Intel

EPM2210F256C5N - 2210 LE, 1700 Macrocells MAX II CPLD | Intel

MPN: EPM2210F256C5N ✓ Active
In Stock Ships in 1-3 business days
2.375 V to 3.6 V (3.3 V typical) Vdss 1.5 V / 1.8 V / 2.5 V / 3.3 V Rds(on) 256-ball FineLine BGA (17x17mm, 1mm pitch) Package 201.1 MHz Speed 8 Kbits Memory
From $17.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-12
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $25.75 $257.50
100 $22.4 $2,240.00
500 $19.3 $9,650.00
1,000 $17.85 $17,850.00
ℹ️ All prices are in USD

Drop-in alternatives for EPM2210F256C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPM2210F256C5

✅ Drop-In
Altera
📦 256-ball FineLine BGA
MAX II · EPM2210 · CPLD (Complex Programmable Logic Device) · 1700 · 201.1 MHz · 5 ns (C5 speed grade) · 272 · 2.5 V / 3.3 V (MultiVolt I/O)

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$14.95 / Unit

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EPM2210F256C4N

✅ Drop-In
Intel
📦 256-ball FineLine BGA
MAX II · CPLD · 2210 · 1700 · 204 Kbit · 247.5 MHz · 7.0 ns · 212 (varies with package)

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$39.85 / Unit

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EPM2210F256C3N

✅ Drop-In
Intel
📦 256-ball FineLine BGA
MAX II · CPLD (Complex Programmable Logic Device) · In System Programmable (JTAG, IEEE 1149.1) · 1700 · 2210 · 204 · 7 ns · 304 MHz

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EPM2210F256C4

✅ Drop-In
Altera
📦 256-ball FineLine BGA
MAX II · 2,210 · 1,700 · 8 Kbits · 212 · 256-ball FineLine BGA (FBGA) · 0.18 µm 6-layer-metal flash · 1.8 V

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$42.8 / Unit

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EPM2210GF256I5N

✅ Drop-In
📦 256-ball FineLine BGA
MAX II G with 1.8V core regulator (lower power), industrial -40C to +100C range, same 2210 LE / 1700 macrocells; pin-compatible

📋 Reference alternative (not in catalog)

EPM2210F256A5NGA

✅ Drop-In
Intel
📦 256-ball FineLine BGA
MAX II · 2210 · 1700 · 7 ns (A5 speed grade) · 212 · 1.8 V · 0C to +85C (NGA, commercial) · 256-ball FineLine BGA (NGA)

✓ In Stock

$48.75 / Unit

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EPM2210F256C5N Maximum Ratings & Electrical Characteristics

Family MAX II
Logic Elements 2210
Macrocells 1700
User I/Os 204
User Flash Memory (UFM) 8 Kbits
Propagation Delay (tPD) 7 ns
Turn-On Delay (tSU) 11.2 ns
Maximum Internal Frequency 201.1 MHz
Supply Voltage (VCCINT) 2.375 V to 3.6 V (3.3 V typical)
I/O Voltage Standards 1.5 V / 1.8 V / 2.5 V / 3.3 V
Process Technology 0.18 um CMOS with on-chip flash
Global Clocks 4
Operating Temperature 0C to +85C (commercial)
Package 256-ball FineLine BGA (17x17mm, 1mm pitch)
Mounting Type Surface Mount
Configuration Memory Internal flash (non-volatile, instant-on)
Programming Interface JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster
RoHS Status Compliant
Lead-Free Yes

EPM2210F256C5N 256-ball fineline bga (17x17mm, 1mm pitch) Pin Configuration Guide

Complete pinout information for EPM2210F256C5N (256-ball fineline bga (17x17mm, 1mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball fineline bga (17x17mm, 1mm pitch) package pinout diagram for EPM2210F256C5N

No detailed pinout data available for EPM2210F256C5N.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EPM2210F256C5N Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EPM2210F256C5N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, Telecom Backplane Address Decoding, Networking Switch Power-Up Sequencing, Medical Device Glue Logic Consolidation, Automated Test Equipment Timing Adjustment, Display Controller Timing Generation.

🏭

Industrial I/O Expansion and Bus Bridging

The EPM2210F256C5N's 2210 logic elements and 204 user I/Os make it ideal for I/O expansion in industrial controllers and bus-bridging between incompatible processor busses. With a 7ns propagation delay and 201.1MHz internal frequency, the CPLD can synchronize signals between a 32-bit MCU bus at 50MHz and a 16-bit FPGA fabric at 100MHz without introducing data corruption. The MultiVolt I/O banks allow direct 3.3V-to-1.8V level translation on the same die, eliminating external level-shifters. The on-chip 8Kbit UFM can store board revision codes or calibration constants, removing the need for external EEPROM. MAX II devices are widely deployed in PLCs, motor drives, and process control equipment where instant-on behavior (<1ms from power-up) is mandatory because FPGAs with SRAM boot PROMs cannot meet cold-start deadlines.

🌐

Telecom Backplane Address Decoding

In telecom backplanes using ATCA or AdvancedMC architectures, the EPM2210F256C5N serves as the central address decoder and chip-select generator across multiple line cards. The 1700 macrocells provide sufficient capacity to decode 24-bit address ranges with individual chip enables for up to 16 slave devices. With 204 I/Os, the part can simultaneously drive enable lines to FPGAs, ASICs, memory banks, and PHY devices without external bus drivers. The instant-on flash-based configuration eliminates the boot-time complexity of SRAM-based FPGAs in systems that require deterministic startup for hitless firmware upgrades. Operating from a single 3.3V supply simplifies power tree design in space-constrained line cards.

🖥️

Networking Switch Power-Up Sequencing

The EPM2210F256C5N is widely used in managed Ethernet switches to generate precise power-up and power-down sequencing signals for multiple voltage rails. With 204 I/Os and deterministic 7ns timing, the part can drive power-good signals, RESET lines, and ENABLE pins for PHYs, MAC ICs, and switch ASICs in the correct order to prevent latch-up. The MultiVolt I/O capability lets a single CPLD interface to 1.8V PHYs, 2.5V MAC blocks, and 3.3V housekeeping logic without external level translation. The instant-on flash configuration guarantees that the power sequence begins within microseconds of VCC ramp, which is critical for meeting IEEE 802.3 startup timing.

💊

Medical Device Glue Logic Consolidation

Medical imaging and patient-monitoring equipment often contains dozens of discrete 74LVC, 74AVC, and 74AHC logic gates scattered across the board. The EPM2210F256C5N can absorb most of this discrete logic into a single programmable device, reducing board area, BOM count, and assembly cost. With 204 user I/Os, the CPLD can replace hundreds of discrete AND/OR/flipflop gates while maintaining the deterministic timing required for safety-critical signal paths. The internal flash UFM stores calibration coefficients for analog front-ends, reducing external EEPROM cost. The Instant-on feature ensures patient-monitor displays reach steady state within milliseconds of clinician power-button press.

🔧

Automated Test Equipment Timing Adjustment

ATE platforms require programmable delay lines, pulse generators, and pattern sequencers to characterize semiconductors. The EPM2210F256C5N's 7ns propagation delay and 201.1MHz internal frequency support delay-line resolution at the nanosecond scale for sub-100MHz device-under-test clocking. With 1700 macrocells, a single part can implement dozens of independent timing channels for parallel test sites, dramatically reducing per-channel instrument cost. The JTAG programming interface allows in-system reconfiguration to adapt to different DUT families without manual jumper changes. The non-volatile flash configuration preserves test program state across power cycles, supporting unattended ATE burn-in runs.

📺

Display Controller Timing Generation

Flat-panel LCD and OLED display controllers require precise HSYNC, VSYNC, DE (data enable), and pixel-clock signals with sub-nanosecond jitter. The EPM2210F256C5N's deterministic 7ns tPD and dedicated global clock networks provide jitter performance far superior to discrete 74-series timing chips. With 204 I/Os, the CPLD can simultaneously drive timing signals to multiple display panels in a multi-monitor KVM switch or digital signage array. The MultiVolt I/O banks interface directly to 1.5V eDP panels, 1.8V MIPI bridge chips, and 3.3V scaler ASICs without external level shifters. Internal UFM stores panel EDID overrides for custom timing modes.

What is the logic capacity of EPM2210F256C5N?
The EPM2210F256C5N contains 2210 logic elements and 1700 macrocells. According to the Altera/Intel MAX II family datasheet, the 1700 macrocells each contain a programmable AND/OR array with a configurable flipflop, providing equivalent capacity to thousands of discrete 74-series logic gates. This positions the part in the mid-range of the MAX II CPLD lineup.
How many user I/O pins does EPM2210F256C5N provide?
The EPM2210F256C5N provides 204 user I/O pins in its 256-ball FineLine BGA package, with the remaining balls assigned to power, ground, JTAG, and configuration pins. This high I/O count makes it suitable for bus-bridging and address-decoding applications that need to replace many discrete logic devices with a single programmable part.
What is the propagation delay of EPM2210F256C5N?
The EPM2210F256C5N has a typical pin-to-pin propagation delay (tPD) of 7 ns and a setup time (tSU) of 11.2 ns in the C5 speed grade. The maximum internal operating frequency is 201.1 MHz, which is sufficient for most glue-logic, bus-interface, and timing-adjustment functions in digital systems running below 100 MHz bus clocks.
What is the difference between EPM2210F256C5N and EPM2210F256C5?
The EPM2210F256C5N and EPM2210F256C5 share the same MAX II family, 2210 logic elements, 1700 macrocells, and 256-ball FBGA package. The 'N' suffix denotes lead-free and RoHS-compliant terminal finish, while the non-N C5 variant uses a leaded terminal finish. Both are pin-to-pin compatible and electrically interchangeable for new designs.
What is the supply voltage range of EPM2210F256C5N?
The EPM2210F256C5N operates from a single 2.375V to 3.6V supply (3.3V typical) on VCCINT, with the internal voltage regulator generating the core 1.8V rail. The I/O banks (VCCIO) can be independently powered at 1.5V, 1.8V, 2.5V, or 3.3V to interface directly with mixed-voltage logic families without external level shifters.
Where can I download the EPM2210F256C5N datasheet PDF?
The original EPM2210F256C5N datasheet can be downloaded from Alldatasheet (https://www.alldatasheet.com/datasheet-pdf/pdf/536589/ALTERA/EPM2210F256C5N.html) and from the official Intel Altera documentation archive. The full MAX II device family datasheet (containing pinouts, timing, and electrical characteristics) is also hosted on Intel's MAX II support page under document name MII51002.
What is the pinout configuration of EPM2210F256C5N?
The EPM2210F256C5N uses a 256-ball FineLine BGA arrangement on a 17x17mm substrate with 1.0mm ball pitch. Per the MAX II family datasheet, balls are organized in a 16x16 grid; pin assignments are listed in the device pin-out table. Engineers should download the MAX II pin-out file (.pin) from Intel to import into Quartus II pin-planner tool.
What is the best drop-in replacement for EPM2210F256C5N?
The best drop-in replacement for EPM2210F256C5N is the EPM2210F256C5 (same package, same logic capacity, identical pinout, but leaded terminal finish). For automotive or industrial temperature grades, the EPM2210GF256I5N provides a -40C to +100C industrial range with MultiVolt core support, also in the same 256-FBGA package footprint.
EPM2210F256C5N vs EPM2210F256I5N - which is better for industrial applications?
The EPM2210F256C5N operates from 0C to +85C (commercial grade), while the EPM2210F256I5N operates from -40C to +100C (industrial grade). For industrial applications exposed to extended temperature ranges, choose the I5N variant. Both share the same 256-FBGA package and identical logic capacity, making them pin-compatible drop-in alternatives for thermal robustness upgrades.
What software is used to program EPM2210F256C5N?
The EPM2210F256C5N is programmed using Altera/Intel Quartus II design software (version 13.0 or later). Quartus II handles synthesis, fitting, timing analysis, and generates the POF (Programmer Object File) for the JTAG interface. Programming hardware includes the USB-Blaster, ByteBlaster II, or Ethernet-Blaster download cables connected to the JTAG pins.
Is EPM2210F256C5N in stock at major distributors?
As of 2026-09-12, the EPM2210F256C5N is listed at DigiKey (PN 544-1354-ND), Mouser, Arrow, Octopart, and Win Source. Stock status varies by distributor; lead time is typically 8-12 weeks for factory-direct orders due to mature product status. We recommend checking each distributor's real-time inventory page for current stock and pricing before placing orders.
What is the price of EPM2210F256C5N in 1000-piece quantities?
As of 2026-09-12, the EPM2210F256C5N prices at 1000-piece quantity break approximately USD 17.85 per unit at major distributors. Single-piece pricing is around USD 28.50. For OEM volumes exceeding 5000 pieces, Intel direct sales or franchised distributors like Arrow and Avnet can offer lower pricing tiers; contact your local Intel representative for volume quotes.
Is EPM2210F256C5N RoHS compliant?
Yes, the EPM2210F256C5N is RoHS compliant per the manufacturer's datasheet and DigiKey product listing. The 'N' suffix in the part number explicitly denotes lead-free terminal finish compliant with the EU RoHS Directive 2002/95/EC. The device also meets REACH requirements and is suitable for use in consumer, industrial, and medical equipment sold in EU markets.
Can EPM2210C5N be replaced with EPM1270F256C5N?
No, the EPM2210F256C5N cannot be directly replaced with EPM1270F256C5N because the EPM1270 has only 1270 logic elements and 980 macrocells - approximately 60% of the EPM2210 capacity. The pinouts also differ between the two density points in the same package. Choose EPM1270 only when you actually need less logic and are willing to redesign the pin assignment; otherwise select a same-capacity part like EPM2210F256C5.
Hey Google, what is the lead time for EPM2210F256C5N?
Lead time for the EPM2210F256C5N is typically 8-12 weeks when ordered through franchised distributors like Arrow, Avnet, and DigiKey, as of 2026-09-12. In-stock quantities at DigiKey (PN 544-1354-ND) and Mouser are limited because the MAX II family is a mature product line. For urgent requirements, request a quote directly from Intel or check authorized brokers for bonded inventory.

Engineering reference data for EPM2210F256C5N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPM2210F256C5N when you need a lead-free, commercial-temperature (0C to +85C) MAX II CPLD with 2210 logic elements in the 256-ball FineLine BGA package and C5 (7ns) speed grade for cost-optimized glue logic. For systems requiring extended temperature range (-40C to +100C), upgrade to the EPM2210GF256I5N, which is pin-compatible and uses the lower-power MAX II G core. If timing margins allow, the EPM2210F256C4N (C4 speed grade) saves cost at the expense of slower tPD (~9ns). For legacy assemblies requiring leaded finish, the EPM2210F256C5 (non-N) is electrically identical. Avoid using EPM1270F256 part numbers - they have lower logic density (1270 LE) and different pinout assignments.

Comparison with Alternatives

Parameter This Product EPM2210F256C5 EPM2210F256C4N EPM2210F256C3N EPM2210GF256I5N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 256-ball FineLine BGA 256-ball FineLine BGA (same) 256-ball FineLine BGA (same) 256-ball FineLine BGA (same) 256-ball FineLine BGA (same)
Logic Elements 2210 2210 2210 2210 2210
Macrocells 1700 1700 1700 1700 1700
Speed Grade (tPD) C5 (7 ns) C5 (7 ns) C4 (~9 ns) C3 (~10 ns) I5 (~7.5 ns)
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C 0C to +85C -40C to +100C (industrial)
Lead-Free Finish Yes (N suffix) No (leaded) Yes Yes Yes
Core Voltage Regulator On-chip (single 3.3V supply) On-chip On-chip On-chip On-chip, 1.8V core (MAX II G)
User I/Os 204 204 204 204 204

Key Differentiators

  • Instant-on flash configuration vs SRAM-FPGA boot PROMs (vs EPF8820ATC144-3 (legacy SRAM-based FLEX 8000))
  • On-chip User Flash Memory (UFM) replaces external EEPROM (vs Discrete 24LC256 I2C EEPROM + standard CPLD)
  • MultiVolt I/O banks support mixed-voltage interfaces on one die (vs Discrete 74LVC4245 level shifters)

Design Notes

The 256-ball FineLine BGA uses a 1.0mm ball pitch, which is at the practical limit for standard 4-mil (0.1mm) laser-drilled via-in-pad PCB processes. Use 0.5mm drill vias with 0.2mm solder mask dam, and route all signal escape traces on the top layer beneath the BGA using microvia or via-in-pad technology. Maintain a continuous ground plane on layer 2 and a 3.3V power plane on layer 3 to provide low-impedance return paths for the high-edge-rate I/O signals. Decoupling: place 0.1uF X7R ceramic capacitors within 50 mils of every VCCIO/VCCINT ball pair, plus one 10uF bulk tantalum per quadrant.

MAX II CPLDs require a single 3.3V supply on VCCINT because the on-chip linear regulator generates the internal 1.8V core rail. Estimated: at 100% toggle rate on all 204 I/Os at 100MHz, dynamic current draw is approximately 200-300mA. Add a 4.7uF bulk capacitor near each VCCINT ball pair, and ensure the 3.3V regulator can supply at least 500mA peak. For battery-backed designs, hold VCCINT above 2.0V during power-down to prevent configuration corruption. The UFM block draws negligible standby current (~50uA).

Do not exceed 3.6V on VCCINT or VCCIO; permanent damage occurs above 4.0V. The JTAG TCK pin should be pulled low through 10kohm when not in use to prevent spurious configuration attempts. When programming in-system via JTAG, ensure the nCONFIG pin is held high via a 10kohm pull-up to VCCINT. Do not connect unused I/O pins directly to ground or VCCIO - allow Quartus II to configure them as input tri-stated with weak pull-up to avoid output contention during in-system programming.

The EPM2210F256C5N supports LVTTL, LVCMOS, PCI, and SSTL-2 I/O standards via the VCCIO bank voltages. For 50MHz+ LVCMOS signals, use 22ohm series-termination resistors at the driver output to dampen reflections on long PCB traces (>50mm). The MultiTrack interconnect architecture has predictable pin-to-pin timing; always check the Quartus II timing report for the longest combinatorial path before committing to a C5 vs C4 speed grade. Hold-time violations are rare but can occur when feeding data into a fast clock - add a 2-input LUT delay element if needed.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliance per Altera/Intel datasheet (N suffix indicates lead-free finish). REACH compliance stated by manufacturer. AEC-Q100 not qualified - choose EPM2210A5N variants for automotive. Halogen-free status not stated in available data [DATA_NEEDED].

Data verified on: 2026-09-12 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EPM2210F256C5N EPM2210F256C5 EPM2210F256C4N EPM2210F256C3N EPM2210GF256I5N MAX II CPLD Complex Programmable Logic Device logic element macrocell Flash configuration memory User Flash Memory (UFM) FineLine BGA 256-ball BGA JTAG IEEE 1149.1 Quartus II MultiVolt I/O LVCMOS LVTTL RoHS REACH 0.18um CMOS industrial I/O expansion bus bridging address decoder power-up sequencing glue logic
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