EPM570T144I5 - 440 Macrocell CPLD, 5.4ns TQFP-144 | Altera
MPN: EPM570T144I5 ✓ Hoạt độngEPM570T144I5 Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete glue-logic ICs (74-series gates) and large SRAM FPGAs in the logic-hierarchy. CPLDs use flash or EEPROM configuration cells and a classic AND-OR PLA-style macrocell fabric, delivering deterministic timing, instant-on behavior (typically <1 ms wake-up), and high drive strength. CPLDs are widely used as interface bridges, bus controllers, address decoding, and power-up sequencers, where their deterministic timing and zero-config-latency offer advantages over SRAM FPGAs that require external boot memory and a multi-millisecond configuration phase.
Key features of the EPM570T144I5 include 440 logic elements (macrocells), 8 Kbits of user flash memory (UFM), 116 user I/O, JTAG IEEE 1149.1 boundary-scan support, and multi-voltage I/O support across 1.5 V to 3.3 V standards. The 'I' suffix denotes the industrial temperature range (-40 °C to +100 °C junction), and the '5' speed grade corresponds to the 5.4 ns tPD1 timing specification. MultiCore architecture and Quartus II / Intel Quartus Prime design support enable straightforward design entry, synthesis, and in-system programming via JTAG.
Typical applications include I/O expansion and bus bridging in industrial control, glue-logic consolidation in telecom line cards, address decoding and interrupt steering in embedded SBCs, and power-sequencing networks in ATCA/uTCA platforms. The non-volatile, instant-on nature also makes the EPM570T144I5 well suited to safety-critical applications where deterministic post-reset behavior is mandatory, and to low-volume ASIC replacement scenarios where NRE costs of an ASIC are not justified.
When designing with the EPM570T144I5, observe I/O bank grouping rules - all I/O in a bank must share a single VCCIO supply - and budget at least four dedicated GND pins plus one decoupling capacitor pair (0.1 µF + bulk) per bank. The TQFP-144 exposed-pad footprint requires a continuous ground plane beneath the package to meet the 4-layer PCB thermal envelope.
This page synthesizes distributor pricing, parametric drop-in alternatives within the MAX II EPM570 family, JTAG programming guidance, and bank-by-bank PCB layout notes that are not consolidated in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EPM570T144I5 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM570T144I5 (cùng hình factor và footprint) — khác nhau ở Process Technology, Operating Temperature, Programming Interface, Package, Configuration Memory.
EPM570T144I5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T144C5N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570GT144I5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T144C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM570T144C4N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPM570T144I5 Tỷ lệ tối đa & tính chất điện
| Product Type | CPLD (Complex Programmable Logic Device) |
| Family | MAX II |
| Macrocells (Logic Elements) | 440 |
| User I/O | 116 |
| User Flash Memory (UFM) | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5.4 ns |
| Maximum Frequency (fMAX) | 304 MHz |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O Banks | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Hộp / Vỏ | TQFP-144 (144-LQFP, 20 x 20 mm) |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | -40 °C to +100 °C (industrial) |
| Process Technology | 0.18 µm flash |
| Programming Interface | JTAG (IEEE 1149.1) |
Cấu hình chân EPM570T144I5
| Chân 1 | I/O — User I/O bank 1 |
| Chân 2 | I/O — User I/O bank 1 |
| Chân 3 | I/O — User I/O bank 1 |
| Chân 4 | I/O — User I/O bank 1 |
| Chân 5 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 6 | GND — Ground |
| Chân 7 | I/O — User I/O bank 2 |
| Chân 8 | I/O — User I/O bank 2 |
| Chân 9 | I/O — User I/O bank 2 |
| Chân 10 | I/O — User I/O bank 2 |
| Chân 11 | GND — Ground |
| Chân 12 | I/O — User I/O bank 2 |
| Chân 13 | I/O — User I/O bank 2 |
| Chân 14 | I/O — User I/O bank 2 |
| Chân 15 | I/O — User I/O bank 2 |
| Chân 16 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 17 | I/O — User I/O bank 2 |
| Chân 18 | I/O — User I/O bank 2 |
| Chân 19 | I/O — User I/O bank 2 |
| Chân 20 | I/O — User I/O bank 2 |
| Chân 21 | GND — Ground |
| Chân 22 | I/O — User I/O bank 2 |
| Chân 23 | I/O — User I/O bank 2 |
| Chân 24 | I/O — User I/O bank 2 |
| Chân 25 | I/O — User I/O bank 2 |
| Chân 26 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 27 | I/O — User I/O bank 2 |
| Chân 28 | I/O — User I/O bank 2 |
| Chân 29 | I/O — User I/O bank 2 |
| Chân 30 | I/O — User I/O bank 2 |
| Chân 31 | GND — Ground |
| Chân 32 | I/O — User I/O bank 3 |
| Chân 33 | I/O — User I/O bank 3 |
| Chân 34 | I/O — User I/O bank 3 |
| Chân 35 | I/O — User I/O bank 3 |
| Chân 36 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 37 | I/O — User I/O bank 3 |
| Chân 38 | TDI — JTAG Test Data In |
| Chân 39 | TCK — JTAG Test Clock |
| Chân 40 | TMS — JTAG Test Mode Select |
| Chân 41 | I/O — User I/O bank 3 |
| Chân 42 | GND — Ground |
| Chân 43 | VCCINT — Core supply voltage 1.8 V |
| Chân 44 | I/O — User I/O bank 3 |
| Chân 45 | I/O — User I/O bank 3 |
| Chân 46 | I/O — User I/O bank 3 |
| Chân 47 | I/O — User I/O bank 3 |
| Chân 48 | I/O — User I/O bank 3 |
| Chân 49 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 50 | I/O — User I/O bank 3 |
| Chân 51 | I/O — User I/O bank 3 |
| Chân 52 | I/O — User I/O bank 3 |
| Chân 53 | I/O — User I/O bank 3 |
| Chân 54 | GND — Ground |
| Chân 55 | I/O — User I/O bank 3 |
| Chân 56 | I/O — User I/O bank 3 |
| Chân 57 | I/O — User I/O bank 3 |
| Chân 58 | I/O — User I/O bank 3 |
| Chân 59 | I/O — User I/O bank 3 |
| Chân 60 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 61 | I/O — User I/O bank 3 |
| Chân 62 | I/O — User I/O bank 3 |
| Chân 63 | I/O — User I/O bank 3 |
| Chân 64 | I/O — User I/O bank 3 |
| Chân 65 | GND — Ground |
| Chân 66 | I/O — User I/O bank 3 |
| Chân 67 | I/O — User I/O bank 3 |
| Chân 68 | I/O — User I/O bank 3 |
| Chân 69 | I/O — User I/O bank 3 |
| Chân 70 | I/O — User I/O bank 3 |
| Chân 71 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 72 | I/O — User I/O bank 4 |
| Chân 73 | I/O — User I/O bank 4 |
| Chân 74 | I/O — User I/O bank 4 |
| Chân 75 | I/O — User I/O bank 4 |
| Chân 76 | GND — Ground |
| Chân 77 | I/O — User I/O bank 4 |
| Chân 78 | I/O — User I/O bank 4 |
| Chân 79 | I/O — User I/O bank 4 |
| Chân 80 | I/O — User I/O bank 4 |
| Chân 81 | I/O — User I/O bank 4 |
| Chân 82 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 83 | I/O — User I/O bank 4 |
| Chân 84 | I/O — User I/O bank 4 |
| Chân 85 | I/O — User I/O bank 4 |
| Chân 86 | I/O — User I/O bank 4 |
| Chân 87 | GND — Ground |
| Chân 88 | I/O — User I/O bank 4 |
| Chân 89 | I/O — User I/O bank 4 |
| Chân 90 | I/O — User I/O bank 4 |
| Chân 91 | I/O — User I/O bank 4 |
| Chân 92 | I/O — User I/O bank 4 |
| Chân 93 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 94 | I/O — User I/O bank 4 |
| Chân 95 | I/O — User I/O bank 4 |
| Chân 96 | I/O — User I/O bank 4 |
| Chân 97 | I/O — User I/O bank 4 |
| Chân 98 | GND — Ground |
| Chân 99 | I/O — User I/O bank 4 |
| Chân 100 | I/O — User I/O bank 4 |
| Chân 101 | TDO — JTAG Test Data Out |
| Chân 102 | I/O — User I/O bank 4 |
| Chân 103 | I/O — User I/O bank 4 |
| Chân 104 | I/O — User I/O bank 4 |
| Chân 105 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 106 | I/O — User I/O bank 4 |
| Chân 107 | I/O — User I/O bank 4 |
| Chân 108 | I/O — User I/O bank 4 |
| Chân 109 | I/O — User I/O bank 4 |
| Chân 110 | I/O — User I/O bank 4 |
| Chân 111 | GND — Ground |
| Chân 112 | I/O — User I/O bank 4 |
| Chân 113 | I/O — User I/O bank 4 |
| Chân 114 | I/O — User I/O bank 4 |
| Chân 115 | I/O — User I/O bank 4 |
| Chân 116 | VCCINT — Core supply voltage 1.8 V |
| Chân 117 | I/O — User I/O bank 1 |
| Chân 118 | I/O — User I/O bank 1 |
| Chân 119 | I/O — User I/O bank 1 |
| Chân 120 | GND — Ground |
| Chân 121 | I/O — User I/O bank 1 |
| Chân 122 | I/O — User I/O bank 1 |
| Chân 123 | I/O — User I/O bank 1 |
| Chân 124 | I/O — User I/O bank 1 |
| Chân 125 | I/O — User I/O bank 1 |
| Chân 126 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 127 | I/O — User I/O bank 1 |
| Chân 128 | I/O — User I/O bank 1 |
| Chân 129 | I/O — User I/O bank 1 |
| Chân 130 | I/O — User I/O bank 1 |
| Chân 131 | I/O — User I/O bank 1 |
| Chân 132 | GND — Ground |
| Chân 133 | I/O — User I/O bank 1 |
| Chân 134 | I/O — User I/O bank 1 |
| Chân 135 | I/O — User I/O bank 1 |
| Chân 136 | I/O — User I/O bank 1 |
| Chân 137 | I/O — User I/O bank 1 |
| Chân 138 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 139 | I/O — User I/O bank 1 |
| Chân 140 | I/O — User I/O bank 1 |
| Chân 141 | I/O — User I/O bank 1 |
| Chân 142 | I/O — User I/O bank 1 |
| Chân 143 | I/O — User I/O bank 1 |
| Chân 144 | I/O — User I/O bank 1 |
Ứng dụng tiêu biểu
EPM570T144I5 phù hợp cho 6 Áp dụngs: Industrial Control I/O Expansion & Bus Bridging, Telecom Line Card Glue Logic, Power-Up Sequencer for Multi-Rail Systems, ASIC/Discrete-Logic Consolidation, Embedded SBC Address Decoding & Interrupt Routing, Test & Measurement Instrumentation Front-End.
Industrial Control I/O Expansion & Bus Bridging
The EPM570T144I5's 116 user I/O and 440 macrocells make it well suited to industrial control designs that need to bridge between legacy parallel buses (ISA, PC/104, address/data demultiplexed buses) and modern microcontrollers. Its 5.4 ns tPD1 supports glue-logic timing paths up to roughly 185 MHz, sufficient for synchronous address decoding and chip-select generation. Instant-on from non-volatile storage avoids bootloader complications when an MCU has crashed, allowing the CPLD to drive deterministic reset vectors. With the industrial -40 °C to +100 °C temperature range, the part is suitable for factory-floor equipment and outdoor controllers.
Được đề xuất
Telecom Line Card Glue Logic
Telecommunications line cards require deterministic, fast response to interrupt, clock, and reset events. The EPM570T144I5's deterministic timing (no SRAM-config latency), 5.4 ns pin-to-pin delay, and JTAG-driven ISP simplify board bring-up and field firmware updates. The multi-voltage I/O banks (1.5 V to 3.3 V) directly interface legacy 3.3 V line-card ASICs alongside newer 1.8 V DSPs and SERDES chips without external level shifters. Use cases include backplane address decoding, TDM bus multiplexing, and clock distribution gating for ATCA/uTCA platforms.
Được đề xuất
Power-Up Sequencer for Multi-Rail Systems
When system boards require strict power-up and power-down sequencing of multiple rails (e.g., 0.9 V core, 1.5 V DDR, 2.5 V analog, 3.3 V I/O), the EPM570T144I5 provides a deterministic sequencing engine. Its non-volatile flash configuration ensures that on every power cycle the same sequence is enforced within microseconds - critical for ASICs, FPGAs, and processors that require core-before-I/O rails. The 116 I/O are sufficient to drive dozens of enable pins and PG signals. Compared with MCU-based sequencers, the CPLD adds no firmware-update risk and boots in <1 ms.
Được đề xuất
ASIC/Discrete-Logic Consolidation
Designs that historically used dozens of 74-series logic gates, multiplexers, and PAL/GAL devices can consolidate the entire logic block into a single EPM570T144I5, reducing PCB area, BOM cost, and assembly time. With 440 macrocells, the device typically replaces 30-60 discrete SSI/MSI packages. The instant-on flash configuration means no boot PROM is needed, and JTAG ISP allows post-assembly logic changes without reworking the board. The TQFP-144 footprint is well suited to 4-layer designs with standard surface-mount assembly lines.
Được đề xuất
Embedded SBC Address Decoding & Interrupt Routing
Single-board computers (SBCs) and ARM/MIPS-based compute modules often need flexible chip-select and interrupt routing between the host CPU and peripheral chips. The EPM570T144I5's 5.4 ns propagation delay supports decoding at 100 MHz+ host bus speeds, and its 116 I/O easily accommodate 8-16 peripheral chip selects plus 16-32 interrupt/gpio lines. The industrial temperature grade and surface-mount TQFP-144 package are well matched to SBC-style designs with passive cooling. Quartus Prime Lite provides a free development environment.
Được đề xuất
Test & Measurement Instrumentation Front-End
Test and measurement equipment (logic analyzers, protocol exercisers, JTAG/boundary-scan controllers) often needs custom stimulus/response logic tightly coupled to an analog front end. The EPM570T144I5 offers 116 user I/O with 5.4 ns timing to drive pattern generators, mux/demux control signals, and trigger logic. Its instant-on behavior eliminates calibration drift after power cycling, and the JTAG interface allows remote in-system firmware updates in deployed test racks. The industrial temperature range covers most lab and field environments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM570T144I5 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM570T144I5N | EPM570T144C5N | EPM570GT144I5 | EPM570T144C5 | EPM570T144C4N |
|---|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | ~7 ns (C4 speed grade) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/O | 116 | 116 | 116 | 116 | 116 | 116 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) |
| Approx. Unit Price @ 1000 | $22.97 | ~$23-30 | ~$22-28 | ~$23-30 | ~$18-24 | ~$20-26 |
Bảo phân biệt quan trọng
- 440 macrocells - largest MAX II in TQFP-144 (vsEPM240T144 (same TQFP-144 footprint))
- Industrial temperature grade -40C to +100C (vsEPM570T144C5N (commercial 0C to +85C))
- Non-volatile flash configuration with instant-on (vsMAX 10 10M02 (SRAM-based FPGA-like CPLD))
- Multi-voltage I/O banks 1.5V-3.3V without level shifters (vsDiscrete 74-series logic)
Ghi chú thiết kế
The EPM570T144I5 requires a clean 1.8 V supply on VCCINT pins (43 and 116) and separate VCCIO supplies for each of the four I/O banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 3 mm of every VCC pin, plus a 10 µF bulk capacitor at the regulator output. The device does not require a specific power-up sequence between VCCINT and VCCIO, but all VCC rails must reach their nominal values within 100 ms to ensure proper configuration from flash. Estimated: at fMAX=304 MHz with all 116 I/O switching, dynamic core current can reach ~80 mA.
The TQFP-144 package has a 0.5 mm pitch and a 20 x 20 mm body, requiring a 4-layer PCB with continuous ground and power planes to meet signal-integrity requirements above 100 MHz. Maintain 50-ohm controlled impedance on critical nets (clock, JTAG) and use 8-mil traces with 8-mil spacing. Place the JTAG header (TCK/TMS/TDO/TDI) on the board edge for in-system programming access. Thermal performance is adequate for typical industrial designs without an explicit heatsink, but a 2 x 2 cm copper pour on the top layer beneath the package is recommended.
Do not leave JTAG pins (TCK, TMS, TDI, TDO) floating - tie TDI and TMS high through 10 kohm pull-ups to VCCIO, and pull TCK low through 10 kohm to GND. Floating JTAG pins can cause ISP failure or unpredictable configuration reload on power-up. Also: the MAX II device configures on every power-up from internal flash, so VCCINT must ramp monotonically; use a supervisor IC if your power tree has soft-start edges. I/O banks must not be left unpowered - unused banks should have their VCCIO tied to a valid rail (1.5 V to 3.3 V) to prevent I/O leakage through floating ESD structures.
Estimated: under worst-case industrial conditions (Tj=100 °C) with all 116 I/O driving 8 mA loads at 50 MHz, total power dissipation is approximately 0.5-0.8 W. The TQFP-144 package has a junction-to-ambient thermal resistance of roughly 35 °C/W on a standard 4-layer JEDEC test board, giving a junction-to-ambient temperature rise of 17-28 °C above ambient. The 'I' industrial temperature grade supports -40 °C to +100 °C junction, sufficient for most sealed enclosure designs. Provide an explicit copper pour or thermal via array beneath the exposed pad area (TQFP-144 has no exposed pad, but top-layer copper flood is recommended).
Thông tin tuân thủ
RoHS and lead-free status not explicitly stated in verified web data for EPM570T144I5 (non-N suffix). The N-suffix variant EPM570T144I5N is documented as RoHS compliant. AEC-Q100 not applicable - this is a commercial/industrial CPLD, not an automotive-qualified part.
