EPM570T144I5 - 440 Macrocell CPLD, 5.4ns TQFP-144 | Altera
MPN: EPM570T144I5 ✓ نشطEPM570T144I5 نظرة عامة
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete glue-logic ICs (74-series gates) and large SRAM FPGAs in the logic-hierarchy. CPLDs use flash or EEPROM configuration cells and a classic AND-OR PLA-style macrocell fabric, delivering deterministic timing, instant-on behavior (typically <1 ms wake-up), and high drive strength. CPLDs are widely used as interface bridges, bus controllers, address decoding, and power-up sequencers, where their deterministic timing and zero-config-latency offer advantages over SRAM FPGAs that require external boot memory and a multi-millisecond configuration phase.
Key features of the EPM570T144I5 include 440 logic elements (macrocells), 8 Kbits of user flash memory (UFM), 116 user I/O, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O support across 1.5 V to 3.3 V standards. The 'I' suffix denotes the industrial temperature range (-40 °C to +100 °C junction), and the '5' speed grade corresponds to the 5.4 ns tPD1 timing specification. MultiCore architecture and Quartus II / Intel Quartus Prime design support enable straightforward design entry, synthesis, and in-system programming via JTAG.
Typical applications include I/O expansion and bus bridging in industrial control, glue-logic consolidation in telecom line cards, address decoding and interrupt steering in embedded SBCs, and power-sequencing networks in ATCA/uTCA platforms. The non-volatile, instant-on nature also makes the EPM570T144I5 well suited to safety-critical applications where deterministic post-reset behavior is mandatory, and to low-volume ASIC replacement scenarios where NRE costs of an ASIC are not justified.
When designing with the EPM570T144I5, observe I/O bank grouping rules - all I/O in a bank must share a single VCCIO supply - and budget at least four dedicated GND pins plus one decoupling capacitor pair (0.1 µF + bulk) per bank. The TQFP-144 exposed-pad footprint requires a continuous ground plane beneath the package to meet the 4-layer PCB thermal envelope.
This page synthesizes distributor pricing, parametric drop-in alternatives within the MAX II EPM570 family, JTAG programming guidance, and bank-by-bank PCB layout notes that are not consolidated in the manufacturer datasheet alone.
بدائل مباشرة لـ EPM570T144I5 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPM570T144I5 (نفس عامل الشكل والبصمة) — يختلف في Process Technology, Operating Temperature, Programming Interface, Package, Configuration Memory.
EPM570T144I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570T144C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570GT144I5
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570T144C5
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570T144C4N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570T144I5 الحدود القصوى والخصائص الكهربائية
| Product Type | CPLD (Complex Programmable Logic Device) |
| Family | MAX II |
| Macrocells (Logic Elements) | 440 |
| User I/O | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| Maximum Frequency (fMAX) | 304 MHz |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Banks | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| العلبة / الحالة | TQFP-144 (144-LQFP, 20 x 20 mm) |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40 °C to +100 °C (industrial) |
| Process Technology | 0.18 µm flash |
| Programming Interface | JTAG (IEEE 1149.1) |
تكوين أطراف EPM570T144I5
| دبوس 1 | I/O — User I/O bank 1 |
| دبوس 2 | I/O — User I/O bank 1 |
| دبوس 3 | I/O — User I/O bank 1 |
| دبوس 4 | I/O — User I/O bank 1 |
| دبوس 5 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 6 | GND — Ground |
| دبوس 7 | I/O — User I/O bank 2 |
| دبوس 8 | I/O — User I/O bank 2 |
| دبوس 9 | I/O — User I/O bank 2 |
| دبوس 10 | I/O — User I/O bank 2 |
| دبوس 11 | GND — Ground |
| دبوس 12 | I/O — User I/O bank 2 |
| دبوس 13 | I/O — User I/O bank 2 |
| دبوس 14 | I/O — User I/O bank 2 |
| دبوس 15 | I/O — User I/O bank 2 |
| دبوس 16 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 17 | I/O — User I/O bank 2 |
| دبوس 18 | I/O — User I/O bank 2 |
| دبوس 19 | I/O — User I/O bank 2 |
| دبوس 20 | I/O — User I/O bank 2 |
| دبوس 21 | GND — Ground |
| دبوس 22 | I/O — User I/O bank 2 |
| دبوس 23 | I/O — User I/O bank 2 |
| دبوس 24 | I/O — User I/O bank 2 |
| دبوس 25 | I/O — User I/O bank 2 |
| دبوس 26 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 27 | I/O — User I/O bank 2 |
| دبوس 28 | I/O — User I/O bank 2 |
| دبوس 29 | I/O — User I/O bank 2 |
| دبوس 30 | I/O — User I/O bank 2 |
| دبوس 31 | GND — Ground |
| دبوس 32 | I/O — User I/O bank 3 |
| دبوس 33 | I/O — User I/O bank 3 |
| دبوس 34 | I/O — User I/O bank 3 |
| دبوس 35 | I/O — User I/O bank 3 |
| دبوس 36 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 37 | I/O — User I/O bank 3 |
| دبوس 38 | TDI — JTAG Test Data In |
| دبوس 39 | TCK — JTAG Test Clock |
| دبوس 40 | TMS — JTAG Test Mode Select |
| دبوس 41 | I/O — User I/O bank 3 |
| دبوس 42 | GND — Ground |
| دبوس 43 | VCCINT — Core supply voltage 1.8 V |
| دبوس 44 | I/O — User I/O bank 3 |
| دبوس 45 | I/O — User I/O bank 3 |
| دبوس 46 | I/O — User I/O bank 3 |
| دبوس 47 | I/O — User I/O bank 3 |
| دبوس 48 | I/O — User I/O bank 3 |
| دبوس 49 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 50 | I/O — User I/O bank 3 |
| دبوس 51 | I/O — User I/O bank 3 |
| دبوس 52 | I/O — User I/O bank 3 |
| دبوس 53 | I/O — User I/O bank 3 |
| دبوس 54 | GND — Ground |
| دبوس 55 | I/O — User I/O bank 3 |
| دبوس 56 | I/O — User I/O bank 3 |
| دبوس 57 | I/O — User I/O bank 3 |
| دبوس 58 | I/O — User I/O bank 3 |
| دبوس 59 | I/O — User I/O bank 3 |
| دبوس 60 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 61 | I/O — User I/O bank 3 |
| دبوس 62 | I/O — User I/O bank 3 |
| دبوس 63 | I/O — User I/O bank 3 |
| دبوس 64 | I/O — User I/O bank 3 |
| دبوس 65 | GND — Ground |
| دبوس 66 | I/O — User I/O bank 3 |
| دبوس 67 | I/O — User I/O bank 3 |
| دبوس 68 | I/O — User I/O bank 3 |
| دبوس 69 | I/O — User I/O bank 3 |
| دبوس 70 | I/O — User I/O bank 3 |
| دبوس 71 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 72 | I/O — User I/O bank 4 |
| دبوس 73 | I/O — User I/O bank 4 |
| دبوس 74 | I/O — User I/O bank 4 |
| دبوس 75 | I/O — User I/O bank 4 |
| دبوس 76 | GND — Ground |
| دبوس 77 | I/O — User I/O bank 4 |
| دبوس 78 | I/O — User I/O bank 4 |
| دبوس 79 | I/O — User I/O bank 4 |
| دبوس 80 | I/O — User I/O bank 4 |
| دبوس 81 | I/O — User I/O bank 4 |
| دبوس 82 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 83 | I/O — User I/O bank 4 |
| دبوس 84 | I/O — User I/O bank 4 |
| دبوس 85 | I/O — User I/O bank 4 |
| دبوس 86 | I/O — User I/O bank 4 |
| دبوس 87 | GND — Ground |
| دبوس 88 | I/O — User I/O bank 4 |
| دبوس 89 | I/O — User I/O bank 4 |
| دبوس 90 | I/O — User I/O bank 4 |
| دبوس 91 | I/O — User I/O bank 4 |
| دبوس 92 | I/O — User I/O bank 4 |
| دبوس 93 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 94 | I/O — User I/O bank 4 |
| دبوس 95 | I/O — User I/O bank 4 |
| دبوس 96 | I/O — User I/O bank 4 |
| دبوس 97 | I/O — User I/O bank 4 |
| دبوس 98 | GND — Ground |
| دبوس 99 | I/O — User I/O bank 4 |
| دبوس 100 | I/O — User I/O bank 4 |
| دبوس 101 | TDO — JTAG Test Data Out |
| دبوس 102 | I/O — User I/O bank 4 |
| دبوس 103 | I/O — User I/O bank 4 |
| دبوس 104 | I/O — User I/O bank 4 |
| دبوس 105 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 106 | I/O — User I/O bank 4 |
| دبوس 107 | I/O — User I/O bank 4 |
| دبوس 108 | I/O — User I/O bank 4 |
| دبوس 109 | I/O — User I/O bank 4 |
| دبوس 110 | I/O — User I/O bank 4 |
| دبوس 111 | GND — Ground |
| دبوس 112 | I/O — User I/O bank 4 |
| دبوس 113 | I/O — User I/O bank 4 |
| دبوس 114 | I/O — User I/O bank 4 |
| دبوس 115 | I/O — User I/O bank 4 |
| دبوس 116 | VCCINT — Core supply voltage 1.8 V |
| دبوس 117 | I/O — User I/O bank 1 |
| دبوس 118 | I/O — User I/O bank 1 |
| دبوس 119 | I/O — User I/O bank 1 |
| دبوس 120 | GND — Ground |
| دبوس 121 | I/O — User I/O bank 1 |
| دبوس 122 | I/O — User I/O bank 1 |
| دبوس 123 | I/O — User I/O bank 1 |
| دبوس 124 | I/O — User I/O bank 1 |
| دبوس 125 | I/O — User I/O bank 1 |
| دبوس 126 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 127 | I/O — User I/O bank 1 |
| دبوس 128 | I/O — User I/O bank 1 |
| دبوس 129 | I/O — User I/O bank 1 |
| دبوس 130 | I/O — User I/O bank 1 |
| دبوس 131 | I/O — User I/O bank 1 |
| دبوس 132 | GND — Ground |
| دبوس 133 | I/O — User I/O bank 1 |
| دبوس 134 | I/O — User I/O bank 1 |
| دبوس 135 | I/O — User I/O bank 1 |
| دبوس 136 | I/O — User I/O bank 1 |
| دبوس 137 | I/O — User I/O bank 1 |
| دبوس 138 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 139 | I/O — User I/O bank 1 |
| دبوس 140 | I/O — User I/O bank 1 |
| دبوس 141 | I/O — User I/O bank 1 |
| دبوس 142 | I/O — User I/O bank 1 |
| دبوس 143 | I/O — User I/O bank 1 |
| دبوس 144 | I/O — User I/O bank 1 |
التطبيقات النموذجية
EPM570T144I5 مناسب لـ 6 التطبيقs: Industrial Control I/O Expansion & Bus Bridging, Telecom Line Card Glue Logic, Power-Up Sequencer for Multi-Rail Systems, ASIC/Discrete-Logic Consolidation, Embedded SBC Address Decoding & Interrupt Routing, Test & Measurement Instrumentation Front-End.
Industrial Control I/O Expansion & Bus Bridging
The EPM570T144I5's 116 user I/O and 440 macrocells make it well suited to industrial control designs that need to bridge between legacy parallel buses (ISA, PC/104, address/data demultiplexed buses) and modern microcontrollers. Its 5.4 ns tPD1 supports glue-logic timing paths up to roughly 185 MHz, sufficient for synchronous address decoding and chip-select generation. Instant-on from non-volatile storage avoids bootloader complications when an MCU has crashed, allowing the CPLD to drive deterministic reset vectors. With the industrial -40 °C to +100 °C temperature range, the part is suitable for factory-floor equipment and outdoor controllers.
موصى به
Telecom Line Card Glue Logic
Telecommunications line cards require deterministic, fast response to interrupt, clock, and reset events. The EPM570T144I5's deterministic timing (no SRAM-config latency), 5.4 ns pin-to-pin delay, and JTAG-driven ISP simplify board bring-up and field firmware updates. The multi-voltage I/O banks (1.5 V to 3.3 V) directly interface legacy 3.3 V line-card ASICs alongside newer 1.8 V DSPs and SERDES chips without external level shifters. Use cases include backplane address decoding, TDM bus multiplexing, and clock distribution gating for ATCA/uTCA platforms.
موصى به
Power-Up Sequencer for Multi-Rail Systems
When system boards require strict power-up and power-down sequencing of multiple rails (e.g., 0.9 V core, 1.5 V DDR, 2.5 V analog, 3.3 V I/O), the EPM570T144I5 provides a deterministic sequencing engine. Its non-volatile flash configuration ensures that on every power cycle the same sequence is enforced within microseconds - critical for ASICs, FPGAs, and processors that require core-before-I/O rails. The 116 I/O are sufficient to drive dozens of enable pins and PG signals. Compared with MCU-based sequencers, the CPLD adds no firmware-update risk and boots in <1 ms.
موصى به
ASIC/Discrete-Logic Consolidation
Designs that historically used dozens of 74-series logic gates, multiplexers, and PAL/GAL devices can consolidate the entire logic block into a single EPM570T144I5, reducing PCB area, BOM cost, and assembly time. With 440 macrocells, the device typically replaces 30-60 discrete SSI/MSI packages. The instant-on flash configuration means no boot PROM is needed, and JTAG ISP allows post-assembly logic changes without reworking the board. The TQFP-144 footprint is well suited to 4-layer designs with standard surface-mount assembly lines.
موصى به
Embedded SBC Address Decoding & Interrupt Routing
Single-board computers (SBCs) and ARM/MIPS-based compute modules often need flexible chip-select and interrupt routing between the host CPU and peripheral chips. The EPM570T144I5's 5.4 ns propagation delay supports decoding at 100 MHz+ host bus speeds, and its 116 I/O easily accommodate 8-16 peripheral chip selects plus 16-32 interrupt/gpio lines. The industrial temperature grade and surface-mount TQFP-144 package are well matched to SBC-style designs with passive cooling. Quartus Prime Lite provides a free development environment.
موصى به
Test & Measurement Instrumentation Front-End
Test and measurement equipment (logic analyzers, protocol exercisers, JTAG/boundary-scan controllers) often needs custom stimulus/response logic tightly coupled to an analog front end. The EPM570T144I5 offers 116 user I/O with 5.4 ns timing to drive pattern generators, mux/demux control signals, and trigger logic. Its instant-on behavior eliminates calibration drift after power cycling, and the JTAG interface allows remote in-system firmware updates in deployed test racks. The industrial temperature range covers most lab and field environments.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPM570T144I5 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPM570T144I5N | EPM570T144C5N | EPM570GT144I5 | EPM570T144C5 | EPM570T144C4N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | ~7 ns (C4 speed grade) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O | 116 | 116 | 116 | 116 | 116 | 116 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) |
| Approx. Unit Price @ 1000 | $22.97 | ~$23-30 | ~$22-28 | ~$23-30 | ~$18-24 | ~$20-26 |
أبرز الفروقات
- 440 macrocells - largest MAX II in TQFP-144 (مقابلEPM240T144 (same TQFP-144 footprint))
- Industrial temperature grade -40C to +100C (مقابلEPM570T144C5N (commercial 0C to +85C))
- Non-volatile flash configuration with instant-on (مقابلMAX 10 10M02 (SRAM-based FPGA-like CPLD))
- Multi-voltage I/O banks 1.5V-3.3V without level shifters (مقابلDiscrete 74-series logic)
ملاحظات التصميم
The EPM570T144I5 requires a clean 1.8 V supply on VCCINT pins (43 and 116) and separate VCCIO supplies for each of the four I/O banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 3 mm of every VCC pin, plus a 10 µF bulk capacitor at the regulator output. The device does not require a specific power-up sequence between VCCINT and VCCIO, but all VCC rails must reach their nominal values within 100 ms to ensure proper configuration from flash. Estimated: at fMAX=304 MHz with all 116 I/O switching, dynamic core current can reach ~80 mA.
The TQFP-144 package has a 0.5 mm pitch and a 20 x 20 mm body, requiring a 4-layer PCB with continuous ground and power planes to meet signal-integrity requirements above 100 MHz. Maintain 50-ohm controlled impedance on critical nets (clock, JTAG) and use 8-mil traces with 8-mil spacing. Place the JTAG header (TCK/TMS/TDO/TDI) on the board edge for in-system programming access. Thermal performance is adequate for typical industrial designs without an explicit heatsink, but a 2 x 2 cm copper pour on the top layer beneath the package is recommended.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - tie TDI and TMS high through 10 kohm pull-ups to VCCIO, and pull TCK low through 10 kohm to GND. Floating JTAG pins can cause ISP failure or unpredictable configuration reload on power-up. Also: the MAX II device configures on every power-up from internal flash, so VCCINT must ramp monotonically; use a supervisor IC if your power tree has soft-start edges. I/O banks must not be left unpowered - unused banks should have their VCCIO tied to a valid rail (1.5 V to 3.3 V) to prevent I/O leakage through floating ESD structures.
Estimated: under worst-case industrial conditions (Tj=100 °C) with all 116 I/O driving 8 mA loads at 50 MHz, total power dissipation is approximately 0.5-0.8 W. The TQFP-144 package has a junction-to-ambient thermal resistance of roughly 35 °C/W on a standard 4-layer JEDEC test board, giving a junction-to-ambient temperature rise of 17-28 °C above ambient. The 'I' industrial temperature grade supports -40 °C to +100 °C junction, sufficient for most sealed enclosure designs. Provide an explicit copper pour or thermal via array beneath the exposed pad area (TQFP-144 has no exposed pad, but top-layer copper flood is recommended).
معلومات الامتثال
RoHS and lead-free status not explicitly stated in verified web data for EPM570T144I5 (non-N suffix). The N-suffix variant EPM570T144I5N is documented as RoHS compliant. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not an automotive-qualified part.
