EPM3256AFC256-10N - 5K Gate 256-Macro MAX 3000A CPLD | Altera
MPN: EPM3256AFC256-10N ✗ انتهى عمره الإنتاجيEPM3256AFC256-10N نظرة عامة
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell arrays with a central interconnect matrix. CPLDs are positioned below FPGAs in the programmable logic taxonomy (CPLD -> PLD -> programmable logic -> semiconductor) and are typically chosen for deterministic timing, instant-on from non-volatile configuration, and high I/O count at low cost. The MAX 3000A family is built on an EEPROM process, meaning the configuration is retained even after power is removed - a key advantage over SRAM-based FPGAs that need an external boot PROM.
Key differentiating features include 3.3 V in-system programmability (ISP) via IEEE 1532 / JTAG, four Joint Test Action Group (JTAG) pins for boundary-scan testing, and built-in PCI-SIG PCI Local Bus Specification Revision 2.2 compliance at the -10 speed grade. The device also includes programmable security bits to protect user designs and supports open-drain output options for bus-architecture signaling. Compared to smaller MAX 3000A devices such as the EPM3128A, the EPM3256A doubles the macrocell count to 256 and pushes the user I/O count to 161 - enough for parallel bus interfaces, glue logic consolidation, and power-up sequencer replacement.
Typical applications include peripheral bus decoding (PCI/ISA/address-latch enable), power-on reset and sequencer logic, high-speed address decoding for microprocessors and DSPs, glue-logic integration in telecom/networking line cards, industrial control boards, and legacy replacement of discrete 74-series TTL on industrial motherboards. Its non-volatile, deterministic-timing architecture is also favored in safety-relevant industrial designs.
Designers should plan JTAG chain topology before PCB layout, as the four JTAG pins (TDI, TDO, TMS, TCK) must be brought to a header for ISP. Decoupling follows Altera's recommendation of 0.1 uF and 0.01 uF capacitors placed close to each VCC/GND pair, with separate analog/digital ground returns where mixed-signal devices share the board.
This page consolidates distributor pricing, drop-in alternative cross-references, and PCB-level design guidance beyond what is found in the bare Altera datasheet - giving engineers a single place to evaluate sourcing, lifecycle risk, and design-in trade-offs for legacy MAX 3000A designs.
بدائل مباشرة لـ EPM3256AFC256-10N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPM3256AFC256-10N (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Propagation Delay (tPD), In-System Programmability, Process Technology.
EPM3256AFC256-10
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM3128AFC256-7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM3128AFI256-10N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM1270F256C5N
✅ بديل مباشر✗ غير متوفر
$16.2 / وحدة
عرض ورقة البيانات ←EPM2210F256C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM3256AFC256-10N الحدود القصوى والخصائص الكهربائية
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Usable Gates | 5,000 gates |
| Macrocells | 256 |
| Maximum User I/O | 161 |
| Pin-to-Pin Logic Delay | 10 ns |
| Maximum Counter Frequency | 227.3 MHz |
| Core Voltage | 3.3 V |
| I/O Logic Level Compatibility | 5.0 V / 3.3 V / 2.5 V (MultiVolt) |
| Programmability | EEPROM, in-system programmable (ISP) |
| JTAG Interface | IEEE 1532 / JTAG (TDI, TDO, TMS, TCK) |
| العلبة | 256-pin FineLine BGA |
| Logic Family | CMOS |
| PCI Compliance | PCI Local Bus Specification Rev 2.2 (at -10 grade) |
| درجة حرارة التشغيل | 0 C to 70 C (commercial) |
تكوين أطراف EPM3256AFC256-10N
| دبوس A1 | I/O — User I/O (bank 1) |
| دبوس A2 | I/O — User I/O (bank 1) |
| دبوس A3 | I/O — User I/O (bank 1) |
| دبوس A4 | I/O — User I/O (bank 1) |
| دبوس A5 | I/O — User I/O (bank 1) |
| دبوس A6 | VCCINT — 3.3 V core supply |
| دبوس A7 | GND — Ground |
| دبوس A8 | TDI — JTAG Test Data In |
| دبوس A9 | TMS — JTAG Test Mode Select |
| دبوس A10 | TCK — JTAG Test Clock |
| دبوس A11 | I/O — User I/O (bank 2) |
| دبوس A12 | I/O — User I/O (bank 2) |
| دبوس A13 | I/O — User I/O (bank 2) |
| دبوس A14 | VCCIO2 — I/O bank 2 reference supply |
| دبوس A15 | I/O — User I/O (bank 2) |
| دبوس A16 | I/O — User I/O (bank 2) |
| دبوس B1 | GND — Ground |
| دبوس B16 | I/O — User I/O (bank 2) |
| دبوس TDO | TDO — JTAG Test Data Out |
| دبوس EP | GND — Exposed center pad - thermal/ground bond (per datasheet) |
التطبيقات النموذجية
EPM3256AFC256-10N مناسب لـ 6 التطبيقs: PCI Bus Address Decoding and Glue Logic, Power-On Reset and Multi-Rail Sequencer, Microprocessor Address/Data Bus Interface Bridge, DSP / Microprocessor Address Decoder and Chip-Select Generator, Legacy Industrial Control Board Consolidation, Telecom Line-Card Glue Logic and Test Access.
PCI Bus Address Decoding and Glue Logic
The EPM3256AFC256-10N's 10 ns pin-to-pin delay and 161 user I/Os make it well suited as the central glue-logic device on legacy PCI add-in cards and backplanes. The -10 speed grade meets PCI Local Bus Specification Revision 2.2 timing, while the 256 macrocells can absorb a full 32-bit address decoder, chip-select generator, and interrupt steering matrix in one device.
موصى به
Power-On Reset and Multi-Rail Sequencer
In telecom and industrial boards, the EPM3256AFC256-10N replaces dozens of 74-series TTL gates by implementing voltage-rail sequencing, POR delays, and reset distribution in one non-volatile part. The EEPROM-based configuration means outputs settle to known states within microseconds of VCC ramp - faster than any SRAM FPGA - which is critical for processor and DSP supply rails that must come up in a specific order.
موصى به
Microprocessor Address/Data Bus Interface Bridge
The 161 user I/Os and 3.3 V MultiVolt I/O make the EPM3256AFC256-10N ideal as a bus-bridge between legacy 5 V microprocessors and modern 3.3 V peripherals or memories. It can latch, multiplex, or transpose address and data buses without external bus drivers, eliminating 2-3 octal transceiver ICs per port. The 10 ns tPD safely meets 50 MHz bus timing with adequate margin.
موصى به
DSP / Microprocessor Address Decoder and Chip-Select Generator
DSP systems require precise, glitch-free chip-select generation for external SRAM, Flash, and peripheral chips. The EPM3256AFC256-10N's 256 macrocells can decode the full 24-bit address space of typical DSPs while the 227.3 MHz maximum counter frequency supports fast memory-cycle generation. Predictable combinational delay (10 ns worst-case) eliminates address-decode glitches that cause memory corruption in discrete-logic decoders.
موصى به
Legacy Industrial Control Board Consolidation
On long-life industrial motherboards (CNC, PLC, motor drives), the EPM3256AFC256-10N replaces 10-20 discrete 74HC/74LS logic packages, reducing board area and improving long-term reliability. Its 0 C to +70 C commercial temperature range suits most factory-floor enclosures, while the EEPROM-based design holds configuration through power cycles without an external boot PROM.
موصى به
Telecom Line-Card Glue Logic and Test Access
The EPM3256AFC256-10N's JTAG (IEEE 1149.1) support, 5V-tolerant I/O, and high I/O count suit telecom line-card applications as the central test-access and signal-routing hub. Designers use it to mux between operational and diagnostic modes, implement BERT loopbacks, and consolidate framer/serializer select logic - tasks that previously required multiple 74-series packages.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPM3256AFC256-10N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPM3256AFC256-10 | EPM3128AFC256-7N | EPM3128AFI256-10N | EPM1270F256C5N | EPM2210F256C5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Family | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX V | MAX V |
| Macrocells | 256 | 256 | 128 | 128 | 980 | 1700 |
| Pin-to-Pin Delay | 10 ns | 10 ns | 7.5 ns | 10 ns | 5.0 ns | 5.0 ns |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V | 1.8 V |
| Temperature Grade | Commercial 0 to 70 C | Commercial 0 to 70 C | Commercial 0 to 70 C | Industrial -40 to +85 C | Commercial 0 to 70 C | Commercial 0 to 70 C |
| Lead-Free / RoHS | Yes (N suffix) | No (tin-lead finish) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Lifecycle Status | Obsolete (EOL by Intel) | Obsolete | Obsolete | Obsolete | Active | Active |
أبرز الفروقات
- Drop-in compatibility with the non-N (tin-lead) variant (مقابلEPM3256AFC256-10)
- Highest macrocell count of any MAX 3000A device (مقابلEPM3128AFI256-10N)
- Most I/O of any MAX 3000A BGA option (مقابلEPM3128AFI256-10N)
ملاحظات التصميم
Estimated: the EPM3256AFC256-10N requires two supplies - VCCINT (3.3 V core) and VCCIO (per bank, 2.5/3.3/5 V tolerant). Decouple every VCC/VCCIO/GND pair with a 0.1 uF ceramic placed within 5 mm of the package ball. Add a single 10 uF bulk tantalum or ceramic near the VCCINT pin. Unused I/O banks should still have their VCCIO pin tied to a valid voltage, not left floating - per Altera's MAX 3000A datasheet, floating VCCIO can cause I/O behaviour to drift during configuration.
The 256-ball FineLine BGA requires X-ray inspection or proper BGA rework tools - hand soldering is impractical. Plan your JTAG chain order before PCB layout: TCK and TMS need 10 kohm pull-ups to VCCIO, and the chain must include any other JTAG devices between TDI and TDO. A common mistake is to chain the CPLD last; instead, put it first so ISP works even when downstream boundary-scan parts are absent on early prototype builds.
Estimated: at 227 MHz internal counters, output edge rates are 1-2 ns, so keep high-speed outputs (clock, OE, chip-select) on short matched-length traces. Use a continuous ground plane under the BGA and avoid routing signals between BGA balls on inner layers. For PCI applications, the -10 speed grade is at the upper limit of PCI 2.2 timing; route the 33 MHz PCI clock with 50 ohm controlled impedance and length-match it within 250 mils across all loads.
معلومات الامتثال
Lead-free finish indicated by 'N' suffix per Altera ordering information. Part is end-of-life as of 2026; new designs should target MAX II / MAX V / MAX 10 CPLDs.
