EPM3256AFC256-10 - 256-Macro CPLD MAX 3000A | Intel / Altera | FBGA-256
MPN: EPM3256AFC256-10 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $30.73 | $30.73 |
| 10 | $28.5 | $285.00 |
| 100 | $25.2 | $2,520.00 |
| 500 | $22.8 | $11,400.00 |
| 1,000 | $19.95 | $19,950.00 |
Drop-in alternatives for EPM3256AFC256-10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM3256AFC256-7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$12.1 / Unit
View Datasheet →EPM3256ATC256-10
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM3256AFC256-10 Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Logic Family | CMOS (EEPROM-based) |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macro Cells | 256 |
| Usable Gates | 5,000 |
| Logic Array Blocks (LABs) | 16 (16 macrocells each) |
| Maximum User I/Os | 161 |
| Propagation Delay (tPD) | 10 ns |
| Internal Counter Frequency (fCNT) | 95.2 MHz |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage Tolerance | 5.0 V tolerant |
| In-System Programmability | Yes (3.3 V ISP via JTAG IEEE 1149.1) |
| Operating Temperature | 0°C to +70°C (Commercial) |
| Package | 256-ball FBGA (Fine-Line BGA) |
| Mounting Type | Surface Mount |
EPM3256AFC256-10 256-ball fbga (fine-line bga) Pin Configuration Guide
Complete pinout information for EPM3256AFC256-10 (256-ball fbga (fine-line bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3256AFC256-10.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3256AFC256-10 is suitable for 6 applications: PCI Bus Interface Glue Logic, Industrial Control Board Logic Consolidation, Address Decoding & Bus Arbitration in Embedded Systems, Peripheral Expansion Bridge for Legacy Microcontrollers, LED Display Multiplexing Driver, Power Supply Sequencing & Monitoring.
PCI Bus Interface Glue Logic
The EPM3256AFC256-10 is well-suited as a PCI Local Bus v2.2 interface bridge in legacy embedded systems. Its 10 ns tPD and 95.2 MHz internal counter frequency meet the PCI 33 MHz bus timing requirements across all loads, allowing engineers to consolidate address decoding, bus arbitration, command/byte-enable translation, and interrupt steering into a single non-volatile device. The 161 user I/Os comfortably accommodate 32-bit address plus 32-bit data multiplexers, four-cycle bursts, and parity generation. ISP via JTAG permits late-stage firmware updates during PCI conformance testing without removing the board.
Recommended
Industrial Control Board Logic Consolidation
Factory automation controllers and PLCs frequently need to replace 8-15 discrete 74HC/74FCT logic packages with a single programmable part. The EPM3256AFC256-10's 256 macrocells and 161 I/Os can absorb optocoupler-to-MCU isolation logic, encoder quadrature decoders, PWM generators, and emergency-stop latches in one chip, cutting PCB area by 50-70% and BOM cost by 30-40%. The 3.3 V core with 5 V tolerant I/Os interfaces directly to legacy 5V industrial sensors and 24V opto-isolated inputs. Commercial 0-70°C temperature range covers most factory-floor enclosures.
Recommended
Address Decoding & Bus Arbitration in Embedded Systems
The EPM3256AFC256-10's deterministic 10 ns tPD makes it an ideal companion to microprocessors, DSPs, and microcontrollers that require chip-select generation, wait-state insertion, and DMA arbitration across multiple peripherals. The MAX 3000A product-term architecture delivers glitch-free outputs independent of routing, eliminating the metastability concerns common in FPGA-based glue logic. With 161 I/Os, the part can simultaneously address SDRAM, flash, UARTs, timers, and GPIO expanders in a 32-bit embedded design. Non-volatile EEPROM configuration means instant boot-up without SPI flash boot devices.
Recommended
Peripheral Expansion Bridge for Legacy Microcontrollers
Older 8051, PIC, and ARM7 microcontrollers with limited address buses benefit from the EPM3256AFC256-10 acting as an external peripheral bridge. The CPLD can decode multiplexed address/data buses, generate chip-select strobes for external SRAM, flash, and peripherals, and provide parallel-to-serial conversion for SPI/I2C peripherals lacking on-chip controllers. Its 161 I/Os handle 8-bit data buses plus extensive control signal multiplexing. ISP via JTAG lets field engineers update bridging firmware as new peripheral ICs are added.
Recommended
LED Display Multiplexing Driver
Large LED matrix displays, stadium scoreboards, and traffic information panels require scan-row and column-driver coordination at refresh rates above 100 Hz to avoid flicker. The EPM3256AFC256-10 can multiplex 16 rows and 32 columns while simultaneously generating PWM dimming waveforms and handling display memory I/O. With 161 user I/Os and a 95.2 MHz internal counter, the device supports up to 16-bit PWM grayscale at 1 kHz refresh. Its 3.3 V core simplifies interface to modern LED driver ICs, while 5V tolerant I/Os bridge to legacy constant-current sink drivers.
Recommended
Power Supply Sequencing & Monitoring
Multi-rail embedded systems (FPGA + DDR + analog + I/O) require carefully ordered power-up and power-down to prevent latch-up and bus contention. The EPM3256AFC256-10 can sequence up to 16 voltage rails with programmable delays, monitor PG (power-good) signals, and drive discrete MOSFETs or ENA pins. Its deterministic 10 ns tPD is far faster than MCU-based sequencers, preventing inrush current spikes during simultaneous rail activation. The 161 user I/Os handle feedback from each rail's PG plus fault outputs to the system reset controller.
Recommended
Recommended Products Summary
Engineering reference data for EPM3256AFC256-10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3256AFC256-7 | EPM3256ATC256-10 |
|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same |
| Macro Cells | 256 | 256 | 256 |
| Usable Gates | 5,000 | 5,000 | 5,000 |
| Propagation Delay (tPD) | 10 ns | 7 ns (faster) | 10 ns |
| Maximum User I/Os | 161 | 161 | 161 |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0°C to +70°C (Commercial) | 0°C to +70°C (Commercial) | 0°C to +70°C (Commercial) |
Key Differentiators
- Highest-density MAX 3000A variant with 161 I/Os (vs EPM3256AQI208-10N)
- Commercial-grade temperature range with PCI-compliant timing (vs EPM3256AQI208-10N (industrial))
- True FBGA-256 pin-compatible drop-in for legacy board revs (vs MAX V 5M256ZE64 (EQFP-144))
Design Notes
The FBGA-256 package uses 1.0 mm ball pitch and requires microvia PCB technology. Allocate a minimum 4-layer stackup with continuous ground plane beneath the package for thermal spreading and controlled impedance. Decoupling requires 0.1 µF X7R ceramic capacitors placed within 5 mm of each VCCINT/VCCIO ball pair, plus 10 µF bulk capacitors on each supply rail at the board edge. Estimate: at full 161 I/O toggle at 10 MHz with 30 pF loads, dynamic current draws can reach 500 mA.
Estimated: At full I/O utilization with all 161 outputs driving 30 pF loads at maximum toggle rate, internal power dissipation can reach 0.8 W. With a typical FBGA-256 θJA of 28°C/W (4-layer JEDEC test board), junction temperature rise above ambient is approximately 22°C. For enclosed industrial enclosures with limited airflow, derate to 75% I/O utilization to maintain junction below 100°C for long-term reliability.
Critical: Never hot-swap or remove JTAG cable during in-system programming - interrupted ISP cycles can corrupt the EEPROM configuration cell and brick the device. Always export the final .pof file and verify checksum after each JTAG write. Do not exceed 3.6 V on VCCINT during power-up transients - the MAX 3000A core does not include internal ESD clamps rated above 4 kV HBM. Add a 3.3 V TVS diode on each supply rail for surge protection in industrial environments.
The 5 V tolerant I/O pins on the EPM3256AFC256-10 do NOT generate 5 V output levels - they only accept 5 V input signals when VCCIO is at 3.3 V. For mixed-voltage systems where the CPLD must drive 5 V receivers, configure VCCIO bank to 3.3 V with external 5 V pull-up resistors on each output line. This adds current draw (typically 1-3 mA per output) and reduces edge rates, so budget propagation delay accordingly.
Recommended: route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a dedicated test bus with a 4-pin header on the PCB edge. Keep JTAG traces under 100 mm total length and route them over a continuous ground plane to avoid noise coupling that can disrupt programming. Include a 10 kΩ pull-up on TCK and a 10 kΩ pull-down on TMS to keep JTAG in a known state during power-up. JTAG chain ordering matters when multiple devices share the bus - place the CPLD closest to the TDO pin of the connector.
Compliance Information
RoHS/REACH compliance status not explicitly stated in distributor data. MAX 3000A family pre-dates strict RoHS enforcement - many date codes are lead-containing; verify per lot CoC. The CPLD is a commercial-grade part and is not AEC-Q100 qualified for automotive use.
