PIC32MX450F256HT-I/MR - 80MHz 32-bit MCU 256KB Flash 64-QFN
MPN: PIC32MX450F256HT-I/MR ✓ نشطPIC32MX450F256HT-I/MR نظرة عامة
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a broad set of peripherals on one die. Within the broader taxonomy of microcontrollers, the PIC32MX450 sits at the high-performance end of Microchip's PIC32 family: microcontroller -> 32-bit MCU -> MIPS-based MCU -> PIC32MX family -> PIC32MX3/4 sub-family. This positioning means the device competes with entry-level ARM Cortex-M3 MCUs in cost while offering Microchip's MPLAB X toolchain and Harmony ecosystem.
Key features include 49 usable I/O, five 16-bit timers, a 16-bit Parallel Master Port, a 10-bit 1 Msps ADC with up to 28 channels, two analog comparators, and a CTMU for capacitive touch. The 64-QFN exposed pad enables efficient PCB thermal dissipation at sustained loads, while the 3.0-3.6 V single-supply operation simplifies power tree design in battery and USB-powered designs.
The architecture pairs a MIPS32 M4K core with a multi-vectored interrupt controller and a 5-stage pipeline, achieving 1.56 DMIPS/MHz or up to 125 DMIPS at 80 MHz. The device includes a 10-bit 1 Msps ADC and 16-bit PMP, enabling integrated graphics or external memory interfacing without external logic, which reduces BOM cost.
Typical applications include consumer audio appliances, low-cost HMI panels with PMP-driven LCDs, industrial sensor hubs, USB device/host controllers, and low-cost 32-bit replacement for PIC24 designs. The wide peripheral set also supports Bluetooth/BLE control hosts using the SPI/I2S bridges and PMP-connected displays.
When designing with this part, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal performance and ground integrity. The 'I' suffix denotes the -40C to +85C industrial temperature grade, while the 'H' indicates 64-pin QFN with internal trace Flash; verify boot configuration and PPS mapping in MPLAB X to avoid pin conflicts.
This page synthesizes distributor pricing, drop-in alternatives within the same 64-QFN footprint, and practical design notes not consolidated in the manufacturer datasheet.
بدائل مباشرة لـ PIC32MX450F256HT-I/MR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MX450F256HT-I/MR (نفس عامل الشكل والبصمة) — يختلف في Package, ADC, Timers, Operating Temperature, DMA Channels.
PIC32MX450F256HT-120/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX450F256H-120/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX350F256HT-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX450F128HT-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX440F256HT-80I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MX450F256HT-I/MR الحدود القصوى والخصائص الكهربائية
| Core Processor | MIPS32 M4K |
| Core Size | 32-Bit Single-Core |
| Maximum Clock Speed | 80 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| RAM Size | 64 KB |
| Number of I/O | 49 |
| جهد التغذية | 2.3 V to 3.6 V |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| Analog Comparators | 2 |
| UART | 2 |
| SPI / I2S | 2 |
| I2C | 2 |
| Parallel Master Port (PMP) | 8-bit |
| Timers | 5 x 16-bit |
| درجة حرارة التشغيل | -40C to +85C (Industrial) |
| العلبة | 64-QFN (9x9 mm) with exposed pad |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف PIC32MX450F256HT-I/MR
| دبوس 1 | RPB15/AN15/PMPDH/PMCS1 — GPIO RB15, ADC ch15, PMP data high, chip select 1 |
| دبوس 2 | RPB14/AN14/PMPDO/PMCS2 — GPIO RB14, ADC ch14, PMP data out, chip select 2 |
| دبوس 3 | RPB13/AN13/RPG6/RPG7 — GPIO RB13, ADC ch13, remappable peripheral |
| دبوس 4 | RPB12/AN12 — GPIO RB12, ADC ch12 |
| دبوس 5 | RPB11/AN11 — GPIO RB11, ADC ch11 |
| دبوس 6 | RPB10/AN10/CVREFOUT — GPIO RB10, ADC ch10, CVREF output |
| دبوس 7 | RPB9/AN9/C1INB/C2INB/C3INB — GPIO RB9, ADC ch9, comparator negative input |
| دبوس 8 | RPB8/AN8/C1INA/C2INA/C3INA — GPIO RB8, ADC ch8, comparator positive input |
| دبوس 9 | RPB7/AN7 — GPIO RB7, ADC ch7 |
| دبوس 10 | RPB6/AN6 — GPIO RB6, ADC ch6 |
| دبوس 11 | VDD — Digital power supply (3.3V nominal) |
| دبوس 12 | VSS — Digital ground |
| دبوس 13 | RPB5/AN5/C1IND/C2IND/C3IND — GPIO RB5, ADC ch5, comparator negative input |
| دبوس 14 | RPB4/AN4/C1INC/C2INC/C3INC — GPIO RB4, ADC ch4, comparator negative input |
| دبوس 15 | RPB3/AN3/C2INA — GPIO RB3, ADC ch3, comparator input |
| دبوس 16 | RPB2/AN2/C2INB — GPIO RB2, ADC ch2, comparator input |
| دبوس 17 | RPB1/AN1/C1INA/C2INA/C3INA — GPIO RB1, ADC ch1, comparator input |
| دبوس 18 | RPB0/AN0/C1INB/C2INB/C3INB — GPIO RB0, ADC ch0, comparator input |
| دبوس 19 | AVDD — Analog power supply |
| دبوس 20 | AVSS — Analog ground |
| دبوس 21 | RPA15/AN27 — GPIO RA15, ADC ch27 |
| دبوس 22 | RPA14/AN26 — GPIO RA14, ADC ch26 |
| دبوس 23 | RPA13/AN25 — GPIO RA13, ADC ch25 |
| دبوس 24 | RPA12/AN24 — GPIO RA12, ADC ch24 |
| دبوس 25 | RPA11/AN23 — GPIO RA11, ADC ch23 |
| دبوس 26 | RPA10/AN22 — GPIO RA10, ADC ch22 |
| دبوس 27 | RPA9/AN21 — GPIO RA9, ADC ch21 |
| دبوس 28 | VDD — Digital power supply |
| دبوس 29 | VSS — Digital ground |
| دبوس 30 | RPC15/AN20 — GPIO RC15, ADC ch20 |
| دبوس 31 | RPC14/AN19 — GPIO RC14, ADC ch19 |
| دبوس 32 | RPC13/AN18 — GPIO RC13, ADC ch18 |
| دبوس 33 | RPC12/AN17 — GPIO RC12, ADC ch17 |
| دبوس 34 | RPC11/AN16 — GPIO RC11, ADC ch16 |
| دبوس 35 | RPC10/AN28 — GPIO RC10, ADC ch28 |
| دبوس 36 | RPC9 — GPIO RC9 |
| دبوس 37 | RPC8 — GPIO RC8 |
| دبوس 38 | RPC7 — GPIO RC7 |
| دبوس 39 | RPC6 — GPIO RC6 |
| دبوس 40 | RPC5 — GPIO RC5 |
| دبوس 41 | RPC4 — GPIO RC4 |
| دبوس 42 | RPC3 — GPIO RC3 |
| دبوس 43 | RPC2 — GPIO RC2 |
| دبوس 44 | RPC1 — GPIO RC1 |
| دبوس 45 | RPC0 — GPIO RC0 |
| دبوس 46 | RPD15/PMPRD/SDO2/SDI1 — GPIO RD15, PMP read strobe, SPI data |
| دبوس 47 | RPD14/PMPA0/SS1 — GPIO RD14, PMP address 0, SPI slave select |
| دبوس 48 | RPD13/PMPA1 — GPIO RD13, PMP address 1 |
| دبوس 49 | RPD12/PMPA2 — GPIO RD12, PMP address 2 |
| دبوس 50 | RPD11/PMPA3/SDI2 — GPIO RD11, PMP address 3, SPI data in |
| دبوس 51 | RPD10/PMPA4/SCK2 — GPIO RD10, PMP address 4, SPI clock |
| دبوس 52 | RPD9/PMPA5 — GPIO RD9, PMP address 5 |
| دبوس 53 | RPD8/PMPA6 — GPIO RD8, PMP address 6 |
| دبوس 54 | RPD7/PMPA7/SS2 — GPIO RD7, PMP address 7, SPI slave select 2 |
| دبوس 55 | RPD6/PMPA8 — GPIO RD6, PMP address 8 |
| دبوس 56 | VDD — Digital power supply |
| دبوس 57 | VSS — Digital ground |
| دبوس 58 | RPD5/PMPA9 — GPIO RD5, PMP address 9 |
| دبوس 59 | RPD4/PMPA10 — GPIO RD4, PMP address 10 |
| دبوس 60 | RPD3/PMPA11 — GPIO RD3, PMP address 11 |
| دبوس 61 | RPD2/PMPA12 — GPIO RD2, PMP address 12 |
| دبوس 62 | RPD1/PMPA13 — GPIO RD1, PMP address 13 |
| دبوس 63 | RPD0/PMPA14 — GPIO RD0, PMP address 14 |
| دبوس 64 | OSC1/CLKI/RC15 — Crystal oscillator input / external clock input |
| دبوس 65 | EP — Exposed thermal pad - connect to ground plane |
التطبيقات النموذجية
PIC32MX450F256HT-I/MR مناسب لـ 6 التطبيقs: Consumer Audio Appliance, HMI Panel with PMP-Driven LCD, Industrial Sensor Hub, USB Device/Host Controller, Low-Cost 32-bit Replacement for PIC24, BLE Host with SPI-Connected Module.
Consumer Audio Appliance
Drives MP3/AAC decoding and audio routing in sound bars, headphones, and Bluetooth speakers. The PIC32MX450F256HT-I/MR's 80 MHz MIPS M4K core and dual SPI/I2S interfaces provide sufficient bandwidth for stereo 48 kHz / 24-bit audio streams, while 256 KB Flash accommodates MP3/AAC decoder tables and UI state machines. Pair with an external audio DAC like the TI PCM5101A via I2S for full Hi-Fi playback; the integrated 10-bit ADC handles auxiliary analog inputs such as microphone preamps or rotary encoder voltage dividers without an external ADC. This architecture eliminates the need for a separate audio processor, reducing BOM cost and PCB footprint for cost-sensitive consumer audio products.
موصى به
HMI Panel with PMP-Driven LCD
Renders text and graphics on character or dot-matrix LCDs via the integrated 8-bit Parallel Master Port (PMP). The PIC32MX450F256HT-I/MR drives ST7066U-based character LCDs directly through PMP, eliminating external display controllers, while its 64 KB SRAM provides buffer space for full-screen framebuffers on smaller graphic LCDs. Industrial -40C to +85C operation enables deployment in appliances and equipment panels, and the 256 KB Flash stores multilingual font tables and UI state machines. Combined with the 10-bit ADC for touch or rotary inputs, this creates a complete HMI solution with minimal external components, ideal for HVAC controls, vending machines, and IoT gateways.
موصى به
Industrial Sensor Hub
Aggregates analog and digital sensors in factory automation and process control installations. The PIC32MX450F256HT-I/MR integrates a 10-bit 1 Msps ADC with 28 channels for direct connection to thermocouples, RTDs, and 4-20 mA loop sensors via signal conditioning, while dual SPI/I2S ports connect to digital accelerometers and environmental sensors. The -40C to +85C industrial temperature rating ensures reliability on factory floors, and the 256 KB Flash accommodates Modbus RTU and proprietary protocol stacks. Hardware CTMU enables capacitive touch or liquid level sensing without an external touch IC, reducing BOM cost in distributed sensor installations.
موصى به
USB Device/Host Controller
Implements USB device or host controllers using the PIC32MX's integrated USB 2.0 full-speed OTG peripheral. The PIC32MX450F256HT-I/MR's 80 MHz MIPS M4K core and 64 KB SRAM handle USB stack and class driver firmware with sufficient headroom for HID, CDC, MSD, and vendor classes. The two UART bridges provide serial-to-USB conversion in industrial gateways, and the 256 KB Flash stores USB stack plus application logic. Drop-in compatibility with the 120 MHz variant allows easy upgrade for designs requiring higher USB throughput or concurrent protocol processing.
موصى به
Low-Cost 32-bit Replacement for PIC24
Provides a migration path for designs currently using 16-bit PIC24 microcontrollers that need more memory and MIPS. The PIC32MX450F256HT-I/MR offers 256 KB Flash (vs 128 KB typical in PIC24), 64 KB RAM, and 32-bit performance at comparable cost, while remaining compatible with Microchip's MPLAB X IDE and Harmony framework. The two I2C, two SPI/I2S, and two UART preserve existing peripheral connections, easing firmware porting. This makes it ideal for upgrading PIC24FJ designs without PCB changes, especially in industrial control, motor drive, and consumer product designs.
موصى به
BLE Host with SPI-Connected Module
Acts as an application host MCU for Bluetooth/BLE modules connected over SPI or UART. The PIC32MX450F256HT-I/MR's dual SPI/I2S interfaces connect directly to modules like the RN4870 or CC2564 for BLE audio and data transfer, while the 256 KB Flash supports BLE GATT profiles and application logic. The 64 KB SRAM provides buffer space for sensor data aggregation before BLE transmission, and the two UART enable concurrent BLE HCI and debug logging. Industrial temperature grade ensures reliable operation in wearables, smart home sensors, and asset tracking devices.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MX450F256HT-I/MR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MX450F256HT-120/MR | PIC32MX450F256H-120/MR | PIC32MX350F256HT-I/MR | PIC32MX450F128HT-I/MR | PIC32MX440F256HT-80I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Maximum Clock Speed | 80 MHz | 120 MHz | 120 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB |
| RAM Size | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB |
| Number of I/O | 49 | 49 | 49 | 49 | 49 | 49 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Sub-Family | PIC32MX4 (USB OTG) | PIC32MX4 (USB OTG) | PIC32MX4 (USB OTG) | PIC32MX3 (no USB) | PIC32MX4 (USB OTG) | PIC32MX4 (USB OTG) |
أبرز الفروقات
- Highest-performance 80 MHz PIC32MX4 in 64-QFN (مقابلPIC32MX350F256HT-I/MR)
- Direct 120 MHz upgrade path in identical footprint (مقابلPIC32MX450F256HT-120/MR)
- 8-bit Parallel Master Port for direct LCD/FPGA interface (مقابلPIC32MX440F256HT-80I/MR)
ملاحظات التصميم
The 64-QFN package's exposed thermal pad (pin 65) must be soldered to a continuous ground copper pour of at least 100 mm^2 on the top or inner PCB layer to meet -40C to +85C specifications. Per Microchip's packaging guidelines, the EP should connect via multiple thermal vias (4-8 vias, 0.3 mm drill) to internal ground planes for optimal heat dissipation. Without proper EP soldering, junction temperature can rise above 100C at full 80 MHz operation with sustained GPIO toggling, reducing long-term reliability.
Place 100 nF decoupling capacitors as close as possible to each VDD/VSS pin pair (pins 11/12, 28/29, 56/57) and a single 10 uF bulk capacitor near the supply entry point. Add a separate 100 nF + 10 uF pair on AVDD/AVSS (pins 19/20) to isolate analog reference noise from the digital rails. Keep analog traces (ADC inputs, comparator inputs) away from high-frequency digital lines and clock traces to minimize coupling; route ADC signals over a continuous ground pour for shielding.
Do not exceed 3.6 V on any VDD or AVDD pin - permanent damage will occur above 4.0 V. The 'I' suffix indicates industrial -40C to +85C; do not substitute a 'V' (extended -40C to +105C) or 'E' (automotive) variant without verifying your thermal design. Configure unused I/O as outputs (not inputs) to avoid floating-pin leakage, and enable the JTAG port's internal pull-ups if you disconnect the debugger, or configure the JTAG pins as GPIO via the DEVCFG0 fuse to free up the four dedicated pins.
The PIC32MX450F256HT-I/MR's 80 MHz system clock produces harmonics up to 240 MHz (3rd harmonic). Place the crystal (typically 8 MHz or 10 MHz fundamental) within 10 mm of OSC1/OSC2 (pin 64 area) and route clock traces over a continuous ground pour with no splits. For designs with 80 MHz core and 10/100 Ethernet, add a 33 ohm series termination at the clock driver to dampen reflections; consult the PIC32MX3/4 family datasheet section 32 for oscillator design.
Estimated: For USB OTG designs using the PIC32MX450F256HT-I/MR, route the D+/D- traces as a 90-ohm differential pair with continuous ground reference on both sides, keeping length matching to within 150 mil. Place the 27 ohm series termination resistors within 2 mm of the MCU's USB pins. Use Microchip's AN1166 layout guidelines as reference; proper USB trace impedance is critical for USB compliance testing and signal integrity.
معلومات الامتثال
RoHS and REACH compliant per Microchip product documentation. Not AEC-Q100 qualified; for automotive applications use PIC32MX variants with explicit automotive grade designation.
