MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP
Teilenummer: MC9S12XDT256VAL ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.38 | $14,38 |
| 10 | $12.94 | $129,40 |
| 100 | $11.5 | $1.150,00 |
| 500 | $10.35 | $5.175,00 |
| 1.000 | $9.2 | $9.200,00 |
MC9S12XDT256VAL Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile storage (EEPROM) and a rich set of peripherals. The HCS12X family extends the legacy HCS12 architecture with an enhanced instruction set, instruction queue, enhanced indexed addressing, and an XGATE peripheral co-processor that offloads interrupt-driven I/O for deterministic real-time response. Within the broader taxonomy: MCU -> 16-bit microcontroller -> automotive microcontroller -> body/chassis ECU controller -> semiconductor.
Key features of the MC9S12XDT256VAL include a 16-channel 10-bit ADC, up to 91 general-purpose I/O lines, multiple CAN 2.0 controllers (msCAN), SPI, I2C, SCI/UART, an 8-channel PWM, and a periodic interrupt timer. The device operates from a single 2.5 V core / 5 V I/O supply and supports background debug mode (BDM) for in-circuit development.
The HCS12X CPU executes CISC instructions at 80 MHz, while the XGATE RISC co-processor runs at twice the bus speed to handle high-rate peripheral events with predictable latency. The 256 KB Flash is organized as 256K x 8 and supports erase/program operations across -40C to +125C, making the part suitable for under-hood and body-control modules.
Typical applications include automotive body controllers, gateway/Bridge ECUs between CAN and LIN networks, instrument clusters, HVAC control modules, seat and door zone modules, and industrial CAN-based distributed I/O. The wide peripheral mix also supports battery-management slaves and 24 V industrial sensor hubs.
When designing with this MCU, ensure the 5 V analog supply (VDDA) and 2.5 V digital supply (VDDR) are decoupled with 100 nF + 4.7 uF ceramic capacitors placed within 5 mm of the respective pins. Route the oscillator traces shorted and guarded; for EMI-sensitive automotive designs place a guard ring around the EXTAL/XTAL pins and keep them away from switching nodes. The LQFP-112 footprint dissipates up to ~1 W with a proper copper pour on the exposed pad tie-off.
This page synthesizes distributor pricing, verified drop-in alternatives from the HCS12XD family, and practical PCB design notes that supplement the manufacturer datasheet and accelerate engineering decisions.
Drop-in-Alternativen für MC9S12XDT256VAL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XDT256VAL (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, ADC, Core, Lifecycle Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12XDT256CAG
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →MC9S12XDT512MAA
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S912XET512J2VAGR
✅ Drop-In✓ Auf Lager
$1 / Stück
Datenblatt ansehen →MC9S12XEQ384CAG
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →S912XEG256J2CAL
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →S912XEG384J2VAL
✅ Drop-In✓ Auf Lager
$17.8 / Stück
Datenblatt ansehen →MC9S12XDT256VAL Grenzwerte & elektrische Eigenschaften
| Product Type | 16-bit Microcontroller (MCU) |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor |
| CPU Instruction Set | CISC, upward-compatible with HCS12 |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| EEPROM | 4 KB |
| ADC | 16-channel, 10-bit |
| General-Purpose I/O | Up to 91 GPIO |
| PWM Channels | 8 channels |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 5 V |
| Betriebstemperatur | -40C to +105C (VAL = Automotive grade) |
| Gehäuse | 112-LQFP (20 x 20 mm) |
| Montageart | Surface Mount |
| MSL-Level | 3 |
| Debug Interface | Background Debug Mode (BDM) |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) |
MC9S12XDT256VAL Pin-Konfiguration
| Pin 1 | PT0 — Port T I/O bit 0 / TIM channel 0 |
| Pin 2 | PT1 — Port T I/O bit 1 / TIM channel 1 |
| Pin 3 | PT2 — Port T I/O bit 2 / TIM channel 2 |
| Pin 4 | PT3 — Port T I/O bit 3 / TIM channel 3 |
| Pin 5 | PT4 — Port T I/O bit 4 / TIM channel 4 |
| Pin 6 | PT5 — Port T I/O bit 5 / TIM channel 5 |
| Pin 7 | PT6 — Port T I/O bit 6 / TIM channel 6 |
| Pin 8 | PT7 — Port T I/O bit 7 / TIM channel 7 |
| Pin 9 | VDDR — Voltage regulator supply (2.5 V core) |
| Pin 10 | VSS — Ground |
| Pin 11 | VDDX — External I/O supply (5 V) |
| Pin 12 | VSSX — I/O ground |
| Pin 13 | PP0 — Port P I/O bit 0 / PWM channel 0 |
| Pin 14 | PP1 — Port P I/O bit 1 / PWM channel 1 |
| Pin 15 | PP2 — Port P I/O bit 2 / PWM channel 2 |
| Pin 16 | PP3 — Port P I/O bit 3 / PWM channel 3 |
| Pin 17 | PP4 — Port P I/O bit 4 / PWM channel 4 |
| Pin 18 | PP5 — Port P I/O bit 5 / PWM channel 5 |
| Pin 19 | PP6 — Port P I/O bit 6 / PWM channel 6 |
| Pin 20 | PP7 — Port P I/O bit 7 / PWM channel 7 |
| Pin 21 | PAD00 — Port AD bit 0 / ATD channel 0 |
| Pin 22 | PAD01 — Port AD bit 1 / ATD channel 1 |
| Pin 23 | PAD02 — Port AD bit 2 / ATD channel 2 |
| Pin 24 | PAD03 — Port AD bit 3 / ATD channel 3 |
| Pin 25 | PAD04 — Port AD bit 4 / ATD channel 4 |
| Pin 26 | PAD05 — Port AD bit 5 / ATD channel 5 |
| Pin 27 | PAD06 — Port AD bit 6 / ATD channel 6 |
| Pin 28 | PAD07 — Port AD bit 7 / ATD channel 7 |
| Pin 29 | PAD08 — Port AD bit 8 / ATD channel 8 |
| Pin 30 | PAD09 — Port AD bit 9 / ATD channel 9 |
| Pin 31 | PAD10 — Port AD bit 10 / ATD channel 10 |
| Pin 32 | PAD11 — Port AD bit 11 / ATD channel 11 |
| Pin 33 | PAD12 — Port AD bit 12 / ATD channel 12 |
| Pin 34 | PAD13 — Port AD bit 13 / ATD channel 13 |
| Pin 35 | PAD14 — Port AD bit 14 / ATD channel 14 |
| Pin 36 | PAD15 — Port AD bit 15 / ATD channel 15 |
| Pin 37 | VDDA — Analog supply (5 V) |
| Pin 38 | VSSA — Analog ground |
| Pin 39 | VRH — ADC high reference voltage |
| Pin 40 | VRL — ADC low reference voltage |
| Pin 41 | PS0 — Port S I/O bit 0 / SPI0 SCK |
| Pin 42 | PS1 — Port S I/O bit 1 / SPI0 MOSI |
| Pin 43 | PS2 — Port S I/O bit 2 / SPI0 MISO |
| Pin 44 | PS3 — Port S I/O bit 3 / SPI0 SS |
| Pin 45 | PS4 — Port S I/O bit 4 / SCI0 TX |
| Pin 46 | PS5 — Port S I/O bit 5 / SCI0 RX |
| Pin 47 | PS6 — Port S I/O bit 6 |
| Pin 48 | PS7 — Port S I/O bit 7 |
| Pin 49 | PM0 — Port M I/O bit 0 / CAN0 TX |
| Pin 50 | PM1 — Port M I/O bit 1 / CAN0 RX |
| Pin 51 | PM2 — Port M I/O bit 2 / CAN1 TX |
| Pin 52 | PM3 — Port M I/O bit 3 / CAN1 RX |
| Pin 53 | PM4 — Port M I/O bit 4 / CAN2 TX |
| Pin 54 | PM5 — Port M I/O bit 5 / CAN2 RX |
| Pin 55 | PM6 — Port M I/O bit 6 / CAN3 TX |
| Pin 56 | PM7 — Port M I/O bit 7 / CAN3 RX |
| Pin 57 | PJ0 — Port J I/O bit 0 |
| Pin 58 | PJ1 — Port J I/O bit 1 |
| Pin 59 | PJ6 — Port J I/O bit 6 |
| Pin 60 | PJ7 — Port J I/O bit 7 |
| Pin 61 | BKGD — Background Debug Mode pin |
| Pin 62 | RESET — External reset (active low) |
| Pin 63 | TEST — Test mode (must be tied high in normal operation) |
| Pin 64 | XIRQ — Non-maskable external interrupt |
| Pin 65 | IRQ — Maskable external interrupt |
| Pin 66 | MODC — Mode select |
| Pin 67 | PE0 — Port E I/O bit 0 / I2C SCL |
| Pin 68 | PE1 — Port E I/O bit 1 / I2C SDA |
| Pin 69 | PE2 — Port E I/O bit 2 |
| Pin 70 | PE3 — Port E I/O bit 3 |
| Pin 71 | PE4 — Port E I/O bit 4 |
| Pin 72 | PE5 — Port E I/O bit 5 |
| Pin 73 | PE6 — Port E I/O bit 6 |
| Pin 74 | PE7 — Port E I/O bit 7 |
| Pin 75 | PH0 — Port H I/O bit 0 / SPI1 SCK |
| Pin 76 | PH1 — Port H I/O bit 1 / SPI1 MOSI |
| Pin 77 | PH2 — Port H I/O bit 2 / SPI1 MISO |
| Pin 78 | PH3 — Port H I/O bit 3 / SPI1 SS |
| Pin 79 | PH4 — Port H I/O bit 4 / SCI1 TX |
| Pin 80 | PH5 — Port H I/O bit 5 / SCI1 RX |
| Pin 81 | PH6 — Port H I/O bit 6 |
| Pin 82 | PH7 — Port H I/O bit 7 |
| Pin 83 | PK0 — Port K I/O bit 0 |
| Pin 84 | PK1 — Port K I/O bit 1 |
| Pin 85 | PK2 — Port K I/O bit 2 |
| Pin 86 | PK3 — Port K I/O bit 3 |
| Pin 87 | PK4 — Port K I/O bit 4 |
| Pin 88 | PK5 — Port K I/O bit 5 |
| Pin 89 | PK6 — Port K I/O bit 6 |
| Pin 90 | PK7 — Port K I/O bit 7 |
| Pin 91 | PA0 — Port A I/O bit 0 |
| Pin 92 | PA1 — Port A I/O bit 1 |
| Pin 93 | PA2 — Port A I/O bit 2 |
| Pin 94 | PA3 — Port A I/O bit 3 |
| Pin 95 | PA4 — Port A I/O bit 4 |
| Pin 96 | PA5 — Port A I/O bit 5 |
| Pin 97 | PA6 — Port A I/O bit 6 |
| Pin 98 | PA7 — Port A I/O bit 7 |
| Pin 99 | PB0 — Port B I/O bit 0 |
| Pin 100 | PB1 — Port B I/O bit 1 |
| Pin 101 | PB2 — Port B I/O bit 2 |
| Pin 102 | PB3 — Port B I/O bit 3 |
| Pin 103 | PB4 — Port B I/O bit 4 |
| Pin 104 | PB5 — Port B I/O bit 5 |
| Pin 105 | PB6 — Port B I/O bit 6 |
| Pin 106 | PB7 — Port B I/O bit 7 |
| Pin 107 | PC0 — Port C I/O bit 0 |
| Pin 108 | PC1 — Port C I/O bit 1 |
| Pin 109 | PC2 — Port C I/O bit 2 |
| Pin 110 | PC3 — Port C I/O bit 3 |
| Pin 111 | PC4 — Port C I/O bit 4 |
| Pin 112 | PC5 — Port C I/O bit 5 |
Typische Anwendungen
MC9S12XDT256VAL ist geeignet für 6 Anwendungs: Automotive Body Control Module, CAN Gateway / Bridge ECU, Instrument Cluster Controller, HVAC Climate Control Module, Seat and Door Zone Module, Industrial CAN Distributed I/O.
Automotive Body Control Module
The MC9S12XDT256VAL is a proven fit for central body control modules (BCMs) because its 256 KB Flash, 4 KB EEPROM, and 91 GPIO can drive multi-channel body loads (lighting, wipers, mirrors) with headroom for OEM software stacks. The HCS12X CPU at 80 MHz plus XGATE co-processor handles CAN/LIN messaging and PWM-driven lamp dimming in parallel without CPU stalls. AEC-Q100 automotive grade and -40C to +105C operation match under-dash thermal environments, and the integrated 16-channel 10-bit ADC reads switch and sensor signals directly. Compared with switching to a Cortex-M BCM MCU, designers retain the legacy CodeWarrior toolchain, mature AUTOSAR support, and the 112-LQFP (20x20 mm) footprint that has shipped in millions of BCM platforms. The XGATE offloads interrupt-driven CAN RX to deterministic cycle counts, freeing the main HCS12X core for body-domain logic.
Empfohlen
CAN Gateway / Bridge ECU
As a CAN-to-CAN or CAN-to-LIN gateway ECU, the MC9S12XDT256VAL's multiple msCAN 2.0 controllers and HCS12X core can route messages between body, chassis, and powertrain networks at automotive bus speeds. The 80 MHz CPU executes gateway routing tables with sub-millisecond latency, and the XGATE co-processor handles bus-off recovery and frame filtering deterministically. The 256 KB Flash accommodates large OEM routing tables and UDS diagnostics stacks, while the 16 KB RAM and 4 KB EEPROM provide storage for DTC logs and learning values. The wide operating temperature range and automotive grade suit under-hood installations, and the 112-LQFP package is large enough for heat dissipation under sustained CAN traffic. Compared with discrete CAN bridging using two microcontrollers, this single-chip approach reduces PCB area by 40% and BOM cost.
Empfohlen
Instrument Cluster Controller
In instrument cluster designs, the MC9S12XDT256VAL drives stepper-motor-based gauges and TFT displays via its 8 PWM channels, SPI, and parallel GPIO. The 16-channel 10-bit ADC reads vehicle speed sensors, fuel level, coolant temperature, and battery voltage directly, eliminating external signal conditioning. The 80 MHz HCS12X core renders cluster graphics and executes CAN diagnostics in parallel with the XGATE handling high-rate CAN RX interrupts. AEC-Q100 grade and -40C to +105C operation match the cluster's cabin thermal environment with margin. Compared with ARM Cortex-M cluster MCUs, designers benefit from a mature display driver library ecosystem and proven long-term availability in automotive Tier-1 supply chains.
Empfohlen
HVAC Climate Control Module
For HVAC control modules, the MC9S12XDT256VAL's PWM channels drive brushless DC fan motors and blower speed control via external MOSFET drivers, while the ADC reads cabin temperature, humidity, and blend-door position sensors. The HCS12X core executes climate-control loops and CAN comfort-bus messaging, and the XGATE co-processor handles high-priority blower overcurrent interrupts. The 256 KB Flash supports large look-up tables for climate curves and OEM calibration data, and the 4 KB EEPROM stores user preferences across power cycles. Compared with 8-bit HVAC MCUs, the 16-bit HCS12X core offers 4x more computational headroom, enabling predictive climate algorithms and zone control.
Empfohlen
Seat and Door Zone Module
In seat control and door zone modules, the MC9S12XDT256VAL integrates LIN connectivity for switch pods, PWM channels for mirror adjustment, and ADC channels for position feedback. The 91 GPIO can drive multi-axis mirror motors, seat heaters, and memory-position switches without external logic, reducing BOM cost. The XGATE co-processor handles LIN scheduling deterministically, freeing the main CPU for seat-position control loops. AEC-Q100 automotive grade and 5 V I/O tolerance allow direct connection to automotive switch contacts. Compared with distributed relay-based modules, this single-chip design consolidates switching into one ECU, saving 0.5-1 kg of wiring harness per door.
Empfohlen
Industrial CAN Distributed I/O
Outside automotive, the MC9S12XDT256VAL is well suited for industrial CANopen or DeviceNet distributed I/O nodes because its msCAN controllers, 91 GPIO, and 16-channel 10-bit ADC can serve as a single-chip I/O concentrator. The 80 MHz HCS12X core executes CANopen CiA 401 profiles, and the XGATE offloads cyclic PDO processing with deterministic latency. The 256 KB Flash supports large CANopen object dictionaries and SDO server stacks, while the 4 KB EEPROM stores node configuration and baud-rate parameters across power cycles. -40C to +105C operation suits cabinet-free industrial installations, and the 112-LQFP package supports hand-solderable prototyping. Compared with 32-bit ARM Cortex-M0+ industrial I/O MCUs, this part offers 2-3x more GPIO per chip at similar cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12XDT256VAL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S912XEG256J2CAL | S912XEG384J2VAL | MC9S12XDT256CAG | MC9S12XDT512MAA |
|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP - same | 112-LQFP - same | 144-LQFP - differs | 80-QFP - differs |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X 80 MHz + XGATE | HCS12X + XGATE | HCS12X + XGATE | HCS12X 80 MHz + XGATE | HCS12X 80 MHz + XGATE |
| Flash Memory | 256 KB | 256 KB | 384 KB | 256 KB | 512 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Lifecycle Status | NRND | Active | Active | NRND | Active |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +85C | -40C to +125C |
Wichtigste Unterscheidungsmerkmale
- Mature HCS12X + XGATE architecture with proven automotive deployments (vs. MC9S12XEQ384CAG)
- True 112-LQFP same-footprint drop-in exists in active lifecycle (vs. S912XEG384J2VAL)
- Lower frequency 40 MHz variant offers cost-down path (vs. MC9S12XD256VAL)
Designhinweise
Decouple VDDR (2.5 V core) with 100 nF + 4.7 uF ceramic placed within 5 mm of the pin, and decouple VDDX (5 V I/O) with the same combination. Place a ferrite bead between VDDX and VDDA to isolate ADC noise from digital switching. VDDR is generated by an internal voltage regulator from VDDX - do not back-drive VDDR externally; instead supply 5 V to VDDX and let the on-chip regulator generate the 2.5 V core rail.
Route the EXTAL/XTAL oscillator traces shorted (<5 mm) and symmetrically, guarded by a ground ring, and keep them away from PWM and switching nodes. For 4-layer PCBs, place a continuous ground plane on layer 2 directly under the MCU, and stitch vias around the LQFP-112 perimeter at 5 mm spacing. The 20 x 20 mm LQFP-112 package requires a 1 oz copper pour on top and bottom layers tied to the ground plane for thermal dissipation (the device dissipates ~1 W max).
For msCAN bus design, keep the CAN TX/RX traces short (<25 mm) and route them as a differential pair with 100 ohm differential impedance on the PCB stack-up. Place the CAN transceiver (e.g. TJA1042) within 50 mm of the MCU's PM0/PM1 (CAN0) pins, and add a 120 ohm termination resistor at the bus ends only. For EMI-sensitive automotive designs, add a common-mode choke on the CAN bus lines and place TVS diodes (e.g. PESD1CAN) within 10 mm of the bus connector.
Do not leave the TEST pin floating - tie TEST high (to VDDX) for normal operation or the device may enter test mode unexpectedly. The BKGD pin is also the clock input for BDM debug mode - do not place a pull-up that exceeds 10 kohm on BKGD or BDM programming may be impaired. When migrating from MC9S12XDT256VAL to MC9S12XDT256CAG (144-LQFP), note that the 144-LQFP has additional I/O pins and a different pinout - PCB redesign is required.
Compliance-Informationen
VAL suffix denotes -40C to +105C automotive grade; AEC-Q100 qualified per NXP product page. RoHS and REACH compliant per NXP material composition data. Conflict-minerals statement available on NXP corporate responsibility page.
