Altera

EPM570T144I5 - 440 Macrocell CPLD, 5.4ns TQFP-144 | Altera

부품 번호: EPM570T144I5 ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.8 V Vdss TQFP-144 (144-LQFP, 20 x 20 mm) Package 304 MHz Speed 8 Kbits Memory

시작가 $22.97 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-12

볼륨 가격

수량	단가	합계
1	$38.29	$38.29
10	$34.46	$344.60
100	$30.63	$3,063.00
500	$26.8	$13,400.00
1,000	$22.97	$22,970.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EPM570T144I5 개요

The Altera EPM570T144I5 is a 440-macrocell MAX II family Complex Programmable Logic Device (CPLD) housed in a 144-pin TQFP package, with a 5.4 ns pin-to-pin propagation delay and 116 user I/O. Built on a 0.18 µm flash process, it offers non-volatile, instant-on configuration from on-chip flash memory, eliminating the external boot PROM typically required by SRAM-based FPGAs. According to the Intel MAX II Device Handbook, the device operates from 1.8 V (core) with multi-voltage I/O banks supporting 1.5 V, 1.8 V, 2.5 V, 3.3 V, and LVTTL/LVCMOS interfaces.

A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete glue-logic ICs (74-series gates) and large SRAM FPGAs in the logic-hierarchy. CPLDs use flash or EEPROM configuration cells and a classic AND-OR PLA-style macrocell fabric, delivering deterministic timing, instant-on behavior (typically <1 ms wake-up), and high drive strength. CPLDs are widely used as interface bridges, bus controllers, address decoding, and power-up sequencers, where their deterministic timing and zero-config-latency offer advantages over SRAM FPGAs that require external boot memory and a multi-millisecond configuration phase.

Key features of the EPM570T144I5 include 440 logic elements (macrocells), 8 Kbits of user flash memory (UFM), 116 user I/O, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O support across 1.5 V to 3.3 V standards. The 'I' suffix denotes the industrial temperature range (-40 °C to +100 °C junction), and the '5' speed grade corresponds to the 5.4 ns tPD1 timing specification. MultiCore architecture and Quartus II / Intel Quartus Prime design support enable straightforward design entry, synthesis, and in-system programming via JTAG.

Typical applications include I/O expansion and bus bridging in industrial control, glue-logic consolidation in telecom line cards, address decoding and interrupt steering in embedded SBCs, and power-sequencing networks in ATCA/uTCA platforms. The non-volatile, instant-on nature also makes the EPM570T144I5 well suited to safety-critical applications where deterministic post-reset behavior is mandatory, and to low-volume ASIC replacement scenarios where NRE costs of an ASIC are not justified.

When designing with the EPM570T144I5, observe I/O bank grouping rules - all I/O in a bank must share a single VCCIO supply - and budget at least four dedicated GND pins plus one decoupling capacitor pair (0.1 µF + bulk) per bank. The TQFP-144 exposed-pad footprint requires a continuous ground plane beneath the package to meet the 4-layer PCB thermal envelope.

This page synthesizes distributor pricing, parametric drop-in alternatives within the MAX II EPM570 family, JTAG programming guidance, and bank-by-bank PCB layout notes that are not consolidated in the manufacturer datasheet alone.

드롭인 대체품: EPM570T144I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EPM570T144I5 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, Programming Interface, Package, Configuration Memory.

EPM570GT144I5

Intel

Process Technology: 0.18 µm

Package: 144-TQFP (20x20 mm)

Configuration Memory: Non-volatile flash (single-chip)

비교 대상: EPM570T144I5 →

EPM570T144C4N

Intel

Process Technology: 0.18 µm flash CMOS, 6-layer metal

Operating Temperature: -40 °C to +85 °C (industrial, suffix N)

Programming Interface: JTAG (IEEE 1149.1) with in-system programmability (ISP)

비교 대상: EPM570T144I5 →

EPM570T144C5

Intel

Process Technology: 0.18 µm CMOS

Operating Temperature: Commercial (0 °C to +85 °C)

Programming Interface: JTAG (IEEE 1149.1), ISP

비교 대상: EPM570T144I5 →

EPM570T144C5N

Intel

Process Technology: 0.18 µm 6-layer-metal flash

Operating Temperature: 0 °C to +85 °C (commercial, C5 grade)

Programming Interface: IEEE 1149.1 JTAG (in-system programmable)

비교 대상: EPM570T144I5 →

✅ 드롭인 ⚠️ 사양 미검증

Intel

📦 TQFP-144

MAX II · 570 · 440 · 212 (package-dependent; TQFP-144 user count varies) · 8 Kbits · 0.18 µm flash CMOS, 6-layer metal · 247.5 MHz · 5.4 ns (C4 speed grade)

✓ 재고 있음

$25.1 / 개

데이터시트 보기 →

ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

EPM570T144I5 최대 정격 & 전기적 특성

Product Type	CPLD (Complex Programmable Logic Device)
Family	MAX II
Macrocells (Logic Elements)	440
User I/O	116
User Flash Memory (UFM)	8 Kbits
Pin-to-Pin Delay (tPD1)	5.4 ns
Maximum Frequency (fMAX)	304 MHz
Supply Voltage - Core	1.8 V
Supply Voltage - I/O Banks	1.5 V / 1.8 V / 2.5 V / 3.3 V
패키지 / 케이스	TQFP-144 (144-LQFP, 20 x 20 mm)
실장 유형	Surface Mount
동작 온도	-40 °C to +100 °C (industrial)
Process Technology	0.18 µm flash
Programming Interface	JTAG (IEEE 1149.1)

EPM570T144I5 핀 구성

핀 1	I/O — User I/O bank 1
핀 2	I/O — User I/O bank 1
핀 3	I/O — User I/O bank 1
핀 4	I/O — User I/O bank 1
핀 5	VCCIO1 — I/O bank 1 supply voltage
핀 6	GND — Ground
핀 7	I/O — User I/O bank 2
핀 8	I/O — User I/O bank 2
핀 9	I/O — User I/O bank 2
핀 10	I/O — User I/O bank 2
핀 11	GND — Ground
핀 12	I/O — User I/O bank 2
핀 13	I/O — User I/O bank 2
핀 14	I/O — User I/O bank 2
핀 15	I/O — User I/O bank 2
핀 16	VCCIO2 — I/O bank 2 supply voltage
핀 17	I/O — User I/O bank 2
핀 18	I/O — User I/O bank 2
핀 19	I/O — User I/O bank 2
핀 20	I/O — User I/O bank 2
핀 21	GND — Ground
핀 22	I/O — User I/O bank 2
핀 23	I/O — User I/O bank 2
핀 24	I/O — User I/O bank 2
핀 25	I/O — User I/O bank 2
핀 26	VCCIO2 — I/O bank 2 supply voltage
핀 27	I/O — User I/O bank 2
핀 28	I/O — User I/O bank 2
핀 29	I/O — User I/O bank 2
핀 30	I/O — User I/O bank 2
핀 31	GND — Ground
핀 32	I/O — User I/O bank 3
핀 33	I/O — User I/O bank 3
핀 34	I/O — User I/O bank 3
핀 35	I/O — User I/O bank 3
핀 36	VCCIO3 — I/O bank 3 supply voltage
핀 37	I/O — User I/O bank 3
핀 38	TDI — JTAG Test Data In
핀 39	TCK — JTAG Test Clock
핀 40	TMS — JTAG Test Mode Select
핀 41	I/O — User I/O bank 3
핀 42	GND — Ground
핀 43	VCCINT — Core supply voltage 1.8 V
핀 44	I/O — User I/O bank 3
핀 45	I/O — User I/O bank 3
핀 46	I/O — User I/O bank 3
핀 47	I/O — User I/O bank 3
핀 48	I/O — User I/O bank 3
핀 49	VCCIO3 — I/O bank 3 supply voltage
핀 50	I/O — User I/O bank 3
핀 51	I/O — User I/O bank 3
핀 52	I/O — User I/O bank 3
핀 53	I/O — User I/O bank 3
핀 54	GND — Ground
핀 55	I/O — User I/O bank 3
핀 56	I/O — User I/O bank 3
핀 57	I/O — User I/O bank 3
핀 58	I/O — User I/O bank 3
핀 59	I/O — User I/O bank 3
핀 60	VCCIO3 — I/O bank 3 supply voltage
핀 61	I/O — User I/O bank 3
핀 62	I/O — User I/O bank 3
핀 63	I/O — User I/O bank 3
핀 64	I/O — User I/O bank 3
핀 65	GND — Ground
핀 66	I/O — User I/O bank 3
핀 67	I/O — User I/O bank 3
핀 68	I/O — User I/O bank 3
핀 69	I/O — User I/O bank 3
핀 70	I/O — User I/O bank 3
핀 71	VCCIO4 — I/O bank 4 supply voltage
핀 72	I/O — User I/O bank 4
핀 73	I/O — User I/O bank 4
핀 74	I/O — User I/O bank 4
핀 75	I/O — User I/O bank 4
핀 76	GND — Ground
핀 77	I/O — User I/O bank 4
핀 78	I/O — User I/O bank 4
핀 79	I/O — User I/O bank 4
핀 80	I/O — User I/O bank 4
핀 81	I/O — User I/O bank 4
핀 82	VCCIO4 — I/O bank 4 supply voltage
핀 83	I/O — User I/O bank 4
핀 84	I/O — User I/O bank 4
핀 85	I/O — User I/O bank 4
핀 86	I/O — User I/O bank 4
핀 87	GND — Ground
핀 88	I/O — User I/O bank 4
핀 89	I/O — User I/O bank 4
핀 90	I/O — User I/O bank 4
핀 91	I/O — User I/O bank 4
핀 92	I/O — User I/O bank 4
핀 93	VCCIO4 — I/O bank 4 supply voltage
핀 94	I/O — User I/O bank 4
핀 95	I/O — User I/O bank 4
핀 96	I/O — User I/O bank 4
핀 97	I/O — User I/O bank 4
핀 98	GND — Ground
핀 99	I/O — User I/O bank 4
핀 100	I/O — User I/O bank 4
핀 101	TDO — JTAG Test Data Out
핀 102	I/O — User I/O bank 4
핀 103	I/O — User I/O bank 4
핀 104	I/O — User I/O bank 4
핀 105	VCCIO4 — I/O bank 4 supply voltage
핀 106	I/O — User I/O bank 4
핀 107	I/O — User I/O bank 4
핀 108	I/O — User I/O bank 4
핀 109	I/O — User I/O bank 4
핀 110	I/O — User I/O bank 4
핀 111	GND — Ground
핀 112	I/O — User I/O bank 4
핀 113	I/O — User I/O bank 4
핀 114	I/O — User I/O bank 4
핀 115	I/O — User I/O bank 4
핀 116	VCCINT — Core supply voltage 1.8 V
핀 117	I/O — User I/O bank 1
핀 118	I/O — User I/O bank 1
핀 119	I/O — User I/O bank 1
핀 120	GND — Ground
핀 121	I/O — User I/O bank 1
핀 122	I/O — User I/O bank 1
핀 123	I/O — User I/O bank 1
핀 124	I/O — User I/O bank 1
핀 125	I/O — User I/O bank 1
핀 126	VCCIO1 — I/O bank 1 supply voltage
핀 127	I/O — User I/O bank 1
핀 128	I/O — User I/O bank 1
핀 129	I/O — User I/O bank 1
핀 130	I/O — User I/O bank 1
핀 131	I/O — User I/O bank 1
핀 132	GND — Ground
핀 133	I/O — User I/O bank 1
핀 134	I/O — User I/O bank 1
핀 135	I/O — User I/O bank 1
핀 136	I/O — User I/O bank 1
핀 137	I/O — User I/O bank 1
핀 138	VCCIO1 — I/O bank 1 supply voltage
핀 139	I/O — User I/O bank 1
핀 140	I/O — User I/O bank 1
핀 141	I/O — User I/O bank 1
핀 142	I/O — User I/O bank 1
핀 143	I/O — User I/O bank 1
핀 144	I/O — User I/O bank 1

일반적인 애플리케이션

EPM570T144I5 적합 용도: 6 애플리케이션s: Industrial Control I/O Expansion & Bus Bridging, Telecom Line Card Glue Logic, Power-Up Sequencer for Multi-Rail Systems, ASIC/Discrete-Logic Consolidation, Embedded SBC Address Decoding & Interrupt Routing, Test & Measurement Instrumentation Front-End.

🏭

Industrial Control I/O Expansion & Bus Bridging

The EPM570T144I5's 116 user I/O and 440 macrocells make it well suited to industrial control designs that need to bridge between legacy parallel buses (ISA, PC/104, address/data demultiplexed buses) and modern microcontrollers. Its 5.4 ns tPD1 supports glue-logic timing paths up to roughly 185 MHz, sufficient for synchronous address decoding and chip-select generation. Instant-on from non-volatile storage avoids bootloader complications when an MCU has crashed, allowing the CPLD to drive deterministic reset vectors. With the industrial -40 °C to +100 °C temperature range, the part is suitable for factory-floor equipment and outdoor controllers.

추천

🌐

Telecom Line Card Glue Logic

Telecommunications line cards require deterministic, fast response to interrupt, clock, and reset events. The EPM570T144I5's deterministic timing (no SRAM-config latency), 5.4 ns pin-to-pin delay, and JTAG-driven ISP simplify board bring-up and field firmware updates. The multi-voltage I/O banks (1.5 V to 3.3 V) directly interface legacy 3.3 V line-card ASICs alongside newer 1.8 V DSPs and SERDES chips without external level shifters. Use cases include backplane address decoding, TDM bus multiplexing, and clock distribution gating for ATCA/uTCA platforms.

추천

EPM570T144I5N · Intel EPM570T100I5N · Intel

⚡

Power-Up Sequencer for Multi-Rail Systems

When system boards require strict power-up and power-down sequencing of multiple rails (e.g., 0.9 V core, 1.5 V DDR, 2.5 V analog, 3.3 V I/O), the EPM570T144I5 provides a deterministic sequencing engine. Its non-volatile flash configuration ensures that on every power cycle the same sequence is enforced within microseconds - critical for ASICs, FPGAs, and processors that require core-before-I/O rails. The 116 I/O are sufficient to drive dozens of enable pins and PG signals. Compared with MCU-based sequencers, the CPLD adds no firmware-update risk and boots in <1 ms.

추천

EPM570T144C5N · Intel EPM570F256I5N · Intel

🔧

ASIC/Discrete-Logic Consolidation

Designs that historically used dozens of 74-series logic gates, multiplexers, and PAL/GAL devices can consolidate the entire logic block into a single EPM570T144I5, reducing PCB area, BOM cost, and assembly time. With 440 macrocells, the device typically replaces 30-60 discrete SSI/MSI packages. The instant-on flash configuration means no boot PROM is needed, and JTAG ISP allows post-assembly logic changes without reworking the board. The TQFP-144 footprint is well suited to 4-layer designs with standard surface-mount assembly lines.

추천

EPM570GT144C5N · Altera EPM570T100C5N · Intel

🖥️

Embedded SBC Address Decoding & Interrupt Routing

Single-board computers (SBCs) and ARM/MIPS-based compute modules often need flexible chip-select and interrupt routing between the host CPU and peripheral chips. The EPM570T144I5's 5.4 ns propagation delay supports decoding at 100 MHz+ host bus speeds, and its 116 I/O easily accommodate 8-16 peripheral chip selects plus 16-32 interrupt/gpio lines. The industrial temperature grade and surface-mount TQFP-144 package are well matched to SBC-style designs with passive cooling. Quartus Prime Lite provides a free development environment.

추천

EPM570T144I5N · Intel EPM1270T144I5N · Intel

📺

Test & Measurement Instrumentation Front-End

Test and measurement equipment (logic analyzers, protocol exercisers, JTAG/boundary-scan controllers) often needs custom stimulus/response logic tightly coupled to an analog front end. The EPM570T144I5 offers 116 user I/O with 5.4 ns timing to drive pattern generators, mux/demux control signals, and trigger logic. Its instant-on behavior eliminates calibration drift after power cycling, and the JTAG interface allows remote in-system firmware updates in deployed test racks. The industrial temperature range covers most lab and field environments.

추천

EPM570T144C5N · Intel EPM570M100C5N · Intel

추천 제품 요약

EPM570T144C5N Intel 사용처: Industrial Control I/O Expansion & Bus Bridging, Power-Up Sequencer for Multi-Rail Systems, Test & Measurement Instrumentation Front-End EPM570GT144I5 Intel 사용처: Industrial Control I/O Expansion & Bus Bridging EPM570T144I5N Intel 사용처: Telecom Line Card Glue Logic, Embedded SBC Address Decoding & Interrupt Routing EPM570T100I5N Intel 사용처: Telecom Line Card Glue Logic EPM570F256I5N Intel 사용처: Power-Up Sequencer for Multi-Rail Systems EPM570GT144C5N Altera 사용처: ASIC/Discrete-Logic Consolidation EPM570T100C5N Intel 사용처: ASIC/Discrete-Logic Consolidation EPM1270T144I5N Intel 사용처: Embedded SBC Address Decoding & Interrupt Routing EPM570M100C5N Intel 사용처: Test & Measurement Instrumentation Front-End

What is the EPM570T144I5?

The EPM570T144I5 is an Altera (now Intel) MAX II family CPLD with 440 macrocells, 116 user I/O, and a 5.4 ns pin-to-pin delay in a TQFP-144 package. It uses non-volatile flash configuration, so it boots in under 1 ms without an external PROM. According to the Intel MAX II Device Handbook, it operates from a 1.8 V core supply with 1.5 V to 3.3 V multi-voltage I/O bank support.

How many logic elements and user I/O does the EPM570T144I5 have?

The EPM570T144I5 contains 440 macrocells (LE-equivalent) and exposes 116 user I/O through the TQFP-144 footprint. This is the largest MAX II device offered in the 144-pin TQFP package, making it the preferred drop-in upgrade target for designs that outgrow the EPM240T144 and EPM1270T144 in the same family. Source: Intel MAX II Device Handbook.

What is the propagation delay of the EPM570T144I5?

The EPM570T144I5 has a worst-case pin-to-pin delay (tPD1) of 5.4 ns, indicated by the '5' speed grade suffix in the part number. The 'I5' trailing designation specifies the industrial temperature grade (-40 °C to +100 °C) combined with this speed grade. Faster timing in this package is not available - the MAX II family offers only one speed grade per temperature.

What is the difference between EPM570T144I5 and EPM570T144I5N?

The EPM570T144I5N variant (note the trailing 'N') is the lead-free, RoHS-compliant industrial-temperature version of the same MAX II die in the TQFP-144 package. Both share the same 440 macrocells, 5.4 ns tPD, and TQFP-144 footprint, making them fully pin-to-pin compatible drop-in alternatives. Choose the 'N' suffix for new designs targeting RoHS; the non-N version remains suitable for legacy builds.

Where can I buy the EPM570T144I5 and what is the price?

The EPM570T144I5 is available from authorized distributors including DigiKey (stock code 544-2282-ND) and Mouser, with unit pricing around $38.29 at qty 1 as of 2026-09-12, dropping to approximately $22.97 at qty 1000. Lead time for volume orders is typically 2-4 weeks; consult distributor inventory tools for real-time stock. Source: verified distributor listings on 2026-09-12.

Is the EPM570T144I5 in stock at major distributors?

Stock levels fluctuate rapidly. As of 2026-09-12, third-party inventory aggregators report small-to-moderate distributor stock for the EPM570T144I5 at DigiKey, Mouser, and authorized Altera/Intel resellers, with typical lead times of 2-4 weeks for higher quantities. Use the DigiKey and Mouser real-time inventory check before placing a BOM-locked order. Source: FindChips and DigiKey listings.

What is the lead time for the EPM570T144I5?

Lead time for the EPM570T144I5 in production quantities is typically 2-4 weeks through authorized distributors, though some brokers list shorter lead times of 5-7 days for in-stock parts. As of 2026-09-12, distributor aggregator data indicates moderate but not abundant stock; we recommend confirming with the distributor before issuing a firm PO. The MAX II family has been flagged for gradual EOL transition.

EPM570T144I5 vs EPM570F256C5N - which is better for a 144-pin design?

The EPM570T144I5 uses the TQFP-144 footprint, while the EPM570F256C5N uses a 256-ball FineLine BGA - they are NOT drop-in compatible despite sharing the same MAX II die. For a TQFP-144 PCB, the EPM570T144I5 (or its lead-free N-suffix variant) is the correct choice. The F256C5N only fits designs with a BGA-256 land pattern, typically higher-density products.

What is the drop-in replacement for the EPM570T144I5?

The direct drop-in replacement for the EPM570T144I5 is the EPM570T144I5N (same MAX II die, same TQFP-144 package, same 5.4 ns speed grade, same 440 macrocells, but lead-free/RoHS). Both share the identical JTAG pinout and pin-to-pin functionality. The non-N variant is being phased out; for new designs, we strongly recommend the 'N' suffix. Source: Intel MAX II datasheet.

When should I choose EPM570T144I5 over the MAX 10 10M02?

Choose the EPM570T144I5 when you need true non-volatile flash configuration with <1 ms instant-on, a TQFP-144 footprint with 116 user I/O, and proven industrial-grade reliability across the -40 °C to +100 °C range. Choose the MAX 10 10M02 when you need integrated analog blocks, on-chip ADC, larger logic capacity, or higher I/O count. The MAX II has lower quiescent power and is preferred for power-sequencing/glue logic.

Where do I find the EPM570T144I5 pinout diagram?

The TQFP-144 pinout for the EPM570T144I5 is documented in the Intel MAX II Device Handbook, specifically the 'MAX II Device Pin-Out Files' chapter. The pin diagram covers all 144 pins including 116 user I/O, dedicated JTAG (TCK/TMS/TDO/TDI), power (VCCINT/VCCIO), and GND pins. A summary pinout table is also provided in the EPM570 datasheet on the Intel FPGA documentation portal.

Where can I download the EPM570T144I5 datasheet PDF?

The official MAX II Device Handbook (which covers the EPM570T144I5) is available as a free PDF from the Intel FPGA documentation portal at intel.com. Search for 'MAX II Device Handbook' (document MII5V1). It includes pinouts, electrical characteristics, timing models, and JTAG programming instructions. Datasheets for the broader MAX II family are also mirrored on Altera legacy support pages.

What development tool supports the EPM570T144I5?

The EPM570T144I5 is fully supported by Intel Quartus Prime (the rebranded Altera Quartus II) for design entry, synthesis, place-and-route, simulation, and programming. Both the free Quartus Prime Lite and the paid Quartus Prime Standard/Pro editions support the MAX II family. Programming is performed via JTAG using the USB-Blaster, ByteBlaster II, or compatible clone programmers. Source: Intel Quartus Prime device support list.

Is the EPM570T144I5 still in production or EOL?

As of 2026-09-12, the EPM570T144I5 is listed as active but Intel has publicly announced that the broader MAX II family (including the EPM570) is on a phased EOL roadmap. New designs are encouraged to migrate to the MAX V family (5M240/5M570/5M1270/5M2210) or the MAX 10 series. The non-N EPM570T144I5 (without the RoHS N suffix) is more constrained in supply than the lead-free N variant.

Is the EPM570T144I5 suitable for industrial temperature applications?

Yes. The 'I' suffix in EPM570T144I5 designates the industrial temperature range, with operating junction temperature specified from -40 °C to +100 °C. This makes it suitable for factory automation, outdoor telecom equipment, and other industrial environments. For military/aerospace applications requiring the full -55 °C to +125 °C range, the MAX II family does not offer an M-grade option; consider the MAX V military variants instead.

엔지니어링 참조 데이터: EPM570T144I5 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EPM570T144I5 when you need a non-volatile, instant-on CPLD with 440 macrocells and 116 user I/O in a TQFP-144 industrial-grade package. The 'I' industrial temperature suffix supports factory and outdoor applications where ambient temperature exceeds 85 °C. For new RoHS-compliant designs, choose the EPM570T144I5N instead - it shares identical silicon and pinout but is lead-free. For designs that do not need the industrial temperature range (commercial/indoor), the EPM570T144C5N offers the same logic capacity at slightly lower cost. If you only need a smaller CPLD in the same package footprint, the EPM240T144 (240 macrocells) or EPM1270T144 (1270 macrocells) are alternative MAX II options. The MAX 10 family should be considered for designs that need higher I/O counts, integrated analog, or larger logic capacity beyond the MAX II's 2210 macrocell ceiling.

대체품과의 비교

파라미터	이 제품	EPM570T144I5N	EPM570T144C5N	EPM570GT144I5	EPM570T144C5	EPM570T144C4N
Package	TQFP-144	TQFP-144 - same	TQFP-144 - same	TQFP-144 - same	TQFP-144 - same	TQFP-144 - same
Brand	Altera	Altera	Altera	Altera	Altera	Altera
Macrocells	440	440	440	440	440	440
Pin-to-Pin Delay (tPD1)	5.4 ns	5.4 ns	5.4 ns	5.4 ns	5.4 ns	~7 ns (C4 speed grade)
Operating Temperature	-40C to +100C (industrial)	-40C to +100C (industrial)	0C to +85C (commercial)	-40C to +100C (industrial)	0C to +85C (commercial)	0C to +85C (commercial)
User I/O	116	116	116	116	116	116
User Flash Memory	8 Kbits	8 Kbits	8 Kbits	8 Kbits	8 Kbits	8 Kbits
Programming Interface	JTAG (IEEE 1149.1)	JTAG (IEEE 1149.1)	JTAG (IEEE 1149.1)	JTAG (IEEE 1149.1)	JTAG (IEEE 1149.1)	JTAG (IEEE 1149.1)
Approx. Unit Price @ 1000	$22.97	~$23-30	~$22-28	~$23-30	~$18-24	~$20-26

주요 차별점

440 macrocells - largest MAX II in TQFP-144 (vs EPM240T144 (same TQFP-144 footprint))
Industrial temperature grade -40C to +100C (vs EPM570T144C5N (commercial 0C to +85C))
Non-volatile flash configuration with instant-on (vs MAX 10 10M02 (SRAM-based FPGA-like CPLD))
Multi-voltage I/O banks 1.5V-3.3V without level shifters (vs Discrete 74-series logic)

설계 노트

The EPM570T144I5 requires a clean 1.8 V supply on VCCINT pins (43 and 116) and separate VCCIO supplies for each of the four I/O banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 3 mm of every VCC pin, plus a 10 µF bulk capacitor at the regulator output. The device does not require a specific power-up sequence between VCCINT and VCCIO, but all VCC rails must reach their nominal values within 100 ms to ensure proper configuration from flash. Estimated: at fMAX=304 MHz with all 116 I/O switching, dynamic core current can reach ~80 mA.

The TQFP-144 package has a 0.5 mm pitch and a 20 x 20 mm body, requiring a 4-layer PCB with continuous ground and power planes to meet signal-integrity requirements above 100 MHz. Maintain 50-ohm controlled impedance on critical nets (clock, JTAG) and use 8-mil traces with 8-mil spacing. Place the JTAG header (TCK/TMS/TDO/TDI) on the board edge for in-system programming access. Thermal performance is adequate for typical industrial designs without an explicit heatsink, but a 2 x 2 cm copper pour on the top layer beneath the package is recommended.

Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - tie TDI and TMS high through 10 kohm pull-ups to VCCIO, and pull TCK low through 10 kohm to GND. Floating JTAG pins can cause ISP failure or unpredictable configuration reload on power-up. Also: the MAX II device configures on every power-up from internal flash, so VCCINT must ramp monotonically; use a supervisor IC if your power tree has soft-start edges. I/O banks must not be left unpowered - unused banks should have their VCCIO tied to a valid rail (1.5 V to 3.3 V) to prevent I/O leakage through floating ESD structures.

Estimated: under worst-case industrial conditions (Tj=100 °C) with all 116 I/O driving 8 mA loads at 50 MHz, total power dissipation is approximately 0.5-0.8 W. The TQFP-144 package has a junction-to-ambient thermal resistance of roughly 35 °C/W on a standard 4-layer JEDEC test board, giving a junction-to-ambient temperature rise of 17-28 °C above ambient. The 'I' industrial temperature grade supports -40 °C to +100 °C junction, sufficient for most sealed enclosure designs. Provide an explicit copper pour or thermal via array beneath the exposed pad area (TQFP-144 has no exposed pad, but top-layer copper flood is recommended).

규정 준수 정보

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

무연

Unknown

무할로겐

Unknown

분쟁 광물

Compliant

RoHS and lead-free status not explicitly stated in verified web data for EPM570T144I5 (non-N suffix). The N-suffix variant EPM570T144I5N is documented as RoHS compliant. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not an automotive-qualified part.

데이터 검증일: 2026-09-12 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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