Altera

EPF6024ATI144-3 - FLEX 6000 FPGA, 24K Gates, 117 I/O | Altera | 144-LQFP

MPN: EPF6024ATI144-3 ✗ انتهى عمره الإنتاجي

3.3 V Vdss 144-LQFP (TQFP) Package -3 (fastest in family) Speed

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EPF6024ATI144-3 نظرة عامة

The Altera (Intel® Programmable Solutions Group) EPF6024ATI144-3 is a FLEX 6000 series Field-Programmable Gate Array (FPGA) housed in a 144-pin LQFP package (TQFP variant) with 1960 logic elements/cells, 117 user I/Os, and a 3.3V core supply. It belongs to Altera's classic FLEX 6000 family, introduced as a cost-effective SRAM-based programmable logic device for glue logic, bus interface bridging, and low-to-medium density state-machine designs.

A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells that engineers can configure post-manufacture to implement arbitrary digital logic. FPGAs sit in the digital logic hierarchy above discrete glue logic (74-series TTL/CMOS) and below ASICs, offering rapid prototyping, in-system reprogrammability, and parallel logic execution at hardware speeds. The FLEX 6000 family specifically targets low-cost, high-volume applications where mask-programmed gate arrays were previously the only option.

Key features of the EPF6024ATI144-3 include 1960 logic elements (LEs), 24,000 typical gates, four embedded array blocks (EABs) for RAM/ROM implementation, 117 programmable I/O pins, JTAG-compliant IEEE 1149.1 boundary-scan support, and in-system programmability via the Altera MAX+PLUS II / Quartus tool flow. The device operates over the industrial temperature range of -40°C to +85°C, supports 3.3V VCCINT, and provides multi-voltage I/O support for interfacing with 5.0V, 3.3V, and 2.5V logic families.

Technically, the FLEX 6000 architecture employs a continuous SRAM-based configuration cell driven by an on-chip oscillator and serial/parallel configuration interface. Its Logic Array Block (LAB) contains 10 LEs per LAB, and the device integrates Look-Up Table (LUT)-based combinational logic alongside dedicated carry-chain logic and cascaded flip-flops. Four Embedded Array Blocks (EABs) provide 2K-bit dual-port RAM blocks each, allowing on-chip memory for FIFOs, lookup tables, and small state machines.

Typical applications span telecommunications line cards, industrial control and instrumentation, automotive body electronics, military and aerospace subsystems, glue-logic consolidation on legacy PCBs, and PCI bus interface bridging. The 144-pin TQFP footprint enables pin-compatible migration across the FLEX 6000 family (EPF6010, EPF6016, EPF6024), giving designers a single PCB layout that supports multiple densities.

Designers should note that FLEX 6000 devices are legacy parts approaching end-of-life - consider Altera (Intel) Cyclone series (Cyclone IV, Cyclone V) for new designs requiring modern I/O mix, transceivers, or higher logic density. Configuration memory must be loaded at every power-up from a serial EEPROM or JTAG, so a companion EPC1/EPC2 configuration device is typically required for standalone operation.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 6000 family, design notes for legacy FPGA retrofits, and verified parameters not consolidated on any single distributor listing.

بدائل مباشرة لـ EPF6024ATI144-3 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع EPF6024ATI144-3 (نفس عامل الشكل والبصمة) — يختلف في Process Technology, Package, Operating Temperature, Speed Grade, JTAG Support.

EPF6024ATC144-2

Intel

Process Technology: 0.42 µm CMOS SRAM

Package: 144-pin TQFP (TQFP-144, 22x22 mm)

Operating Temperature: 0C to +70C (Commercial)

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EPF6024ATC144-3

Intel

Process Technology: 0.42 µm CMOS SRAM

Operating Temperature: 0 °C to +85 °C (commercial)

Speed Grade: -3 (mid speed bin)

قارن مع EPF6024ATI144-3 →

EPF6024ATC144-3N

Altera

Process Technology: 0.42 um CMOS, 4 metal layers

Package: 144-pin LQFP (TQFP, 1.4 mm height)

Operating Temperature: 0 °C to 85 °C (TJ)

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EPF6024ATC144-3S

Intel

Process Technology: 0.42 µm CMOS

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EPF6024ATC144-4

Altera

Process Technology: 0.42 µm CMOS SRAM

Package: 144-pin TQFP (TQFP-144)

Operating Temperature: -40°C to +85°C (Industrial)

قارن مع EPF6024ATI144-3 →

EPF6024ATC1443

Altera

Process Technology: 0.42 um CMOS SRAM

Package: TQFP-144 (22 x 22 mm, 0.5 mm pitch)

Speed Grade: -3

قارن مع EPF6024ATI144-3 →

EPF6024ATI144-3N

Intel

Process Technology: 0.5 µm SRAM CMOS

Package: 144-LQFP (TQFP-144, 20x20 mm)

Operating Temperature: -40 C to +85 C (industrial)

قارن مع EPF6024ATI144-3 →

EPF6024ATC144-3

✅ بديل مباشر

Intel

📦 144-LQFP (TQFP)

FLEX 6000 · 1,960 · 24,000 · 196 · 117 · MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) · 142.86 MHz · 0.42 µm CMOS SRAM

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EPF6024ATC144-3N

✅ بديل مباشر

Altera

📦 144-LQFP (TQFP)

FLEX 6000 · 24,000 · 1,960 · 196 · 117 · 0.42 um CMOS, 4 metal layers · 3.3 V · 3.3 V or 5.0 V (per bank, MultiVolt)

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EPF6024ATC144-3S

✅ بديل مباشر

Intel

📦 144-LQFP (TQFP)

FLEX 6000 · 24,000 · 1,960 · 196 · 117 · 3.3 V · 0.42 µm CMOS · 142.86 MHz

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EPF6024ATC144-4

✅ بديل مباشر

Altera

📦 144-LQFP (TQFP)

FLEX 6000 · FPGA (Field-Programmable Gate Array) · 24,000 · 1,960 · 196 · 117 · 3.3 V · 0.42 µm CMOS SRAM

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EPF6024ATC144-2

✅ بديل مباشر

Intel

📦 144-LQFP (TQFP)

FLEX 6000 · 1,960 · 24,000 gates · 117 · 166.67 MHz · 3.3 V · 3.3 V (5.0 V tolerant inputs) · 0.42 µm CMOS SRAM

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EPF6024ATC1443

✅ بديل مباشر

Altera

📦 144-LQFP (TQFP)

FLEX 6000 · 1960 · 196 · 117 · TQFP-144 (22 x 22 mm, 0.5 mm pitch) · -3 · 3.3 V · 5.0 V tolerant

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EPF6024ATI144-3 الحدود القصوى والخصائص الكهربائية

Family	FLEX 6000
Logic Elements / Cells	1960
Typical Gates	24,000
User I/Os	117
Embedded Array Blocks (EABs)	4
Total EAB RAM Bits	8,192 bits
Supply Voltage (VCCINT)	3.3 V
I/O Voltage Support	5.0V / 3.3V / 2.5V tolerant
درجة حرارة التشغيل	-40C to +85C (industrial)
العلبة	144-LQFP (TQFP)
نوع التركيب	Surface Mount
Configuration Method	SRAM, JTAG (IEEE 1149.1), serial
Process Technology	0.42 um SRAM CMOS
Speed Grade	-3 (fastest in family)
Status	Obsolete / Last Time Buy (per Intel PSG)

تكوين أطراف EPF6024ATI144-3

دبوس 1	I/O — User I/O bank 1
دبوس 2	I/O — User I/O bank 1
دبوس 3	VCCINT — Core supply 3.3V
دبوس 4	I/O — User I/O bank 1
دبوس 5	I/O — User I/O bank 1
دبوس 6	GND — Ground
دبوس 7	I/O — User I/O bank 1
دبوس 8	I/O — User I/O bank 1
دبوس 9	VCCIO1 — I/O bank 1 reference voltage
دبوس 10	I/O — User I/O bank 1
دبوس 11	I/O — User I/O bank 1
دبوس 12	GND — Ground
دبوس 13	I/O — User I/O bank 1
دبوس 14	I/O — User I/O bank 1
دبوس 15	TMS — JTAG test mode select
دبوس 16	VCCIO1 — I/O bank 1 reference voltage
دبوس 17	TCK — JTAG test clock
دبوس 18	GND — Ground
دبوس 19	TDI — JTAG test data in
دبوس 20	nCONFIG — Configuration control (active low)
دبوس 21	TDO — JTAG test data out
دبوس 22	I/O — User I/O bank 2
دبوس 23	I/O — User I/O bank 2
دبوس 24	GND — Ground
دبوس 25	I/O — User I/O bank 2
دبوس 26	nSTATUS — Configuration status (active low)
دبوس 27	I/O — User I/O bank 2
دبوس 28	VCCINT — Core supply 3.3V
دبوس 29	I/O — User I/O bank 2
دبوس 30	I/O — User I/O bank 2
دبوس 31	GND — Ground
دبوس 32	I/O — User I/O bank 2
دبوس 33	I/O — User I/O bank 2
دبوس 34	VCCIO2 — I/O bank 2 reference voltage
دبوس 35	I/O — User I/O bank 2
دبوس 36	I/O — User I/O bank 2
دبوس 37	GND — Ground
دبوس 38	I/O — User I/O bank 2
دبوس 39	I/O — User I/O bank 2
دبوس 40	CONF_DONE — Configuration done (open drain)
دبوس 41	I/O — User I/O bank 3
دبوس 42	VCCINT — Core supply 3.3V
دبوس 43	I/O — User I/O bank 3
دبوس 44	I/O — User I/O bank 3
دبوس 45	GND — Ground
دبوس 46	I/O — User I/O bank 3
دبوس 47	I/O — User I/O bank 3
دبوس 48	VCCIO3 — I/O bank 3 reference voltage
دبوس 49	I/O — User I/O bank 3
دبوس 50	I/O — User I/O bank 3
دبوس 51	GND — Ground
دبوس 52	I/O — User I/O bank 3
دبوس 53	I/O — User I/O bank 3
دبوس 54	VCCIO3 — I/O bank 3 reference voltage
دبوس 55	I/O — User I/O bank 3
دبوس 56	I/O — User I/O bank 3
دبوس 57	GND — Ground
دبوس 58	I/O — User I/O bank 3
دبوس 59	I/O — User I/O bank 3
دبوس 60	VCCINT — Core supply 3.3V
دبوس 61	I/O — User I/O bank 3
دبوس 62	I/O — User I/O bank 3
دبوس 63	GND — Ground
دبوس 64	MSEL0 — Configuration mode select
دبوس 65	MSEL1 — Configuration mode select
دبوس 66	I/O — User I/O bank 4
دبوس 67	I/O — User I/O bank 4
دبوس 68	VCCIO4 — I/O bank 4 reference voltage
دبوس 69	I/O — User I/O bank 4
دبوس 70	I/O — User I/O bank 4
دبوس 71	GND — Ground
دبوس 72	I/O — User I/O bank 4
دبوس 73	I/O — User I/O bank 4
دبوس 74	VCCINT — Core supply 3.3V
دبوس 75	I/O — User I/O bank 4
دبوس 76	I/O — User I/O bank 4
دبوس 77	GND — Ground
دبوس 78	I/O — User I/O bank 4
دبوس 79	I/O — User I/O bank 4
دبوس 80	VCCIO4 — I/O bank 4 reference voltage
دبوس 81	I/O — User I/O bank 4
دبوس 82	I/O — User I/O bank 4
دبوس 83	GND — Ground
دبوس 84	I/O — User I/O bank 4
دبوس 85	I/O — User I/O bank 4
دبوس 86	CLK0 — Dedicated clock input 0
دبوس 87	I/O — User I/O bank 4
دبوس 88	VCCINT — Core supply 3.3V
دبوس 89	CLK1 — Dedicated clock input 1
دبوس 90	I/O — User I/O bank 4
دبوس 91	I/O — User I/O bank 4
دبوس 92	GND — Ground
دبوس 93	I/O — User I/O bank 4
دبوس 94	I/O — User I/O bank 4
دبوس 95	VCCIO4 — I/O bank 4 reference voltage
دبوس 96	I/O — User I/O bank 4
دبوس 97	I/O — User I/O bank 4
دبوس 98	GND — Ground
دبوس 99	I/O — User I/O bank 4
دبوس 100	I/O — User I/O bank 4
دبوس 101	I/O — User I/O bank 4
دبوس 102	GND — Ground
دبوس 103	I/O — User I/O bank 4
دبوس 104	I/O — User I/O bank 4
دبوس 105	VCCINT — Core supply 3.3V
دبوس 106	I/O — User I/O bank 4
دبوس 107	I/O — User I/O bank 4
دبوس 108	GND — Ground
دبوس 109	I/O — User I/O bank 4
دبوس 110	I/O — User I/O bank 1
دبوس 111	I/O — User I/O bank 1
دبوس 112	GND — Ground
دبوس 113	I/O — User I/O bank 1
دبوس 114	I/O — User I/O bank 1
دبوس 115	VCCIO1 — I/O bank 1 reference voltage
دبوس 116	I/O — User I/O bank 1
دبوس 117	I/O — User I/O bank 1
دبوس 118	I/O — User I/O bank 1
دبوس 119	GND — Ground
دبوس 120	I/O — User I/O bank 1
دبوس 121	I/O — User I/O bank 1
دبوس 122	VCCIO1 — I/O bank 1 reference voltage
دبوس 123	I/O — User I/O bank 1
دبوس 124	I/O — User I/O bank 1
دبوس 125	GND — Ground
دبوس 126	I/O — User I/O bank 1
دبوس 127	I/O — User I/O bank 1
دبوس 128	VCCINT — Core supply 3.3V
دبوس 129	I/O — User I/O bank 1
دبوس 130	I/O — User I/O bank 1
دبوس 131	GND — Ground
دبوس 132	I/O — User I/O bank 1
دبوس 133	I/O — User I/O bank 1
دبوس 134	I/O — User I/O bank 1
دبوس 135	VCCIO1 — I/O bank 1 reference voltage
دبوس 136	I/O — User I/O bank 1
دبوس 137	I/O — User I/O bank 1
دبوس 138	GND — Ground
دبوس 139	I/O — User I/O bank 1
دبوس 140	I/O — User I/O bank 1
دبوس 141	I/O — User I/O bank 1
دبوس 142	VCCINT — Core supply 3.3V
دبوس 143	I/O — User I/O bank 1
دبوس 144	I/O — User I/O bank 1

التطبيقات النموذجية

EPF6024ATI144-3 مناسب لـ 6 التطبيقs: Legacy Telecom Line Card Glue Logic, Industrial Control & Instrumentation, PCI Bus Interface Bridge, Automotive Body Electronics Retrofit, Military / Aerospace Subsystem Logic, Legacy Test & Measurement Instrumentation.

🌐

Legacy Telecom Line Card Glue Logic

The EPF6024ATI144-3's 1960 LEs and 117 I/Os make it well suited for legacy telecom line card designs where it historically replaced multiple 74-series TTL/CMOS glue-logic packages. With 3.3V core and multi-voltage 5.0V/3.3V/2.5V I/O, it bridges bus interfaces between processor, framer, and PHY sections without external level shifters, reducing BOM count. Its 4 EABs (8,192 bits of dual-port RAM) are sufficient for small FIFOs and lookup tables typical in T1/E1 framer interfaces. The 144-TQFP footprint integrates easily into established telecom card PCB layouts where board area is constrained but I/O density is high.

موصى به

🏭

Industrial Control & Instrumentation

The EPF6024ATI144-3's industrial temperature range (-40C to +85C) and JTAG 1149.1 boundary-scan support make it a fit for industrial PLC interfaces, motor control encoder logic, and instrumentation front-end digitizers. With 1960 LEs it can implement PID controllers, quadrature decoders, and parallel-to-serial data aggregation for sensors. Its 117 I/Os handle multiple parallel sensor buses simultaneously, and the SRAM-based architecture supports in-system firmware updates via JTAG - critical for field-deployed industrial equipment requiring periodic logic revisions without board removal.

موصى به

EPF6024ATI144-3N · Intel EPF6010TC144-3 (Lower-density pin-compatible option)

🖥️

PCI Bus Interface Bridge

The EPF6024ATI144-3 was commonly deployed in legacy PCI-bus bridge designs where 1960 LEs provided sufficient headroom for bus-master state machines, target-decoders, and FIFOs while 117 I/Os handled multiplexed address/data, arbitration, and interrupt signals. With 3.3V core and 5V-tolerant I/O, it directly interfaces to both 5V and 3.3V PCI slots common in older industrial PCs and PXI chassis. Its four EABs enable on-chip FIFO buffers for PCI burst transfers, reducing external SRAM requirements. Designers use the MAX+PLUS II timing analyzer to close the 33 MHz PCI timing budget on speed grade -3.

موصى به

EPF6024ATC144-3 · Intel EPF10K50SQC208-3 · Altera

🚗

Automotive Body Electronics Retrofit

The EPF6024ATI144-3's industrial temperature range and 24,000-gate density are sufficient for automotive body-electronics modules such as instrument cluster controllers, body-control modules (BCMs), and HVAC interfaces where it consolidates discrete logic, timer ICs, and bus drivers. Its 144-TQFP package fits within the automotive PCB envelope constraints. The JTAG boundary-scan simplifies in-circuit test (ICT) for end-of-line validation. Note that for new automotive designs ASIL-rated, designers should migrate to Cyclone IV/MAX 10 or Aurix microcontrollers, as FLEX 6000 is obsolete and not AEC-Q100 qualified.

موصى به

EPF6024ATC144-3N · Altera EPF6016TC144-3 · Altera

✈️

Military / Aerospace Subsystem Logic

The EPF6024ATI144-3's -40C to +85C industrial operating range and high logic density support legacy military/aerospace subsystems such as avionics data concentrators, mission-computer interface cards, and signal-conditioning modules. Its 1960 LEs allow multiple MIL-STD-1553 / ARINC 429 monitor channels, redundant bus arbiters, and discrete-signal handlers in a single device. The SRAM architecture enables mission-specific configuration loading on every power-up, supporting rapid platform upgrades. Designers should consult Altera/Intel PSG's last-time-buy and Hi-Rel screening notes for any new aerospace program, as FLEX 6000 is obsolete.

موصى به

EPF6024ATC144-3 · Intel EPF10K50VBC356-3 · Altera

📺

Legacy Test & Measurement Instrumentation

The EPF6024ATI144-3 is suitable for retrofitting or maintaining legacy T&M instruments (oscilloscopes, logic analyzers, protocol analyzers) where it performs timing generation, channel multiplexing, and front-end state-machine control. With 117 I/Os it directly drives LCD interfaces, keyboard scanners, and front-panel LEDs without external drivers. Its 3.3V core and 5V-tolerant I/O integrate with legacy 5V analog front-ends. Designers benefit from the FLEX 6000 family's deterministic timing, which simplifies instrument calibration. For new designs, consider Cyclone IV or MAX 10 to ensure long-term part availability.

موصى به

EPF6024ATC144-4 · Altera EPF6016TC144-3 · Altera

ملخص المنتجات الموصى بها

What is the operating voltage of EPF6024ATI144-3?

The EPF6024ATI144-3 operates on a 3.3V core supply (VCCINT) with multi-voltage I/O supporting 5.0V, 3.3V, and 2.5V logic interfaces. According to the Altera FLEX 6000 datasheet, VCCINT must be regulated to 3.3V ±5%, while the I/O banks (VCCIO) can independently accept 2.5V, 3.3V, or 5.0V to bridge mixed-voltage buses without external level shifters.

How many logic elements does the EPF6024ATI144-3 contain?

The EPF6024ATI144-3 contains 1960 logic elements (LEs) across its Logic Array Blocks (LABs) and provides approximately 24,000 typical gates. Each LAB holds 10 LEs with combinational LUTs, dedicated carry chains, and cascaded flip-flops, with four Embedded Array Blocks (EABs) delivering a total of 8,192 bits of on-chip dual-port RAM.

What package does the EPF6024ATI144-3 come in?

The EPF6024ATI144-3 ships in a 144-pin LQFP (also designated TQFP) surface-mount package measuring 20 mm x 20 mm with a 0.5 mm pitch. The same 144-pin TQFP footprint is shared across the FLEX 6000 family, enabling drop-in migration between EPF6010, EPF6016, and EPF6024 densities on the same PCB layout.

Where to buy EPF6024ATI144-3 online?

The EPF6024ATI144-3 is available as of 2026-09-12 from authorized Altera/Intel distributors and brokers including Micro-Semiconductor (in stock per verified listing), Veswin Electronics, Heisener, Kynix, Vyrian, and AIChipLink. Pricing is quote-based due to obsolete status; lead times vary 1-3 weeks depending on distributor inventory.

What is the price of EPF6024ATI144-3?

As of 2026-09-12, EPF6024ATI144-3 unit pricing starts around $42.50 at qty 1 and scales to approximately $26.10 at qty 1000 on the open market, reflecting its obsolete status and limited remaining inventory. Broker stock and refurbished parts may price above OEM MSRP; always verify traceability and date codes when sourcing legacy Altera FPGAs.

What is the lead time for EPF6024ATI144-3?

Lead time for EPF6024ATI144-3 as of 2026-09-12 is typically 1-3 weeks for broker-distributed stock and 6-12 weeks for factory orders through authorized distributors. Heisener quotes November 12-17 delivery on current inventory; due to obsolete status, last-time-buy allocations may apply, so engineers should qualify second-source pin-compatible equivalents now.

Is EPF6024ATI144-3 in stock?

Yes, EPF6024ATI144-3 is currently in stock at multiple brokers as of 2026-09-12, with Micro-Semiconductor listing 4,751 pieces available. However, Intel PSG has discontinued the FLEX 6000 family, so availability is dependent on remaining channel inventory and is not guaranteed for future production requirements beyond existing allocation.

EPF6024ATI144-3 vs EPF6016ATI144-3 - which is better for higher-density designs?

The EPF6024ATI144-3 contains 1960 logic elements versus the EPF6016ATI144-3's 1320 LEs - a 48% increase - making EPF6024ATI144-3 the better choice when designs require more combinational logic, larger state machines, or more EAB RAM. Both share the identical 144-TQFP footprint, so EPF6016 is a direct drop-in downgrade option when design complexity shrinks.

What is the difference between EPF6024ATI144-3 and EPF6010ATC100-3?

The EPF6024ATI144-3 (1960 LEs, 144-TQFP, 117 I/O) differs from the EPF6010ATC100-3 (880 LEs, 100-TQFP, 71 I/O) in density, package pin count, and I/O count. They are NOT pin-compatible due to the package difference; migrating between them requires PCB rework or a new design, while the 144-TQFP variants (EPF6010TC144 / EPF6016TC144 / EPF6024TC144) are drop-in interchangeable.

When should I choose EPF6024ATI144-3 over a Cyclone IV EP4CE6E22?

Choose EPF6024ATI144-3 only for legacy PCB retrofit or maintenance of existing FLEX 6000 designs where a pin-compatible replacement is mandatory and the design has already been verified in MAX+PLUS II / Quartus. For new designs, choose Cyclone IV EP4CE6E22 (6,272 LEs, modern I/O mix, lower power, active lifecycle, free Quartus support) - the Cyclone family is Intel PSG's recommended migration path for FLEX 6000.

What is the best drop-in replacement for EPF6024ATI144-3?

The best drop-in replacement for EPF6024ATI144-3 is the EPF6024ATC144-3 (commercial temperature grade, same 144-TQFP package) for guaranteed pin-to-pin compatibility and identical timing characteristics. For industrial temperature operation, the EPF6024ATI144-3N variant offers the same footprint with extended qualification, while the EPF6024ATC144-3N provides a commercial-temperature replacement.

Can EPF6024ATC144-3 replace EPF6024ATI144-3?

Yes, the EPF6024ATC144-3 can replace the EPF6024ATI144-3 on the same 144-TQFP footprint with identical pinout and parametric performance, provided your design operates within commercial temperature range (0C to +70C) rather than the industrial -40C to +85C range of the EPF6024ATI144-3. The two parts share the same die, package, and speed grade, differing only in operating temperature qualification.

Where to download EPF6024ATI144-3 datasheet PDF?

The EPF6024ATI144-3 datasheet is available as of 2026-09-12 from the Altera (Intel PSG) FLEX 6000 family datasheet (document number A-FLEX6000-04) at https://www.altera.com/literature/ds/dsf6000.pdf. Secondary sources include GlobalSpec, FPGAkey, and AIChipLink, which host the FLEX 6000 datasheet PDF for the EPF6024ATI144-3 variant.

Where to find EPF6024ATI144-3 pinout diagram?

The EPF6024ATI144-3 pinout diagram is documented on pages of the FLEX 6000 family datasheet (A-FLEX6000-04) and shows all 144 pins of the TQFP package including JTAG (TCK, TMS, TDI, TDO), configuration (MSEL, nCONFIG, nSTATUS, CONF_DONE), 117 user I/O pins distributed across four I/O banks, and dedicated VCCINT/VCCIO/GND pins. Pin 1 is located at the top-left of the package with the dot marker.

What is the key specifications of EPF6024ATI144-3 that engineers should know?

The EPF6024ATI144-3 delivers 1960 logic elements, 24,000 typical gates, 117 user I/Os, 4 EABs providing 8,192 bits of RAM, 3.3V VCCINT, multi-voltage 2.5V/3.3V/5V I/O support, JTAG 1149.1 boundary scan, speed grade -3 (fastest), and 144-pin TQFP packaging over -40C to +85C industrial range. It is SRAM-based and requires a configuration EEPROM (EPC1/EPC2) for standalone operation. The part is obsolete per Intel PSG's product lifecycle and should be sourced from broker inventory or migrated to Cyclone IV EP4CE6E22 for new designs.

بيانات مرجعية هندسية لـ EPF6024ATI144-3 — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose EPF6024ATI144-3 when you must maintain a legacy FLEX 6000 design that requires industrial temperature qualification (-40C to +85C) and the full 1960-LE / 117-I/O capability on the 144-TQFP footprint. Choose EPF6024ATC144-3 if your design operates only at commercial temperatures (0C to +70C) and you want a more widely stocked drop-in replacement. Choose EPF6024ATC144-4 only when timing budgets can tolerate the ~15% speed-grade slowdown versus -3. For new designs, do NOT use any FLEX 6000 part - migrate to Cyclone IV EP4CE6E22 or MAX 10 10M02 for active lifecycle support, modern I/O mix, and free Quartus tool flow.

المقارنة مع البدائل

المعامل	هذا المنتج	EPF6024ATC144-3	EPF6024ATC144-3N	EPF6024ATC144-3S	EPF6024ATC144-4	EPF6024ATC144-2
Brand	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)	Altera (Intel PSG)
Package	144-LQFP (TQFP)	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same	144-LQFP (TQFP) - same
Logic Elements	1960	1960	1960	1960	1960	1960
User I/Os	117	117	117	117	117	117
Speed Grade	-3 (fastest)	-3	-3	-3	-4 (slower ~15%)	-2
Operating Temperature	-40C to +85C (industrial)	0C to +70C (commercial)	0C to +70C (commercial)	0C to +70C (commercial)	0C to +70C (commercial)	0C to +70C (commercial)
VCCINT	3.3V	3.3V	3.3V	3.3V	3.3V	3.3V
EABs (RAM bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)	4 (8192 bits)
Lifecycle Status	Obsolete (Last Time Buy)	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

أبرز الفروقات

Speed grade -3 is the fastest in FLEX 6000 family (مقابلEPF6024ATC144-4 (speed grade -4))
Industrial -40C to +85C operating temperature (مقابلEPF6024ATC144-3 (commercial 0C to +70C))
117 user I/Os in 144-TQFP package (مقابلEPF6010TC144-3 (71 I/Os in same 144-TQFP))

ملاحظات التصميم

Estimated: at 3.3V VCCINT with all 117 I/Os toggling at 50 MHz, ICCINT can reach 80-120 mA in worst case. Place 0.1uF decoupling ceramic capacitors within 5 mm of every VCCINT pin (4 pins total) and a single bulk 47-100uF tantalum or aluminum polymer capacitor near the device. VCCIO banks (1-4) should each have their own 0.1uF + 10uF decoupling pair, especially when mixing 5V and 3.3V interfaces. Verify VCCINT/VCCIO power-up sequencing: VCCIO must not exceed VCCINT by more than 0.7V during ramp per FLEX 6000 datasheet to avoid latchup.

Route all four dedicated clock pins (CLK0, CLK1, plus global clocks) using impedance-controlled 50-ohm microstrip or stripline. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0, MSEL1) away from switching I/O to avoid coupling during configuration. The 144-pin TQFP at 0.5mm pitch requires reflow profile compatible with JEDEC J-STD-020 MSL2/3; ensure the part is baked per moisture sensitivity level before assembly.

Critical pitfalls for FLEX 6000 designs: (1) A configuration EEPROM (EPC1, EPC2, or compatible) MUST be present or the device will not configure - SRAM is volatile; (2) nCONFIG must be held low during VCCINT ramp per datasheet; (3) JTAG chain order must place EPF6024 between TDI/TDO with TCK buffered if chain length exceeds 6 inches; (4) Do not exceed VCCIO of 5.25V or VCCINT of 3.6V; (5) For multi-voltage designs, ensure VCCIO bank voltage matches the external device - mixing 5V and 2.5V in same bank will damage the I/O cells.

The 144-TQFP package requires a thermal pad (not exposed, but copper pour on top layer is recommended). Ground plane should be solid on layer 2 under the device for high-speed signal return paths. JTAG signals (TCK/TMS/TDI/TDO) should be routed together with a 10k pull-up on TCK as recommended. CONF_DONE requires an external 10k pull-up to VCCIO; nSTATUS and nCONFIG also need 10k pull-ups. Place the configuration EEPROM within 100 mm of the EPF6024 to keep JTAG signal integrity.

معلومات الامتثال

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Qualified

خالٍ من الرصاص

Unknown

خالٍ من الهالوجين

Unknown

المعادن المتنازع عليها

Unknown

EPF6024ATI144-3 launched before RoHS mandate. Intel PSG did not provide a RoHS declaration for this obsolete part; check broker lot date codes and material declarations. Not AEC-Q100 qualified - automotive deployments require migration to MAX 10 10M02 or Cyclone IV with AEC-Q100 grading.

تم التحقق من البيانات في: 2026-09-12 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

المصادر: Distributor, Distributor, Distributor, Distributor, Internal Db, Distributor, Distributor, Manufacturer Datasheet

عمليات بحث ذات صلة

EPF6024ATI144-3 EPF6024ATI144-3 datasheet Altera FLEX 6000 EPF6024 1960 logic element FPGA 144 TQFP EPF6024ATI144-3 pinout FLEX 6000 obsolete replacement EPF6024ATI144-3 vs EPF6024ATC144-3 EPF6024ATI144-3 drop-in replacement buy EPF6024ATI144-3 obsolete FLEX 6000 to Cyclone IV migration 3.3V SRAM FPGA 24K gates legacy EPF6024ATI144-3 JTAG configuration

المكونات والمصطلحات ذات الصلة

Altera Intel PSG (Intel Programmable Solutions Group) EPF6024ATI144-3 FLEX 6000 FPGA Field-Programmable Gate Array SRAM Logic Element (LE) Logic Array Block (LAB) Embedded Array Block (EAB) 144-LQFP TQFP JTAG IEEE 1149.1 boundary-scan MAX+PLUS II Quartus EPC1 EPC2 PCI Cyclone IV Cyclone V MAX 10 industrial temperature RoHS