MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP
N.º da peça: MC9S12XDT256VAL ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.38 | $14,38 |
| 10 | $12.94 | $129,40 |
| 100 | $11.5 | $1.150,00 |
| 500 | $10.35 | $5.175,00 |
| 1.000 | $9.2 | $9.200,00 |
MC9S12XDT256VAL Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile storage (EEPROM) and a rich set of peripherals. The HCS12X family extends the legacy HCS12 architecture with an enhanced instruction set, instruction queue, enhanced indexed addressing, and an XGATE peripheral co-processor that offloads interrupt-driven I/O for deterministic real-time response. Within the broader taxonomy: MCU -> 16-bit microcontroller -> automotive microcontroller -> body/chassis ECU controller -> semiconductor.
Key features of the MC9S12XDT256VAL include a 16-channel 10-bit ADC, up to 91 general-purpose I/O lines, multiple CAN 2.0 controllers (msCAN), SPI, I2C, SCI/UART, an 8-channel PWM, and a periodic interrupt timer. The device operates from a single 2.5 V core / 5 V I/O supply and supports background debug mode (BDM) for in-circuit development.
The HCS12X CPU executes CISC instructions at 80 MHz, while the XGATE RISC co-processor runs at twice the bus speed to handle high-rate peripheral events with predictable latency. The 256 KB Flash is organized as 256K x 8 and supports erase/program operations across -40C to +125C, making the part suitable for under-hood and body-control modules.
Typical applications include automotive body controllers, gateway/Bridge ECUs between CAN and LIN networks, instrument clusters, HVAC control modules, seat and door zone modules, and industrial CAN-based distributed I/O. The wide peripheral mix also supports battery-management slaves and 24 V industrial sensor hubs.
When designing with this MCU, ensure the 5 V analog supply (VDDA) and 2.5 V digital supply (VDDR) are decoupled with 100 nF + 4.7 uF ceramic capacitors placed within 5 mm of the respective pins. Route the oscillator traces shorted and guarded; for EMI-sensitive automotive designs place a guard ring around the EXTAL/XTAL pins and keep them away from switching nodes. The LQFP-112 footprint dissipates up to ~1 W with a proper copper pour on the exposed pad tie-off.
This page synthesizes distributor pricing, verified drop-in alternatives from the HCS12XD family, and practical PCB design notes that supplement the manufacturer datasheet and accelerate engineering decisions.
Alternativas drop-in para MC9S12XDT256VAL — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC9S12XDT256VAL (mesmo formato e footprint) — diferindo em Operating Temperature, Package, ADC, Core, Lifecycle Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC9S12XDT256CAG
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →MC9S12XDT512MAA
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →S912XET512J2VAGR
✅ Drop-In✓ Em estoque
$1 / unidade
Ver ficha técnica →MC9S12XEQ384CAG
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →S912XEG256J2CAL
✅ Drop-In✓ Em estoque
$15.4 / unidade
Ver ficha técnica →S912XEG384J2VAL
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →MC9S12XDT256VAL Classificações máximas e características elétricas
| Product Type | 16-bit Microcontroller (MCU) |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor |
| CPU Instruction Set | CISC, upward-compatible with HCS12 |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| EEPROM | 4 KB |
| ADC | 16-channel, 10-bit |
| General-Purpose I/O | Up to 91 GPIO |
| PWM Channels | 8 channels |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 5 V |
| Temperatura de operação | -40C to +105C (VAL = Automotive grade) |
| Encapsulamento | 112-LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Debug Interface | Background Debug Mode (BDM) |
| Status RoHS | Compliant |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) |
Configuração de pinos do MC9S12XDT256VAL
| Pino 1 | PT0 — Port T I/O bit 0 / TIM channel 0 |
| Pino 2 | PT1 — Port T I/O bit 1 / TIM channel 1 |
| Pino 3 | PT2 — Port T I/O bit 2 / TIM channel 2 |
| Pino 4 | PT3 — Port T I/O bit 3 / TIM channel 3 |
| Pino 5 | PT4 — Port T I/O bit 4 / TIM channel 4 |
| Pino 6 | PT5 — Port T I/O bit 5 / TIM channel 5 |
| Pino 7 | PT6 — Port T I/O bit 6 / TIM channel 6 |
| Pino 8 | PT7 — Port T I/O bit 7 / TIM channel 7 |
| Pino 9 | VDDR — Voltage regulator supply (2.5 V core) |
| Pino 10 | VSS — Ground |
| Pino 11 | VDDX — External I/O supply (5 V) |
| Pino 12 | VSSX — I/O ground |
| Pino 13 | PP0 — Port P I/O bit 0 / PWM channel 0 |
| Pino 14 | PP1 — Port P I/O bit 1 / PWM channel 1 |
| Pino 15 | PP2 — Port P I/O bit 2 / PWM channel 2 |
| Pino 16 | PP3 — Port P I/O bit 3 / PWM channel 3 |
| Pino 17 | PP4 — Port P I/O bit 4 / PWM channel 4 |
| Pino 18 | PP5 — Port P I/O bit 5 / PWM channel 5 |
| Pino 19 | PP6 — Port P I/O bit 6 / PWM channel 6 |
| Pino 20 | PP7 — Port P I/O bit 7 / PWM channel 7 |
| Pino 21 | PAD00 — Port AD bit 0 / ATD channel 0 |
| Pino 22 | PAD01 — Port AD bit 1 / ATD channel 1 |
| Pino 23 | PAD02 — Port AD bit 2 / ATD channel 2 |
| Pino 24 | PAD03 — Port AD bit 3 / ATD channel 3 |
| Pino 25 | PAD04 — Port AD bit 4 / ATD channel 4 |
| Pino 26 | PAD05 — Port AD bit 5 / ATD channel 5 |
| Pino 27 | PAD06 — Port AD bit 6 / ATD channel 6 |
| Pino 28 | PAD07 — Port AD bit 7 / ATD channel 7 |
| Pino 29 | PAD08 — Port AD bit 8 / ATD channel 8 |
| Pino 30 | PAD09 — Port AD bit 9 / ATD channel 9 |
| Pino 31 | PAD10 — Port AD bit 10 / ATD channel 10 |
| Pino 32 | PAD11 — Port AD bit 11 / ATD channel 11 |
| Pino 33 | PAD12 — Port AD bit 12 / ATD channel 12 |
| Pino 34 | PAD13 — Port AD bit 13 / ATD channel 13 |
| Pino 35 | PAD14 — Port AD bit 14 / ATD channel 14 |
| Pino 36 | PAD15 — Port AD bit 15 / ATD channel 15 |
| Pino 37 | VDDA — Analog supply (5 V) |
| Pino 38 | VSSA — Analog ground |
| Pino 39 | VRH — ADC high reference voltage |
| Pino 40 | VRL — ADC low reference voltage |
| Pino 41 | PS0 — Port S I/O bit 0 / SPI0 SCK |
| Pino 42 | PS1 — Port S I/O bit 1 / SPI0 MOSI |
| Pino 43 | PS2 — Port S I/O bit 2 / SPI0 MISO |
| Pino 44 | PS3 — Port S I/O bit 3 / SPI0 SS |
| Pino 45 | PS4 — Port S I/O bit 4 / SCI0 TX |
| Pino 46 | PS5 — Port S I/O bit 5 / SCI0 RX |
| Pino 47 | PS6 — Port S I/O bit 6 |
| Pino 48 | PS7 — Port S I/O bit 7 |
| Pino 49 | PM0 — Port M I/O bit 0 / CAN0 TX |
| Pino 50 | PM1 — Port M I/O bit 1 / CAN0 RX |
| Pino 51 | PM2 — Port M I/O bit 2 / CAN1 TX |
| Pino 52 | PM3 — Port M I/O bit 3 / CAN1 RX |
| Pino 53 | PM4 — Port M I/O bit 4 / CAN2 TX |
| Pino 54 | PM5 — Port M I/O bit 5 / CAN2 RX |
| Pino 55 | PM6 — Port M I/O bit 6 / CAN3 TX |
| Pino 56 | PM7 — Port M I/O bit 7 / CAN3 RX |
| Pino 57 | PJ0 — Port J I/O bit 0 |
| Pino 58 | PJ1 — Port J I/O bit 1 |
| Pino 59 | PJ6 — Port J I/O bit 6 |
| Pino 60 | PJ7 — Port J I/O bit 7 |
| Pino 61 | BKGD — Background Debug Mode pin |
| Pino 62 | RESET — External reset (active low) |
| Pino 63 | TEST — Test mode (must be tied high in normal operation) |
| Pino 64 | XIRQ — Non-maskable external interrupt |
| Pino 65 | IRQ — Maskable external interrupt |
| Pino 66 | MODC — Mode select |
| Pino 67 | PE0 — Port E I/O bit 0 / I2C SCL |
| Pino 68 | PE1 — Port E I/O bit 1 / I2C SDA |
| Pino 69 | PE2 — Port E I/O bit 2 |
| Pino 70 | PE3 — Port E I/O bit 3 |
| Pino 71 | PE4 — Port E I/O bit 4 |
| Pino 72 | PE5 — Port E I/O bit 5 |
| Pino 73 | PE6 — Port E I/O bit 6 |
| Pino 74 | PE7 — Port E I/O bit 7 |
| Pino 75 | PH0 — Port H I/O bit 0 / SPI1 SCK |
| Pino 76 | PH1 — Port H I/O bit 1 / SPI1 MOSI |
| Pino 77 | PH2 — Port H I/O bit 2 / SPI1 MISO |
| Pino 78 | PH3 — Port H I/O bit 3 / SPI1 SS |
| Pino 79 | PH4 — Port H I/O bit 4 / SCI1 TX |
| Pino 80 | PH5 — Port H I/O bit 5 / SCI1 RX |
| Pino 81 | PH6 — Port H I/O bit 6 |
| Pino 82 | PH7 — Port H I/O bit 7 |
| Pino 83 | PK0 — Port K I/O bit 0 |
| Pino 84 | PK1 — Port K I/O bit 1 |
| Pino 85 | PK2 — Port K I/O bit 2 |
| Pino 86 | PK3 — Port K I/O bit 3 |
| Pino 87 | PK4 — Port K I/O bit 4 |
| Pino 88 | PK5 — Port K I/O bit 5 |
| Pino 89 | PK6 — Port K I/O bit 6 |
| Pino 90 | PK7 — Port K I/O bit 7 |
| Pino 91 | PA0 — Port A I/O bit 0 |
| Pino 92 | PA1 — Port A I/O bit 1 |
| Pino 93 | PA2 — Port A I/O bit 2 |
| Pino 94 | PA3 — Port A I/O bit 3 |
| Pino 95 | PA4 — Port A I/O bit 4 |
| Pino 96 | PA5 — Port A I/O bit 5 |
| Pino 97 | PA6 — Port A I/O bit 6 |
| Pino 98 | PA7 — Port A I/O bit 7 |
| Pino 99 | PB0 — Port B I/O bit 0 |
| Pino 100 | PB1 — Port B I/O bit 1 |
| Pino 101 | PB2 — Port B I/O bit 2 |
| Pino 102 | PB3 — Port B I/O bit 3 |
| Pino 103 | PB4 — Port B I/O bit 4 |
| Pino 104 | PB5 — Port B I/O bit 5 |
| Pino 105 | PB6 — Port B I/O bit 6 |
| Pino 106 | PB7 — Port B I/O bit 7 |
| Pino 107 | PC0 — Port C I/O bit 0 |
| Pino 108 | PC1 — Port C I/O bit 1 |
| Pino 109 | PC2 — Port C I/O bit 2 |
| Pino 110 | PC3 — Port C I/O bit 3 |
| Pino 111 | PC4 — Port C I/O bit 4 |
| Pino 112 | PC5 — Port C I/O bit 5 |
Aplicações típicas
MC9S12XDT256VAL é adequado para 6 aplicaçãos: Automotive Body Control Module, CAN Gateway / Bridge ECU, Instrument Cluster Controller, HVAC Climate Control Module, Seat and Door Zone Module, Industrial CAN Distributed I/O.
Automotive Body Control Module
The MC9S12XDT256VAL is a proven fit for central body control modules (BCMs) because its 256 KB Flash, 4 KB EEPROM, and 91 GPIO can drive multi-channel body loads (lighting, wipers, mirrors) with headroom for OEM software stacks. The HCS12X CPU at 80 MHz plus XGATE co-processor handles CAN/LIN messaging and PWM-driven lamp dimming in parallel without CPU stalls. AEC-Q100 automotive grade and -40C to +105C operation match under-dash thermal environments, and the integrated 16-channel 10-bit ADC reads switch and sensor signals directly. Compared with switching to a Cortex-M BCM MCU, designers retain the legacy CodeWarrior toolchain, mature AUTOSAR support, and the 112-LQFP (20x20 mm) footprint that has shipped in millions of BCM platforms. The XGATE offloads interrupt-driven CAN RX to deterministic cycle counts, freeing the main HCS12X core for body-domain logic.
Recomendado
CAN Gateway / Bridge ECU
As a CAN-to-CAN or CAN-to-LIN gateway ECU, the MC9S12XDT256VAL's multiple msCAN 2.0 controllers and HCS12X core can route messages between body, chassis, and powertrain networks at automotive bus speeds. The 80 MHz CPU executes gateway routing tables with sub-millisecond latency, and the XGATE co-processor handles bus-off recovery and frame filtering deterministically. The 256 KB Flash accommodates large OEM routing tables and UDS diagnostics stacks, while the 16 KB RAM and 4 KB EEPROM provide storage for DTC logs and learning values. The wide operating temperature range and automotive grade suit under-hood installations, and the 112-LQFP package is large enough for heat dissipation under sustained CAN traffic. Compared with discrete CAN bridging using two microcontrollers, this single-chip approach reduces PCB area by 40% and BOM cost.
Recomendado
Instrument Cluster Controller
In instrument cluster designs, the MC9S12XDT256VAL drives stepper-motor-based gauges and TFT displays via its 8 PWM channels, SPI, and parallel GPIO. The 16-channel 10-bit ADC reads vehicle speed sensors, fuel level, coolant temperature, and battery voltage directly, eliminating external signal conditioning. The 80 MHz HCS12X core renders cluster graphics and executes CAN diagnostics in parallel with the XGATE handling high-rate CAN RX interrupts. AEC-Q100 grade and -40C to +105C operation match the cluster's cabin thermal environment with margin. Compared with ARM Cortex-M cluster MCUs, designers benefit from a mature display driver library ecosystem and proven long-term availability in automotive Tier-1 supply chains.
Recomendado
HVAC Climate Control Module
For HVAC control modules, the MC9S12XDT256VAL's PWM channels drive brushless DC fan motors and blower speed control via external MOSFET drivers, while the ADC reads cabin temperature, humidity, and blend-door position sensors. The HCS12X core executes climate-control loops and CAN comfort-bus messaging, and the XGATE co-processor handles high-priority blower overcurrent interrupts. The 256 KB Flash supports large look-up tables for climate curves and OEM calibration data, and the 4 KB EEPROM stores user preferences across power cycles. Compared with 8-bit HVAC MCUs, the 16-bit HCS12X core offers 4x more computational headroom, enabling predictive climate algorithms and zone control.
Recomendado
Seat and Door Zone Module
In seat control and door zone modules, the MC9S12XDT256VAL integrates LIN connectivity for switch pods, PWM channels for mirror adjustment, and ADC channels for position feedback. The 91 GPIO can drive multi-axis mirror motors, seat heaters, and memory-position switches without external logic, reducing BOM cost. The XGATE co-processor handles LIN scheduling deterministically, freeing the main CPU for seat-position control loops. AEC-Q100 automotive grade and 5 V I/O tolerance allow direct connection to automotive switch contacts. Compared with distributed relay-based modules, this single-chip design consolidates switching into one ECU, saving 0.5-1 kg of wiring harness per door.
Recomendado
Industrial CAN Distributed I/O
Outside automotive, the MC9S12XDT256VAL is well suited for industrial CANopen or DeviceNet distributed I/O nodes because its msCAN controllers, 91 GPIO, and 16-channel 10-bit ADC can serve as a single-chip I/O concentrator. The 80 MHz HCS12X core executes CANopen CiA 401 profiles, and the XGATE offloads cyclic PDO processing with deterministic latency. The 256 KB Flash supports large CANopen object dictionaries and SDO server stacks, while the 4 KB EEPROM stores node configuration and baud-rate parameters across power cycles. -40C to +105C operation suits cabinet-free industrial installations, and the 112-LQFP package supports hand-solderable prototyping. Compared with 32-bit ARM Cortex-M0+ industrial I/O MCUs, this part offers 2-3x more GPIO per chip at similar cost.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC9S12XDT256VAL — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | S912XEG256J2CAL | S912XEG384J2VAL | MC9S12XDT256CAG | MC9S12XDT512MAA |
|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP - same | 112-LQFP - same | 144-LQFP - differs | 80-QFP - differs |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X 80 MHz + XGATE | HCS12X + XGATE | HCS12X + XGATE | HCS12X 80 MHz + XGATE | HCS12X 80 MHz + XGATE |
| Flash Memory | 256 KB | 256 KB | 384 KB | 256 KB | 512 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Lifecycle Status | NRND | Active | Active | NRND | Active |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +85C | -40C to +125C |
Principais diferenciais
- Mature HCS12X + XGATE architecture with proven automotive deployments (vs MC9S12XEQ384CAG)
- True 112-LQFP same-footprint drop-in exists in active lifecycle (vs S912XEG384J2VAL)
- Lower frequency 40 MHz variant offers cost-down path (vs MC9S12XD256VAL)
Notas de projeto
Decouple VDDR (2.5 V core) with 100 nF + 4.7 uF ceramic placed within 5 mm of the pin, and decouple VDDX (5 V I/O) with the same combination. Place a ferrite bead between VDDX and VDDA to isolate ADC noise from digital switching. VDDR is generated by an internal voltage regulator from VDDX - do not back-drive VDDR externally; instead supply 5 V to VDDX and let the on-chip regulator generate the 2.5 V core rail.
Route the EXTAL/XTAL oscillator traces shorted (<5 mm) and symmetrically, guarded by a ground ring, and keep them away from PWM and switching nodes. For 4-layer PCBs, place a continuous ground plane on layer 2 directly under the MCU, and stitch vias around the LQFP-112 perimeter at 5 mm spacing. The 20 x 20 mm LQFP-112 package requires a 1 oz copper pour on top and bottom layers tied to the ground plane for thermal dissipation (the device dissipates ~1 W max).
For msCAN bus design, keep the CAN TX/RX traces short (<25 mm) and route them as a differential pair with 100 ohm differential impedance on the PCB stack-up. Place the CAN transceiver (e.g. TJA1042) within 50 mm of the MCU's PM0/PM1 (CAN0) pins, and add a 120 ohm termination resistor at the bus ends only. For EMI-sensitive automotive designs, add a common-mode choke on the CAN bus lines and place TVS diodes (e.g. PESD1CAN) within 10 mm of the bus connector.
Do not leave the TEST pin floating - tie TEST high (to VDDX) for normal operation or the device may enter test mode unexpectedly. The BKGD pin is also the clock input for BDM debug mode - do not place a pull-up that exceeds 10 kohm on BKGD or BDM programming may be impaired. When migrating from MC9S12XDT256VAL to MC9S12XDT256CAG (144-LQFP), note that the 144-LQFP has additional I/O pins and a different pinout - PCB redesign is required.
Informações de conformidade
VAL suffix denotes -40C to +105C automotive grade; AEC-Q100 qualified per NXP product page. RoHS and REACH compliant per NXP material composition data. Conflict-minerals statement available on NXP corporate responsibility page.
