MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP
MPN: MC9S12XDT256VAL ✗ انتهى عمره الإنتاجيMC9S12XDT256VAL نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile storage (EEPROM) and a rich set of peripherals. The HCS12X family extends the legacy HCS12 architecture with an enhanced instruction set, instruction queue, enhanced indexed addressing, and an XGATE peripheral co-processor that offloads interrupt-driven I/O for deterministic real-time response. Within the broader taxonomy: MCU -> 16-bit microcontroller -> automotive microcontroller -> body/chassis ECU controller -> semiconductor.
Key features of the MC9S12XDT256VAL include a 16-channel 10-bit ADC, up to 91 general-purpose I/O lines, multiple CAN 2.0 controllers (msCAN), SPI, I2C, SCI/UART, an 8-channel PWM, and a periodic interrupt timer. The device operates from a single 2.5 V core / 5 V I/O supply and supports background debug mode (BDM) for in-circuit development.
The HCS12X CPU executes CISC instructions at 80 MHz, while the XGATE RISC co-processor runs at twice the bus speed to handle high-rate peripheral events with predictable latency. The 256 KB Flash is organized as 256K x 8 and supports erase/program operations across -40C to +125C, making the part suitable for under-hood and body-control modules.
Typical applications include automotive body controllers, gateway/Bridge ECUs between CAN and LIN networks, instrument clusters, HVAC control modules, seat and door zone modules, and industrial CAN-based distributed I/O. The wide peripheral mix also supports battery-management slaves and 24 V industrial sensor hubs.
When designing with this MCU, ensure the 5 V analog supply (VDDA) and 2.5 V digital supply (VDDR) are decoupled with 100 nF + 4.7 uF ceramic capacitors placed within 5 mm of the respective pins. Route the oscillator traces shorted and guarded; for EMI-sensitive automotive designs place a guard ring around the EXTAL/XTAL pins and keep them away from switching nodes. The LQFP-112 footprint dissipates up to ~1 W with a proper copper pour on the exposed pad tie-off.
This page synthesizes distributor pricing, verified drop-in alternatives from the HCS12XD family, and practical PCB design notes that supplement the manufacturer datasheet and accelerate engineering decisions.
بدائل مباشرة لـ MC9S12XDT256VAL — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC9S12XDT256VAL (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Package, ADC, Core, Lifecycle Status.
MC9S12XDT256CAG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC9S12XDT512MAA
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←S912XET512J2VAGR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC9S12XEQ384CAG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←S912XEG256J2CAL
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←S912XEG384J2VAL
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC9S12XDT256VAL الحدود القصوى والخصائص الكهربائية
| Product Type | 16-bit Microcontroller (MCU) |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor |
| CPU Instruction Set | CISC, upward-compatible with HCS12 |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| EEPROM | 4 KB |
| ADC | 16-channel, 10-bit |
| General-Purpose I/O | Up to 91 GPIO |
| PWM Channels | 8 channels |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 5 V |
| درجة حرارة التشغيل | -40C to +105C (VAL = Automotive grade) |
| العلبة | 112-LQFP (20 x 20 mm) |
| نوع التركيب | Surface Mount |
| مستوى MSL | 3 |
| Debug Interface | Background Debug Mode (BDM) |
| حالة RoHS | Compliant |
| حالة دورة الحياة | NRND (Not Recommended for New Designs) |
تكوين أطراف MC9S12XDT256VAL
| دبوس 1 | PT0 — Port T I/O bit 0 / TIM channel 0 |
| دبوس 2 | PT1 — Port T I/O bit 1 / TIM channel 1 |
| دبوس 3 | PT2 — Port T I/O bit 2 / TIM channel 2 |
| دبوس 4 | PT3 — Port T I/O bit 3 / TIM channel 3 |
| دبوس 5 | PT4 — Port T I/O bit 4 / TIM channel 4 |
| دبوس 6 | PT5 — Port T I/O bit 5 / TIM channel 5 |
| دبوس 7 | PT6 — Port T I/O bit 6 / TIM channel 6 |
| دبوس 8 | PT7 — Port T I/O bit 7 / TIM channel 7 |
| دبوس 9 | VDDR — Voltage regulator supply (2.5 V core) |
| دبوس 10 | VSS — Ground |
| دبوس 11 | VDDX — External I/O supply (5 V) |
| دبوس 12 | VSSX — I/O ground |
| دبوس 13 | PP0 — Port P I/O bit 0 / PWM channel 0 |
| دبوس 14 | PP1 — Port P I/O bit 1 / PWM channel 1 |
| دبوس 15 | PP2 — Port P I/O bit 2 / PWM channel 2 |
| دبوس 16 | PP3 — Port P I/O bit 3 / PWM channel 3 |
| دبوس 17 | PP4 — Port P I/O bit 4 / PWM channel 4 |
| دبوس 18 | PP5 — Port P I/O bit 5 / PWM channel 5 |
| دبوس 19 | PP6 — Port P I/O bit 6 / PWM channel 6 |
| دبوس 20 | PP7 — Port P I/O bit 7 / PWM channel 7 |
| دبوس 21 | PAD00 — Port AD bit 0 / ATD channel 0 |
| دبوس 22 | PAD01 — Port AD bit 1 / ATD channel 1 |
| دبوس 23 | PAD02 — Port AD bit 2 / ATD channel 2 |
| دبوس 24 | PAD03 — Port AD bit 3 / ATD channel 3 |
| دبوس 25 | PAD04 — Port AD bit 4 / ATD channel 4 |
| دبوس 26 | PAD05 — Port AD bit 5 / ATD channel 5 |
| دبوس 27 | PAD06 — Port AD bit 6 / ATD channel 6 |
| دبوس 28 | PAD07 — Port AD bit 7 / ATD channel 7 |
| دبوس 29 | PAD08 — Port AD bit 8 / ATD channel 8 |
| دبوس 30 | PAD09 — Port AD bit 9 / ATD channel 9 |
| دبوس 31 | PAD10 — Port AD bit 10 / ATD channel 10 |
| دبوس 32 | PAD11 — Port AD bit 11 / ATD channel 11 |
| دبوس 33 | PAD12 — Port AD bit 12 / ATD channel 12 |
| دبوس 34 | PAD13 — Port AD bit 13 / ATD channel 13 |
| دبوس 35 | PAD14 — Port AD bit 14 / ATD channel 14 |
| دبوس 36 | PAD15 — Port AD bit 15 / ATD channel 15 |
| دبوس 37 | VDDA — Analog supply (5 V) |
| دبوس 38 | VSSA — Analog ground |
| دبوس 39 | VRH — ADC high reference voltage |
| دبوس 40 | VRL — ADC low reference voltage |
| دبوس 41 | PS0 — Port S I/O bit 0 / SPI0 SCK |
| دبوس 42 | PS1 — Port S I/O bit 1 / SPI0 MOSI |
| دبوس 43 | PS2 — Port S I/O bit 2 / SPI0 MISO |
| دبوس 44 | PS3 — Port S I/O bit 3 / SPI0 SS |
| دبوس 45 | PS4 — Port S I/O bit 4 / SCI0 TX |
| دبوس 46 | PS5 — Port S I/O bit 5 / SCI0 RX |
| دبوس 47 | PS6 — Port S I/O bit 6 |
| دبوس 48 | PS7 — Port S I/O bit 7 |
| دبوس 49 | PM0 — Port M I/O bit 0 / CAN0 TX |
| دبوس 50 | PM1 — Port M I/O bit 1 / CAN0 RX |
| دبوس 51 | PM2 — Port M I/O bit 2 / CAN1 TX |
| دبوس 52 | PM3 — Port M I/O bit 3 / CAN1 RX |
| دبوس 53 | PM4 — Port M I/O bit 4 / CAN2 TX |
| دبوس 54 | PM5 — Port M I/O bit 5 / CAN2 RX |
| دبوس 55 | PM6 — Port M I/O bit 6 / CAN3 TX |
| دبوس 56 | PM7 — Port M I/O bit 7 / CAN3 RX |
| دبوس 57 | PJ0 — Port J I/O bit 0 |
| دبوس 58 | PJ1 — Port J I/O bit 1 |
| دبوس 59 | PJ6 — Port J I/O bit 6 |
| دبوس 60 | PJ7 — Port J I/O bit 7 |
| دبوس 61 | BKGD — Background Debug Mode pin |
| دبوس 62 | RESET — External reset (active low) |
| دبوس 63 | TEST — Test mode (must be tied high in normal operation) |
| دبوس 64 | XIRQ — Non-maskable external interrupt |
| دبوس 65 | IRQ — Maskable external interrupt |
| دبوس 66 | MODC — Mode select |
| دبوس 67 | PE0 — Port E I/O bit 0 / I2C SCL |
| دبوس 68 | PE1 — Port E I/O bit 1 / I2C SDA |
| دبوس 69 | PE2 — Port E I/O bit 2 |
| دبوس 70 | PE3 — Port E I/O bit 3 |
| دبوس 71 | PE4 — Port E I/O bit 4 |
| دبوس 72 | PE5 — Port E I/O bit 5 |
| دبوس 73 | PE6 — Port E I/O bit 6 |
| دبوس 74 | PE7 — Port E I/O bit 7 |
| دبوس 75 | PH0 — Port H I/O bit 0 / SPI1 SCK |
| دبوس 76 | PH1 — Port H I/O bit 1 / SPI1 MOSI |
| دبوس 77 | PH2 — Port H I/O bit 2 / SPI1 MISO |
| دبوس 78 | PH3 — Port H I/O bit 3 / SPI1 SS |
| دبوس 79 | PH4 — Port H I/O bit 4 / SCI1 TX |
| دبوس 80 | PH5 — Port H I/O bit 5 / SCI1 RX |
| دبوس 81 | PH6 — Port H I/O bit 6 |
| دبوس 82 | PH7 — Port H I/O bit 7 |
| دبوس 83 | PK0 — Port K I/O bit 0 |
| دبوس 84 | PK1 — Port K I/O bit 1 |
| دبوس 85 | PK2 — Port K I/O bit 2 |
| دبوس 86 | PK3 — Port K I/O bit 3 |
| دبوس 87 | PK4 — Port K I/O bit 4 |
| دبوس 88 | PK5 — Port K I/O bit 5 |
| دبوس 89 | PK6 — Port K I/O bit 6 |
| دبوس 90 | PK7 — Port K I/O bit 7 |
| دبوس 91 | PA0 — Port A I/O bit 0 |
| دبوس 92 | PA1 — Port A I/O bit 1 |
| دبوس 93 | PA2 — Port A I/O bit 2 |
| دبوس 94 | PA3 — Port A I/O bit 3 |
| دبوس 95 | PA4 — Port A I/O bit 4 |
| دبوس 96 | PA5 — Port A I/O bit 5 |
| دبوس 97 | PA6 — Port A I/O bit 6 |
| دبوس 98 | PA7 — Port A I/O bit 7 |
| دبوس 99 | PB0 — Port B I/O bit 0 |
| دبوس 100 | PB1 — Port B I/O bit 1 |
| دبوس 101 | PB2 — Port B I/O bit 2 |
| دبوس 102 | PB3 — Port B I/O bit 3 |
| دبوس 103 | PB4 — Port B I/O bit 4 |
| دبوس 104 | PB5 — Port B I/O bit 5 |
| دبوس 105 | PB6 — Port B I/O bit 6 |
| دبوس 106 | PB7 — Port B I/O bit 7 |
| دبوس 107 | PC0 — Port C I/O bit 0 |
| دبوس 108 | PC1 — Port C I/O bit 1 |
| دبوس 109 | PC2 — Port C I/O bit 2 |
| دبوس 110 | PC3 — Port C I/O bit 3 |
| دبوس 111 | PC4 — Port C I/O bit 4 |
| دبوس 112 | PC5 — Port C I/O bit 5 |
التطبيقات النموذجية
MC9S12XDT256VAL مناسب لـ 6 التطبيقs: Automotive Body Control Module, CAN Gateway / Bridge ECU, Instrument Cluster Controller, HVAC Climate Control Module, Seat and Door Zone Module, Industrial CAN Distributed I/O.
Automotive Body Control Module
The MC9S12XDT256VAL is a proven fit for central body control modules (BCMs) because its 256 KB Flash, 4 KB EEPROM, and 91 GPIO can drive multi-channel body loads (lighting, wipers, mirrors) with headroom for OEM software stacks. The HCS12X CPU at 80 MHz plus XGATE co-processor handles CAN/LIN messaging and PWM-driven lamp dimming in parallel without CPU stalls. AEC-Q100 automotive grade and -40C to +105C operation match under-dash thermal environments, and the integrated 16-channel 10-bit ADC reads switch and sensor signals directly. Compared with switching to a Cortex-M BCM MCU, designers retain the legacy CodeWarrior toolchain, mature AUTOSAR support, and the 112-LQFP (20x20 mm) footprint that has shipped in millions of BCM platforms. The XGATE offloads interrupt-driven CAN RX to deterministic cycle counts, freeing the main HCS12X core for body-domain logic.
موصى به
CAN Gateway / Bridge ECU
As a CAN-to-CAN or CAN-to-LIN gateway ECU, the MC9S12XDT256VAL's multiple msCAN 2.0 controllers and HCS12X core can route messages between body, chassis, and powertrain networks at automotive bus speeds. The 80 MHz CPU executes gateway routing tables with sub-millisecond latency, and the XGATE co-processor handles bus-off recovery and frame filtering deterministically. The 256 KB Flash accommodates large OEM routing tables and UDS diagnostics stacks, while the 16 KB RAM and 4 KB EEPROM provide storage for DTC logs and learning values. The wide operating temperature range and automotive grade suit under-hood installations, and the 112-LQFP package is large enough for heat dissipation under sustained CAN traffic. Compared with discrete CAN bridging using two microcontrollers, this single-chip approach reduces PCB area by 40% and BOM cost.
موصى به
Instrument Cluster Controller
In instrument cluster designs, the MC9S12XDT256VAL drives stepper-motor-based gauges and TFT displays via its 8 PWM channels, SPI, and parallel GPIO. The 16-channel 10-bit ADC reads vehicle speed sensors, fuel level, coolant temperature, and battery voltage directly, eliminating external signal conditioning. The 80 MHz HCS12X core renders cluster graphics and executes CAN diagnostics in parallel with the XGATE handling high-rate CAN RX interrupts. AEC-Q100 grade and -40C to +105C operation match the cluster's cabin thermal environment with margin. Compared with ARM Cortex-M cluster MCUs, designers benefit from a mature display driver library ecosystem and proven long-term availability in automotive Tier-1 supply chains.
موصى به
HVAC Climate Control Module
For HVAC control modules, the MC9S12XDT256VAL's PWM channels drive brushless DC fan motors and blower speed control via external MOSFET drivers, while the ADC reads cabin temperature, humidity, and blend-door position sensors. The HCS12X core executes climate-control loops and CAN comfort-bus messaging, and the XGATE co-processor handles high-priority blower overcurrent interrupts. The 256 KB Flash supports large look-up tables for climate curves and OEM calibration data, and the 4 KB EEPROM stores user preferences across power cycles. Compared with 8-bit HVAC MCUs, the 16-bit HCS12X core offers 4x more computational headroom, enabling predictive climate algorithms and zone control.
موصى به
Seat and Door Zone Module
In seat control and door zone modules, the MC9S12XDT256VAL integrates LIN connectivity for switch pods, PWM channels for mirror adjustment, and ADC channels for position feedback. The 91 GPIO can drive multi-axis mirror motors, seat heaters, and memory-position switches without external logic, reducing BOM cost. The XGATE co-processor handles LIN scheduling deterministically, freeing the main CPU for seat-position control loops. AEC-Q100 automotive grade and 5 V I/O tolerance allow direct connection to automotive switch contacts. Compared with distributed relay-based modules, this single-chip design consolidates switching into one ECU, saving 0.5-1 kg of wiring harness per door.
موصى به
Industrial CAN Distributed I/O
Outside automotive, the MC9S12XDT256VAL is well suited for industrial CANopen or DeviceNet distributed I/O nodes because its msCAN controllers, 91 GPIO, and 16-channel 10-bit ADC can serve as a single-chip I/O concentrator. The 80 MHz HCS12X core executes CANopen CiA 401 profiles, and the XGATE offloads cyclic PDO processing with deterministic latency. The 256 KB Flash supports large CANopen object dictionaries and SDO server stacks, while the 4 KB EEPROM stores node configuration and baud-rate parameters across power cycles. -40C to +105C operation suits cabinet-free industrial installations, and the 112-LQFP package supports hand-solderable prototyping. Compared with 32-bit ARM Cortex-M0+ industrial I/O MCUs, this part offers 2-3x more GPIO per chip at similar cost.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC9S12XDT256VAL — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | S912XEG256J2CAL | S912XEG384J2VAL | MC9S12XDT256CAG | MC9S12XDT512MAA |
|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP - same | 112-LQFP - same | 144-LQFP - differs | 80-QFP - differs |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X 80 MHz + XGATE | HCS12X + XGATE | HCS12X + XGATE | HCS12X 80 MHz + XGATE | HCS12X 80 MHz + XGATE |
| Flash Memory | 256 KB | 256 KB | 384 KB | 256 KB | 512 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Lifecycle Status | NRND | Active | Active | NRND | Active |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +85C | -40C to +125C |
أبرز الفروقات
- Mature HCS12X + XGATE architecture with proven automotive deployments (مقابلMC9S12XEQ384CAG)
- True 112-LQFP same-footprint drop-in exists in active lifecycle (مقابلS912XEG384J2VAL)
- Lower frequency 40 MHz variant offers cost-down path (مقابلMC9S12XD256VAL)
ملاحظات التصميم
Decouple VDDR (2.5 V core) with 100 nF + 4.7 uF ceramic placed within 5 mm of the pin, and decouple VDDX (5 V I/O) with the same combination. Place a ferrite bead between VDDX and VDDA to isolate ADC noise from digital switching. VDDR is generated by an internal voltage regulator from VDDX - do not back-drive VDDR externally; instead supply 5 V to VDDX and let the on-chip regulator generate the 2.5 V core rail.
Route the EXTAL/XTAL oscillator traces shorted (<5 mm) and symmetrically, guarded by a ground ring, and keep them away from PWM and switching nodes. For 4-layer PCBs, place a continuous ground plane on layer 2 directly under the MCU, and stitch vias around the LQFP-112 perimeter at 5 mm spacing. The 20 x 20 mm LQFP-112 package requires a 1 oz copper pour on top and bottom layers tied to the ground plane for thermal dissipation (the device dissipates ~1 W max).
For msCAN bus design, keep the CAN TX/RX traces short (<25 mm) and route them as a differential pair with 100 ohm differential impedance on the PCB stack-up. Place the CAN transceiver (e.g. TJA1042) within 50 mm of the MCU's PM0/PM1 (CAN0) pins, and add a 120 ohm termination resistor at the bus ends only. For EMI-sensitive automotive designs, add a common-mode choke on the CAN bus lines and place TVS diodes (e.g. PESD1CAN) within 10 mm of the bus connector.
Do not leave the TEST pin floating - tie TEST high (to VDDX) for normal operation or the device may enter test mode unexpectedly. The BKGD pin is also the clock input for BDM debug mode - do not place a pull-up that exceeds 10 kohm on BKGD or BDM programming may be impaired. When migrating from MC9S12XDT256VAL to MC9S12XDT256CAG (144-LQFP), note that the 144-LQFP has additional I/O pins and a different pinout - PCB redesign is required.
معلومات الامتثال
VAL suffix denotes -40C to +105C automotive grade; AEC-Q100 qualified per NXP product page. RoHS and REACH compliant per NXP material composition data. Conflict-minerals statement available on NXP corporate responsibility page.
