EP1SGX25DF1020C6 - Stratix GX FPGA, 25660 LEs, 607 I/O | Intel
MPN: EP1SGX25DF1020C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $358 | $35,800.00 |
| 500 | $322 | $161,000.00 |
| 1,000 | $289 | $289,000.00 |
Drop-in alternatives for EP1SGX25DF1020C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX25DF1020C5
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View Datasheet →EP1SGX25DF1020C5ES
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View Datasheet →EP1SGX25FF1020C6N
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EP1SGX25DF1020C4
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View Datasheet →EP1SGX25DF1020C6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Device Logic Elements | 25,660 |
| LABs / CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 607 (614 user pins per datasheet) |
| Core Supply Voltage | 1.5 V (1.425 V min, 1.575 V max) |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| Package Type | 1020-BBGA / FC-FBGA |
| Package Size | 33 x 33 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Transceivers | Embedded multi-gigabit transceivers (3.125 Gbps class) |
| Configuration Method | Passive Serial, Fast Passive Parallel, JTAG |
| RoHS Status | Lead-free per datasheet |
EP1SGX25DF1020C6 33 x 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020C6 (33 x 33 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020C6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020C6 is suitable for 7 applications: High-Speed Serial Interface Bridging, Telecom Baseband DSP, Digital Video Broadcast Processing, ASIC Prototyping, Software-Defined Radio Digital Front-End, Industrial Imaging and Machine Vision, Aerospace Avionics Databus.
High-Speed Serial Interface Bridging
The EP1SGX25DF1020C6 is well suited for protocol-conversion bridges between PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI thanks to its embedded transceivers at up to 3.125 Gbps per channel. The 25,660 logic elements and dedicated PCS/PMA blocks let designers implement multi-lane MACs, serdes controllers, and packet-processing pipelines on a single device. The 607 user I/O pins fan out cleanly to external memory companions and parallel buses, while the FC-FBGA-1020 package supplies the thermal headroom for sustained multi-lane operation. A typical design maps 4 transceiver channels to a x4 PCIe Gen1 link, with the remaining fabric dedicated to DMA engines.
Recommended
Telecom Baseband DSP
The EP1SGX25DF1020C6's DSP blocks, combined with 1,944,576 embedded memory bits, support multi-carrier baseband DSP for 3G/4G base-station fronthaul. The device can implement FFT/iFFT engines, channelization filters, and crest-factor-reduction blocks while the integrated transceivers carry CPRI or OBSAI data to the radio unit. Quartus II IP cores for Turbo decoding and Viterbi accelerate time-to-deployment, and the 1020-FBGA package dissipates heat evenly when paired with a moderate copper heatsink. The C6 speed grade provides Fmax headroom for tight baseband timing budgets in OFDM numerologies up to 20 MHz.
Recommended
Digital Video Broadcast Processing
The EP1SGX25DF1020C6 is widely deployed in DVB-ASI, SMPTE 259M/292M/424M SDI, and H.264 contribution encoder platforms. Its 25,660 logic elements plus DSP blocks implement real-time video scaling, de-interlacing, and MPEG transport-stream muxing, while the multi-gigabit transceivers carry uncompressed SDI at 2.97 Gbps. The 607 I/O support parallel video buses to external DDR2 SDRAM frame buffers. Designers typically pair the SGX25 with a Magnum or Harris video AVD for analogue-domain output, with the FPGA supplying all digital timing and protocol handling.
Recommended
ASIC Prototyping
The EP1SGX25DF1020C6 is used as a multi-FPGA prototyping vehicle for ASIC and ASSC pre-silicon validation because the Stratix GX family matches many ASIC cells in timing and I/O behaviour. Engineers partition large ASIC RTL across multiple SGX25 devices using serial TDM or Aurora channels provided by the embedded transceivers. The 1020-FBGA package exposes every user pin, simplifying bring-up on a custom prototyping PCB. Quartus II multi-device compilation supports incremental design flows that map synthesised ASIC RTL to a network of EP1SGX25 devices with predictable timing closure.
Recommended
Software-Defined Radio Digital Front-End
The EP1SGX25DF1020C6 implements SDR digital front-ends for military and commercial radio platforms, handling digital up/down-conversion, channelization, and wideband ADC/DAC interfacing. The transceivers support up to 3.125 Gbps JESD204B links to high-speed data converters, while the DSP fabric executes DDC, DUC, and pulse-shaping filters. With 25,660 LEs and 1.9 Mbit memory, the device supports up to four wideband channels at 100 MSPS each. Combined with deterministic latency, the SGX25 suits time-sensitive phased-array and direction-finding applications in defence SDR systems.
Recommended
Industrial Imaging and Machine Vision
The EP1SGX25DF1020C6 is used in industrial machine-vision line-scan and area-scan camera link frame grabbers, processing Camera Link Full/Medium/Base streams at up to 6.8 Gbps aggregated. Its multi-gigabit transceivers deserialise Camera Link with low deterministic latency, and the DSP fabric performs real-time filtering, blob analysis, and Bayer demosaicing. The 607 I/O enable connection to external DDR2 frame buffers and Host PC interfaces (PCIe, GigE Vision). The commercial 0 to 85 °C range suits factory-floor deployments with appropriate heatsinking.
Recommended
Aerospace Avionics Databus
The EP1SGX25DF1020C6 implements MIL-STD-1553, ARINC 429, and Fibre Channel avionics databus interfaces, where its embedded transceivers handle Fibre Channel FC-AE-ASM at 1.0625 Gbps with deterministic latency. The 25,660 LEs support redundant channel encoding/decoding and built-in-test (BIT) logic. Designers appreciate the FC-FBGA-1020 package for its robust solder joint reliability under aerospace vibration profiles. The part's NRND status means aerospace programs typically lock in long-term orders and route through authorised distributors with extended supply agreements.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020C5 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5ES | EP1SGX25FF1020C6N | EP1SGX25DF1020C4 | EP1SGX25DF1020C6N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| LABs / CLBs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 | 607 |
| Speed Grade | C6 (faster) | C5 (-1 Fmax step) | C5 (-1 Fmax step) | C5 (-1 Fmax step) | C6 (same) | C4 (-2 Fmax steps) | C6 (same) |
| Lead-Free Finish | Lead-free per datasheet | Standard finish | Lead-free | Standard finish | Lead-free | Standard finish | Lead-free |
| Core Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Highest speed grade in the SGX25 1020-FBGA family (vs EP1SGX25DF1020C5)
- Enhanced transceiver feature set versus same-density FF variant (vs EP1SGX25FF1020C6N)
- Largest 33 x 33 mm BGA with full 607 I/O exposure (vs EP1SGX25CF672C7)
Design Notes
The Stratix GX SGX25 device requires multiple independent supply rails per the Stratix GX Device Handbook: a 1.5 V core (VCCINT) that sources the logic fabric and DSP blocks, separate VCCIO banks for the I/O (1.5 V / 1.8 V / 2.5 V / 3.3 V as configured in Quartus II), VCCA_PLL for phase-locked loops, and a dedicated VCC transceiver supply for each multi-gigabit transceiver channel. Decoupling capacitors must follow the reference design's capacitor matrix - typically 0.1 uF X7R placed within 100 mils of each supply pin plus bulk 22 uF tantalum capacitors per rail. Estimated: at 100 % logic utilization with 4 active transceivers, expect ~5 W core plus ~1 W per active transceiver channel.
The 1020-ball FC-FBGA package (33 x 33 mm) relies primarily on the PCB copper pour plus optional heatsink for thermal dissipation. Estimated: at 8 W total power dissipation and a typical 4-layer PCB with 1 oz copper, junction-to-ambient theta_JA is approximately 15 C/W, yielding a 120 °C junction temperature rise above a 25 °C ambient. A 1 square-inch copper pour plus 10 CFM airflow reduces theta_JA below 10 C/W. Designers should run Quartus II PowerPlay early in the design cycle to estimate toggle rates and apply Thermal Margin Mode if junction temperature exceeds 100 °C.
The 1.0 mm pitch BGA requires at minimum a 4-layer PCB with microvia-in-pad construction to escape the inner rows. Recommended stack-up uses 8 mil core plus 4 mil prepreg plus 1 oz copper, with via-in-pad filled and plated flat. Differential transmit-pair routing for transceivers must be 100 ohm ±10 %, length-matched to within 150 mil, and isolated from noisy signals with a continuous ground pour. Keep DC-coupled signals short and avoid stubs; reference the Stratix GX Stratix GX Device Handbook Chapter 5 PCB layout guidelines for full routing rules.
Place configuration EEPROM and JTAG header within 4 inches of the FPGA to ensure reliable configuration. Dedicated MSEL[2:0] pins must be tied to select Passive Serial vs Fast Passive Parallel configuration mode, and nCONFIG must be pulled high through a 10 kohm resistor. JTAG chain supports boundary-scan and SignalTap II embedded logic analyser probing. Place an external clock source (typically 50 MHz or 100 MHz) within 250 mil of the dedicated clock input pin to minimise jitter on the PLL reference.
Estimated: the Stratix GX family does not support 2.5 V VCCIO on all I/O banks; consult the device pin tables in the Stratix GX Device Handbook to verify each bank supports the required I/O standard. A common mistake is to leave unused transceiver channels unterminated - per the datasheet, unused transmitter outputs must be AC-coupled and tri-stated, while unused receiver inputs must be biased through the internal 50-ohm termination network. Failing to do this causes excess current draw and CRC errors during configuration. Always generate the final pinout using Quartus II pin planner rather than hand-editing the ASCII .qsf file.
Compliance Information
RoHS compliant per datasheet 'lead free' marking. AEC-Q100 is not applicable since this is a programmable logic device, not a fixed-function automotive IC. Conflict-minerals declaration compliant per Intel PSG policy.
