EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel
부품 번호: EP4CGX50DF23C6N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $65.4 | $6,540.00 |
| 500 | $58.75 | $29,375.00 |
| 1,000 | $52.3 | $52,300.00 |
EP4CGX50DF23C6N 개요
A Cyclone IV GX FPGA is a programmable logic device that combines general-purpose fabric (look-up tables, flip-flops, routing, and block RAM) with hardened serial transceivers and PCIe IP, enabling cost-effective implementation of custom digital hardware, protocol bridges, and high-speed serial interfaces on a single chip. The Cyclone IV family sits below Cyclone V/10 in Intel's low-cost FPGA portfolio, optimized for volume production where power, density, and integrated transceivers matter more than absolute performance.
Key features of the EP4CGX50DF23C6N include 218 user I/O, dedicated hardware multipliers for DSP, 8 transceiver channels up to 3.125 Gbps, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and JTAG-based configuration. Compared with pure logic-only Cyclone IV E parts, the GX variant adds transceiver capability at the cost of slightly higher static power, which is acceptable when serial connectivity is required.
The device is fabricated on a 60 nm process node, which trades off absolute performance versus comparable 28/20 nm parts for substantially lower static and dynamic power consumption. The integrated transceivers remove the need for external PHY ICs in typical serial-link designs, reducing BOM cost and board area.
Typical applications include industrial video and image processing, low-cost PCIe endpoint cards, motor control and motor drive DSP, broadband access aggregation, broadcast video bridging, and protocol conversion cards. Designers choose Cyclone IV GX when a long-life, mature-node FPGA with built-in transceivers is needed at low unit cost.
A practical design tip is to plan the JTAG and configuration pinout early, and verify that the 484-pin FBGA routing escape supports both single-ended and differential pairs without violating skew rules.
This page synthesizes Intel distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select and qualify the part more efficiently.
드롭인 대체품: EP4CGX50DF23C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX50DF23C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX50DF23C7N
✅ 드롭인✓ 재고 있음
$43.2 / 개
데이터시트 보기 →EP4CGX50DF23C8N
✅ 드롭인✓ 재고 있음
$56.4 / 개
데이터시트 보기 →EP4CGX50DF27C6N
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP4CGX30DF23C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CGX110DF23I7N
✅ 드롭인✓ 재고 있음
$182 / 개
데이터시트 보기 →EP4CGX50DF23C6N 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 |
| Embedded Memory | 2,340 Kbits |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Number of Pins / Balls | 484 |
| Package Type | 484-ball FBGA (PBGA) |
| JEDEC Package Code | S-PBGA-B484 |
| User I/O | 218 |
| Transceiver Channels | Up to 8 |
| Maximum Transceiver Data Rate | 3.125 Gbps |
| Operating Temperature Grade | Commercial |
| 실장 유형 | Surface Mount (BGA) |
| Configuration Method | JTAG / Passive Serial / Active Serial |
EP4CGX50DF23C6N s-pbga-b484 핀 구성 가이드
EP4CGX50DF23C6N(s-pbga-b484 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX50DF23C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX50DF23C6N 적합 용도: 6 애플리케이션s: Industrial Ethernet Protocol Bridging, Low-Cost PCIe Endpoint Card, Broadcast Video Bridge and Router, Motor Control and Drive DSP, Wireless Baseband Aggregation, Test and Measurement Instrumentation.
Industrial Ethernet Protocol Bridging
The EP4CGX50DF23C6N's 8 high-speed transceivers at up to 3.125 Gbps and 49,888 logic elements make it ideal for industrial Ethernet bridges between PROFINET, EtherCAT, EtherNet/IP, and Modbus TCP networks. The transceiver channels handle 1000BASE-T PHY SERDES while the dense logic fabric implements protocol stacks, cycle-time scheduling, and timestamping. With 2,340 Kbits embedded RAM, frame buffers can be hosted on-chip. Its commercial 0-85C temperature grade and 484-ball FBGA package fit typical factory-floor enclosure budgets and supply requirements.
추천
Low-Cost PCIe Endpoint Card
The EP4CGX50DF23C6N's integrated PCIe hard IP block paired with 8 transceivers enables compact PCIe Gen1 x1/x4 endpoint cards without external PHYs. With 49,888 LE the device implements typical endpoint logic, DMA engines, MSI/MSI-X handlers, and small register interfaces. The 484-ball FBGA provides ample user I/O (218) for board-level signaling, while 2,340 Kbits of block RAM buffers PCIe payloads. Designers choose this part for industrial control cards, low-cost data acquisition, and instrumentation where PCIe x1 Gen1 bandwidth suffices.
추천
Broadcast Video Bridge and Router
The EP4CGX50DF23C6N's transceivers handle SDI, HDMI, and DisplayPort physical-layer serialization while 49,888 logic elements implement format conversion (SD/HD/3G-SDI), color-space translation, and audio embedding. Its 2,340 Kbits embedded RAM hosts line buffers, lookup tables, and audio channel memory. With 218 user I/O the FBGA-484 package accommodates parallel video buses plus control interfaces. Commercial temperature grade suits studio and broadcast truck environments.
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Motor Control and Drive DSP
The EP4CGX50DF23C6N's dedicated hardware multipliers and 49,888 LE support multi-axis field-oriented control (FOC) loops, SVPWM generation, and closed-loop PID at tens of kHz per axis. The 8 transceivers connect to digital encoder buses (EnDat 2.2, BISS, HIPERFACE DSL) and backplane EtherCAT. With 2,340 Kbits embedded RAM and 218 user I/O, gate-driver signals and current-sensor ADCs interface directly. Commercial temperature rating fits most enclosed drives.
추천
Wireless Baseband Aggregation
The EP4CGX50DF23C6N's 8 transceivers up to 3.125 Gbps enable CPRI/OBSAI fronthaul aggregation between baseband units and remote radio heads in small-cell and DAS deployments. The 49,888 LE implement IQ sample packing, framer/deframer, and timing synchronization logic; 2,340 Kbits embedded RAM buffers sub-frame data. The 484-ball FBGA is industry-standard for line-card layouts, easing PCB reuse across product variants.
추천
Test and Measurement Instrumentation
The EP4CGX50DF23C6N's logic density, transceivers, and 218 user I/O make it ideal for mid-range bench instruments such as protocol analyzers, logic-pattern generators, and JTAG-controlled board testers. The transceivers handle high-speed serial triggers and stimulus while 49,888 LE implement capture memory, pattern matching, and triggering state machines. With 2,340 Kbits embedded RAM and a 60 nm low-power process, fanless bench-top operation is feasible at the commercial 0-85C grade.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX50DF23C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX50DF23C7N | EP4CGX50DF23C8N | EP4CGX50DF27C6N | EP4CGX30DF23C6N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (PBGA) | 484-ball FBGA (PBGA) - same | 484-ball FBGA (PBGA) - same | 672-ball FBGA - not pin-compatible | 484-ball FBGA (PBGA) - same | 484-ball FBGA (PBGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 29,440 | 109,440 |
| Embedded Memory (Kbits) | 2,340 | 2,340 | 2,340 | 2,340 | 1,080 | 5,490 |
| Transceiver Channels | 8 (up to 3.125 Gbps) | 8 | 8 | 8 | 8 | 8 |
| User I/O | 218 | 218 | 218 | 310 | 168 | 270 |
| Process / Core Voltage | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V |
| Temperature Grade | Commercial (0 to 85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40 to 100C) |
| Speed Grade | C6 | C7 (faster) | C8 (fastest) | C6 | C6 | I7 (industrial + faster) |
주요 차별점
- Integrated 8-channel transceivers at 3.125 Gbps (vs EP4CGX50CF23C6N)
- Higher density with same FBGA-484 footprint (vs EP4CGX30DF23C6N)
- Mature 60 nm low-power process (vs Lattice ECP4)
설계 노트
The 484-ball FBGA package requires a 1.0 mm or 1.27 mm pitch escape routing. Use a 6-layer or 8-layer stackup with dedicated ground planes under the device to control impedance of differential transceiver pairs (typically 100 ohm differential). Reference the JEDEC S-PBGA-B484 mechanical drawing for ball pad and solder-mask dimensions; non-solder-mask-defined pads are recommended.
Estimated: with 8 transceivers active at 3.125 Gbps and ~70% logic utilization, core current draw will approach 0.8-1.2 A at 1.2 V. Use a dedicated LDO or DC-DC regulator for VCCINT with at least 20% headroom; place bulk decoupling (220 uF tantalum or polymer) and 0.1 uF + 10 nF ceramic pairs within 5 mm of every supply pin pair.
Transceiver channels require AC-coupling capacitors (0.01 uF) in series with each TX/RX pair. Route transceiver lanes with controlled 100-ohm differential impedance, keep length matching within 0.127 mm (5 mil) on a pair, and avoid crossing reference-plane splits. The Cyclone IV GX Transceiver User Guide provides reference equalization settings per data rate.
Estimated: at full transceiver and logic activity the FBGA-484 junction-to-ambient thermal resistance is approximately 15-20 C/W with 4-layer PCB and adequate copper. With 2 W typical dissipation, expect ~30-40 C junction rise above ambient. For sealed enclosures, derate transceiver data rate or use a heatsink. Industrial variants (I7) are recommended above 70C ambient.
Common pitfalls when designing with this part include: (1) confusing the 'DF23' ball pattern with 'DF27' (different ball counts); (2) using the wrong configuration mode (AS vs PS) for the boot EEPROM; (3) leaving JTAG TCK unterminated; (4) mixing LVDS and LVTTL I/O standards on the same bank without VREF planning. Verify each against the Cyclone IV Device Handbook pin connection guidelines before tape-out.
규정 준수 정보
RoHS and REACH compliance inferred from Intel/Alterac product line standards; no AEC-Q100 automotive grade for this commercial-temp part. JEDEC package code S-PBGA-B484 verified from third-party distributor listings.
