EP20K600CF1020I9 - APEX 20KC FPGA 600K Gates 1020-BGA | Intel / Altera
MPN: EP20K600CF1020I9 ⚠ آخر فرصة للشراءEP20K600CF1020I9 نظرة عامة
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells into a single semiconductor die. Within the power-management and broader signal-processing hierarchy, FPGAs sit between fixed-function ASICs and software-driven microcontrollers. The APEX 20KC family extends the original APEX 20K architecture with multiCore architecture, embedded system blocks, and enhanced LVDS/LVTTL I/O capability.
Key features include a maximum toggle rate of 250 MHz, 4-input look-up-table (LUT) based logic elements, distributed and embedded memory (EABs), and a -40 °C to +100 °C industrial operating range. The 1020-ball FC-FBGA package uses a 1.00 mm ball pitch in a 32 x 32 array, enabling dense PCB escape routing and robust power distribution.
The device's high gate count and I/O density make it suitable for telecom bridging, high-speed protocol conversion, and memory-controller aggregation. Embedded multipliers and DSP-style data paths support up to 64-bit datapath arithmetic.
Typical applications include high-speed serial protocol bridging, RAID/HBA controllers, telecom line cards, and industrial imaging pipelines where deterministic latency and high I/O count outweigh the lower power efficiency of competing CPLD or discrete-logic solutions.
When designing with the EP20K600CF1020I9, allocate a multi-rail decoupling network (1.8 V core plus I/O supply) directly under the BGA footprint and route configuration/JTAG signals with impedance-controlled traces. Industrial-temperature -I9 speed-grade parts must use thermal vias and at least four PCB layers for reliable operation above 200 MHz logic toggling rates.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical PCB layout notes not collected in the original manufacturer datasheet alone.
بدائل مباشرة لـ EP20K600CF1020I9 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP20K600CF1020I9 (نفس عامل الشكل والبصمة) — يختلف في Package, Speed Grade, Maximum Operating Frequency, Process Technology, Operating Temperature.
EP20K600CF1020I8
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CF1020I7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CF1020C9
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CF1020C8
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CF1020C7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CF1020I9 الحدود القصوى والخصائص الكهربائية
| Family | APEX 20KC |
| Series | EP20K600 |
| الوظيفة | Loadable PLD / FPGA |
| Technology | CMOS, 0.15 µm process |
| System Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Operating Frequency | 250 MHz |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Count | 588 user I/O |
| Dedicated Inputs | 580 |
| العلبة | 1020-ball FC-FBGA |
| Terminal Pitch | 1.00 mm |
| Ball Array | 32 x 32 |
| درجة حرارة التشغيل | -40 °C to +100 °C (Industrial) |
| Speed Grade | I9 (-9 speed grade, industrial) |
| PCI SIG Compliance | PCI Local Bus Specification Revision 2.2 (32/64-bit, 33/66 MHz, 3.3 V) |
| External Memory Support | DDR SDRAM, ZBT SRAM |
دليل تكوين أطراف EP20K600CF1020I9 1020-ball fc-fbga
تكوين الأطراف لـ EP20K600CF1020I9 (حزمة 1020-ball fc-fbga). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP20K600CF1020I9.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP20K600CF1020I9 مناسب لـ 6 التطبيقs: Telecom Line-Card Protocol Bridging, High-Speed Memory Controller Aggregation, Industrial Imaging / Video Pipeline, RAID / HBA Storage Controller, Aerospace Avionics Databus Interface, High-Speed Test & Measurement Instrumentation.
Telecom Line-Card Protocol Bridging
The EP20K600CF1020I9 fits telecom line-card protocol bridging because its 600K system gates and 24,320 logic cells provide ample capacity for concurrent serial protocol converters (T1/E1, HDLC, SPI-4.2) and 588 user I/O can directly connect to backplane transceivers and 32/64-bit PCI buses. PCI SIG Revision 2.2 compliance at 66 MHz supports legacy host interface cards. The 1.8 V core keeps per-FPGA power reasonable when eight or more line cards populate a shelf, and 250 MHz internal toggling handles high-speed state-machine arbitration without timing closure issues.
موصى به
High-Speed Memory Controller Aggregation
The EP20K600CF1020I9's dedicated DDR SDRAM and ZBT SRAM interface circuitry makes it well suited as a memory-controller aggregation point in RAID HBAs or base-station baseband cards. Source-synchronous data-strobe timing and embedded memory blocks (EABs) cut external delay-locked loops and reduce component count. Industrial -40 °C to +100 °C operation supports outdoor cabinet deployments, while 580 dedicated inputs allow multiple DDR channels to fan into the device without external multiplexing.
موصى به
Industrial Imaging / Video Pipeline
For machine-vision, medical imaging, or video-broadcast frame buffers, the EP20K600CF1020I9 offers high logic density at a moderate 250 MHz internal rate, which is sufficient to capture LVDS camera-link data at 80 MHz, store frames in DDR SDRAM, and pipe them to a processing ASIC. 588 user I/O handle multi-tap sensor interfaces, and the 1.00 mm-pitch FC-FBGA package routes cleanly on 4-6 layer HDI boards commonly used in camera electronics. Industrial temperature grade ensures reliability in factory-floor or outdoor environments.
موصى به
RAID / HBA Storage Controller
Storage controllers for RAID 5/6 HBAs and SAS/SATA aggregators use the EP20K600CF1020I9 because of its high logic density and 580 dedicated inputs, which can ingest multiple SAS PHY data channels simultaneously. The 32/64-bit PCI bus at 33/66 MHz interfaces directly to host chipsets, and embedded EABs deliver parity-buffer storage without external SRAM. The 1.8 V core keeps thermal dissipation manageable in multi-card server backplanes.
موصى به
Aerospace Avionics Databus Interface
Avionics LRUs (Line Replaceable Units) for ARINC 429, MIL-STD-1553, or FlexRay bus aggregation benefit from the EP20K600CF1020I9's high I/O count and industrial temperature range (-40 °C to +100 °C). 588 user I/O accept numerous discrete analog discretes and bus transceivers, while 600K gates implement multi-protocol translation in a single device. The 1.8 V core simplifies power architecture in aircraft 28 V-bus systems stepped down through intermediate regulators.
موصى به
High-Speed Test & Measurement Instrumentation
Logic-analyzer probe heads, protocol analyzers, and high-channel-count oscilloscope acquisition cards can use the EP20K600CF1020I9 as the timing/state-machine aggregation core. Its 250 MHz toggle rate and 24,320 logic cells handle concurrent state tracking across hundreds of channels, and 588 I/O absorb hundreds of probe-tip signals directly. Industrial temperature grade supports bench-to-field portability, while the 1.00 mm BGA allows fan-out routing of hundreds of matched-length LVDS traces on HDI PCBs.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP20K600CF1020I9 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP20K600CF1020I8 | EP20K600CF1020I7 | EP20K600CF1020C9 | EP20K600CF1020C8 | EP20K600CF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Speed Grade | I9 (industrial, -9) | I8 (industrial, -8) | I7 (industrial, -7) | C9 (commercial, -9) | C8 (commercial, -8) | C7 (commercial, -7) |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Maximum Toggle Frequency | 250 MHz | ~270 MHz (est. from -8 grade) | ~290 MHz (est. from -7 grade) | 250 MHz | ~270 MHz (est. from -8 grade) | ~290 MHz (est. from -7 grade) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| User I/O | 588 | 588 | 588 | 588 | 588 | 588 |
أبرز الفروقات
- Industrial temperature grade with -9 speed grade for balanced performance / reliability (مقابلEP20K600CF1020I8 (industrial -8 speed grade))
- High I/O count (588) for I/O-dense backplane designs (مقابلEP20K400CB652I9 (652-ball, 400K gates))
- Full PCI SIG 32/64-bit compliance for host bus cards (مقابلEP20K300EFC672-2 (300K gates, smaller BGA))
ملاحظات التصميم
Estimated: The 1020-ball FC-FBGA at 1.00 mm pitch requires HDI microvia stack-ups. Use a minimum 4-layer PCB with continuous ground plane directly under the BGA, dedicated power islands for 1.8 V VCCINT and per-bank VCCIO supplies, and stitching vias every 3 mm around the BGA perimeter. Power decoupling should include 100 nF ceramic caps every 10 balls and 10 µF bulk caps on each power rail within 5 mm of the device.
Estimated: with all 24,320 logic cells switching at 250 MHz in the -I9 industrial temperature grade, worst-case junction temperature can approach 110-115 °C. Mount at least four thermal vias (0.3 mm drill, 0.5 mm pad) under the central BGA thermal balls and provide a continuous copper pour on inner power planes to spread heat. Use a thermal camera or simulation (FloTHERM/Icepak) to validate your specific design.
Estimated: high-speed differential pairs (LVDS, LVTTL) routed from this 588-I/O device should target 50 Ω ±10 % controlled impedance on the outer microstrip layer, with reference return paths preserved through uninterrupted ground planes below. Keep matched-length skew within 50 ps for DDR SDRAM data-strobe and address/command groups; use Altera's TimeQuest timing analyzer in the Quartus II legacy toolchain for closure.
Do not confuse -I9 industrial temperature with -C9 commercial temperature; the package marking and voltage tolerance differ even though the pin-out is identical. Always verify device decoupling at first power-up with an inrush current probe to detect missing bulk capacitance - simultaneous switching of 588 I/O at 66 MHz can pull VCCINT below 1.71 V if decoupling is undersized. Configure unused I/O as inputs with bus-hold and tie nCONFIG high through a 4.7 kΩ resistor.
معلومات الامتثال
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the verified web data; marked unknown pending datasheet verification. AEC-Q100 not applicable for FPGAs. PCI SIG Revision 2.2 compliance verified per manufacturer datasheet.