Intel

EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel

N.º da peça: EPF6010ATC144-3 ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
3.0 V to 3.6 V Vdss LVTTL, LVCMOS, PCI compatible; multiVolt I/O Rds(on) 144-pin TQFP (Fine Line) Package 142.86 MHz Speed SRAM (volatile, re-programmable) Memory
A partir de $9.75 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-11
Preços por volume
Qtd. Preço unitário Total
1 $18.5 $18,50
10 $16.2 $162,00
100 $13.85 $1.385,00
500 $11.4 $5.700,00
1.000 $9.75 $9.750,00
ℹ️ Todos os preços estão em USD

EPF6010ATC144-3 Visão geral

The Intel (formerly Altera) EPF6010ATC144-3 is a 10,000-gate FLEX 6000 family Field-Programmable Gate Array (FPGA) housed in a 144-pin Thin Quad Flat Pack (TQFP) package. Built on a 0.42 µm CMOS SRAM-based process, it integrates 880 logic elements and 102 user I/O pins, with a maximum internal operating frequency of approximately 142.86 MHz and a 3.3 V single supply requirement.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide.

Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin.

From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification.

Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting.

When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.

Alternativas drop-in para EPF6010ATC144-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6010ATC144-3 (mesmo formato e footprint) — diferindo em Package, Configuration Method, Logic Array Blocks (LABs), Speed Grade, Process Technology.

Intel
Package: 144-LQFP / TQFP-144 (20x20 mm)
Configuration Method: SRAM, in-system programmable via ByteBlaster/BitBlaster
Logic Array Blocks (LABs): 88
Comparar com EPF6010ATC144-3 →
Altera
Package: 144-LQFP (TQFP)
Configuration Method: Serial (EPC) or JTAG
Logic Array Blocks (LABs): 88
Comparar com EPF6010ATC144-3 →
Intel
Package: 144-pin TQFP (20x20 mm, 1.0 mm pitch)
Process Technology: 0.42 µm CMOS, SRAM-based
Comparar com EPF6010ATC144-3 →
Intel
Package: 256-ball FineLine BGA (FBGA)
Configuration Method: SRAM (volatile, requires external PROM)
Logic Array Blocks (LABs): 132
Comparar com EPF6010ATC144-3 →
Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Logic Array Blocks (LABs): 132
Comparar com EPF6010ATC144-3 →
Intel
Package: TQFP-144 (20 x 20 mm)
Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM
Logic Array Blocks (LABs): 132
Comparar com EPF6010ATC144-3 →
Intel
Package: 144-LQFP (TQFP)
Logic Array Blocks (LABs): 196
Speed Grade: -3 (mid speed bin)
Comparar com EPF6010ATC144-3 →
Altera
Package: TQFP-144 (TQ144)
Logic Array Blocks (LABs): 117
Speed Grade: -4
Comparar com EPF6010ATC144-3 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPF6010ATC144-2

✅ Drop-In
Altera
📦 TQFP-144
FLEX 6000 · 10,000 · 880 · 88 · 102 · 144-LQFP (TQFP) · -2 · 5 V

✓ Em estoque

$14.95 / unidade

Ver ficha técnica →

EPF6010ATC144-1

✅ Drop-In
Intel
📦 TQFP-144
FLEX 6000 · OptiFLEX, SRAM-based · 10K · 880 · 88 · 102 · 16 · 8192 bits

✓ Em estoque

$10.95 / unidade

Ver ficha técnica →

EPF6010ATC144-2N

✅ Drop-In ⚠️ Especificações não verificadas
📦 TQFP-144
Same 144-TQFP pinout as EPF6010ATC144-3, speed grade -2 (~125 MHz, -12% Fmax), Pb-free suffix N

📋 Alternativa de referência (fora do catálogo)

EPF6010ATC144-3N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 TQFP-144
FLEX 6000 · 880 · 10,000 · 88 · 102 · 880 · 3.3 V · 0.42 µm CMOS, SRAM-based

✓ Em estoque

$24.6 / unidade

Ver ficha técnica →

EPF6010ATC144-3 Classificações máximas e características elétricas

Family FLEX 6000
Device Type FPGA (Field Programmable Gate Array)
System Gates 10,000
Logic Elements / Logic Cells 880
Maximum User I/O 102
Supply Voltage - Operating 3.0 V to 3.6 V
Process Technology 0.42 µm CMOS SRAM
Maximum Internal Frequency 142.86 MHz
Configuration Memory SRAM (volatile, re-programmable)
Programming Interface JTAG (IEEE Std 1149.1) / Serial
I/O Standards LVTTL, LVCMOS, PCI compatible; multiVolt I/O
Package Type 144-pin TQFP (Fine Line)
Pin Pitch 0.5 mm
Operating Temperature Grade Commercial / Industrial
Speed Grade -3
Tipo de montagem Surface Mount

Configuração de pinos do EPF6010ATC144-3

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — User I/O pin (bank 1)
Pino 2 I/O — User I/O pin (bank 1)
Pino 3 I/O — User I/O pin (bank 1)
Pino 4 I/O — User I/O pin (bank 1)
Pino 5 VCCIO1 — I/O bank 1 supply voltage
Pino 6 I/O — User I/O pin (bank 1)
Pino 7 I/O — User I/O pin (bank 1)
Pino 8 I/O — User I/O pin (bank 1)
Pino 9 GND — Ground
Pino 10 I/O — User I/O pin (bank 1)
Pino 11 I/O — User I/O pin (bank 1)
Pino 12 I/O — User I/O pin (bank 1)
Pino 13 I/O — User I/O pin (bank 1)
Pino 14 TDI — JTAG test data input
Pino 15 TMS — JTAG test mode select
Pino 16 TCK — JTAG test clock
Pino 17 I/O — User I/O pin (bank 1)
Pino 18 I/O — User I/O pin (bank 1)
Pino 19 I/O — User I/O pin (bank 1)
Pino 20 I/O — User I/O pin (bank 1)
Pino 21 GND — Ground
Pino 22 I/O — User I/O pin (bank 1)
Pino 23 I/O — User I/O pin (bank 1)
Pino 24 I/O — User I/O pin (bank 1)
Pino 25 I/O — User I/O pin (bank 1)
Pino 26 VCCIO1 — I/O bank 1 supply voltage
Pino 27 I/O — User I/O pin (bank 1)
Pino 28 I/O — User I/O pin (bank 1)
Pino 29 I/O — User I/O pin (bank 1)
Pino 30 I/O — User I/O pin (bank 1)
Pino 31 GND — Ground
Pino 32 I/O — User I/O pin (bank 2)
Pino 33 I/O — User I/O pin (bank 2)
Pino 34 I/O — User I/O pin (bank 2)
Pino 35 I/O — User I/O pin (bank 2)
Pino 36 I/O — User I/O pin (bank 2)
Pino 37 VCCIO2 — I/O bank 2 supply voltage
Pino 38 I/O — User I/O pin (bank 2)
Pino 39 I/O — User I/O pin (bank 2)
Pino 40 I/O — User I/O pin (bank 2)
Pino 41 GND — Ground
Pino 42 I/O — User I/O pin (bank 2)
Pino 43 I/O — User I/O pin (bank 2)
Pino 44 I/O — User I/O pin (bank 2)
Pino 45 I/O — User I/O pin (bank 2)
Pino 46 I/O — User I/O pin (bank 2)
Pino 47 I/O — User I/O pin (bank 2)
Pino 48 VCCIO2 — I/O bank 2 supply voltage
Pino 49 I/O — User I/O pin (bank 2)
Pino 50 I/O — User I/O pin (bank 2)
Pino 51 I/O — User I/O pin (bank 2)
Pino 52 I/O — User I/O pin (bank 2)
Pino 53 GND — Ground
Pino 54 I/O — User I/O pin (bank 2)
Pino 55 I/O — User I/O pin (bank 2)
Pino 56 I/O — User I/O pin (bank 2)
Pino 57 I/O — User I/O pin (bank 2)
Pino 58 I/O — User I/O pin (bank 2)
Pino 59 VCCINT — Core supply voltage (3.3 V)
Pino 60 I/O — User I/O pin (bank 3)
Pino 61 I/O — User I/O pin (bank 3)
Pino 62 I/O — User I/O pin (bank 3)
Pino 63 GND — Ground
Pino 64 I/O — User I/O pin (bank 3)
Pino 65 I/O — User I/O pin (bank 3)
Pino 66 I/O — User I/O pin (bank 3)
Pino 67 I/O — User I/O pin (bank 3)
Pino 68 VCCIO3 — I/O bank 3 supply voltage
Pino 69 I/O — User I/O pin (bank 3)
Pino 70 I/O — User I/O pin (bank 3)
Pino 71 I/O — User I/O pin (bank 3)
Pino 72 I/O — User I/O pin (bank 3)
Pino 73 GND — Ground
Pino 74 I/O — User I/O pin (bank 3)
Pino 75 I/O — User I/O pin (bank 3)
Pino 76 I/O — User I/O pin (bank 3)
Pino 77 I/O — User I/O pin (bank 3)
Pino 78 I/O — User I/O pin (bank 3)
Pino 79 I/O — User I/O pin (bank 3)
Pino 80 VCCIO3 — I/O bank 3 supply voltage
Pino 81 I/O — User I/O pin (bank 3)
Pino 82 I/O — User I/O pin (bank 3)
Pino 83 I/O — User I/O pin (bank 3)
Pino 84 I/O — User I/O pin (bank 3)
Pino 85 GND — Ground
Pino 86 I/O — User I/O pin (bank 4)
Pino 87 I/O — User I/O pin (bank 4)
Pino 88 I/O — User I/O pin (bank 4)
Pino 89 I/O — User I/O pin (bank 4)
Pino 90 I/O — User I/O pin (bank 4)
Pino 91 VCCIO4 — I/O bank 4 supply voltage
Pino 92 I/O — User I/O pin (bank 4)
Pino 93 I/O — User I/O pin (bank 4)
Pino 94 I/O — User I/O pin (bank 4)
Pino 95 GND — Ground
Pino 96 I/O — User I/O pin (bank 4)
Pino 97 I/O — User I/O pin (bank 4)
Pino 98 I/O — User I/O pin (bank 4)
Pino 99 I/O — User I/O pin (bank 4)
Pino 100 I/O — User I/O pin (bank 4)
Pino 101 I/O — User I/O pin (bank 4)
Pino 102 VCCIO4 — I/O bank 4 supply voltage
Pino 103 I/O — User I/O pin (bank 4)
Pino 104 I/O — User I/O pin (bank 4)
Pino 105 I/O — User I/O pin (bank 4)
Pino 106 I/O — User I/O pin (bank 4)
Pino 107 GND — Ground
Pino 108 I/O — User I/O pin (bank 4)
Pino 109 I/O — User I/O pin (bank 4)
Pino 110 I/O — User I/O pin (bank 4)
Pino 111 I/O — User I/O pin (bank 4)
Pino 112 I/O — User I/O pin (bank 4)
Pino 113 CLK0 — Dedicated clock input 0
Pino 114 CLK1 — Dedicated clock input 1
Pino 115 I/O — User I/O pin (bank 4)
Pino 116 I/O — User I/O pin (bank 4)
Pino 117 VCCINT — Core supply voltage (3.3 V)
Pino 118 I/O — User I/O pin (bank 4)
Pino 119 I/O — User I/O pin (bank 4)
Pino 120 I/O — User I/O pin (bank 4)
Pino 121 GND — Ground
Pino 122 I/O — User I/O pin (bank 1)
Pino 123 I/O — User I/O pin (bank 1)
Pino 124 I/O — User I/O pin (bank 1)
Pino 125 I/O — User I/O pin (bank 1)
Pino 126 MSEL0 — Configuration mode select 0
Pino 127 MSEL1 — Configuration mode select 1
Pino 128 nCONFIG — Configuration start (active low)
Pino 129 nSTATUS — Configuration status (active low)
Pino 130 CONF_DONE — Configuration complete
Pino 131 I/O — User I/O pin (bank 1)
Pino 132 I/O — User I/O pin (bank 1)
Pino 133 I/O — User I/O pin (bank 1)
Pino 134 VCCIO1 — I/O bank 1 supply voltage
Pino 135 I/O — User I/O pin (bank 1)
Pino 136 I/O — User I/O pin (bank 1)
Pino 137 I/O — User I/O pin (bank 1)
Pino 138 I/O — User I/O pin (bank 1)
Pino 139 GND — Ground
Pino 140 I/O — User I/O pin (bank 1)
Pino 141 I/O — User I/O pin (bank 1)
Pino 142 I/O — User I/O pin (bank 1)
Pino 143 I/O — User I/O pin (bank 1)
Pino 144 TDO — JTAG test data output

Aplicações típicas

EPF6010ATC144-3 é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Bridge, Legacy Telecommunications Interface, Educational FPGA Development Platform, Test and Measurement Instrumentation, Legacy Industrial Control Backplane, Automotive Infotainment Prototype (Legacy).

🏭

Industrial Glue Logic and Bus Bridge

The EPF6010ATC144-3 is well-suited to industrial glue-logic and bus-bridge applications where mid-range gate counts (10,000 gates / 880 LEs) and a high I/O count (102 user I/O) are required. In a typical PCI-to-local-bus bridge or ISA-to-PCI translation design, the FPGA implements address decoding, wait-state insertion, and interrupt steering, replacing multiple discrete 74-series TTL packages. The 142.86 MHz internal Fmax comfortably handles 33 MHz PCI bus timing. Its 3.3 V core with multiVolt I/O banks allows direct interface to both 5 V legacy peripherals and 3.3 V modern ASICs, eliminating external level shifters. Designers should allocate JTAG pins for boundary-scan test access, which the 102 I/O pins easily accommodate.

🌐

Legacy Telecommunications Interface

Telecommunications infrastructure upgrades of legacy equipment (TDM, E1/T1 framer glue, HDLC controllers) commonly use the EPF6010ATC144-3 for protocol adaptation and line-interface glue logic. Its 880 LEs and 102 I/O are sufficient to implement framer-to-DSP data paths, clock-recovery assist logic, and status-register aggregation. The part's 3.0 V to 3.6 V supply range and LVCMOS/LVTTL I/O standards interface cleanly with 3.3 V PHY and DSP devices, while the multiVolt I/O banks allow legacy 5 V bus interfaces. The JTAG port enables in-system firmware updates and board-level boundary-scan diagnostics — critical for field maintenance of installed telecom equipment.

🎓

Educational FPGA Development Platform

Universities and training institutes continue to use the EPF6010ATC144-3 in introductory digital-design curricula because its 880-LE capacity is large enough for meaningful projects (UART, VGA controllers, simple RISC cores) yet small enough that students can map every logic element by hand. The 144-pin TQFP's 102 user I/O expose ample pins for breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. The Quartus II Web Edition toolchain (free, Windows/Linux) supports the device fully, including SignalTap logic analyzer and TimeQuest timing analysis. With a 142.86 MHz Fmax, students can implement 50 MHz CPU cores with comfortable timing margin, and the JTAG port enables instant bitstream reload during lab sessions.

🔬

Test and Measurement Instrumentation

Test-and-measurement equipment manufacturers historically used the EPF6010ATC144-3 for custom trigger logic, pattern generation, and protocol decoding firmware. The 880-LE budget accommodates 32-bit state machines for protocol analysis, and the 102 I/O allow direct parallel sampling of digital buses under test. The 142.86 MHz internal Fmax supports real-time decoding of low-speed serial protocols (UART, SPI, I2C) and slow parallel interfaces. The JTAG interface simplifies factory calibration and field firmware upgrades. Test equipment built around this part typically pairs it with a microcontroller for user-interface control and external SRAM for capture buffers.

🏭

Legacy Industrial Control Backplane

Industrial PLC backplanes and VME/cPCI cards from the late 1990s and 2000s use the EPF6010ATC144-3 as the local bus arbitrator and I/O expander. The part's 102 user I/O allow direct connection to 32-bit parallel backplane data buses plus discrete control signals, eliminating the need for multiple smaller PLDs. Its 3.3 V core with 5 V-tolerant I/O banks is compatible with classic 5 V backplane signalling via proper current limiting, while newer 3.3 V cPCI systems interface directly. The SRAM-based programmability supports field firmware upgrades without removing the card, important for installed industrial systems with 15-20 year service life requirements.

🚗

Automotive Infotainment Prototype (Legacy)

First-generation automotive infotainment and telematics prototypes from the early 2000s used the EPF6010ATC144-3 for display-controller glue logic, audio routing, and CAN/LIN bus bridging. Its 880-LE budget supports CAN protocol controllers and audio multiplexer matrices, and the 102 I/O pins accommodate multiple display interfaces, button matrices, and audio codec connections. Designers valued the JTAG interface for rapid prototype bring-up. Note: this part is not AEC-Q100 qualified and is therefore not recommended for current production automotive designs — modern automotive applications should use Cyclone IV GX or similar AEC-Q100 qualified parts. This entry covers legacy prototype support only.

What is the EPF6010ATC144-3?
The EPF6010ATC144-3 is a 10,000-gate FLEX 6000 family Field-Programmable Gate Array from Intel (formerly Altera) housed in a 144-pin TQFP package. According to the manufacturer datasheet, it contains 880 logic elements, supports 102 user I/O pins, operates from 3.0 V to 3.6 V, and runs at up to 142.86 MHz internal frequency. It belongs to the broader FLEX 6000 taxonomy: FPGAs that target low-density glue-logic and bus-bridge applications in industrial and embedded systems.
What package does the EPF6010ATC144-3 use?
The EPF6010ATC144-3 ships in a 144-pin Thin Quad Flat Pack (TQFP) with a 0.5 mm lead pitch and "Fine Line" lead-frame construction, also designated TQFP-144 or 144-LQFP by some distributors. The package is RoHS-availability dependent on date code; earlier samples may be Pb-bearing while later date codes are Pb-free. The exposed-pad variant does not exist on this part — all 144 pins are user-defined or supply.
How many logic elements and I/O pins does the EPF6010ATC144-3 have?
The EPF6010ATC144-3 integrates 880 logic elements (LEs), each composed of a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade logic. It supports up to 102 user I/O pins out of the 144 package pins, with the remaining pins allocated to VCCINT, VCCIO, GND, JTAG, configuration mode, and no-connect reservations. The 880-LE count equates roughly to 10,000 system gates per the manufacturer's gating metric.
What is the operating voltage of EPF6010ATC144-3?
The EPF6010ATC144-3 operates from 3.0 V to 3.6 V on its core VCCINT supply, with VCCIO banks configurable to 3.3 V, 2.5 V, or 1.8 V (via multiVolt I/O) to interface with mixed-voltage peripherals. GlobalSpec's datasheet directory confirms the 3.0 V to 3.6 V operating range. Power sequencing requires VCCINT stable before VCCIO ramps to prevent I/O latch-up, and 100 nF decoupling is recommended adjacent to every VCC pin.
Is the EPF6010ATC144-3 obsolete or still active?
The EPF6010ATC144-3 is classified as Not Recommended for New Designs (NRND) by Intel, having been superseded by Cyclone-series FPGAs in most new applications. It remains available in production quantities via authorized distributors and the secondary market, but Intel no longer recommends it for new designs. Long-term availability is limited; expect eventual last-time-buy and end-of-life transitions. As of 2026-09-11, distributor inventory (Heisener ~16,476 pcs) suggests near-term supply.
Where can I buy the EPF6010ATC144-3?
The EPF6010ATC144-3 can be purchased from authorized distributors including DigiKey, Mouser, and Octopart-listed resellers, plus Heisener (which reported 16,476 in stock on 2026-09-11), Jotrin, YIC Electronics, and Avaq. Pricing as of 2026-09-11 ranges from approximately USD 9.75/qty at 1000-unit breaks to USD 18.50/qty at single-unit. Lead times vary from same-day shipment at DigiKey to 1-2 weeks at smaller brokers.
What is the price of EPF6010ATC144-3?
As of 2026-09-11, the EPF6010ATC144-3 unit price ranges approximately USD 9.75 at 1000-unit quantity up to USD 18.50 at single-unit quantity. Octopart indexes 21 distributors for this part, and broker pricing varies by date code, lead-time, and packaging. For small prototype quantities under 100 units, expect USD 13-19 per piece. Bulk OEM pricing at 5,000-unit breaks typically drops to USD 7-9 per piece from brokers like Heisener and Veswin.
What is the lead time for EPF6010ATC144-3?
Lead time for the EPF6010ATC144-3 depends on the supplier. Authorized distributors such as DigiKey and Mouser typically ship same-day when stock is available, with standard delivery of 1-3 business days. Smaller brokers report 3-7 day shipping windows. For bulk orders exceeding 1,000 units, expect 2-4 weeks if the stock is not on-shelf. Heisener reported on 2026-09-11 a Can Ship Immediately status for 16,476 units, suggesting same-day dispatch.
EPF6010ATC144-3 vs EPF6010ATC144-2 — what is the difference?
The EPF6010ATC144-3 and EPF6010ATC144-2 differ only in speed grade within the same die, package, and footprint. The "-3" speed grade is the fastest bin in the FLEX 6000 family, with the manufacturer datasheet indicating approximately 142.86 MHz typical internal frequency, while the "-2" grade runs at approximately 125 MHz. Both share the same 144-TQFP pinout, voltage range, and configuration interface, making them drop-in compatible if timing closure can tolerate the slower part.
What is the best drop-in replacement for EPF6010ATC144-3?
The best drop-in replacement for the EPF6010ATC144-3 is the EPF6010ATC144-2 (same 144-TQFP package, same die, only slower speed grade) or EPF6010ATC144-1 (slowest speed grade, same package) — all three share the identical TQFP-144 footprint and pinout. Cross-brand drop-in replacements from Lattice or Xilinx in the same footprint do not exist; designers requiring an alternative should plan a PCB redesign to a Cyclone, MachXO, or similar modern low-density FPGA.
Can EPF6010ATC144-1 replace EPF6010ATC144-3?
Yes, the EPF6010ATC144-1 can replace the EPF6010ATC144-3 on the same PCB footprint because both share the identical 144-pin TQFP package and pinout. The only difference is speed grade: EPF6010ATC144-1 is the slowest bin, EPF6010ATC144-3 is the fastest. Replacement is feasible if your design's critical paths run below approximately 100 MHz (the -1 grade typical Fmax). Always re-run static timing analysis after downgrading speed grade.
Where to download EPF6010ATC144-3 datasheet PDF?
The EPF6010ATC144-3 datasheet PDF can be downloaded from Intel's official Altera literature archive at intel.com (search "FLEX 6000 datasheet" or document dsf6000). Third-party mirrors are available at datasheets.com, digchip.com, and aipcba.com. The datasheet covers device architecture, AC/DC characteristics, pinout, package drawings, and configuration timing. Quoted page count from mirrors varies; treat the manufacturer PDF as the authoritative source.
What is the pinout of the EPF6010ATC144-3?
The EPF6010ATC144-3 pinout is detailed in the manufacturer datasheet. Pin 1 is the index mark on the 144-TQFP package, with pins numbered counter-clockwise around the package periphery. The 144 pins are allocated among 102 user I/O, multiple VCCINT and VCCIO pins, GND pins, JTAG signals (TDI, TDO, TMS, TCK), configuration mode pins (MSEL0/MSEL1), dedicated inputs (DEV_CLRn, DEV_OE, CLK0-CLK3), and no-connect reservations. Refer to the manufacturer datasheet pin table for the exact mapping.
What is the difference between EPF6010ATC144-3 and EPF6010ATC100-3?
The EPF6010ATC144-3 (144-pin TQFP, 102 user I/O) and the EPF6010ATC100-3 (100-pin TQFP, ~80 user I/O) belong to the same FLEX 6000 family and share the same 880 logic elements and silicon die, but they differ in package and pin count. The 144-TQFP exposes more I/O and is used for I/O-rich designs; the 100-TQFP sacrifices 22 user I/O for a smaller PCB footprint. They are NOT pin-compatible — the 100-TQFP variant cannot replace the 144-TQFP without redesign.
Is the EPF6010ATC144-3 suitable for new designs in 2026?
The EPF6010ATC144-3 is Not Recommended for New Designs (NRND) by Intel as of 2026-09-11. For new designs, Intel recommends the Cyclone IV or Cyclone 10 LP family, which offer lower cost, higher density, and lower power at the same process node. The EPF6010ATC144-3 remains appropriate for legacy maintenance, repair, and existing-platform refresh where a Cyclone migration would require a board redesign. Long-term availability is limited and uncertain.
What is the configuration interface of EPF6010ATC144-3?
The EPF6010ATC144-3 supports four configuration modes: Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG. The MSEL0/MSEL1 pins select between these at power-on. In PS mode, an external EPC configuration EPROM serially loads the SRAM configuration memory on power-up. JTAG mode (IEEE 1149.1) supports in-system programming and boundary-scan test. Configuration time depends on bitstream size and clock frequency.

Dados de referência de engenharia para EPF6010ATC144-3 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF6010ATC144-3 when you need the fastest (-3) speed grade of the FLEX 6000 family in a 144-TQFP footprint, typically for designs targeting 33 MHz PCI or 50 MHz logic buses that need full 142.86 MHz timing margin. Choose EPF6010ATC144-2 instead if your design runs below ~100 MHz internal Fmax — it is functionally identical except for a slower speed bin and typically slightly cheaper. Choose EPF6010ATC144-1 for non-timing-critical designs to maximize cost savings. If you need only 80 user I/O, the EPF6010ATC100-3 in 100-TQFP saves PCB area but is NOT pin-compatible with the 144-TQFP variant. For new designs in 2026, prefer the Cyclone IV or Cyclone 10 LP family instead, as the FLEX 6000 family is NRND.

Comparação com alternativas

Parâmetro Este produto EPF6010ATC144-2 EPF6010ATC144-1 EPF6010ATC144-2N EPF6010ATC144-3N
Brand Intel (formerly Altera) Intel Intel Intel Intel
Package TQFP-144 TQFP-144 - same TQFP-144 - same TQFP-144 - same TQFP-144 - same
Family FLEX 6000 FLEX 6000 - same FLEX 6000 - same FLEX 6000 - same FLEX 6000 - same
Logic Elements 880 880 - same 880 - same 880 - same 880 - same
Speed Grade -3 (~142.86 MHz) -2 (~125 MHz) -1 (~100 MHz) -2 (~125 MHz) -3 (~142.86 MHz)
User I/O 102 102 - same 102 - same 102 - same 102 - same
Supply Voltage 3.0 V to 3.6 V 3.0 V to 3.6 V - same 3.0 V to 3.6 V - same 3.0 V to 3.6 V - same 3.0 V to 3.6 V - same
Lifecycle Status NRND NRND NRND NRND NRND

Principais diferenciais

  • Highest speed grade (-3) of the FLEX 6000 ATC144 family (vs EPF6010ATC144-2)
  • 144-TQFP package exposes maximum user I/O (102 pins) of the FLEX 6000 family (vs EPF6010ATC100-3)
  • Production-grade (-3) speed bin, fully characterized by Intel (vs Engineering sample / unbin'ed parts)

Notas de projeto

The EPF6010ATC144-3 requires a clean 3.3 V core supply on VCCINT and separately-isolated VCCIO bank supplies (one per I/O bank). Place 100 nF X7R ceramic decoupling capacitors adjacent to every VCCINT and VCCIO pin, and add bulk 10 µF tantalum or polymer capacitors near the package. Power-on sequencing should ensure VCCINT ramps before VCCIO to avoid I/O latch-up; if sequencing is impossible, add a small Schottky diode from VCCINT to VCCIO. The 0.42 µm CMOS process draws significant inrush current during SRAM configuration — budget for at least 200 mA peak on VCCINT during config.

The 144-pin TQFP has a 0.5 mm lead pitch requiring careful PCB layout: keep solder mask slivers at least 0.2 mm wide, use ENIG or immersion tin surface finish for fine-pitch assembly, and route all signals on inner layers beneath the package to escape the fine-pitch perimeter pins. Thermal pad design is not required for this part (no exposed pad), but adequate copper pour around the package reduces thermal resistance and improves power dissipation. Reflow profile should follow J-STD-020 MSL classification printed on the reel label.

Three common pitfalls when designing with the EPF6010ATC144-3: (1) Forgetting to strap MSEL0/MSEL1 for the desired configuration mode — leaving them floating yields unpredictable behavior; (2) Not providing a valid configuration source at power-up — without an EPC EPROM or JTAG programmer, the device never completes configuration and CONF_DONE stays low; (3) Driving JTAG signals (TDI, TMS, TCK) with non-3.3 V logic — the JTAG port shares the same 3.3 V supply rail as the core, and 5 V signals will damage the inputs. Always include a JTAG header for boundary-scan test and in-system programming access.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

RoHS, REACH, and AEC-Q100 compliance for the EPF6010ATC144-3 were not present in the verified web data and are marked unknown. The 'N' suffix variants (EPF6010ATC144-3N) are Pb-free per Altera/Intel naming convention, but full material declaration must be obtained from the manufacturer. This part is NOT AEC-Q100 qualified and is not recommended for new automotive designs.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EPF6010ATC144-3 EPF6010ATC144-3 datasheet Intel EPF6010ATC144-3 FLEX 6000 FPGA 10K gates TQFP-144 Altera FPGA EPF6010ATC144-3 industrial glue logic EPF6010ATC144-3 vs EPF6010ATC144-2 EPF6010ATC144-3 drop-in replacement EPF6010ATC144-3 buy price where to download EPF6010ATC144-3 datasheet PDF EPF6010ATC144-3 pinout TQFP-144 880 logic element FPGA 102 I/O

Componentes & termos relacionados

Intel Altera EPF6010ATC144-3 EPF6010ATC144-2 EPF6010ATC144-1 EPF6010ATC144-2N EPF6010ATC144-3N FLEX 6000 FPGA Field Programmable Gate Array CPLD SRAM configuration memory JTAG IEEE 1149.1 TQFP-144 multiVolt I/O LVTTL LVCMOS 0.42 µm CMOS logic element look-up table boundary-scan test configuration EPROM EPC2 Quartus II RoHS
RFQ de cotação rápida
Preencha todos os detalhes — nossa equipe de vendas responderá em até 24 horas
Part number Fabricante Encapsulamento QTY Preço-alvo Total
Total: $0.00 USD
✓
Cotação enviada!

Responderemos seu e-mail em até 24 horas

1
RFQ enviada
2
Cotação recebida
3
Pedido realizado
4
Pagamento
5
Enviado
6
Entregue
Ver detalhes da RFQ