EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel
Référence : EPF6010ATC144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.75 | $9 750,00 |
EPF6010ATC144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide.
Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin.
From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification.
Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting.
When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.
Alternatives de remplacement direct pour EPF6010ATC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6010ATC144-3 (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Logic Array Blocks (LABs), Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6010ATC144-2
✅ Remplacement direct✓ En stock
$14.95 / unité
Voir la fiche technique →EPF6010ATC144-1
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EPF6010ATC144-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPF6010ATC144-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$24.6 / unité
Voir la fiche technique →EPF6010ATC144-3 Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 10,000 |
| Logic Elements / Logic Cells | 880 |
| Maximum User I/O | 102 |
| Supply Voltage - Operating | 3.0 V to 3.6 V |
| Process Technology | 0.42 µm CMOS SRAM |
| Maximum Internal Frequency | 142.86 MHz |
| Configuration Memory | SRAM (volatile, re-programmable) |
| Programming Interface | JTAG (IEEE Std 1149.1) / Serial |
| I/O Standards | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | 144-pin TQFP (Fine Line) |
| Pin Pitch | 0.5 mm |
| Operating Temperature Grade | Commercial / Industrial |
| Speed Grade | -3 |
| Type de montage | Surface Mount |
Configuration des broches de EPF6010ATC144-3
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | TDI — JTAG test data input |
| Broche 15 | TMS — JTAG test mode select |
| Broche 16 | TCK — JTAG test clock |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | I/O — User I/O pin (bank 2) |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | GND — Ground |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | I/O — User I/O pin (bank 2) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | VCCINT — Core supply voltage (3.3 V) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | GND — Ground |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | I/O — User I/O pin (bank 3) |
| Broche 77 | I/O — User I/O pin (bank 3) |
| Broche 78 | I/O — User I/O pin (bank 3) |
| Broche 79 | I/O — User I/O pin (bank 3) |
| Broche 80 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 81 | I/O — User I/O pin (bank 3) |
| Broche 82 | I/O — User I/O pin (bank 3) |
| Broche 83 | I/O — User I/O pin (bank 3) |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | GND — Ground |
| Broche 86 | I/O — User I/O pin (bank 4) |
| Broche 87 | I/O — User I/O pin (bank 4) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | GND — Ground |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | I/O — User I/O pin (bank 4) |
| Broche 100 | I/O — User I/O pin (bank 4) |
| Broche 101 | I/O — User I/O pin (bank 4) |
| Broche 102 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 103 | I/O — User I/O pin (bank 4) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (bank 4) |
| Broche 109 | I/O — User I/O pin (bank 4) |
| Broche 110 | I/O — User I/O pin (bank 4) |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | CLK0 — Dedicated clock input 0 |
| Broche 114 | CLK1 — Dedicated clock input 1 |
| Broche 115 | I/O — User I/O pin (bank 4) |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | VCCINT — Core supply voltage (3.3 V) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — User I/O pin (bank 1) |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | I/O — User I/O pin (bank 1) |
| Broche 126 | MSEL0 — Configuration mode select 0 |
| Broche 127 | MSEL1 — Configuration mode select 1 |
| Broche 128 | nCONFIG — Configuration start (active low) |
| Broche 129 | nSTATUS — Configuration status (active low) |
| Broche 130 | CONF_DONE — Configuration complete |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O pin (bank 1) |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | TDO — JTAG test data output |
Applications typiques
EPF6010ATC144-3 convient pour 6 applications: Industrial Glue Logic and Bus Bridge, Legacy Telecommunications Interface, Educational FPGA Development Platform, Test and Measurement Instrumentation, Legacy Industrial Control Backplane, Automotive Infotainment Prototype (Legacy).
Industrial Glue Logic and Bus Bridge
The EPF6010ATC144-3 is well-suited to industrial glue-logic and bus-bridge applications where mid-range gate counts (10,000 gates / 880 LEs) and a high I/O count (102 user I/O) are required. In a typical PCI-to-local-bus bridge or ISA-to-PCI translation design, the FPGA implements address decoding, wait-state insertion, and interrupt steering, replacing multiple discrete 74-series TTL packages. The 142.86 MHz internal Fmax comfortably handles 33 MHz PCI bus timing. Its 3.3 V core with multiVolt I/O banks allows direct interface to both 5 V legacy peripherals and 3.3 V modern ASICs, eliminating external level shifters. Designers should allocate JTAG pins for boundary-scan test access, which the 102 I/O pins easily accommodate.
Recommandé
Legacy Telecommunications Interface
Telecommunications infrastructure upgrades of legacy equipment (TDM, E1/T1 framer glue, HDLC controllers) commonly use the EPF6010ATC144-3 for protocol adaptation and line-interface glue logic. Its 880 LEs and 102 I/O are sufficient to implement framer-to-DSP data paths, clock-recovery assist logic, and status-register aggregation. The part's 3.0 V to 3.6 V supply range and LVCMOS/LVTTL I/O standards interface cleanly with 3.3 V PHY and DSP devices, while the multiVolt I/O banks allow legacy 5 V bus interfaces. The JTAG port enables in-system firmware updates and board-level boundary-scan diagnostics — critical for field maintenance of installed telecom equipment.
Recommandé
Educational FPGA Development Platform
Universities and training institutes continue to use the EPF6010ATC144-3 in introductory digital-design curricula because its 880-LE capacity is large enough for meaningful projects (UART, VGA controllers, simple RISC cores) yet small enough that students can map every logic element by hand. The 144-pin TQFP's 102 user I/O expose ample pins for breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. The Quartus II Web Edition toolchain (free, Windows/Linux) supports the device fully, including SignalTap logic analyzer and TimeQuest timing analysis. With a 142.86 MHz Fmax, students can implement 50 MHz CPU cores with comfortable timing margin, and the JTAG port enables instant bitstream reload during lab sessions.
Recommandé
Test and Measurement Instrumentation
Test-and-measurement equipment manufacturers historically used the EPF6010ATC144-3 for custom trigger logic, pattern generation, and protocol decoding firmware. The 880-LE budget accommodates 32-bit state machines for protocol analysis, and the 102 I/O allow direct parallel sampling of digital buses under test. The 142.86 MHz internal Fmax supports real-time decoding of low-speed serial protocols (UART, SPI, I2C) and slow parallel interfaces. The JTAG interface simplifies factory calibration and field firmware upgrades. Test equipment built around this part typically pairs it with a microcontroller for user-interface control and external SRAM for capture buffers.
Recommandé
Legacy Industrial Control Backplane
Industrial PLC backplanes and VME/cPCI cards from the late 1990s and 2000s use the EPF6010ATC144-3 as the local bus arbitrator and I/O expander. The part's 102 user I/O allow direct connection to 32-bit parallel backplane data buses plus discrete control signals, eliminating the need for multiple smaller PLDs. Its 3.3 V core with 5 V-tolerant I/O banks is compatible with classic 5 V backplane signalling via proper current limiting, while newer 3.3 V cPCI systems interface directly. The SRAM-based programmability supports field firmware upgrades without removing the card, important for installed industrial systems with 15-20 year service life requirements.
Recommandé
Automotive Infotainment Prototype (Legacy)
First-generation automotive infotainment and telematics prototypes from the early 2000s used the EPF6010ATC144-3 for display-controller glue logic, audio routing, and CAN/LIN bus bridging. Its 880-LE budget supports CAN protocol controllers and audio multiplexer matrices, and the 102 I/O pins accommodate multiple display interfaces, button matrices, and audio codec connections. Designers valued the JTAG interface for rapid prototype bring-up. Note: this part is not AEC-Q100 qualified and is therefore not recommended for current production automotive designs — modern automotive applications should use Cyclone IV GX or similar AEC-Q100 qualified parts. This entry covers legacy prototype support only.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6010ATC144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6010ATC144-2 | EPF6010ATC144-1 | EPF6010ATC144-2N | EPF6010ATC144-3N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same |
| Logic Elements | 880 | 880 - same | 880 - same | 880 - same | 880 - same |
| Speed Grade | -3 (~142.86 MHz) | -2 (~125 MHz) | -1 (~100 MHz) | -2 (~125 MHz) | -3 (~142.86 MHz) |
| User I/O | 102 | 102 - same | 102 - same | 102 - same | 102 - same |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest speed grade (-3) of the FLEX 6000 ATC144 family (vs EPF6010ATC144-2)
- 144-TQFP package exposes maximum user I/O (102 pins) of the FLEX 6000 family (vs EPF6010ATC100-3)
- Production-grade (-3) speed bin, fully characterized by Intel (vs Engineering sample / unbin'ed parts)
Notes de conception
The EPF6010ATC144-3 requires a clean 3.3 V core supply on VCCINT and separately-isolated VCCIO bank supplies (one per I/O bank). Place 100 nF X7R ceramic decoupling capacitors adjacent to every VCCINT and VCCIO pin, and add bulk 10 µF tantalum or polymer capacitors near the package. Power-on sequencing should ensure VCCINT ramps before VCCIO to avoid I/O latch-up; if sequencing is impossible, add a small Schottky diode from VCCINT to VCCIO. The 0.42 µm CMOS process draws significant inrush current during SRAM configuration — budget for at least 200 mA peak on VCCINT during config.
The 144-pin TQFP has a 0.5 mm lead pitch requiring careful PCB layout: keep solder mask slivers at least 0.2 mm wide, use ENIG or immersion tin surface finish for fine-pitch assembly, and route all signals on inner layers beneath the package to escape the fine-pitch perimeter pins. Thermal pad design is not required for this part (no exposed pad), but adequate copper pour around the package reduces thermal resistance and improves power dissipation. Reflow profile should follow J-STD-020 MSL classification printed on the reel label.
Three common pitfalls when designing with the EPF6010ATC144-3: (1) Forgetting to strap MSEL0/MSEL1 for the desired configuration mode — leaving them floating yields unpredictable behavior; (2) Not providing a valid configuration source at power-up — without an EPC EPROM or JTAG programmer, the device never completes configuration and CONF_DONE stays low; (3) Driving JTAG signals (TDI, TMS, TCK) with non-3.3 V logic — the JTAG port shares the same 3.3 V supply rail as the core, and 5 V signals will damage the inputs. Always include a JTAG header for boundary-scan test and in-system programming access.
Informations de conformité
RoHS, REACH, and AEC-Q100 compliance for the EPF6010ATC144-3 were not present in the verified web data and are marked unknown. The 'N' suffix variants (EPF6010ATC144-3N) are Pb-free per Altera/Intel naming convention, but full material declaration must be obtained from the manufacturer. This part is NOT AEC-Q100 qualified and is not recommended for new automotive designs.
