel LUT fabric and embedded DSP blocks accelerate real-time video processing pipelines such as motion estimation, deinterlacing, and color-space conversion. The 1,669,248 bits of block RAM store multiple video frames as line buffers, while the 426 user I/Os accept parallel DVI/HDMI pixel streams and drive DDR memory controllers. Compared to a CPU/GPU, the FPGA's deterministic per-pixel latency avoids jitter in broadcast workflows.
推荐
Industrial Motion Control & Robotics
The EP1S20B672C7N executes multi-axis PID control loops, trajectory generation, and EtherCAT / SERCOS interface logic on a single chip. Its 426 I/Os accept quadrature encoder feedback and drive PWM outputs, the DSP blocks accelerate Park/Clarke transforms for field-oriented motor control, and the deterministic LUT fabric guarantees sub-microsecond loop time at the -7 speed grade. The commercial-extended temperature range (0 °C to 85 °C) suits most factory-floor enclosures.
推荐
High-Speed Serial Interface Bridging
The EP1S20B672C7N bridges between legacy parallel buses (PCI, UTOPIA, SPI-4.2) and modern high-speed serial links by running soft PHYs in the LUT fabric. The 1.67 Mbits of block RAM stage packets between clock domains, and the 426 user I/Os expose enough LVDS pairs to drive multiple multi-gigabit transceivers via external PHY devices. Although the Stratix I lacks native transceivers, the LUT/IO count makes it a viable bridge for protocol conversion at moderate data rates.
推荐
推荐产品汇总
工程参考数据： EP1S20B672C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S25F672C7N | EP1S25B672C7N | EP1S20F672C7N | EP1S20B672C6N | EP1S10B672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BBGA (35 × 35 mm, 1.27 mm pitch) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) | 672-BBGA (same) |
| Logic Elements | 18,460 | 25,660 (+39 %) | 25,660 (+39 %) | 18,460 (same die) | 18,460 (same) | 10,570 (-43 %) |
| Embedded Memory (bits) | 1,669,248 | 1,944,576 (+16 %) | 1,944,576 (+16 %) | 1,669,248 (same) | 1,669,248 (same) | 920,448 (-45 %) |
| Maximum User I/O | 426 | 426 (same) | 426 (same) | 426 (same) | 426 (same) | 346 (-19 %) |
| Speed Grade | -7 | -7 (same) | -7 (same) | -7 (same) | -6 (slower) | -7 (same) |
| Operating Temperature | 0 °C to 85 °C (commercial extended) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) | 0 °C to 85 °C (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Higher logic density at same package （对比 EP1S10B672C7N)
- Drop-in density upgrade available （对比 EP1S25F672C7N)
- Lead-free variant exists in same package （对比 EP1S20F672C7N)
设计说明
The 672-BGA package measures 35 × 35 mm and typically exhibits theta-JA around 15-20 °C/W with forced airflow. Estimated: at 1.5 V core and 1.2 A core current (≈1.8 W core power) plus I/O bank dissipation, total device power can reach 4-7 W for typical designs. Add a heatsink or thermal pad for sustained high ambient temperatures.
Route 1.5 V core (VCCINT), PLL analog (VCCA_PLL), and I/O bank VCCIO supplies in separate power planes with star-ground returns. Use a 4-layer PCB at minimum with continuous power/ground planes directly beneath the BGA escape region. The 1.27 mm ball pitch requires laser-drilled or 4-mil mechanical micro-vias for inner-row escape to internal layers.
Stratix I requires a specific power-on sequence (VCCINT first, then VCCA_PLL, then VCCIO) - failure to follow this can trigger in-rush latch-up. Configure unused I/O pins as tri-stated inputs with weak pull-up in the Quartus II fitter settings. Configuration via passive serial (PS) mode requires a valid configuration clock on DCLK before CONF_DONE goes high.
The 672-BGA escape pattern uses dog-bone fanout to BGA pads on the top layer with micro-via transition to internal routing layers. Match-length tuning is required for LVDS pairs, SSTL memories, and clock-distribution nets to meet Stratix I timing closure at the -7 speed grade. Use the Quartus II TimeQuest timing analyzer with Synopsys Design Constraints (.sdc) files.
合规信息
RoHS and lead-free status not explicitly stated in verified web data; the B (SnPb ball) suffix suggests a non-RoHS component, while F variants are lead-free. AEC-Q100 is not applicable for FPGAs. Always request manufacturer documentation for compliance verification on obsolete parts.
