EPF6024ATC1443 - FLEX 6000 FPGA, 1960 Gates, 117 I/O, TQFP-144 | Altera
MPN: EPF6024ATC1443 ⚠ آخر فرصة للشراءEPF6024ATC1443 نظرة عامة
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose digital logic function is defined after manufacture via a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader programmable logic hierarchy between simple programmable logic devices (SPLDs/CPLDs) and high-capacity FPGAs, and are widely used for glue logic, bus bridging, and modest-throughput state-machine implementation. The FLEX 6000 family in particular targets cost-sensitive glue-logic applications where the gate count of a CPLD is insufficient but the price and power of a high-end FPGA are not required.
Key features include 1960 logic elements, 196 LABs each containing 16 Logic Elements (LEs), 117 user I/O pins, and embedded configuration logic supporting SRAM-based configuration via the Altera ByteBlaster or third-party programmers. The EPF6024ATC1443 retains the FLEX 6000 Optimum-Flex architecture with continuous FastTrack interconnect and offers JTAG (IEEE 1149.1) boundary-scan testability. Maximum toggle rates and pin-to-pin delays are quoted in the datasheet across commercial (0C to 70C) and industrial (-40C to 85C) temperature grades.
Architecture-wise, the device is built on a 0.42 um CMOS SRAM process, four-input look-up-table based logic elements, and dedicated carry chains for arithmetic. Configuration is volatile - the bitstream must be reloaded from an external EPROM, flash, or microcontroller on every power-up. The TQFP-144 package provides a 0.5 mm lead pitch on a 22 mm x 22 mm body for surface-mount assembly.
Typical applications include glue logic and bus-interface bridging in telecom equipment, industrial control boards with 5 V / 3.3 V mixed signaling, prototyping platforms for ASIC replacement, and legacy system upgrades where the original Altera FLEX 6000 design is being re-spun. Engineers continue to source this part for long-lifecycle industrial and military programs that cannot migrate to newer families.
Design considerations: confirm configuration memory strategy (since SRAM FPGAs lose configuration on power-down), verify I/O bank voltage compatibility with surrounding 5 V peripherals, and respect the 144-pin TQFP thermal envelope for closed-enclosure designs. Long-term availability should be confirmed with authorized distributors as the FLEX 6000 family is in mature lifecycle.
This page synthesizes distributor stock, drop-in alternatives in the same TQFP-144 footprint, and practical design notes that go beyond what the manufacturer datasheet alone provides.
بدائل مباشرة لـ EPF6024ATC1443 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF6024ATC1443 (نفس عامل الشكل والبصمة) — يختلف في Process Technology, Package, Operating Temperature, Speed Grade, Logic Elements / Cells.
EPF6024ATC144-3
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ATC144-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ATC144-3S
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ATC144-2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ATC144-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ATC144-2N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF6024ATC1443 الحدود القصوى والخصائص الكهربائية
| Family | FLEX 6000 |
| Logic Elements | 1960 |
| Logic Array Blocks (LABs) | 196 |
| User I/O Pins | 117 |
| العلبة | TQFP-144 (22 x 22 mm, 0.5 mm pitch) |
| Speed Grade | -3 |
| Core Voltage | 3.3 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| Configuration Method | SRAM (volatile) |
| Process Technology | 0.42 um CMOS SRAM |
| نطاق درجة حرارة التشغيل | -40C to +85C (industrial) / 0C to 70C (commercial) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| نوع التركيب | Surface Mount |
تكوين أطراف EPF6024ATC1443
| دبوس 1 | I/O — User I/O pin (bank 1) |
| دبوس 2 | I/O — User I/O pin (bank 1) |
| دبوس 3 | VCCIO1 — I/O bank 1 supply voltage (3.3 V or 5 V tolerant) |
| دبوس 4 | I/O — User I/O pin (bank 1) |
| دبوس 5 | I/O — User I/O pin (bank 1) |
| دبوس 6 | I/O — User I/O pin (bank 1) |
| دبوس 7 | I/O — User I/O pin (bank 1) |
| دبوس 8 | I/O — User I/O pin (bank 1) |
| دبوس 9 | GND — Ground |
| دبوس 10 | I/O — User I/O pin (bank 1) |
| دبوس 11 | I/O — User I/O pin (bank 1) |
| دبوس 12 | I/O — User I/O pin (bank 1) |
| دبوس 13 | I/O — User I/O pin (bank 1) |
| دبوس 14 | TMS — JTAG Test Mode Select |
| دبوس 15 | TCK — JTAG Test Clock |
| دبوس 16 | I/O — User I/O pin (bank 2) |
| دبوس 17 | I/O — User I/O pin (bank 2) |
| دبوس 18 | I/O — User I/O pin (bank 2) |
| دبوس 19 | I/O — User I/O pin (bank 2) |
| دبوس 20 | I/O — User I/O pin (bank 2) |
| دبوس 21 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 22 | I/O — User I/O pin (bank 2) |
| دبوس 23 | I/O — User I/O pin (bank 2) |
| دبوس 24 | GND — Ground |
| دبوس 25 | I/O — User I/O pin (bank 2) |
| دبوس 26 | I/O — User I/O pin (bank 2) |
| دبوس 27 | I/O — User I/O pin (bank 2) |
| دبوس 28 | I/O — User I/O pin (bank 2) |
| دبوس 29 | I/O — User I/O pin (bank 2) |
| دبوس 30 | I/O — User I/O pin (bank 2) |
| دبوس 31 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 32 | I/O — User I/O pin (bank 2) |
| دبوس 33 | I/O — User I/O pin (bank 2) |
| دبوس 34 | I/O — User I/O pin (bank 2) |
| دبوس 35 | I/O — User I/O pin (bank 2) |
| دبوس 36 | I/O — User I/O pin (bank 3) |
| دبوس 37 | I/O — User I/O pin (bank 3) |
| دبوس 38 | I/O — User I/O pin (bank 3) |
| دبوس 39 | GND — Ground |
| دبوس 40 | I/O — User I/O pin (bank 3) |
| دبوس 41 | I/O — User I/O pin (bank 3) |
| دبوس 42 | I/O — User I/O pin (bank 3) |
| دبوس 43 | I/O — User I/O pin (bank 3) |
| دبوس 44 | TDI — JTAG Test Data In |
| دبوس 45 | TDO — JTAG Test Data Out |
| دبوس 46 | I/O — User I/O pin (bank 3) |
| دبوس 47 | I/O — User I/O pin (bank 3) |
| دبوس 48 | I/O — User I/O pin (bank 3) |
| دبوس 49 | I/O — User I/O pin (bank 3) |
| دبوس 50 | I/O — User I/O pin (bank 3) |
| دبوس 51 | I/O — User I/O pin (bank 3) |
| دبوس 52 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 53 | I/O — User I/O pin (bank 3) |
| دبوس 54 | I/O — User I/O pin (bank 4) |
| دبوس 55 | GND — Ground |
| دبوس 56 | I/O — User I/O pin (bank 4) |
| دبوس 57 | I/O — User I/O pin (bank 4) |
| دبوس 58 | I/O — User I/O pin (bank 4) |
| دبوس 59 | I/O — User I/O pin (bank 4) |
| دبوس 60 | I/O — User I/O pin (bank 4) |
| دبوس 61 | I/O — User I/O pin (bank 4) |
| دبوس 62 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 63 | I/O — User I/O pin (bank 4) |
| دبوس 64 | I/O — User I/O pin (bank 4) |
| دبوس 65 | I/O — User I/O pin (bank 4) |
| دبوس 66 | I/O — User I/O pin (bank 4) |
| دبوس 67 | I/O — User I/O pin (bank 4) |
| دبوس 68 | I/O — User I/O pin (bank 4) |
| دبوس 69 | I/O — User I/O pin (bank 4) |
| دبوس 70 | I/O — User I/O pin (bank 4) |
| دبوس 71 | GND — Ground |
| دبوس 72 | I/O — User I/O pin (bank 4) |
| دبوس 73 | I/O — User I/O pin (bank 4) |
| دبوس 74 | I/O — User I/O pin (bank 4) |
| دبوس 75 | I/O — User I/O pin (bank 5) |
| دبوس 76 | nCONFIG — Configuration control (active-low reset) |
| دبوس 77 | nSTATUS — Configuration status (active-low) |
| دبوس 78 | CONF_DONE — Configuration complete indicator |
| دبوس 79 | I/O — User I/O pin (bank 5) |
| دبوس 80 | I/O — User I/O pin (bank 5) |
| دبوس 81 | I/O — User I/O pin (bank 5) |
| دبوس 82 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 83 | I/O — User I/O pin (bank 5) |
| دبوس 84 | I/O — User I/O pin (bank 5) |
| دبوس 85 | I/O — User I/O pin (bank 5) |
| دبوس 86 | I/O — User I/O pin (bank 5) |
| دبوس 87 | GND — Ground |
| دبوس 88 | I/O — User I/O pin (bank 5) |
| دبوس 89 | I/O — User I/O pin (bank 5) |
| دبوس 90 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 91 | I/O — User I/O pin (bank 5) |
| دبوس 92 | I/O — User I/O pin (bank 5) |
| دبوس 93 | I/O — User I/O pin (bank 5) |
| دبوس 94 | I/O — User I/O pin (bank 5) |
| دبوس 95 | I/O — User I/O pin (bank 5) |
| دبوس 96 | I/O — User I/O pin (bank 5) |
| دبوس 97 | I/O — User I/O pin (bank 5) |
| دبوس 98 | I/O — User I/O pin (bank 6) |
| دبوس 99 | MSEL0 — Configuration mode select bit 0 |
| دبوس 100 | MSEL1 — Configuration mode select bit 1 |
| دبوس 101 | I/O — User I/O pin (bank 6) |
| دبوس 102 | I/O — User I/O pin (bank 6) |
| دبوس 103 | I/O — User I/O pin (bank 6) |
| دبوس 104 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 105 | GND — Ground |
| دبوس 106 | I/O — User I/O pin (bank 6) |
| دبوس 107 | I/O — User I/O pin (bank 6) |
| دبوس 108 | I/O — User I/O pin (bank 6) |
| دبوس 109 | I/O — User I/O pin (bank 6) |
| دبوس 110 | I/O — User I/O pin (bank 6) |
| دبوس 111 | I/O — User I/O pin (bank 6) |
| دبوس 112 | I/O — User I/O pin (bank 6) |
| دبوس 113 | I/O — User I/O pin (bank 6) |
| دبوس 114 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 115 | I/O — User I/O pin (bank 6) |
| دبوس 116 | I/O — User I/O pin (bank 6) |
| دبوس 117 | GND — Ground |
| دبوس 118 | I/O — User I/O pin (bank 7) |
| دبوس 119 | I/O — User I/O pin (bank 7) |
| دبوس 120 | I/O — User I/O pin (bank 7) |
| دبوس 121 | I/O — User I/O pin (bank 7) |
| دبوس 122 | I/O — User I/O pin (bank 7) |
| دبوس 123 | I/O — User I/O pin (bank 7) |
| دبوس 124 | VCCIO6 — I/O bank 6 supply voltage |
| دبوس 125 | I/O — User I/O pin (bank 7) |
| دبوس 126 | I/O — User I/O pin (bank 7) |
| دبوس 127 | I/O — User I/O pin (bank 7) |
| دبوس 128 | I/O — User I/O pin (bank 7) |
| دبوس 129 | I/O — User I/O pin (bank 7) |
| دبوس 130 | I/O — User I/O pin (bank 7) |
| دبوس 131 | I/O — User I/O pin (bank 7) |
| دبوس 132 | GND — Ground |
| دبوس 133 | I/O — User I/O pin (bank 7) |
| دبوس 134 | I/O — User I/O pin (bank 8) |
| دبوس 135 | I/O — User I/O pin (bank 8) |
| دبوس 136 | I/O — User I/O pin (bank 8) |
| دبوس 137 | I/O — User I/O pin (bank 8) |
| دبوس 138 | I/O — User I/O pin (bank 8) |
| دبوس 139 | VCCINT — Core supply voltage (3.3 V) |
| دبوس 140 | I/O — User I/O pin (bank 8) |
| دبوس 141 | I/O — User I/O pin (bank 8) |
| دبوس 142 | I/O — User I/O pin (bank 8) |
| دبوس 143 | I/O — User I/O pin (bank 8) |
| دبوس 144 | I/O — User I/O pin (bank 8) |
التطبيقات النموذجية
EPF6024ATC1443 مناسب لـ 6 التطبيقs: Legacy Telecom Glue Logic, Industrial Control Board (5V / 3.3V Mixed Signaling), ASIC Replacement Prototyping, Military / Aerospace Legacy Avionics, Test and Measurement Instrumentation Front-End, Educational and Development Boards.
Legacy Telecom Glue Logic
The EPF6024ATC1443's 1960 logic elements and 117 user I/O make it well-suited for legacy telecom board-level glue logic where bus bridging, address decoding, and protocol conversion sit between older 5 V peripherals and a 3.3 V processor. Its 5 V-tolerant I/O bank simplifies interfacing with legacy TTL/CMOS peripherals, eliminating level shifters that would otherwise consume board area and add propagation delay. The TQFP-144 footprint has been proven in production telecom infrastructure for over two decades, giving long-lifecycle program managers confidence in the silicon supply. Reference designs in the FLEX 6000 datasheet illustrate PCI-to-ISA bridge implementations that consume roughly 60 percent of the device, leaving headroom for status LEDs and watchdog timers.
موصى به
Industrial Control Board (5V / 3.3V Mixed Signaling)
Industrial control boards frequently mix 5 V sensor signal conditioning with 3.3 V microcontroller or FPGA logic, and the EPF6024ATC1443 handles this directly with its 5 V-tolerant I/O banks and 3.3 V core. The 117 user I/Os comfortably absorb 32-bit parallel sensor buses plus PWM, encoder, and relay-drive signals without multiplexing, simplifying firmware and timing closure. The FLEX 6000 architecture's continuous FastTrack interconnect provides predictable routing delay, which matters for deterministic control loops running in the 10-100 kHz band. The industrial temperature grade (-40C to 85C) supports factory-floor enclosures.
موصى به
ASIC Replacement Prototyping
Engineering teams transitioning from a mature ASIC to a programmable platform frequently select the EPF6024ATC1443 because its 1960-LE capacity matches the gate-equivalent of mid-complexity ASICs in the 30k-50k gate range. The TQFP-144 package is hand-solderable for early engineering builds, allowing quick PCB revisions before committing to volume assembly. ByteBlaster programming via JTAG lets prototypes iterate in minutes, and the SRAM-based configuration means last-minute design changes cost only a re-synthesized bitstream. The FLEX 6000 architecture's Quartus II support remains usable on legacy tool versions, preserving the original RTL source.
موصى به
Military / Aerospace Legacy Avionics
Long-life avionics programs (15-25 year support windows) require FPGA silicon that is no longer in active development but remains qualified and procurable. The EPF6024ATC1443 meets this profile, with established reliability data and a stable TQFP-144 package used in deployed systems. Its industrial temperature grade supports the -40C to 85C range typical of military ground-vehicle and avionics line-replaceable units. Procurement must go through authorized distributors with full traceability, and brokers are used only for spot buys with paperwork verification. The device's mature silicon minimizes the risk of last-time-buy surprise discontinuance.
موصى به
Test and Measurement Instrumentation Front-End
Bench-top and rack-mount test equipment often integrates an FPGA as a flexible timing generator or protocol analyzer, and the EPF6024ATC1443's 1960 LEs comfortably implement multi-channel pattern generators, counter/timers, and parallel data formatters. The 117 user I/O accommodate front-panel BNC fan-out via 74-series buffers and let engineers route signals to backplane connectors without external muxing. The -3 speed grade's tPD is sufficient for sub-50 MHz control-plane logic typical of GPIB and LXI front-panel interfaces. The TQFP-144's 0.5 mm pitch is still hand-reworkable, simplifying field repairs.
موصى به
Educational and Development Boards
University FPGA courses and embedded-systems training labs benefit from the EPF6024ATC1443's predictable architecture, extensive Altera documentation, and Quartus II tool support. Its 1960-LE capacity exercises meaningful design content (small CPUs, peripheral controllers) while still fitting within student-project timing. The TQFP-144 package on a 0.5 mm pitch is approachable for student assembly with a hot-air station, and the JTAG programming via ByteBlaster is a low-cost entry point. Many legacy Altera University Program boards used the FLEX 6000 family, so educational resources, lab manuals, and reference designs remain abundant.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF6024ATC1443 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF6024ATC144-3 | EPF6024ATC144-3N | EPF6024ATC144-3S | EPF6024ATC144-2 | EPF6024ATC144-1 | EPF6024ATC144-2N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Logic Elements | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 | 1960 |
| LABs | 196 | 196 | 196 | 196 | 196 | 196 | 196 |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 (standard) | -3 | -3 | -3 | -2 (faster) | -1 (fastest) | -2 (faster) |
أبرز الفروقات
- Industry-standard TQFP-144 footprint with widest FLEX 6000 I/O count (مقابلEPF6016ATC144-3)
- Pin-compatible speed-grade flexibility across the EPF6024ATC144 family (مقابلEPF6024AQI208-3)
- Cost-optimized -3 speed grade for price-sensitive industrial designs (مقابلEPF6024ATC144-1)
ملاحظات التصميم
The EPF6024ATC1443 requires a 3.3 V core supply (VCCINT) and a per-bank I/O supply (VCCIO) that may be 3.3 V or 5 V tolerant. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the package, and bulk-decouple each VCCIO bank with a 10 uF tantalum plus 0.1 uF ceramic. Power-on ramp should be monotonic; consult the FLEX 6000 datasheet for the tRAMP specification.
Because the FLEX 6000 family uses volatile SRAM configuration, the device's I/O pins remain tri-stated until CONF_DONE asserts. If the downstream circuitry cannot tolerate high-impedance inputs at power-up, add 10 kohm pull-ups or pull-downs on critical signal pins. Always include an EPC configuration EPROM (EPC1064, EPC2, etc.) on the board to ensure the device configures on every power-up.
Route JTAG signals (TCK, TMS, TDI, TDO) as a daisy-chain with no stubs; place a 10 kohm pull-up on TCK and TMS per the IEEE 1149.1 specification. Keep configuration-related pins (nCONFIG, nSTATUS, CONF_DONE) short and direct to the configuration EPROM. Maintain a continuous ground plane under the TQFP-144 package and stitch vias around the perimeter at 5 mm spacing for thermal and EMI performance.
Estimated: TQFP-144 with 0.5 mm lead pitch on a 4-layer JEDEC test board typically yields theta_JA around 35-45 C/W. For typical FLEX 6000 designs with 50-70 percent utilization, junction-temperature rise is well below 20 C above ambient, so no heatsink is needed. For sealed enclosures without airflow, validate with a thermal probe on a pilot build.
معلومات الامتثال
EPF6024ATC1443 belongs to a legacy Altera family; RoHS/REACH status not confirmed in the verified web data. Standard variant likely non-RoHS; -N suffix variants typically indicate lead-free finish. AEC-Q100 not qualified - this is a commercial/industrial FPGA.
