EP20K600CF1020C8 - APEX 20KC 600K Gate FPGA, 1020-BGA | Altera
MPN: EP20K600CF1020C8 ✗ انتهى عمره الإنتاجيEP20K600CF1020C8 نظرة عامة
What is an APEX 20KC FPGA? The APEX 20KC family belongs to the broader category of programmable logic devices (PLDs), which sit hierarchically under FPGAs (Field-Programmable Gate Arrays) and CPLDs (Complex Programmable Logic Devices). APEX 20KC extends the original APEX 20K architecture by embedding dedicated True-Look-Up-Table memory blocks called ESBs (Embedded System Blocks), enabling single-chip implementation of logic, on-chip memory, and specialty functions such as CAMs and FIFOs. It occupies a specific position in the historical Altera roadmap between APEX 20K (logic-only) and the later Stratix family.
Key features include MultiVolt I/O support for 1.8 V, 2.5 V, and 3.3 V interfaces, hot-socketing capability, JTAG IEEE 1149.1 boundary-scan testing, and a 4-wire serial configuration interface. The PLLs provide flexible clock management, while the ESBs can be configured as dual-port RAM up to 311 Kbit, ROM, or CAM. The device also supports DDR SDRAM and ZBT SRAM external memory interfaces through dedicated I/O circuitry.
Typical applications include telecommunications line cards, PCI bridge designs, high-speed digital signal processing, custom microcontroller implementation, and ASIC prototyping. Industrial designers frequently use the EP20K600CF1020C8 in 3.3 V backplane designs where its 588 I/Os replace multiple discrete glue-logic devices.
When designing with this part, ensure the PCB accommodates the 1.00 mm BGA pitch and that the multi-voltage I/O banks are powered correctly. Quiescent supply current rises significantly with logic utilization, so thermal dissipation analysis is recommended at >70 % utilization.
بدائل مباشرة لـ EP20K600CF1020C8 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP20K600CF1020C8 (نفس عامل الشكل والبصمة) — يختلف في Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
EP20K600CF1020C7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CB652C8
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CB652C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CB672C8
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CB672C7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP20K600CF1020C8 الحدود القصوى والخصائص الكهربائية
| Family | APEX 20KC |
| Series | EP20K600 |
| Logic Elements / Cells | 24,320 |
| System Gates | 600,000 |
| Embedded Memory (ESB) | 311 Kbit (max) |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Maximum Internal Frequency | 301.21 MHz (C8 speed grade) |
| User I/O Pins | 588 |
| Dedicated Inputs | 4 |
| العلبة | 1020-ball FC-FBGA (1.00 mm pitch) |
| درجة حرارة التشغيل | 0 °C to +85 °C (commercial, "C") |
| Speed Grade | C8 |
| Configuration Interface | Serial / JTAG (IEEE 1149.1) |
| PCI Compliance | PCI SIG Local Bus Spec Rev 2.2, 32/64-bit, 33/66 MHz, 3.3 V |
دليل تكوين أطراف EP20K600CF1020C8 1020-ball fc-fbga (1.00 mm pitch)
تكوين الأطراف لـ EP20K600CF1020C8 (حزمة 1020-ball fc-fbga (1.00 mm pitch)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP20K600CF1020C8.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP20K600CF1020C8 مناسب لـ 6 التطبيقs: Telecommunications Line Card, ASIC Prototyping Platform, PCI Bus Bridge, Industrial Automation Controller, High-Speed Digital Signal Processing, Custom Microcontroller / Soft-Core CPU.
Telecommunications Line Card
The EP20K600CF1020C8's 588 user I/Os and PCI 2.2 compliance make it well-suited for telecom line cards aggregating T1/E1 or ATM traffic. Its 311 Kbit embedded memory implements per-channel FIFOs without external SRAM, while the 301 MHz internal frequency supports 66 MHz PCI 64-bit system bus bridging with comfortable timing margin.
موصى به
ASIC Prototyping Platform
With 24,320 logic elements and 600 K system gates, the EP20K600CF1020C8 emulates ASICs up to ~500 K gates before partitioning. Its ESBs map cleanly to ASIC SRAM/CAM blocks, and MultiVolt I/O (1.8/2.5/3.3 V) connects directly to legacy ASIC pin voltages, shortening prototype-to-silicon bring-up cycles.
موصى به
PCI Bus Bridge
The EP20K600CF1020C8 is PCI SIG 2.2 compliant for both 32-bit and 64-bit, 33 MHz and 66 MHz operation at 3.3 V. Designers use it as a PCI-to-PCI bridge or custom peripheral controller, leveraging the 588 I/Os to expose multiple PCI segments plus local processor and memory buses on one device.
موصى به
Industrial Automation Controller
Industrial motion-control and PLC platforms benefit from the EP20K600CF1020C8's 588 I/Os, which directly drive hundreds of opto-isolated digital channels. The 1.8 V core plus 3.3 V I/O simplifies interfacing to legacy 5 V-tolerant logic via external buffers, while the 0 °C to +85 °C commercial temperature range suits factory-floor enclosures.
موصى به
High-Speed Digital Signal Processing
The 301 MHz internal frequency of the EP20K600CF1020C8 enables multi-channel FIR filtering and FFT datapaths at sample rates above 100 MSPS. ESBs configured as dual-port RAM store tap coefficients, while the 588 I/Os stream data to external DDR SDRAM or ZBT SRAM at sustained throughput without bus contention.
موصى به
Custom Microcontroller / Soft-Core CPU
The 600 K system gates comfortably host 32-bit soft processors such as Nios, ARM7TDMI, or OpenRISC alongside peripherals. Designers implement UARTs, timers, DMA, and external bus controllers in the EP20K600CF1020C8's logic fabric, using ESBs as register files and cache, while exposing 588 I/Os as GPIO and bus pins.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP20K600CF1020C8 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP20K600CF1020C7 | EP20K600CB652C8 | EP20K600CB652C8N | EP20K600CB672C8 | EP20K600CB672C7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (1.00 mm pitch) | 1020-ball FC-FBGA (1.00 mm pitch) - same | 652-ball FBGA - smaller | 652-ball FBGA - smaller | 672-ball FBGA - smaller | 672-ball FBGA - smaller |
| Speed Grade | C8 (~301 MHz) | C7 (~260 MHz) | C8 (~301 MHz) | C8 (~301 MHz) | C8 (~301 MHz) | C7 (~260 MHz) |
| User I/O Pins | 588 | 588 | 380 | 380 | 408 | 408 |
| System Gates | 600 K | 600 K | 600 K | 600 K | 600 K | 600 K |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory (ESB) | 311 Kbit | 311 Kbit | 311 Kbit | 311 Kbit | 311 Kbit | 311 Kbit |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
أبرز الفروقات
- Largest I/O count in the APEX 20KC family (مقابلEP20K600CB652C8)
- Highest speed grade available in this footprint (مقابلEP20K600CF1020C7)
- Largest embedded memory budget at full I/O (مقابلEP20K600CB672C8)
ملاحظات التصميم
The 1020-ball FC-FBGA package uses a 1.00 mm ball pitch. PCB layout requires HDI microvia stack-ups with 0.4 mm via pitch escape routing, plus a continuous ground plane beneath the BGA for return-current integrity. Recommended microvia aspect ratio is 1:1 or smaller for reliable assembly yield.
Core current scales with toggle rate and logic utilisation. At >70 % utilisation the EP20K600CF1020C8 typically draws 1.5-2.5 A on the 1.8 V VCCINT rail, so use a low-dropout regulator with at least 3 A headroom and decouple each VCCINT ball pair with 0.1 µF plus 10 µF bulk ceramic capacitors placed within 5 mm of the package.
The FC-FBGA package relies on PCB thermal conduction rather than a heatsink. At 2 A × 1.8 V ≈ 3.6 W dissipation, ensure the top and inner copper layers connected to GND provide at least 25 cm² of continuous pour. Without this, junction temperature may exceed the 125 °C limit and trigger thermal-shutdown-induced bit corruption during long configuration cycles.
MultiVolt I/O banks must each be powered even if unused, or the unpowered bank draws leakage that prevents configuration. Program all bank VCCIO pins before JTAG configuration. Also, MSEL pins must be tied to the correct logic level to select the configuration mode (Fast Passive Parallel, etc.).
معلومات الامتثال
RoHS status, lead-free finish, and halogen-free status were not confirmed by the verified web data; manufacturer datasheet predates many of these disclosures. Cross-reference the device marking or contact Altera/Intel for an authoritative certificate of conformance before consumer-market deployment.
