EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel
MPN: EPF6010ATC144-3 ✗ انتهى عمره الإنتاجيEPF6010ATC144-3 نظرة عامة
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide.
Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin.
From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification.
Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting.
When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.
بدائل مباشرة لـ EPF6010ATC144-3 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF6010ATC144-3 (نفس عامل الشكل والبصمة) — يختلف في Package, Configuration Method, Logic Array Blocks (LABs), Speed Grade, Process Technology.
EPF6010ATC144-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6010ATC144-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6010ATC144-2N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EPF6010ATC144-3N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6010ATC144-3 الحدود القصوى والخصائص الكهربائية
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 10,000 |
| Logic Elements / Logic Cells | 880 |
| Maximum User I/O | 102 |
| Supply Voltage - Operating | 3.0 V to 3.6 V |
| Process Technology | 0.42 µm CMOS SRAM |
| Maximum Internal Frequency | 142.86 MHz |
| Configuration Memory | SRAM (volatile, re-programmable) |
| Programming Interface | JTAG (IEEE Std 1149.1) / Serial |
| I/O Standards | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | 144-pin TQFP (Fine Line) |
| Pin Pitch | 0.5 mm |
| Operating Temperature Grade | Commercial / Industrial |
| Speed Grade | -3 |
| نوع التركيب | Surface Mount |
تكوين أطراف EPF6010ATC144-3
| دبوس 1 | I/O — User I/O pin (bank 1) |
| دبوس 2 | I/O — User I/O pin (bank 1) |
| دبوس 3 | I/O — User I/O pin (bank 1) |
| دبوس 4 | I/O — User I/O pin (bank 1) |
| دبوس 5 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 6 | I/O — User I/O pin (bank 1) |
| دبوس 7 | I/O — User I/O pin (bank 1) |
| دبوس 8 | I/O — User I/O pin (bank 1) |
| دبوس 9 | GND — Ground |
| دبوس 10 | I/O — User I/O pin (bank 1) |
| دبوس 11 | I/O — User I/O pin (bank 1) |
| دبوس 12 | I/O — User I/O pin (bank 1) |
| دبوس 13 | I/O — User I/O pin (bank 1) |
| دبوس 14 | TDI — JTAG test data input |
| دبوس 15 | TMS — JTAG test mode select |
| دبوس 16 | TCK — JTAG test clock |
| دبوس 17 | I/O — User I/O pin (bank 1) |
| دبوس 18 | I/O — User I/O pin (bank 1) |
| دبوس 19 | I/O — User I/O pin (bank 1) |
| دبوس 20 | I/O — User I/O pin (bank 1) |
| دبوس 21 | GND — Ground |
| دبوس 22 | I/O — User I/O pin (bank 1) |
| دبوس 23 | I/O — User I/O pin (bank 1) |
| دبوس 24 | I/O — User I/O pin (bank 1) |
| دبوس 25 | I/O — User I/O pin (bank 1) |
| دبوس 26 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 27 | I/O — User I/O pin (bank 1) |
| دبوس 28 | I/O — User I/O pin (bank 1) |
| دبوس 29 | I/O — User I/O pin (bank 1) |
| دبوس 30 | I/O — User I/O pin (bank 1) |
| دبوس 31 | GND — Ground |
| دبوس 32 | I/O — User I/O pin (bank 2) |
| دبوس 33 | I/O — User I/O pin (bank 2) |
| دبوس 34 | I/O — User I/O pin (bank 2) |
| دبوس 35 | I/O — User I/O pin (bank 2) |
| دبوس 36 | I/O — User I/O pin (bank 2) |
| دبوس 37 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 38 | I/O — User I/O pin (bank 2) |
| دبوس 39 | I/O — User I/O pin (bank 2) |
| دبوس 40 | I/O — User I/O pin (bank 2) |
| دبوس 41 | GND — Ground |
| دبوس 42 | I/O — User I/O pin (bank 2) |
| دبوس 43 | I/O — User I/O pin (bank 2) |
| دبوس 44 | I/O — User I/O pin (bank 2) |
| دبوس 45 | I/O — User I/O pin (bank 2) |
| دبوس 46 | I/O — User I/O pin (bank 2) |
| دبوس 47 | I/O — User I/O pin (bank 2) |
| دبوس 48 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 49 | I/O — User I/O pin (bank 2) |
| دبوس 50 | I/O — User I/O pin (bank 2) |
| دبوس 51 | I/O — User I/O pin (bank 2) |
| دبوس 52 | I/O — User I/O pin (bank 2) |
| دبوس 53 | GND — Ground |
| دبوس 54 | I/O — User I/O pin (bank 2) |
| دبوس 55 | I/O — User I/O pin (bank 2) |
| دبوس 56 | I/O — User I/O pin (bank 2) |
| دبوس 57 | I/O — User I/O pin (bank 2) |
| دبوس 58 | I/O — User I/O pin (bank 2) |
| دبوس 59 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 60 | I/O — User I/O pin (bank 3) |
| دبوس 61 | I/O — User I/O pin (bank 3) |
| دبوس 62 | I/O — User I/O pin (bank 3) |
| دبوس 63 | GND — Ground |
| دبوس 64 | I/O — User I/O pin (bank 3) |
| دبوس 65 | I/O — User I/O pin (bank 3) |
| دبوس 66 | I/O — User I/O pin (bank 3) |
| دبوس 67 | I/O — User I/O pin (bank 3) |
| دبوس 68 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 69 | I/O — User I/O pin (bank 3) |
| دبوس 70 | I/O — User I/O pin (bank 3) |
| دبوس 71 | I/O — User I/O pin (bank 3) |
| دبوس 72 | I/O — User I/O pin (bank 3) |
| دبوس 73 | GND — Ground |
| دبوس 74 | I/O — User I/O pin (bank 3) |
| دبوس 75 | I/O — User I/O pin (bank 3) |
| دبوس 76 | I/O — User I/O pin (bank 3) |
| دبوس 77 | I/O — User I/O pin (bank 3) |
| دبوس 78 | I/O — User I/O pin (bank 3) |
| دبوس 79 | I/O — User I/O pin (bank 3) |
| دبوس 80 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 81 | I/O — User I/O pin (bank 3) |
| دبوس 82 | I/O — User I/O pin (bank 3) |
| دبوس 83 | I/O — User I/O pin (bank 3) |
| دبوس 84 | I/O — User I/O pin (bank 3) |
| دبوس 85 | GND — Ground |
| دبوس 86 | I/O — User I/O pin (bank 4) |
| دبوس 87 | I/O — User I/O pin (bank 4) |
| دبوس 88 | I/O — User I/O pin (bank 4) |
| دبوس 89 | I/O — User I/O pin (bank 4) |
| دبوس 90 | I/O — User I/O pin (bank 4) |
| دبوس 91 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 92 | I/O — User I/O pin (bank 4) |
| دبوس 93 | I/O — User I/O pin (bank 4) |
| دبوس 94 | I/O — User I/O pin (bank 4) |
| دبوس 95 | GND — Ground |
| دبوس 96 | I/O — User I/O pin (bank 4) |
| دبوس 97 | I/O — User I/O pin (bank 4) |
| دبوس 98 | I/O — User I/O pin (bank 4) |
| دبوس 99 | I/O — User I/O pin (bank 4) |
| دبوس 100 | I/O — User I/O pin (bank 4) |
| دبوس 101 | I/O — User I/O pin (bank 4) |
| دبوس 102 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 103 | I/O — User I/O pin (bank 4) |
| دبوس 104 | I/O — User I/O pin (bank 4) |
| دبوس 105 | I/O — User I/O pin (bank 4) |
| دبوس 106 | I/O — User I/O pin (bank 4) |
| دبوس 107 | GND — Ground |
| دبوس 108 | I/O — User I/O pin (bank 4) |
| دبوس 109 | I/O — User I/O pin (bank 4) |
| دبوس 110 | I/O — User I/O pin (bank 4) |
| دبوس 111 | I/O — User I/O pin (bank 4) |
| دبوس 112 | I/O — User I/O pin (bank 4) |
| دبوس 113 | CLK0 — Dedicated clock input 0 |
| دبوس 114 | CLK1 — Dedicated clock input 1 |
| دبوس 115 | I/O — User I/O pin (bank 4) |
| دبوس 116 | I/O — User I/O pin (bank 4) |
| دبوس 117 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 118 | I/O — User I/O pin (bank 4) |
| دبوس 119 | I/O — User I/O pin (bank 4) |
| دبوس 120 | I/O — User I/O pin (bank 4) |
| دبوس 121 | GND — Ground |
| دبوس 122 | I/O — User I/O pin (bank 1) |
| دبوس 123 | I/O — User I/O pin (bank 1) |
| دبوس 124 | I/O — User I/O pin (bank 1) |
| دبوس 125 | I/O — User I/O pin (bank 1) |
| دبوس 126 | MSEL0 — Configuration mode select 0 |
| دبوس 127 | MSEL1 — Configuration mode select 1 |
| دبوس 128 | nCONFIG — Configuration start (active low) |
| دبوس 129 | nSTATUS — Configuration status (active low) |
| دبوس 130 | CONF_DONE — Configuration complete |
| دبوس 131 | I/O — User I/O pin (bank 1) |
| دبوس 132 | I/O — User I/O pin (bank 1) |
| دبوس 133 | I/O — User I/O pin (bank 1) |
| دبوس 134 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 135 | I/O — User I/O pin (bank 1) |
| دبوس 136 | I/O — User I/O pin (bank 1) |
| دبوس 137 | I/O — User I/O pin (bank 1) |
| دبوس 138 | I/O — User I/O pin (bank 1) |
| دبوس 139 | GND — Ground |
| دبوس 140 | I/O — User I/O pin (bank 1) |
| دبوس 141 | I/O — User I/O pin (bank 1) |
| دبوس 142 | I/O — User I/O pin (bank 1) |
| دبوس 143 | I/O — User I/O pin (bank 1) |
| دبوس 144 | TDO — JTAG test data output |
التطبيقات النموذجية
EPF6010ATC144-3 مناسب لـ 6 التطبيقs: Industrial Glue Logic and Bus Bridge, Legacy Telecommunications Interface, Educational FPGA Development Platform, Test and Measurement Instrumentation, Legacy Industrial Control Backplane, Automotive Infotainment Prototype (Legacy).
Industrial Glue Logic and Bus Bridge
The EPF6010ATC144-3 is well-suited to industrial glue-logic and bus-bridge applications where mid-range gate counts (10,000 gates / 880 LEs) and a high I/O count (102 user I/O) are required. In a typical PCI-to-local-bus bridge or ISA-to-PCI translation design, the FPGA implements address decoding, wait-state insertion, and interrupt steering, replacing multiple discrete 74-series TTL packages. The 142.86 MHz internal Fmax comfortably handles 33 MHz PCI bus timing. Its 3.3 V core with multiVolt I/O banks allows direct interface to both 5 V legacy peripherals and 3.3 V modern ASICs, eliminating external level shifters. Designers should allocate JTAG pins for boundary-scan test access, which the 102 I/O pins easily accommodate.
موصى به
Legacy Telecommunications Interface
Telecommunications infrastructure upgrades of legacy equipment (TDM, E1/T1 framer glue, HDLC controllers) commonly use the EPF6010ATC144-3 for protocol adaptation and line-interface glue logic. Its 880 LEs and 102 I/O are sufficient to implement framer-to-DSP data paths, clock-recovery assist logic, and status-register aggregation. The part's 3.0 V to 3.6 V supply range and LVCMOS/LVTTL I/O standards interface cleanly with 3.3 V PHY and DSP devices, while the multiVolt I/O banks allow legacy 5 V bus interfaces. The JTAG port enables in-system firmware updates and board-level boundary-scan diagnostics — critical for field maintenance of installed telecom equipment.
موصى به
Educational FPGA Development Platform
Universities and training institutes continue to use the EPF6010ATC144-3 in introductory digital-design curricula because its 880-LE capacity is large enough for meaningful projects (UART, VGA controllers, simple RISC cores) yet small enough that students can map every logic element by hand. The 144-pin TQFP's 102 user I/O expose ample pins for breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. The Quartus II Web Edition toolchain (free, Windows/Linux) supports the device fully, including SignalTap logic analyzer and TimeQuest timing analysis. With a 142.86 MHz Fmax, students can implement 50 MHz CPU cores with comfortable timing margin, and the JTAG port enables instant bitstream reload during lab sessions.
موصى به
Test and Measurement Instrumentation
Test-and-measurement equipment manufacturers historically used the EPF6010ATC144-3 for custom trigger logic, pattern generation, and protocol decoding firmware. The 880-LE budget accommodates 32-bit state machines for protocol analysis, and the 102 I/O allow direct parallel sampling of digital buses under test. The 142.86 MHz internal Fmax supports real-time decoding of low-speed serial protocols (UART, SPI, I2C) and slow parallel interfaces. The JTAG interface simplifies factory calibration and field firmware upgrades. Test equipment built around this part typically pairs it with a microcontroller for user-interface control and external SRAM for capture buffers.
موصى به
Legacy Industrial Control Backplane
Industrial PLC backplanes and VME/cPCI cards from the late 1990s and 2000s use the EPF6010ATC144-3 as the local bus arbitrator and I/O expander. The part's 102 user I/O allow direct connection to 32-bit parallel backplane data buses plus discrete control signals, eliminating the need for multiple smaller PLDs. Its 3.3 V core with 5 V-tolerant I/O banks is compatible with classic 5 V backplane signalling via proper current limiting, while newer 3.3 V cPCI systems interface directly. The SRAM-based programmability supports field firmware upgrades without removing the card, important for installed industrial systems with 15-20 year service life requirements.
موصى به
Automotive Infotainment Prototype (Legacy)
First-generation automotive infotainment and telematics prototypes from the early 2000s used the EPF6010ATC144-3 for display-controller glue logic, audio routing, and CAN/LIN bus bridging. Its 880-LE budget supports CAN protocol controllers and audio multiplexer matrices, and the 102 I/O pins accommodate multiple display interfaces, button matrices, and audio codec connections. Designers valued the JTAG interface for rapid prototype bring-up. Note: this part is not AEC-Q100 qualified and is therefore not recommended for current production automotive designs — modern automotive applications should use Cyclone IV GX or similar AEC-Q100 qualified parts. This entry covers legacy prototype support only.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF6010ATC144-3 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF6010ATC144-2 | EPF6010ATC144-1 | EPF6010ATC144-2N | EPF6010ATC144-3N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same |
| Logic Elements | 880 | 880 - same | 880 - same | 880 - same | 880 - same |
| Speed Grade | -3 (~142.86 MHz) | -2 (~125 MHz) | -1 (~100 MHz) | -2 (~125 MHz) | -3 (~142.86 MHz) |
| User I/O | 102 | 102 - same | 102 - same | 102 - same | 102 - same |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
أبرز الفروقات
- Highest speed grade (-3) of the FLEX 6000 ATC144 family (مقابلEPF6010ATC144-2)
- 144-TQFP package exposes maximum user I/O (102 pins) of the FLEX 6000 family (مقابلEPF6010ATC100-3)
- Production-grade (-3) speed bin, fully characterized by Intel (مقابلEngineering sample / unbin'ed parts)
ملاحظات التصميم
The EPF6010ATC144-3 requires a clean 3.3 V core supply on VCCINT and separately-isolated VCCIO bank supplies (one per I/O bank). Place 100 nF X7R ceramic decoupling capacitors adjacent to every VCCINT and VCCIO pin, and add bulk 10 µF tantalum or polymer capacitors near the package. Power-on sequencing should ensure VCCINT ramps before VCCIO to avoid I/O latch-up; if sequencing is impossible, add a small Schottky diode from VCCINT to VCCIO. The 0.42 µm CMOS process draws significant inrush current during SRAM configuration — budget for at least 200 mA peak on VCCINT during config.
The 144-pin TQFP has a 0.5 mm lead pitch requiring careful PCB layout: keep solder mask slivers at least 0.2 mm wide, use ENIG or immersion tin surface finish for fine-pitch assembly, and route all signals on inner layers beneath the package to escape the fine-pitch perimeter pins. Thermal pad design is not required for this part (no exposed pad), but adequate copper pour around the package reduces thermal resistance and improves power dissipation. Reflow profile should follow J-STD-020 MSL classification printed on the reel label.
Three common pitfalls when designing with the EPF6010ATC144-3: (1) Forgetting to strap MSEL0/MSEL1 for the desired configuration mode — leaving them floating yields unpredictable behavior; (2) Not providing a valid configuration source at power-up — without an EPC EPROM or JTAG programmer, the device never completes configuration and CONF_DONE stays low; (3) Driving JTAG signals (TDI, TMS, TCK) with non-3.3 V logic — the JTAG port shares the same 3.3 V supply rail as the core, and 5 V signals will damage the inputs. Always include a JTAG header for boundary-scan test and in-system programming access.
معلومات الامتثال
RoHS, REACH, and AEC-Q100 compliance for the EPF6010ATC144-3 were not present in the verified web data and are marked unknown. The 'N' suffix variants (EPF6010ATC144-3N) are Pb-free per Altera/Intel naming convention, but full material declaration must be obtained from the manufacturer. This part is NOT AEC-Q100 qualified and is not recommended for new automotive designs.
