MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP
Référence : MC9S12XDT256VAL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.38 | $14,38 |
| 10 | $12.94 | $129,40 |
| 100 | $11.5 | $1 150,00 |
| 500 | $10.35 | $5 175,00 |
| 1 000 | $9.2 | $9 200,00 |
MC9S12XDT256VAL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile storage (EEPROM) and a rich set of peripherals. The HCS12X family extends the legacy HCS12 architecture with an enhanced instruction set, instruction queue, enhanced indexed addressing, and an XGATE peripheral co-processor that offloads interrupt-driven I/O for deterministic real-time response. Within the broader taxonomy: MCU -> 16-bit microcontroller -> automotive microcontroller -> body/chassis ECU controller -> semiconductor.
Key features of the MC9S12XDT256VAL include a 16-channel 10-bit ADC, up to 91 general-purpose I/O lines, multiple CAN 2.0 controllers (msCAN), SPI, I2C, SCI/UART, an 8-channel PWM, and a periodic interrupt timer. The device operates from a single 2.5 V core / 5 V I/O supply and supports background debug mode (BDM) for in-circuit development.
The HCS12X CPU executes CISC instructions at 80 MHz, while the XGATE RISC co-processor runs at twice the bus speed to handle high-rate peripheral events with predictable latency. The 256 KB Flash is organized as 256K x 8 and supports erase/program operations across -40C to +125C, making the part suitable for under-hood and body-control modules.
Typical applications include automotive body controllers, gateway/Bridge ECUs between CAN and LIN networks, instrument clusters, HVAC control modules, seat and door zone modules, and industrial CAN-based distributed I/O. The wide peripheral mix also supports battery-management slaves and 24 V industrial sensor hubs.
When designing with this MCU, ensure the 5 V analog supply (VDDA) and 2.5 V digital supply (VDDR) are decoupled with 100 nF + 4.7 uF ceramic capacitors placed within 5 mm of the respective pins. Route the oscillator traces shorted and guarded; for EMI-sensitive automotive designs place a guard ring around the EXTAL/XTAL pins and keep them away from switching nodes. The LQFP-112 footprint dissipates up to ~1 W with a proper copper pour on the exposed pad tie-off.
This page synthesizes distributor pricing, verified drop-in alternatives from the HCS12XD family, and practical PCB design notes that supplement the manufacturer datasheet and accelerate engineering decisions.
Alternatives de remplacement direct pour MC9S12XDT256VAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12XDT256VAL (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, ADC, Core, Lifecycle Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12XDT256CAG
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →MC9S12XDT512MAA
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S912XET512J2VAGR
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →MC9S12XEQ384CAG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S912XEG256J2CAL
✅ Remplacement direct✓ En stock
$15.4 / unité
Voir la fiche technique →S912XEG384J2VAL
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →MC9S12XDT256VAL Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit Microcontroller (MCU) |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor |
| CPU Instruction Set | CISC, upward-compatible with HCS12 |
| Maximum CPU Frequency | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| EEPROM | 4 KB |
| ADC | 16-channel, 10-bit |
| General-Purpose I/O | Up to 91 GPIO |
| PWM Channels | 8 channels |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 5 V |
| Température de fonctionnement | -40C to +105C (VAL = Automotive grade) |
| Boîtier | 112-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Debug Interface | Background Debug Mode (BDM) |
| Statut RoHS | Compliant |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) |
Configuration des broches de MC9S12XDT256VAL
| Broche 1 | PT0 — Port T I/O bit 0 / TIM channel 0 |
| Broche 2 | PT1 — Port T I/O bit 1 / TIM channel 1 |
| Broche 3 | PT2 — Port T I/O bit 2 / TIM channel 2 |
| Broche 4 | PT3 — Port T I/O bit 3 / TIM channel 3 |
| Broche 5 | PT4 — Port T I/O bit 4 / TIM channel 4 |
| Broche 6 | PT5 — Port T I/O bit 5 / TIM channel 5 |
| Broche 7 | PT6 — Port T I/O bit 6 / TIM channel 6 |
| Broche 8 | PT7 — Port T I/O bit 7 / TIM channel 7 |
| Broche 9 | VDDR — Voltage regulator supply (2.5 V core) |
| Broche 10 | VSS — Ground |
| Broche 11 | VDDX — External I/O supply (5 V) |
| Broche 12 | VSSX — I/O ground |
| Broche 13 | PP0 — Port P I/O bit 0 / PWM channel 0 |
| Broche 14 | PP1 — Port P I/O bit 1 / PWM channel 1 |
| Broche 15 | PP2 — Port P I/O bit 2 / PWM channel 2 |
| Broche 16 | PP3 — Port P I/O bit 3 / PWM channel 3 |
| Broche 17 | PP4 — Port P I/O bit 4 / PWM channel 4 |
| Broche 18 | PP5 — Port P I/O bit 5 / PWM channel 5 |
| Broche 19 | PP6 — Port P I/O bit 6 / PWM channel 6 |
| Broche 20 | PP7 — Port P I/O bit 7 / PWM channel 7 |
| Broche 21 | PAD00 — Port AD bit 0 / ATD channel 0 |
| Broche 22 | PAD01 — Port AD bit 1 / ATD channel 1 |
| Broche 23 | PAD02 — Port AD bit 2 / ATD channel 2 |
| Broche 24 | PAD03 — Port AD bit 3 / ATD channel 3 |
| Broche 25 | PAD04 — Port AD bit 4 / ATD channel 4 |
| Broche 26 | PAD05 — Port AD bit 5 / ATD channel 5 |
| Broche 27 | PAD06 — Port AD bit 6 / ATD channel 6 |
| Broche 28 | PAD07 — Port AD bit 7 / ATD channel 7 |
| Broche 29 | PAD08 — Port AD bit 8 / ATD channel 8 |
| Broche 30 | PAD09 — Port AD bit 9 / ATD channel 9 |
| Broche 31 | PAD10 — Port AD bit 10 / ATD channel 10 |
| Broche 32 | PAD11 — Port AD bit 11 / ATD channel 11 |
| Broche 33 | PAD12 — Port AD bit 12 / ATD channel 12 |
| Broche 34 | PAD13 — Port AD bit 13 / ATD channel 13 |
| Broche 35 | PAD14 — Port AD bit 14 / ATD channel 14 |
| Broche 36 | PAD15 — Port AD bit 15 / ATD channel 15 |
| Broche 37 | VDDA — Analog supply (5 V) |
| Broche 38 | VSSA — Analog ground |
| Broche 39 | VRH — ADC high reference voltage |
| Broche 40 | VRL — ADC low reference voltage |
| Broche 41 | PS0 — Port S I/O bit 0 / SPI0 SCK |
| Broche 42 | PS1 — Port S I/O bit 1 / SPI0 MOSI |
| Broche 43 | PS2 — Port S I/O bit 2 / SPI0 MISO |
| Broche 44 | PS3 — Port S I/O bit 3 / SPI0 SS |
| Broche 45 | PS4 — Port S I/O bit 4 / SCI0 TX |
| Broche 46 | PS5 — Port S I/O bit 5 / SCI0 RX |
| Broche 47 | PS6 — Port S I/O bit 6 |
| Broche 48 | PS7 — Port S I/O bit 7 |
| Broche 49 | PM0 — Port M I/O bit 0 / CAN0 TX |
| Broche 50 | PM1 — Port M I/O bit 1 / CAN0 RX |
| Broche 51 | PM2 — Port M I/O bit 2 / CAN1 TX |
| Broche 52 | PM3 — Port M I/O bit 3 / CAN1 RX |
| Broche 53 | PM4 — Port M I/O bit 4 / CAN2 TX |
| Broche 54 | PM5 — Port M I/O bit 5 / CAN2 RX |
| Broche 55 | PM6 — Port M I/O bit 6 / CAN3 TX |
| Broche 56 | PM7 — Port M I/O bit 7 / CAN3 RX |
| Broche 57 | PJ0 — Port J I/O bit 0 |
| Broche 58 | PJ1 — Port J I/O bit 1 |
| Broche 59 | PJ6 — Port J I/O bit 6 |
| Broche 60 | PJ7 — Port J I/O bit 7 |
| Broche 61 | BKGD — Background Debug Mode pin |
| Broche 62 | RESET — External reset (active low) |
| Broche 63 | TEST — Test mode (must be tied high in normal operation) |
| Broche 64 | XIRQ — Non-maskable external interrupt |
| Broche 65 | IRQ — Maskable external interrupt |
| Broche 66 | MODC — Mode select |
| Broche 67 | PE0 — Port E I/O bit 0 / I2C SCL |
| Broche 68 | PE1 — Port E I/O bit 1 / I2C SDA |
| Broche 69 | PE2 — Port E I/O bit 2 |
| Broche 70 | PE3 — Port E I/O bit 3 |
| Broche 71 | PE4 — Port E I/O bit 4 |
| Broche 72 | PE5 — Port E I/O bit 5 |
| Broche 73 | PE6 — Port E I/O bit 6 |
| Broche 74 | PE7 — Port E I/O bit 7 |
| Broche 75 | PH0 — Port H I/O bit 0 / SPI1 SCK |
| Broche 76 | PH1 — Port H I/O bit 1 / SPI1 MOSI |
| Broche 77 | PH2 — Port H I/O bit 2 / SPI1 MISO |
| Broche 78 | PH3 — Port H I/O bit 3 / SPI1 SS |
| Broche 79 | PH4 — Port H I/O bit 4 / SCI1 TX |
| Broche 80 | PH5 — Port H I/O bit 5 / SCI1 RX |
| Broche 81 | PH6 — Port H I/O bit 6 |
| Broche 82 | PH7 — Port H I/O bit 7 |
| Broche 83 | PK0 — Port K I/O bit 0 |
| Broche 84 | PK1 — Port K I/O bit 1 |
| Broche 85 | PK2 — Port K I/O bit 2 |
| Broche 86 | PK3 — Port K I/O bit 3 |
| Broche 87 | PK4 — Port K I/O bit 4 |
| Broche 88 | PK5 — Port K I/O bit 5 |
| Broche 89 | PK6 — Port K I/O bit 6 |
| Broche 90 | PK7 — Port K I/O bit 7 |
| Broche 91 | PA0 — Port A I/O bit 0 |
| Broche 92 | PA1 — Port A I/O bit 1 |
| Broche 93 | PA2 — Port A I/O bit 2 |
| Broche 94 | PA3 — Port A I/O bit 3 |
| Broche 95 | PA4 — Port A I/O bit 4 |
| Broche 96 | PA5 — Port A I/O bit 5 |
| Broche 97 | PA6 — Port A I/O bit 6 |
| Broche 98 | PA7 — Port A I/O bit 7 |
| Broche 99 | PB0 — Port B I/O bit 0 |
| Broche 100 | PB1 — Port B I/O bit 1 |
| Broche 101 | PB2 — Port B I/O bit 2 |
| Broche 102 | PB3 — Port B I/O bit 3 |
| Broche 103 | PB4 — Port B I/O bit 4 |
| Broche 104 | PB5 — Port B I/O bit 5 |
| Broche 105 | PB6 — Port B I/O bit 6 |
| Broche 106 | PB7 — Port B I/O bit 7 |
| Broche 107 | PC0 — Port C I/O bit 0 |
| Broche 108 | PC1 — Port C I/O bit 1 |
| Broche 109 | PC2 — Port C I/O bit 2 |
| Broche 110 | PC3 — Port C I/O bit 3 |
| Broche 111 | PC4 — Port C I/O bit 4 |
| Broche 112 | PC5 — Port C I/O bit 5 |
Applications typiques
MC9S12XDT256VAL convient pour 6 applications: Automotive Body Control Module, CAN Gateway / Bridge ECU, Instrument Cluster Controller, HVAC Climate Control Module, Seat and Door Zone Module, Industrial CAN Distributed I/O.
Automotive Body Control Module
The MC9S12XDT256VAL is a proven fit for central body control modules (BCMs) because its 256 KB Flash, 4 KB EEPROM, and 91 GPIO can drive multi-channel body loads (lighting, wipers, mirrors) with headroom for OEM software stacks. The HCS12X CPU at 80 MHz plus XGATE co-processor handles CAN/LIN messaging and PWM-driven lamp dimming in parallel without CPU stalls. AEC-Q100 automotive grade and -40C to +105C operation match under-dash thermal environments, and the integrated 16-channel 10-bit ADC reads switch and sensor signals directly. Compared with switching to a Cortex-M BCM MCU, designers retain the legacy CodeWarrior toolchain, mature AUTOSAR support, and the 112-LQFP (20x20 mm) footprint that has shipped in millions of BCM platforms. The XGATE offloads interrupt-driven CAN RX to deterministic cycle counts, freeing the main HCS12X core for body-domain logic.
Recommandé
CAN Gateway / Bridge ECU
As a CAN-to-CAN or CAN-to-LIN gateway ECU, the MC9S12XDT256VAL's multiple msCAN 2.0 controllers and HCS12X core can route messages between body, chassis, and powertrain networks at automotive bus speeds. The 80 MHz CPU executes gateway routing tables with sub-millisecond latency, and the XGATE co-processor handles bus-off recovery and frame filtering deterministically. The 256 KB Flash accommodates large OEM routing tables and UDS diagnostics stacks, while the 16 KB RAM and 4 KB EEPROM provide storage for DTC logs and learning values. The wide operating temperature range and automotive grade suit under-hood installations, and the 112-LQFP package is large enough for heat dissipation under sustained CAN traffic. Compared with discrete CAN bridging using two microcontrollers, this single-chip approach reduces PCB area by 40% and BOM cost.
Recommandé
Instrument Cluster Controller
In instrument cluster designs, the MC9S12XDT256VAL drives stepper-motor-based gauges and TFT displays via its 8 PWM channels, SPI, and parallel GPIO. The 16-channel 10-bit ADC reads vehicle speed sensors, fuel level, coolant temperature, and battery voltage directly, eliminating external signal conditioning. The 80 MHz HCS12X core renders cluster graphics and executes CAN diagnostics in parallel with the XGATE handling high-rate CAN RX interrupts. AEC-Q100 grade and -40C to +105C operation match the cluster's cabin thermal environment with margin. Compared with ARM Cortex-M cluster MCUs, designers benefit from a mature display driver library ecosystem and proven long-term availability in automotive Tier-1 supply chains.
Recommandé
HVAC Climate Control Module
For HVAC control modules, the MC9S12XDT256VAL's PWM channels drive brushless DC fan motors and blower speed control via external MOSFET drivers, while the ADC reads cabin temperature, humidity, and blend-door position sensors. The HCS12X core executes climate-control loops and CAN comfort-bus messaging, and the XGATE co-processor handles high-priority blower overcurrent interrupts. The 256 KB Flash supports large look-up tables for climate curves and OEM calibration data, and the 4 KB EEPROM stores user preferences across power cycles. Compared with 8-bit HVAC MCUs, the 16-bit HCS12X core offers 4x more computational headroom, enabling predictive climate algorithms and zone control.
Recommandé
Seat and Door Zone Module
In seat control and door zone modules, the MC9S12XDT256VAL integrates LIN connectivity for switch pods, PWM channels for mirror adjustment, and ADC channels for position feedback. The 91 GPIO can drive multi-axis mirror motors, seat heaters, and memory-position switches without external logic, reducing BOM cost. The XGATE co-processor handles LIN scheduling deterministically, freeing the main CPU for seat-position control loops. AEC-Q100 automotive grade and 5 V I/O tolerance allow direct connection to automotive switch contacts. Compared with distributed relay-based modules, this single-chip design consolidates switching into one ECU, saving 0.5-1 kg of wiring harness per door.
Recommandé
Industrial CAN Distributed I/O
Outside automotive, the MC9S12XDT256VAL is well suited for industrial CANopen or DeviceNet distributed I/O nodes because its msCAN controllers, 91 GPIO, and 16-channel 10-bit ADC can serve as a single-chip I/O concentrator. The 80 MHz HCS12X core executes CANopen CiA 401 profiles, and the XGATE offloads cyclic PDO processing with deterministic latency. The 256 KB Flash supports large CANopen object dictionaries and SDO server stacks, while the 4 KB EEPROM stores node configuration and baud-rate parameters across power cycles. -40C to +105C operation suits cabinet-free industrial installations, and the 112-LQFP package supports hand-solderable prototyping. Compared with 32-bit ARM Cortex-M0+ industrial I/O MCUs, this part offers 2-3x more GPIO per chip at similar cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12XDT256VAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XEG256J2CAL | S912XEG384J2VAL | MC9S12XDT256CAG | MC9S12XDT512MAA |
|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP - same | 112-LQFP - same | 144-LQFP - differs | 80-QFP - differs |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X 80 MHz + XGATE | HCS12X + XGATE | HCS12X + XGATE | HCS12X 80 MHz + XGATE | HCS12X 80 MHz + XGATE |
| Flash Memory | 256 KB | 256 KB | 384 KB | 256 KB | 512 KB |
| EEPROM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Maximum CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Lifecycle Status | NRND | Active | Active | NRND | Active |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +85C | -40C to +125C |
Principaux différenciateurs
- Mature HCS12X + XGATE architecture with proven automotive deployments (vs MC9S12XEQ384CAG)
- True 112-LQFP same-footprint drop-in exists in active lifecycle (vs S912XEG384J2VAL)
- Lower frequency 40 MHz variant offers cost-down path (vs MC9S12XD256VAL)
Notes de conception
Decouple VDDR (2.5 V core) with 100 nF + 4.7 uF ceramic placed within 5 mm of the pin, and decouple VDDX (5 V I/O) with the same combination. Place a ferrite bead between VDDX and VDDA to isolate ADC noise from digital switching. VDDR is generated by an internal voltage regulator from VDDX - do not back-drive VDDR externally; instead supply 5 V to VDDX and let the on-chip regulator generate the 2.5 V core rail.
Route the EXTAL/XTAL oscillator traces shorted (<5 mm) and symmetrically, guarded by a ground ring, and keep them away from PWM and switching nodes. For 4-layer PCBs, place a continuous ground plane on layer 2 directly under the MCU, and stitch vias around the LQFP-112 perimeter at 5 mm spacing. The 20 x 20 mm LQFP-112 package requires a 1 oz copper pour on top and bottom layers tied to the ground plane for thermal dissipation (the device dissipates ~1 W max).
For msCAN bus design, keep the CAN TX/RX traces short (<25 mm) and route them as a differential pair with 100 ohm differential impedance on the PCB stack-up. Place the CAN transceiver (e.g. TJA1042) within 50 mm of the MCU's PM0/PM1 (CAN0) pins, and add a 120 ohm termination resistor at the bus ends only. For EMI-sensitive automotive designs, add a common-mode choke on the CAN bus lines and place TVS diodes (e.g. PESD1CAN) within 10 mm of the bus connector.
Do not leave the TEST pin floating - tie TEST high (to VDDX) for normal operation or the device may enter test mode unexpectedly. The BKGD pin is also the clock input for BDM debug mode - do not place a pull-up that exceeds 10 kohm on BKGD or BDM programming may be impaired. When migrating from MC9S12XDT256VAL to MC9S12XDT256CAG (144-LQFP), note that the 144-LQFP has additional I/O pins and a different pinout - PCB redesign is required.
Informations de conformité
VAL suffix denotes -40C to +105C automotive grade; AEC-Q100 qualified per NXP product page. RoHS and REACH compliant per NXP material composition data. Conflict-minerals statement available on NXP corporate responsibility page.
