EPF6010ATC144-3 - 10K Gates FLEX 6000 FPGA, 144-TQFP | Intel
N.º da peça: EPF6010ATC144-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
EPF6010ATC144-3 Visão geral
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of user-customizable interconnect. The FLEX 6000 family sits at the lower-density end of the Altera/Intel CPLD/FPGA taxonomy: CPLD -> FLEX 6000 -> APEX/Stratix/Cyclone family hierarchy, used for glue logic, bus bridging, and moderate-complexity state-machine applications. FPGAs in this class are typically selected over CPLDs when the design requires more flip-flops, wider fan-in, or higher register density than a CPLD's macrocell structure can provide.
Key features include in-system programmability through a 4-pin JTAG/IEEE Std 1149.1 interface, built-in SRAM configuration memory, multiVolt I/O support for interfacing to 5.0 V, 3.3 V, and 2.5 V devices, and built-in boundary-scan test (BST) circuitry. The device also offers dedicated clock and global control signal networks, low-power standby modes, and tri-state buffer support on every I/O pin.
From an architectural standpoint, the EPF6010ATC144-3 uses logic elements (LEs) — each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade chains — wired through a continuous, row-and-column FastTrack interconnect. The "-3" speed grade denotes a specific Fmax bin in the Altera naming convention; -3 parts are typically faster than -2 and -1 grade equivalents. Configuration data can be loaded from a serial EPROM or via JTAG, and the part retains its configuration indefinitely while VCC is held within specification.
Typical applications include legacy industrial control interfaces, telecommunications glue logic, bus-bridge and protocol-conversion bridges (e.g., PCI to local bus), and educational/development platforms for digital logic curricula. The wide 3.3 V supply tolerance makes it compatible with both 3.3 V and 5 V mixed-voltage systems when used with proper level-shifting.
When designing with this part, attention must be paid to I/O bank voltage selection, decoupling capacitor placement near each VCC/GND pair, and configuration mode selection (PS, AS, or JTAG). The 144-pin TQFP is a fine-pitch (0.5 mm pitch) package that requires careful PCB layout and assembly; production volumes should use a contract assembler familiar with fine-pitch QFP handling.
Alternativas drop-in para EPF6010ATC144-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6010ATC144-3 (mesmo formato e footprint) — diferindo em Package, Configuration Method, Logic Array Blocks (LABs), Speed Grade, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6010ATC144-2
✅ Drop-In✓ Em estoque
$14.95 / unidade
Ver ficha técnica →EPF6010ATC144-1
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →EPF6010ATC144-2N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPF6010ATC144-3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$24.6 / unidade
Ver ficha técnica →EPF6010ATC144-3 Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| System Gates | 10,000 |
| Logic Elements / Logic Cells | 880 |
| Maximum User I/O | 102 |
| Supply Voltage - Operating | 3.0 V to 3.6 V |
| Process Technology | 0.42 µm CMOS SRAM |
| Maximum Internal Frequency | 142.86 MHz |
| Configuration Memory | SRAM (volatile, re-programmable) |
| Programming Interface | JTAG (IEEE Std 1149.1) / Serial |
| I/O Standards | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | 144-pin TQFP (Fine Line) |
| Pin Pitch | 0.5 mm |
| Operating Temperature Grade | Commercial / Industrial |
| Speed Grade | -3 |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EPF6010ATC144-3
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | GND — Ground |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | TDI — JTAG test data input |
| Pino 15 | TMS — JTAG test mode select |
| Pino 16 | TCK — JTAG test clock |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | I/O — User I/O pin (bank 1) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin (bank 1) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | I/O — User I/O pin (bank 1) |
| Pino 26 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 27 | I/O — User I/O pin (bank 1) |
| Pino 28 | I/O — User I/O pin (bank 1) |
| Pino 29 | I/O — User I/O pin (bank 1) |
| Pino 30 | I/O — User I/O pin (bank 1) |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | I/O — User I/O pin (bank 2) |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O pin (bank 2) |
| Pino 43 | I/O — User I/O pin (bank 2) |
| Pino 44 | I/O — User I/O pin (bank 2) |
| Pino 45 | I/O — User I/O pin (bank 2) |
| Pino 46 | I/O — User I/O pin (bank 2) |
| Pino 47 | I/O — User I/O pin (bank 2) |
| Pino 48 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 49 | I/O — User I/O pin (bank 2) |
| Pino 50 | I/O — User I/O pin (bank 2) |
| Pino 51 | I/O — User I/O pin (bank 2) |
| Pino 52 | I/O — User I/O pin (bank 2) |
| Pino 53 | GND — Ground |
| Pino 54 | I/O — User I/O pin (bank 2) |
| Pino 55 | I/O — User I/O pin (bank 2) |
| Pino 56 | I/O — User I/O pin (bank 2) |
| Pino 57 | I/O — User I/O pin (bank 2) |
| Pino 58 | I/O — User I/O pin (bank 2) |
| Pino 59 | VCCINT — Core supply voltage (3.3 V) |
| Pino 60 | I/O — User I/O pin (bank 3) |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | I/O — User I/O pin (bank 3) |
| Pino 63 | GND — Ground |
| Pino 64 | I/O — User I/O pin (bank 3) |
| Pino 65 | I/O — User I/O pin (bank 3) |
| Pino 66 | I/O — User I/O pin (bank 3) |
| Pino 67 | I/O — User I/O pin (bank 3) |
| Pino 68 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 69 | I/O — User I/O pin (bank 3) |
| Pino 70 | I/O — User I/O pin (bank 3) |
| Pino 71 | I/O — User I/O pin (bank 3) |
| Pino 72 | I/O — User I/O pin (bank 3) |
| Pino 73 | GND — Ground |
| Pino 74 | I/O — User I/O pin (bank 3) |
| Pino 75 | I/O — User I/O pin (bank 3) |
| Pino 76 | I/O — User I/O pin (bank 3) |
| Pino 77 | I/O — User I/O pin (bank 3) |
| Pino 78 | I/O — User I/O pin (bank 3) |
| Pino 79 | I/O — User I/O pin (bank 3) |
| Pino 80 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 81 | I/O — User I/O pin (bank 3) |
| Pino 82 | I/O — User I/O pin (bank 3) |
| Pino 83 | I/O — User I/O pin (bank 3) |
| Pino 84 | I/O — User I/O pin (bank 3) |
| Pino 85 | GND — Ground |
| Pino 86 | I/O — User I/O pin (bank 4) |
| Pino 87 | I/O — User I/O pin (bank 4) |
| Pino 88 | I/O — User I/O pin (bank 4) |
| Pino 89 | I/O — User I/O pin (bank 4) |
| Pino 90 | I/O — User I/O pin (bank 4) |
| Pino 91 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 92 | I/O — User I/O pin (bank 4) |
| Pino 93 | I/O — User I/O pin (bank 4) |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | GND — Ground |
| Pino 96 | I/O — User I/O pin (bank 4) |
| Pino 97 | I/O — User I/O pin (bank 4) |
| Pino 98 | I/O — User I/O pin (bank 4) |
| Pino 99 | I/O — User I/O pin (bank 4) |
| Pino 100 | I/O — User I/O pin (bank 4) |
| Pino 101 | I/O — User I/O pin (bank 4) |
| Pino 102 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 103 | I/O — User I/O pin (bank 4) |
| Pino 104 | I/O — User I/O pin (bank 4) |
| Pino 105 | I/O — User I/O pin (bank 4) |
| Pino 106 | I/O — User I/O pin (bank 4) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O pin (bank 4) |
| Pino 109 | I/O — User I/O pin (bank 4) |
| Pino 110 | I/O — User I/O pin (bank 4) |
| Pino 111 | I/O — User I/O pin (bank 4) |
| Pino 112 | I/O — User I/O pin (bank 4) |
| Pino 113 | CLK0 — Dedicated clock input 0 |
| Pino 114 | CLK1 — Dedicated clock input 1 |
| Pino 115 | I/O — User I/O pin (bank 4) |
| Pino 116 | I/O — User I/O pin (bank 4) |
| Pino 117 | VCCINT — Core supply voltage (3.3 V) |
| Pino 118 | I/O — User I/O pin (bank 4) |
| Pino 119 | I/O — User I/O pin (bank 4) |
| Pino 120 | I/O — User I/O pin (bank 4) |
| Pino 121 | GND — Ground |
| Pino 122 | I/O — User I/O pin (bank 1) |
| Pino 123 | I/O — User I/O pin (bank 1) |
| Pino 124 | I/O — User I/O pin (bank 1) |
| Pino 125 | I/O — User I/O pin (bank 1) |
| Pino 126 | MSEL0 — Configuration mode select 0 |
| Pino 127 | MSEL1 — Configuration mode select 1 |
| Pino 128 | nCONFIG — Configuration start (active low) |
| Pino 129 | nSTATUS — Configuration status (active low) |
| Pino 130 | CONF_DONE — Configuration complete |
| Pino 131 | I/O — User I/O pin (bank 1) |
| Pino 132 | I/O — User I/O pin (bank 1) |
| Pino 133 | I/O — User I/O pin (bank 1) |
| Pino 134 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 135 | I/O — User I/O pin (bank 1) |
| Pino 136 | I/O — User I/O pin (bank 1) |
| Pino 137 | I/O — User I/O pin (bank 1) |
| Pino 138 | I/O — User I/O pin (bank 1) |
| Pino 139 | GND — Ground |
| Pino 140 | I/O — User I/O pin (bank 1) |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | TDO — JTAG test data output |
Aplicações típicas
EPF6010ATC144-3 é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Bridge, Legacy Telecommunications Interface, Educational FPGA Development Platform, Test and Measurement Instrumentation, Legacy Industrial Control Backplane, Automotive Infotainment Prototype (Legacy).
Industrial Glue Logic and Bus Bridge
The EPF6010ATC144-3 is well-suited to industrial glue-logic and bus-bridge applications where mid-range gate counts (10,000 gates / 880 LEs) and a high I/O count (102 user I/O) are required. In a typical PCI-to-local-bus bridge or ISA-to-PCI translation design, the FPGA implements address decoding, wait-state insertion, and interrupt steering, replacing multiple discrete 74-series TTL packages. The 142.86 MHz internal Fmax comfortably handles 33 MHz PCI bus timing. Its 3.3 V core with multiVolt I/O banks allows direct interface to both 5 V legacy peripherals and 3.3 V modern ASICs, eliminating external level shifters. Designers should allocate JTAG pins for boundary-scan test access, which the 102 I/O pins easily accommodate.
Recomendado
Legacy Telecommunications Interface
Telecommunications infrastructure upgrades of legacy equipment (TDM, E1/T1 framer glue, HDLC controllers) commonly use the EPF6010ATC144-3 for protocol adaptation and line-interface glue logic. Its 880 LEs and 102 I/O are sufficient to implement framer-to-DSP data paths, clock-recovery assist logic, and status-register aggregation. The part's 3.0 V to 3.6 V supply range and LVCMOS/LVTTL I/O standards interface cleanly with 3.3 V PHY and DSP devices, while the multiVolt I/O banks allow legacy 5 V bus interfaces. The JTAG port enables in-system firmware updates and board-level boundary-scan diagnostics — critical for field maintenance of installed telecom equipment.
Recomendado
Educational FPGA Development Platform
Universities and training institutes continue to use the EPF6010ATC144-3 in introductory digital-design curricula because its 880-LE capacity is large enough for meaningful projects (UART, VGA controllers, simple RISC cores) yet small enough that students can map every logic element by hand. The 144-pin TQFP's 102 user I/O expose ample pins for breadboard-friendly breakout boards with switches, LEDs, and 7-segment displays. The Quartus II Web Edition toolchain (free, Windows/Linux) supports the device fully, including SignalTap logic analyzer and TimeQuest timing analysis. With a 142.86 MHz Fmax, students can implement 50 MHz CPU cores with comfortable timing margin, and the JTAG port enables instant bitstream reload during lab sessions.
Recomendado
Test and Measurement Instrumentation
Test-and-measurement equipment manufacturers historically used the EPF6010ATC144-3 for custom trigger logic, pattern generation, and protocol decoding firmware. The 880-LE budget accommodates 32-bit state machines for protocol analysis, and the 102 I/O allow direct parallel sampling of digital buses under test. The 142.86 MHz internal Fmax supports real-time decoding of low-speed serial protocols (UART, SPI, I2C) and slow parallel interfaces. The JTAG interface simplifies factory calibration and field firmware upgrades. Test equipment built around this part typically pairs it with a microcontroller for user-interface control and external SRAM for capture buffers.
Recomendado
Legacy Industrial Control Backplane
Industrial PLC backplanes and VME/cPCI cards from the late 1990s and 2000s use the EPF6010ATC144-3 as the local bus arbitrator and I/O expander. The part's 102 user I/O allow direct connection to 32-bit parallel backplane data buses plus discrete control signals, eliminating the need for multiple smaller PLDs. Its 3.3 V core with 5 V-tolerant I/O banks is compatible with classic 5 V backplane signalling via proper current limiting, while newer 3.3 V cPCI systems interface directly. The SRAM-based programmability supports field firmware upgrades without removing the card, important for installed industrial systems with 15-20 year service life requirements.
Recomendado
Automotive Infotainment Prototype (Legacy)
First-generation automotive infotainment and telematics prototypes from the early 2000s used the EPF6010ATC144-3 for display-controller glue logic, audio routing, and CAN/LIN bus bridging. Its 880-LE budget supports CAN protocol controllers and audio multiplexer matrices, and the 102 I/O pins accommodate multiple display interfaces, button matrices, and audio codec connections. Designers valued the JTAG interface for rapid prototype bring-up. Note: this part is not AEC-Q100 qualified and is therefore not recommended for current production automotive designs — modern automotive applications should use Cyclone IV GX or similar AEC-Q100 qualified parts. This entry covers legacy prototype support only.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6010ATC144-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6010ATC144-2 | EPF6010ATC144-1 | EPF6010ATC144-2N | EPF6010ATC144-3N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same | FLEX 6000 - same |
| Logic Elements | 880 | 880 - same | 880 - same | 880 - same | 880 - same |
| Speed Grade | -3 (~142.86 MHz) | -2 (~125 MHz) | -1 (~100 MHz) | -2 (~125 MHz) | -3 (~142.86 MHz) |
| User I/O | 102 | 102 - same | 102 - same | 102 - same | 102 - same |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same | 3.0 V to 3.6 V - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Highest speed grade (-3) of the FLEX 6000 ATC144 family (vs EPF6010ATC144-2)
- 144-TQFP package exposes maximum user I/O (102 pins) of the FLEX 6000 family (vs EPF6010ATC100-3)
- Production-grade (-3) speed bin, fully characterized by Intel (vs Engineering sample / unbin'ed parts)
Notas de projeto
The EPF6010ATC144-3 requires a clean 3.3 V core supply on VCCINT and separately-isolated VCCIO bank supplies (one per I/O bank). Place 100 nF X7R ceramic decoupling capacitors adjacent to every VCCINT and VCCIO pin, and add bulk 10 µF tantalum or polymer capacitors near the package. Power-on sequencing should ensure VCCINT ramps before VCCIO to avoid I/O latch-up; if sequencing is impossible, add a small Schottky diode from VCCINT to VCCIO. The 0.42 µm CMOS process draws significant inrush current during SRAM configuration — budget for at least 200 mA peak on VCCINT during config.
The 144-pin TQFP has a 0.5 mm lead pitch requiring careful PCB layout: keep solder mask slivers at least 0.2 mm wide, use ENIG or immersion tin surface finish for fine-pitch assembly, and route all signals on inner layers beneath the package to escape the fine-pitch perimeter pins. Thermal pad design is not required for this part (no exposed pad), but adequate copper pour around the package reduces thermal resistance and improves power dissipation. Reflow profile should follow J-STD-020 MSL classification printed on the reel label.
Three common pitfalls when designing with the EPF6010ATC144-3: (1) Forgetting to strap MSEL0/MSEL1 for the desired configuration mode — leaving them floating yields unpredictable behavior; (2) Not providing a valid configuration source at power-up — without an EPC EPROM or JTAG programmer, the device never completes configuration and CONF_DONE stays low; (3) Driving JTAG signals (TDI, TMS, TCK) with non-3.3 V logic — the JTAG port shares the same 3.3 V supply rail as the core, and 5 V signals will damage the inputs. Always include a JTAG header for boundary-scan test and in-system programming access.
Informações de conformidade
RoHS, REACH, and AEC-Q100 compliance for the EPF6010ATC144-3 were not present in the verified web data and are marked unknown. The 'N' suffix variants (EPF6010ATC144-3N) are Pb-free per Altera/Intel naming convention, but full material declaration must be obtained from the manufacturer. This part is NOT AEC-Q100 qualified and is not recommended for new automotive designs.