EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel
MPN: EP4CGX50DF23C6N ✓ نشطEP4CGX50DF23C6N نظرة عامة
A Cyclone IV GX FPGA is a programmable logic device that combines general-purpose fabric (look-up tables, flip-flops, routing, and block RAM) with hardened serial transceivers and PCIe IP, enabling cost-effective implementation of custom digital hardware, protocol bridges, and high-speed serial interfaces on a single chip. The Cyclone IV family sits below Cyclone V/10 in Intel's low-cost FPGA portfolio, optimized for volume production where power, density, and integrated transceivers matter more than absolute performance.
Key features of the EP4CGX50DF23C6N include 218 user I/O, dedicated hardware multipliers for DSP, 8 transceiver channels up to 3.125 Gbps, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and JTAG-based configuration. Compared with pure logic-only Cyclone IV E parts, the GX variant adds transceiver capability at the cost of slightly higher static power, which is acceptable when serial connectivity is required.
The device is fabricated on a 60 nm process node, which trades off absolute performance versus comparable 28/20 nm parts for substantially lower static and dynamic power consumption. The integrated transceivers remove the need for external PHY ICs in typical serial-link designs, reducing BOM cost and board area.
Typical applications include industrial video and image processing, low-cost PCIe endpoint cards, motor control and motor drive DSP, broadband access aggregation, broadcast video bridging, and protocol conversion cards. Designers choose Cyclone IV GX when a long-life, mature-node FPGA with built-in transceivers is needed at low unit cost.
A practical design tip is to plan the JTAG and configuration pinout early, and verify that the 484-pin FBGA routing escape supports both single-ended and differential pairs without violating skew rules.
This page synthesizes Intel distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select and qualify the part more efficiently.
بدائل مباشرة لـ EP4CGX50DF23C6N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP4CGX50DF23C6N (نفس عامل الشكل والبصمة) — يختلف في Package, Embedded Memory, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.
EP4CGX50DF23C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CGX50DF23C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CGX50DF27C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CGX30DF23C6N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CGX110DF23I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CGX50DF23C6N الحدود القصوى والخصائص الكهربائية
| Family | Cyclone IV GX |
| Logic Elements | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 |
| Embedded Memory | 2,340 Kbits |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Number of Pins / Balls | 484 |
| Package Type | 484-ball FBGA (PBGA) |
| JEDEC Package Code | S-PBGA-B484 |
| User I/O | 218 |
| Transceiver Channels | Up to 8 |
| Maximum Transceiver Data Rate | 3.125 Gbps |
| Operating Temperature Grade | Commercial |
| نوع التركيب | Surface Mount (BGA) |
| Configuration Method | JTAG / Passive Serial / Active Serial |
دليل تكوين أطراف EP4CGX50DF23C6N s-pbga-b484
تكوين الأطراف لـ EP4CGX50DF23C6N (حزمة s-pbga-b484). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP4CGX50DF23C6N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP4CGX50DF23C6N مناسب لـ 6 التطبيقs: Industrial Ethernet Protocol Bridging, Low-Cost PCIe Endpoint Card, Broadcast Video Bridge and Router, Motor Control and Drive DSP, Wireless Baseband Aggregation, Test and Measurement Instrumentation.
Industrial Ethernet Protocol Bridging
The EP4CGX50DF23C6N's 8 high-speed transceivers at up to 3.125 Gbps and 49,888 logic elements make it ideal for industrial Ethernet bridges between PROFINET, EtherCAT, EtherNet/IP, and Modbus TCP networks. The transceiver channels handle 1000BASE-T PHY SERDES while the dense logic fabric implements protocol stacks, cycle-time scheduling, and timestamping. With 2,340 Kbits embedded RAM, frame buffers can be hosted on-chip. Its commercial 0-85C temperature grade and 484-ball FBGA package fit typical factory-floor enclosure budgets and supply requirements.
موصى به
Low-Cost PCIe Endpoint Card
The EP4CGX50DF23C6N's integrated PCIe hard IP block paired with 8 transceivers enables compact PCIe Gen1 x1/x4 endpoint cards without external PHYs. With 49,888 LE the device implements typical endpoint logic, DMA engines, MSI/MSI-X handlers, and small register interfaces. The 484-ball FBGA provides ample user I/O (218) for board-level signaling, while 2,340 Kbits of block RAM buffers PCIe payloads. Designers choose this part for industrial control cards, low-cost data acquisition, and instrumentation where PCIe x1 Gen1 bandwidth suffices.
موصى به
Broadcast Video Bridge and Router
The EP4CGX50DF23C6N's transceivers handle SDI, HDMI, and DisplayPort physical-layer serialization while 49,888 logic elements implement format conversion (SD/HD/3G-SDI), color-space translation, and audio embedding. Its 2,340 Kbits embedded RAM hosts line buffers, lookup tables, and audio channel memory. With 218 user I/O the FBGA-484 package accommodates parallel video buses plus control interfaces. Commercial temperature grade suits studio and broadcast truck environments.
موصى به
Motor Control and Drive DSP
The EP4CGX50DF23C6N's dedicated hardware multipliers and 49,888 LE support multi-axis field-oriented control (FOC) loops, SVPWM generation, and closed-loop PID at tens of kHz per axis. The 8 transceivers connect to digital encoder buses (EnDat 2.2, BISS, HIPERFACE DSL) and backplane EtherCAT. With 2,340 Kbits embedded RAM and 218 user I/O, gate-driver signals and current-sensor ADCs interface directly. Commercial temperature rating fits most enclosed drives.
موصى به
Wireless Baseband Aggregation
The EP4CGX50DF23C6N's 8 transceivers up to 3.125 Gbps enable CPRI/OBSAI fronthaul aggregation between baseband units and remote radio heads in small-cell and DAS deployments. The 49,888 LE implement IQ sample packing, framer/deframer, and timing synchronization logic; 2,340 Kbits embedded RAM buffers sub-frame data. The 484-ball FBGA is industry-standard for line-card layouts, easing PCB reuse across product variants.
موصى به
Test and Measurement Instrumentation
The EP4CGX50DF23C6N's logic density, transceivers, and 218 user I/O make it ideal for mid-range bench instruments such as protocol analyzers, logic-pattern generators, and JTAG-controlled board testers. The transceivers handle high-speed serial triggers and stimulus while 49,888 LE implement capture memory, pattern matching, and triggering state machines. With 2,340 Kbits embedded RAM and a 60 nm low-power process, fanless bench-top operation is feasible at the commercial 0-85C grade.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP4CGX50DF23C6N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP4CGX50DF23C7N | EP4CGX50DF23C8N | EP4CGX50DF27C6N | EP4CGX30DF23C6N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (PBGA) | 484-ball FBGA (PBGA) - same | 484-ball FBGA (PBGA) - same | 672-ball FBGA - not pin-compatible | 484-ball FBGA (PBGA) - same | 484-ball FBGA (PBGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 29,440 | 109,440 |
| Embedded Memory (Kbits) | 2,340 | 2,340 | 2,340 | 2,340 | 1,080 | 5,490 |
| Transceiver Channels | 8 (up to 3.125 Gbps) | 8 | 8 | 8 | 8 | 8 |
| User I/O | 218 | 218 | 218 | 310 | 168 | 270 |
| Process / Core Voltage | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V |
| Temperature Grade | Commercial (0 to 85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40 to 100C) |
| Speed Grade | C6 | C7 (faster) | C8 (fastest) | C6 | C6 | I7 (industrial + faster) |
أبرز الفروقات
- Integrated 8-channel transceivers at 3.125 Gbps (مقابلEP4CGX50CF23C6N)
- Higher density with same FBGA-484 footprint (مقابلEP4CGX30DF23C6N)
- Mature 60 nm low-power process (مقابلLattice ECP4)
ملاحظات التصميم
The 484-ball FBGA package requires a 1.0 mm or 1.27 mm pitch escape routing. Use a 6-layer or 8-layer stackup with dedicated ground planes under the device to control impedance of differential transceiver pairs (typically 100 ohm differential). Reference the JEDEC S-PBGA-B484 mechanical drawing for ball pad and solder-mask dimensions; non-solder-mask-defined pads are recommended.
Estimated: with 8 transceivers active at 3.125 Gbps and ~70% logic utilization, core current draw will approach 0.8-1.2 A at 1.2 V. Use a dedicated LDO or DC-DC regulator for VCCINT with at least 20% headroom; place bulk decoupling (220 uF tantalum or polymer) and 0.1 uF + 10 nF ceramic pairs within 5 mm of every supply pin pair.
Transceiver channels require AC-coupling capacitors (0.01 uF) in series with each TX/RX pair. Route transceiver lanes with controlled 100-ohm differential impedance, keep length matching within 0.127 mm (5 mil) on a pair, and avoid crossing reference-plane splits. The Cyclone IV GX Transceiver User Guide provides reference equalization settings per data rate.
Estimated: at full transceiver and logic activity the FBGA-484 junction-to-ambient thermal resistance is approximately 15-20 C/W with 4-layer PCB and adequate copper. With 2 W typical dissipation, expect ~30-40 C junction rise above ambient. For sealed enclosures, derate transceiver data rate or use a heatsink. Industrial variants (I7) are recommended above 70C ambient.
Common pitfalls when designing with this part include: (1) confusing the 'DF23' ball pattern with 'DF27' (different ball counts); (2) using the wrong configuration mode (AS vs PS) for the boot EEPROM; (3) leaving JTAG TCK unterminated; (4) mixing LVDS and LVTTL I/O standards on the same bank without VREF planning. Verify each against the Cyclone IV Device Handbook pin connection guidelines before tape-out.
معلومات الامتثال
RoHS and REACH compliance inferred from Intel/Alterac product line standards; no AEC-Q100 automotive grade for this commercial-temp part. JEDEC package code S-PBGA-B484 verified from third-party distributor listings.
