EPF6024AQC208-1N - FLEX 6000 FPGA 24K Gates 208-PQFP | Intel
MPN: EPF6024AQC208-1N ✗ انتهى عمره الإنتاجيEPF6024AQC208-1N نظرة عامة
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing — hence "field-programmable". FPGAs sit at the top of the programmable logic hierarchy: programmable logic devices (PLDs) -> complex PLDs (CPLDs) -> FPGAs -> SoC FPGAs. The FLEX 6000 family in particular was an early 1990s low-cost, high-volume SRAM-LUT architecture targeting glue logic, bus interface, and state-machine replacement, allowing fast design changes during prototyping without the NRE of an ASIC.
Key features of the EPF6024AQC208-1N include 196 LABs arranged across the chip fabric, 171 user I/O pins distributed on the periphery, JTAG-compliant boundary-scan test support (IEEE 1149.1), and SRAM-based configuration cells that must be reloaded at every power-up from an external configuration PROM or controller. The -1 speed grade is the slowest of the FLEX 6000 grade options (-1, -2, -3), trading timing margin for cost savings.
Architecturally the FLEX 6000 family uses a four-input Look-Up Table (LUT) per Logic Element, embedded array blocks, and continuous FastTrack interconnect. This LUT-based fabric is more flexible than older PAL/PLA gate-array hybrids and supports fully synchronous design via per-LAB carry chains and dedicated clock trees. The device is configured via the Altera MAX+PLUS II or Quartus development flows.
Typical applications include industrial control glue logic, telecommunications interface bridges, PCI bus controllers, prototyping platforms for ASIC emulation, and replacement of multiple discrete 74-series TTL packages on legacy boards. The wide 171-user-I/O count suits parallel bus aggregation tasks.
When designing with this part, remember the FLEX 6000 family is now obsolete (NRND/EOL) and current designs should consider Cyclone IV/V or MAX II CPLDs from Intel for new builds. Existing designs should keep spares on hand or migrate to the pin-compatible EPF6024AQC208-2 or -3 speed grades if timing closure is loose.
This page synthesizes distributor stock indicators, drop-in speed-grade alternatives, and 208-PQFP PCB layout guidance not found in the original FLEX 6000 datasheet — practical intelligence for engineers maintaining legacy designs in 2026.
بدائل مباشرة لـ EPF6024AQC208-1N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF6024AQC208-1N (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Package, Speed Grade, Process Technology, Device Type.
EPF6024AQC208-1
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024AQC208-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ABC256-2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024AQC208-1N الحدود القصوى والخصائص الكهربائية
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Typical Gates | 24,000 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 171 |
| Number of I/O Pins | 171 |
| العلبة | 208-BFQFP (Plastic Quad Flat Pack, PQFP) |
| Package Pin Count | 208 |
| نوع التركيب | Surface Mount |
| جهد التغذية | 3.3 V |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 200 MHz |
| درجة حرارة التشغيل | 0 °C to +85 °C (TJ) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Speed Grade | -1 (slowest) |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Programming Tools | Altera MAX+PLUS II / Quartus |
| Part Status | Obsolete |
دليل تكوين أطراف EPF6024AQC208-1N 208
تكوين الأطراف لـ EPF6024AQC208-1N (حزمة 208). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EPF6024AQC208-1N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EPF6024AQC208-1N مناسب لـ 6 التطبيقs: Industrial Glue Logic Replacement, PCI Bus Interface Bridge, ASIC Emulation Platform, Telecommunications Interface Bridge, Legacy 74-series TTL Replacement, Prototyping & Design Verification Platform.
Industrial Glue Logic Replacement
The EPF6024AQC208-1N replaces banks of 74-series TTL/MSI logic on legacy industrial control boards. With 1,960 logic elements and 196 LABs, the FLEX 6000 fabric can absorb dozens of discrete AND/OR/latch/decoder functions into one device. The 171 user I/O count comfortably aggregates 24-32 bit parallel buses plus address decoding logic. Quartus/MAX+PLUS II synthesis makes timing closure straightforward at industrial 50-100 MHz clocks. Note: for new industrial designs, choose Intel Cyclone IV or MAX II for continued supply and lower BOM cost.
موصى به
PCI Bus Interface Bridge
The EPF6024AQC208-1N is well-suited as a 33 MHz PCI 2.0 target/master bridge on legacy ISA/PCI motherboards. Its 4-input LUT fabric, dedicated carry chains, and 171 I/Os comfortably absorb the 49-signal PCI bus plus bus-arbitration glue and target-state registers. The 0.42 µm CMOS process supports 3.3 V PCI signaling directly without level translation. For 66 MHz PCI, choose the -3 speed grade instead. Modern replacement: Intel Cyclone IV EP4CE22F17 offers PCI IP cores and wider supply.
موصى به
ASIC Emulation Platform
Use the EPF6024AQC208-1N as a multi-chip ASIC emulator for designs targeting 10K-20K gate equivalents. Designers partition the ASIC into the 24K-gate FLEX 6000 fabric and iterate HDL quickly in MAX+PLUS II before committing to mask. The 200 MHz internal Fmax supports pipelined datapath emulation. Re-programmability makes it ideal for FPGA prototyping boards. Modern alternatives like Cyclone IV GX provide higher logic density and embedded transceivers.
موصى به
Telecommunications Interface Bridge
The EPF6024AQC208-1N bridges E1/T1 framers, HDLC controllers, and UART chains on telecom line cards. Its SRAM-based fabric supports in-system reconfiguration for protocol upgrades, while 171 I/Os aggregate multiple serial data streams and status LEDs. JTAG boundary-scan (IEEE 1149.1) simplifies board-level test. For new telecom designs, choose Intel Cyclone V with hard PCIe and transceivers.
موصى به
Legacy 74-series TTL Replacement
Use the EPF6024AQC208-1N to replace 20-40 pieces of 74LS/74F/74HC logic on maintenance-grade legacy boards. One FLEX 6000 device replaces an entire inventory of AND/OR/flip-flop/decoder packages, reducing BOM and improving reliability. The 208-PQFP surface-mount footprint fits standard JEDEC land patterns. Engineers must verify operating temperature (0 °C to +85 °C) and ensure 3.3 V supply is available; level shifters may be needed for 5 V legacy logic.
موصى به
Prototyping & Design Verification Platform
The EPF6024AQC208-1N serves as a re-programmable verification platform during ASIC development. Designers can download revised HDL each morning and verify in-system against real I/O before taping out. The 24K-gate capacity handles substantial state machines, FIFOs, and datapaths. SRAM configuration means a bad bit-stream simply reloads — no permanent damage. The -1 speed grade trades Fmax for cost; upgrade to -3 if your prototype exceeds 100 MHz.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF6024AQC208-1N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF6024AQC208-1 | EPF6024AQC208-3N | EPF6024ABC256-2N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) | 256-BGA |
| Logic Elements / Cells | 1,960 | 1,960 | 1,960 | 1,960 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 |
| Speed Grade | -1 (slowest) | -1 | -3 (fastest) | -2 (mid) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Slowest speed grade (lowest cost) of FLEX 6000 EPF6024 family (مقابلEPF6024AQC208-3N)
- PQFP package offers easier hand-prototyping than BGA (مقابلEPF6024ABC256-2N (256-BGA))
- Established FLEX 6000 design tool flow (مقابلNewer Intel FPGA families (Cyclone, MAX II))
ملاحظات التصميم
The EPF6024AQC208-1N is a SRAM-based FPGA — configuration is volatile and must be reloaded from an external EPC configuration PROM, a microcontroller, or a download cable at every power-up. Do not design a board that depends on the FPGA retaining state through power cycle without an external configuration source. Adding a JTAG header is strongly recommended for in-system re-programming during prototyping.
Place the EPF6024AQC208-1N's dedicated CONFIG_DONE, nSTATUS, nCONFIG, and DCLK pins with short traces to the configuration EPROM. Add 0.1 µF decoupling capacitors on every VCCIO/VCCINT pin pair, plus bulk 10-100 µF tantalums near the package. The 208-PQFP footprint requires fine-pitch surface-mount soldering; reflow profile must keep peak below 250 °C and follow JEDEC J-STD-020 MSL guidance for the device's moisture sensitivity level.
Operating temperature range for the EPF6024AQC208-1N is 0 °C to +85 °C commercial grade only. Industrial grade is not offered for the FLEX 6000 family — for industrial temperature (-40 °C to +85 °C) you must migrate to a different Intel FPGA family (Cyclone IV or newer). Always confirm ambient temperature before deploying this part in outdoor or industrial enclosures.
معلومات الامتثال
RoHS/REACH status not explicitly stated in the verified web data. The 'N' suffix in EPF6024AQC208-1N typically denotes lead-free finish per industry ordering convention. AEC-Q100 is not applicable — FPGAs are not AEC-Q100 qualified at the chip level; qualification happens at the system module level.
