EP1SGX25F1020C6 - Stratix GX FPGA, 25K LE, 1020-BBGA | Intel
MPN: EP1SGX25F1020C6 ✗ انتهى عمره الإنتاجيEP1SGX25F1020C6 نظرة عامة
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture sits between an ASIC and a CPLD in the digital semiconductor hierarchy. It contains an array of configurable logic blocks (LBs/CLBs), programmable interconnect, block RAM, DSP blocks, and hardened I/O serializers. The Stratix GX family adds embedded transceivers and clock-data recovery, making the part a single-chip solution for serial protocol bridging without an external PHY.
Key features of the EP1SGX25F1020C6 include 607 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI-X), 14 embedded transceivers in this density, and 1.5 V core supply with auxiliary 3.3 V I/O support. The device is built on a 1.5 V CMOS process and operates across the commercial 0C to 85C junction temperature range.
Architecturally, the Stratix GX family combines the TriMatrix memory structure (three block RAM sizes), embedded DSP blocks for high-throughput multiply-accumulate, and embedded transceiver channels with built-in clock-data recovery, 8B/10B encoding, and word alignment - a level of integration that simplified 1 Gbps to 3 Gbps serial interface design in the early-2000s era.
Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO), telecom line cards, optical transport networking, high-speed serial I/O expansion, and prototyping of high-bandwidth ASICs. The combination of 25K logic elements, 1.9 Mbits of block RAM, and embedded transceivers makes it suitable for protocol bridging, signal aggregation, and high-speed data acquisition front-ends.
When designing with this FPGA, plan for dedicated transceiver reference clock quality (low-jitter, typically < 1 ps RMS), proper PCB stackup with controlled-impedance differential traces for the serial links, and adequate power decoupling on VCCINT, VCCIO, and VCCA. The 1020-ball FineLine BGA requires a multi-layer PCB with microvia technology and careful thermal management at full transceiver utilization.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing a one-stop reference for engineers evaluating the Stratix GX family.
بدائل مباشرة لـ EP1SGX25F1020C6 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1SGX25F1020C6 (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Speed Grade, Package, RoHS Status, Package Type.
EP1SGX25DF1020C6
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1SGX25DF1020C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1SGX25DF1020C5
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1SGX25DF1020C7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1SGX25DF1020I7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1SGX25DF1020C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1SGX25F1020C6 الحدود القصوى والخصائص الكهربائية
| Family | Stratix GX |
| Logic Elements | 25,660 |
| LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| User I/O Pins | 607 |
| العلبة | 1020-ball FineLine BGA (FBGA-1020) |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch |
| Core Voltage | 1.5 V |
| درجة حرارة التشغيل | 0C to 85C (commercial) |
| Logic Family | CMOS |
| Transceivers | Up to 20 multi-gigabit channels (this die density supports up to 14 active) |
| Transceiver Data Rate | 622 Mbps to 3.1875 Gbps |
| نوع التركيب | Surface Mount (BGA) |
| Lead Free | Yes |
دليل تكوين أطراف EP1SGX25F1020C6 33 x 33 mm, 1.0 mm pitch
تكوين الأطراف لـ EP1SGX25F1020C6 (حزمة 33 x 33 mm, 1.0 mm pitch). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP1SGX25F1020C6.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP1SGX25F1020C6 مناسب لـ 7 التطبيقs: Multi-Gigabit Serial Backplane Interface, Telecom Line Card Aggregation, Optical Transport Network Equipment, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front-End, Industrial Serial Protocol Bridging, Aerospace Test and Instrumentation.
Multi-Gigabit Serial Backplane Interface
The EP1SGX25F1020C6 is purpose-built for multi-gigabit backplane designs supporting XAUI (4 x 3.125 Gbps), Serial RapidIO, and 10G Ethernet backplane channels. Its 20 embedded transceivers deliver up to 3.1875 Gbps per channel with integrated clock-data recovery, 8B/10B encoding, and word alignment, eliminating the need for external PHY chips. The 25,660 logic elements and 1,944,576 bits of block RAM are sized for protocol aggregation and rate-matching FIFOs, while the 607 user I/O pins accommodate legacy parallel sideband signaling. PCB implementation requires controlled-impedance 100 ohm differential traces and a multi-layer stackup with microvia technology.
موصى به
Telecom Line Card Aggregation
In telecom line card designs, the EP1SGX25F1020C6 aggregates multiple lower-speed tributaries onto high-speed serial links for backhaul to switch fabrics. The 25K logic element budget accommodates protocol adaptation logic for OC-12/STM-4, gigabit Ethernet, and Fibre Channel 1x/2x, while 1.9 Mbits of block RAM provide the elastic stores and rate-matching FIFOs required between the parallel interfaces and serial transceiver channels. With 607 user I/O pins, the device directly interfaces with TDM framers, network processors, and switch fabric ASICs without external glue logic.
موصى به
Optical Transport Network Equipment
The EP1SGX25F1020C6 fits OTN (Optical Transport Network) line card and transponder designs where its multi-gigabit transceivers interface with SFP/SFP+ optical modules at data rates up to 3.1875 Gbps. The 25K logic element budget supports GFP/LCAS mapping, OTN framer logic, and FEC processing for OTU-1 (2.666 Gbps) signals, while the abundant block RAM holds framer state and payload mappings. Designers typically pair this FPGA with a forward-error-correction ASIC and OTN framer companion chip in a hybrid silicon solution.
موصى به
ASIC Prototyping and Emulation
The EP1SGX25F1020C6 is widely used as an ASIC prototype vehicle for networking ASICs that target 1-3 Gbps serial I/O. Its combination of 25K logic elements, 1.9 Mbits of block RAM, and 20 multi-gigabit transceivers allows emulation of pre-silicon ASIC RTL with real-world I/O timing and SERDES behavior. Designers map ASIC RTL directly into the FPGA using Quartus synthesis, with the transceivers providing accurate serial I/O behavior that ASIC prototypes often lack. This is a cost-effective risk-reduction step before committing to multi-million dollar ASIC mask sets.
موصى به
High-Speed Data Acquisition Front-End
In high-speed data acquisition systems, the EP1SGX25F1020C6 ingests multi-channel analog-to-digital converter data streams and aggregates them onto high-speed serial links for backplane transmission to a host processor. The device's 607 user I/O pins accommodate parallel LVDS interfaces from multi-channel ADC boards, while the embedded transceivers serialize the aggregated data for transmission to a host FPGA or signal processor. This topology is common in radar, electronic warfare, and wideband SDR systems where high channel density and gigabit serial output are required.
موصى به
Industrial Serial Protocol Bridging
The EP1SGX25F1020C6 bridges legacy industrial protocols (PROFIBUS, RS-485, CAN) to modern serial interfaces in industrial networking gateways. While the part is specified for 0C to 85C commercial temperature, its industrial temperature counterpart EP1SGX25DF1020I7 covers -40C to 100C junction for harsh environments. The embedded transceivers aggregate multiple industrial gateways onto gigabit Ethernet uplinks, while the 607 user I/O handle the dense parallel interface requirements of legacy industrial controllers.
موصى به
Aerospace Test and Instrumentation
In aerospace test rigs, the EP1SGX25F1020C6 functions as a flexible protocol converter that bridges multiple avionics buses (MIL-STD-1553, ARINC 429, AFDX) and high-speed serial telemetry links. Its 20 multi-gigabit transceivers support AFDX (ARINC 664) at 100 Mbps full-duplex over multiple virtual links, while the 25K logic elements implement the avionic protocol stacks. For flight-rated environments, designers migrate to the EP1SGX25DF1020I7 industrial temperature grade or, more commonly, modern radiation-tolerant FPGAs from Microsemi/Microchip or Xilinx.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1SGX25F1020C6 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1SGX25DF1020C6 | EP1SGX25DF1020C6N | EP1SGX25DF1020C5 | EP1SGX25DF1020C7 | EP1SGX25DF1020I7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FineLine BGA (33 x 33 mm) | 1020-ball FineLine BGA (33 x 33 mm) - same | 1020-ball FineLine BGA (33 x 33 mm) - same | 1020-ball FineLine BGA (33 x 33 mm) - same | 1020-ball FineLine BGA (33 x 33 mm) - same | 1020-ball FineLine BGA (33 x 33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C6 | C6 | C6 | C5 (faster) | C7 (slower) | I7 |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to 100C) |
| Lifecycle Status | NRNR | NRNR | NRNR | NRNR | NRNR | NRNR |
أبرز الفروقات
- Direct drop-in compatible with full Stratix GX 25K density family (مقابلEP1SGX25DF1020C6)
- Industrial temperature option in same footprint (مقابلEP1SGX25DF1020I7)
- Faster speed grade available in same footprint (مقابلEP1SGX25DF1020C5)
- Higher logic density than lower-density Stratix variants (مقابلEP1S25F1020C6 (Stratix without GX transceivers))
ملاحظات التصميم
The 1020-ball FineLine BGA at 33 x 33 mm with 1.0 mm pitch requires a multi-layer PCB (typically 8+ layers) with laser-drilled microvia technology. Per Altera BGA layout guidelines, fan-out vias must be placed on a 1.0 mm pitch grid to access inner balls; designers should use 4 mil via-pad and 8 mil drill microvias. Maintain 100 ohm differential impedance for all 20 transceiver channels with via stitching (ground vias every lambda/10 along the trace edges). Leave thermal pad region under the BGA unobstructed for heatsink attachment.
Estimated: at full transceiver utilization (20 channels active at 3.1875 Gbps) and typical logic utilization (~70%), total power dissipation reaches approximately 15-20 W. Decoupling requires at least 20 low-ESR 0.1 uF ceramic capacitors placed within 100 mils of the BGA, plus four 10 uF bulk capacitors per voltage rail. Sequence the VCCINT (1.5 V), VCCIO (3.3 V), and VCCA (transceiver analog) rails in the order specified by the Stratix GX datasheet to avoid inrush current latch-up.
Do not exceed the maximum transceiver reference-clock jitter of 1 ps RMS or the CDR will lose lock. Reference clocks must be sourced from a dedicated low-jitter clock generator (e.g. Crystek CVHD-950 or equivalent), not from an FPGA-generated PLL clock. Confirm that the Quartus II pin assignments match the ballout in the device datasheet; miswiring of JTAG pins (TCK, TMS, TDI, TDO) is the most common first-programming failure on this BGA package.
Transceiver channels operate at up to 3.1875 Gbps, requiring pre-emphasis and equalization settings configured in the Quartus II ALTGX megafunction. Use IBIS-AMI simulation (e.g. HyperLynx or SiSoft QCD) to validate the backplane channel response before committing to PCB layout. AC-coupling capacitors (0.1 uF) must be placed within 100 mils of the transmitter balls for each channel per the Stratix GX AC-coupling application note.
At full transceiver utilization with typical ambient 70C, the junction temperature can approach 100C. Mount a heatsink with thermal interface material (TIM) on the BGA topside; alternatively, use thermal vias in the PCB BGA land pattern to draw heat to internal copper planes. Recommended airflow is at least 200 LFM (linear feet per minute) at 70C ambient to maintain the 85C commercial junction limit.
معلومات الامتثال
Lead-free per Verified Web Data ('LEAD FREE' package marking). RoHS/REACH/AEC-Q100 status not specified in retrieved distributor data; consult Intel product compliance documentation directly. AEC-Q100 not applicable for FPGA logic devices.
