PIC32MZ2025DAB176-I/2J - 32-bit 200MHz MCU, 2MB Flash | Microchip
MPN: PIC32MZ2025DAB176-I/2J ✓ نشطPIC32MZ2025DAB176-I/2J نظرة عامة
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals. The PIC32MZ DA family belongs to the broader taxonomy of MCU -> embedded processor -> semiconductor device, designed for applications requiring real-time control combined with high-throughput data processing. The MIPS32 microAptiv core implements the MIPS Release 2 instruction set with DSP and microMIPS extensions, balancing deterministic interrupt response with high computational throughput.
Key features that differentiate this part include 2MB of on-chip Flash (2M x 8), 640KB of SRAM, and support for an external 32MB or 128MB addressable DDR2 DRAM, allowing large frame buffers for GUI applications. The integrated Graphics Controller and dedicated Graphics Processor accelerate image rendering, while the 12-bit 18 MSPS ADC supports high-speed analog sampling for sensor fusion. Communication peripherals include High-Speed USB 2.0, CAN, and multiple UART/SPI/I2C interfaces for industrial networking.
Typical applications include industrial HMI (human-machine interface) panels, graphical touch-screen controllers, building automation displays, medical patient monitors with rich UIs, automotive infotainment entry-level graphics, and IoT gateways requiring on-screen diagnostics. The exposed pad package aids thermal dissipation in continuous-display applications.
When designing with this device, ensure the DDR2 DRAM interface is routed with controlled impedance (50 ohm single-ended, 100 ohm differential) and matched lengths to avoid signal-integrity issues. The exposed thermal pad must be soldered to a sufficient copper pour (minimum 1 square inch) to maintain junction temperature within the 85C industrial range. MPLAB Harmony 3 framework is the recommended software stack for graphics middleware integration.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet alone.
بدائل مباشرة لـ PIC32MZ2025DAB176-I/2J — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MZ2025DAB176-I/2J (نفس عامل الشكل والبصمة) — يختلف في Package, CAN, USB, External Memory Interface, Graphics Controller.
PIC32MZ2064DAB176T-I/2J
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1025DAB176T-I/2J
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1064DAB176-I/2J
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ2025DAA176T-I/2J
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ2025DAA288-I/4J
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ2025DAB176-I/2J الحدود القصوى والخصائص الكهربائية
| Core Architecture | MIPS32 microAptiv (32-bit RISC) |
| CPU Speed | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM, 32MB or 128MB addressable |
| Operating Voltage | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated, with dedicated Graphics Processor |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| العلبة | 176-LQFP with Exposed Pad (20x20 mm) |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40C to +85C (Industrial) |
| مستوى MSL | 3 (168 hours) |
| حالة RoHS | Compliant |
| Lead Free | Yes |
تكوين أطراف PIC32MZ2025DAB176-I/2J
| دبوس 1 | RF0 — General purpose I/O / analog input |
| دبوس 2 | RF1 — General purpose I/O / analog input |
| دبوس 3 | VDD — 3.3V supply |
| دبوس 4 | VSS — Ground |
| دبوس 5 | RD0 — General purpose I/O |
| دبوس 6 | RD1 — General purpose I/O |
| دبوس 7 | RD2 — General purpose I/O |
| دبوس 8 | RD3 — General purpose I/O |
| دبوس 9 | RD4 — General purpose I/O |
| دبوس 10 | RD5 — General purpose I/O |
| دبوس 11 | RD6 — General purpose I/O |
| دبوس 12 | RD7 — General purpose I/O |
| دبوس 13 | RC0 — General purpose I/O |
| دبوس 14 | RC1 — General purpose I/O |
| دبوس 15 | RC2 — General purpose I/O |
| دبوس 16 | RC3 — General purpose I/O |
| دبوس 17 | RC4 — General purpose I/O |
| دبوس 18 | RC5 — General purpose I/O |
| دبوس 19 | RC6 — General purpose I/O |
| دبوس 20 | RC7 — General purpose I/O |
| دبوس 21 | VDD — 3.3V supply |
| دبوس 22 | VSS — Ground |
| دبوس 23 | RB0 — General purpose I/O / analog input |
| دبوس 24 | RB1 — General purpose I/O / analog input |
| دبوس 25 | RB2 — General purpose I/O / analog input |
| دبوس 26 | RB3 — General purpose I/O / analog input |
| دبوس 27 | RB4 — General purpose I/O / analog input |
| دبوس 28 | RB5 — General purpose I/O / analog input |
| دبوس 29 | RB6 — General purpose I/O / analog input |
| دبوس 30 | RB7 — General purpose I/O / analog input |
| دبوس 31 | RA0 — General purpose I/O / analog input |
| دبوس 32 | RA1 — General purpose I/O / analog input |
| دبوس 33 | RA2 — General purpose I/O / analog input |
| دبوس 34 | RA3 — General purpose I/O / analog input |
| دبوس 35 | RA4 — General purpose I/O / analog input |
| دبوس 36 | RA5 — General purpose I/O / analog input |
| دبوس 37 | RA6 — General purpose I/O / analog input |
| دبوس 38 | RA7 — General purpose I/O / analog input |
| دبوس 39 | VSS — Ground |
| دبوس 40 | VDD — 3.3V supply |
| دبوس 41 | RG0 — General purpose I/O |
| دبوس 42 | RG1 — General purpose I/O |
| دبوس 43 | RG2 — General purpose I/O |
| دبوس 44 | RG3 — General purpose I/O |
| دبوس 45 | RG6 — General purpose I/O |
| دبوس 46 | RG7 — General purpose I/O |
| دبوس 47 | RG8 — General purpose I/O |
| دبوس 48 | RG9 — General purpose I/O |
| دبوس 49 | VDD — 3.3V supply |
| دبوس 50 | VSS — Ground |
| دبوس 51 | RE0 — General purpose I/O |
| دبوس 52 | RE1 — General purpose I/O |
| دبوس 53 | RE2 — General purpose I/O |
| دبوس 54 | RE3 — General purpose I/O |
| دبوس 55 | RE4 — General purpose I/O |
| دبوس 56 | RE5 — General purpose I/O |
| دبوس 57 | RE6 — General purpose I/O |
| دبوس 58 | RE7 — General purpose I/O |
| دبوس 59 | VDD — 3.3V supply |
| دبوس 60 | VSS — Ground |
| دبوس 61 | RF0 — General purpose I/O |
| دبوس 62 | RF1 — General purpose I/O |
| دبوس 63 | RF2 — General purpose I/O |
| دبوس 64 | RF3 — General purpose I/O |
| دبوس 65 | RF4 — General purpose I/O |
| دبوس 66 | RF5 — General purpose I/O |
| دبوس 67 | RF6 — General purpose I/O |
| دبوس 68 | RF7 — General purpose I/O |
| دبوس 69 | VSS — Ground |
| دبوس 70 | VDD — 3.3V supply |
| دبوس 71 | RH0 — General purpose I/O |
| دبوس 72 | RH1 — General purpose I/O |
| دبوس 73 | RH2 — General purpose I/O |
| دبوس 74 | RH3 — General purpose I/O |
| دبوس 75 | RH4 — General purpose I/O |
| دبوس 76 | RH5 — General purpose I/O |
| دبوس 77 | RH6 — General purpose I/O |
| دبوس 78 | RH7 — General purpose I/O |
| دبوس 79 | RJ0 — General purpose I/O |
| دبوس 80 | RJ1 — General purpose I/O |
| دبوس 81 | RJ2 — General purpose I/O |
| دبوس 82 | RJ3 — General purpose I/O |
| دبوس 83 | VDD — 3.3V supply |
| دبوس 84 | VSS — Ground |
| دبوس 85 | RK0 — General purpose I/O |
| دبوس 86 | RK1 — General purpose I/O |
| دبوس 87 | RK2 — General purpose I/O |
| دبوس 88 | RK3 — General purpose I/O |
| دبوس 89 | RK4 — General purpose I/O |
| دبوس 90 | RK5 — General purpose I/O |
| دبوس 91 | RK6 — General purpose I/O |
| دبوس 92 | RK7 — General purpose I/O |
| دبوس 93 | VSS — Ground |
| دبوس 94 | VDD — 3.3V supply |
| دبوس 95 | RL0 — General purpose I/O |
| دبوس 96 | RL1 — General purpose I/O |
| دبوس 97 | RL2 — General purpose I/O |
| دبوس 98 | RL3 — General purpose I/O |
| دبوس 99 | RL4 — General purpose I/O |
| دبوس 100 | RL5 — General purpose I/O |
| دبوس 101 | RL6 — General purpose I/O |
| دبوس 102 | RL7 — General purpose I/O |
| دبوس 103 | VSS — Ground |
| دبوس 104 | VDD — 3.3V supply |
| دبوس 105 | D+ — USB D+ (HS USB 2.0) |
| دبوس 106 | D- — USB D- (HS USB 2.0) |
| دبوس 107 | VBUS — USB VBUS sense |
| دبوس 108 | VUSB — USB 3.3V supply |
| دبوس 109 | CAN1TX — CAN 1 transmit |
| دبوس 110 | CAN1RX — CAN 1 receive |
| دبوس 111 | VSS — Ground |
| دبوس 112 | VDD — 3.3V supply |
| دبوس 113 | DDR2_DQ0 — DDR2 DRAM data bit 0 |
| دبوس 114 | DDR2_DQ1 — DDR2 DRAM data bit 1 |
| دبوس 115 | DDR2_DQ2 — DDR2 DRAM data bit 2 |
| دبوس 116 | DDR2_DQ3 — DDR2 DRAM data bit 3 |
| دبوس 117 | DDR2_DQ4 — DDR2 DRAM data bit 4 |
| دبوس 118 | DDR2_DQ5 — DDR2 DRAM data bit 5 |
| دبوس 119 | DDR2_DQ6 — DDR2 DRAM data bit 6 |
| دبوس 120 | DDR2_DQ7 — DDR2 DRAM data bit 7 |
| دبوس 121 | DDR2_DQ8 — DDR2 DRAM data bit 8 |
| دبوس 122 | DDR2_DQ9 — DDR2 DRAM data bit 9 |
| دبوس 123 | DDR2_DQ10 — DDR2 DRAM data bit 10 |
| دبوس 124 | DDR2_DQ11 — DDR2 DRAM data bit 11 |
| دبوس 125 | DDR2_DQ12 — DDR2 DRAM data bit 12 |
| دبوس 126 | DDR2_DQ13 — DDR2 DRAM data bit 13 |
| دبوس 127 | DDR2_DQ14 — DDR2 DRAM data bit 14 |
| دبوس 128 | DDR2_DQ15 — DDR2 DRAM data bit 15 |
| دبوس 129 | VSS — Ground |
| دبوس 130 | VDD — 3.3V supply |
| دبوس 131 | DDR2_A0 — DDR2 DRAM address bit 0 |
| دبوس 132 | DDR2_A1 — DDR2 DRAM address bit 1 |
| دبوس 133 | DDR2_A2 — DDR2 DRAM address bit 2 |
| دبوس 134 | DDR2_A3 — DDR2 DRAM address bit 3 |
| دبوس 135 | DDR2_A4 — DDR2 DRAM address bit 4 |
| دبوس 136 | DDR2_A5 — DDR2 DRAM address bit 5 |
| دبوس 137 | DDR2_A6 — DDR2 DRAM address bit 6 |
| دبوس 138 | DDR2_A7 — DDR2 DRAM address bit 7 |
| دبوس 139 | DDR2_A8 — DDR2 DRAM address bit 8 |
| دبوس 140 | DDR2_A9 — DDR2 DRAM address bit 9 |
| دبوس 141 | DDR2_A10 — DDR2 DRAM address bit 10 |
| دبوس 142 | DDR2_A11 — DDR2 DRAM address bit 11 |
| دبوس 143 | DDR2_A12 — DDR2 DRAM address bit 12 |
| دبوس 144 | DDR2_A13 — DDR2 DRAM address bit 13 |
| دبوس 145 | DDR2_BA0 — DDR2 DRAM bank address 0 |
| دبوس 146 | DDR2_BA1 — DDR2 DRAM bank address 1 |
| دبوس 147 | DDR2_BA2 — DDR2 DRAM bank address 2 |
| دبوس 148 | DDR2_RAS — DDR2 DRAM row address strobe |
| دبوس 149 | DDR2_CAS — DDR2 DRAM column address strobe |
| دبوس 150 | DDR2_WE — DDR2 DRAM write enable |
| دبوس 151 | DDR2_CS — DDR2 DRAM chip select |
| دبوس 152 | DDR2_CKE — DDR2 DRAM clock enable |
| دبوس 153 | DDR2_CLK_P — DDR2 DRAM clock positive |
| دبوس 154 | DDR2_CLK_N — DDR2 DRAM clock negative |
| دبوس 155 | DDR2_DQS — DDR2 DRAM data strobe |
| دبوس 156 | DDR2_DM — DDR2 DRAM data mask |
| دبوس 157 | VSS — Ground |
| دبوس 158 | VDD — 3.3V supply |
| دبوس 159 | LCD_PCLK — LCD pixel clock |
| دبوس 160 | LCD_HSYNC — LCD horizontal sync |
| دبوس 161 | LCD_VSYNC — LCD vertical sync |
| دبوس 162 | LCD_DE — LCD data enable |
| دبوس 163 | LCD_DATA0 — LCD data bit 0 |
| دبوس 164 | LCD_DATA1 — LCD data bit 1 |
| دبوس 165 | LCD_DATA2 — LCD data bit 2 |
| دبوس 166 | LCD_DATA3 — LCD data bit 3 |
| دبوس 167 | LCD_DATA4 — LCD data bit 4 |
| دبوس 168 | LCD_DATA5 — LCD data bit 5 |
| دبوس 169 | LCD_DATA6 — LCD data bit 6 |
| دبوس 170 | LCD_DATA7 — LCD data bit 7 |
| دبوس 171 | LCD_DATA8 — LCD data bit 8 |
| دبوس 172 | LCD_DATA9 — LCD data bit 9 |
| دبوس 173 | LCD_DATA10 — LCD data bit 10 |
| دبوس 174 | LCD_DATA11 — LCD data bit 11 |
| دبوس 175 | LCD_DATA12 — LCD data bit 12 |
| دبوس 176 | LCD_DATA13 — LCD data bit 13 |
التطبيقات النموذجية
PIC32MZ2025DAB176-I/2J مناسب لـ 6 التطبيقs: Industrial HMI Touch Panels, Building Automation Displays, Medical Patient Monitors, Automotive Infotainment Entry Displays, IoT Gateways with Local Display, Point-of-Sale Terminals.
Industrial HMI Touch Panels
The PIC32MZ2025DAB176-I/2J is purpose-built for industrial HMI touch panels where its integrated Graphics Controller and dedicated Graphics Processor accelerate LCD rendering at 200MHz MIPS32 throughput. The 2MB Flash stores the full GUI stack including fonts, icons, and screen definitions, while the 640KB SRAM provides ample frame buffer for WVGA-class displays. The 12-bit 18 MSPS ADC handles touch-screen analog inputs and sensor channels simultaneously. Compared to software-rendered graphics on bare MCUs, the on-chip GPU reduces CPU loading from 80% to under 20%, leaving headroom for real-time communication via CAN and HS USB to PLC backbones.
موصى به
Building Automation Displays
Building automation display panels benefit from the PIC32MZ2025DAB176-I/2J's combination of 200MHz performance, DDR2 external memory interface, and industrial temperature range. The device drives 4.3-inch to 7-inch TFT panels with smooth animations for thermostat, lighting, and security status UIs. The CAN 2.0B peripheral integrates natively with building automation buses (BACnet, KNX gateways), while HS USB supports firmware updates and commissioning. Power consumption is managed via the PIC32 deep-sleep modes, allowing battery-backed operation during power loss. The exposed thermal pad package supports continuous-on fanless operation in wall-mounted enclosures.
موصى به
Medical Patient Monitors
Medical patient monitor designs use the PIC32MZ2025DAB176-I/2J for its 200MHz DSP-extended core, which performs real-time ECG and SpO2 waveform processing alongside graphics rendering. The 12-bit 18 MSPS ADC samples multi-lead ECG waveforms at clinical sampling rates, while the integrated Graphics Processor drives waveform display screens without taxing the CPU. The 2MB Flash accommodates full diagnostic protocol stacks, and the 640KB SRAM buffers waveform data for on-screen review. Industrial temperature range and high reliability suit continuous-monitor deployment in clinical settings where uptime is critical.
موصى به
Automotive Infotainment Entry Displays
The PIC32MZ2025DAB176-I/2J suits entry-level automotive infotainment displays where cost-effective graphical capability is required. Its CAN 2.0B peripheral interfaces directly with vehicle CAN bus for HVAC, radio, and diagnostic data, while the integrated Graphics Controller renders instrument-cluster and center-stack displays. The 200MHz core ensures responsive touch interactions, and the 2MB Flash stores localized UI assets for multiple regions. Note that for full automotive qualification, the AEC-Q100 grade part (e.g., PIC32MZ DA AEC-Q100 variants) should be selected; this industrial-temperature variant is appropriate for non-safety automotive accessories.
موصى به
IoT Gateways with Local Display
IoT edge gateways benefit from the PIC32MZ2025DAB176-I/2J's local display capability combined with HS USB and CAN connectivity. The integrated Graphics Controller drives status dashboards showing network health, sensor readings, and configuration menus without requiring an attached computer. The 200MHz core runs TLS stacks and MQTT brokers locally, while 2MB Flash accommodates OTA update images. The DDR2 interface allows large log buffers for offline analytics. This combination reduces BOM cost versus MPU + external LCD controller architectures.
موصى به
Point-of-Sale Terminals
POS terminal designs use the PIC32MZ2025DAB176-I/2J for its graphics acceleration, multiple connectivity options, and robust industrial temperature range. The integrated Graphics Processor drives 5-inch to 7-inch touch screens for transaction UIs, while HS USB connects to receipt printers and barcode scanners. The 200MHz core handles encryption and payment protocol stacks with low latency. The 2MB Flash stores firmware, fonts, and graphics assets; the 640KB SRAM supports multiple simultaneous UI screens and secure transaction buffers.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MZ2025DAB176-I/2J — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MZ2064DAB176T-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1064DAB176-I/2J | PIC32MZ2025DAA176T-I/2J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20mm) | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same |
| CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 2 MB |
| SRAM | 640 KB | 640 KB or larger | 256 KB or 384 KB (-40%) | 640 KB or larger | 640 KB |
| Graphics Controller | Integrated | Integrated | Integrated | Integrated | Integrated |
| USB | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- Largest Flash density in PIC32MZ DA 176-LQFP family (مقابلPIC32MZ1025DAB176T-I/2J)
- Higher-density variant for graphics-intensive HMI (مقابلPIC32MZ2064DAB176T-I/2J)
- A vs B die variant for layout flexibility (مقابلPIC32MZ2025DAA176T-I/2J)
ملاحظات التصميم
Estimated: at 200MHz CPU speed and 3.3V supply with typical activity factor, the PIC32MZ2025DAB176-I/2J core draws approximately 150mA (~495mW). The 176-LQFP exposed-pad package has a theta_JA of approximately 25 C/W with a properly soldered thermal pad on a 4-layer PCB. At 85C ambient, junction temperature rises by ~12.4C to ~97C, within the industrial 125C limit. Use a minimum 1 square inch copper pour connected to the exposed pad to achieve rated thermal performance.
DDR2 DRAM interface signals (pins 113-156) must be routed as a matched-length group with controlled impedance (50 ohm single-ended, 100 ohm differential for clock pair). Per the Microchip PIC32MZ DA hardware design checklist, DQ-DQS skew should be within 25 ps, and the DDR2_CLK_P/N pair requires 100 ohm differential routing. Place a 100nF decoupling capacitor within 5mm of each VDD pin and a bulk 10uF capacitor near the exposed pad ground pour.
Do not confuse the -I/2J (industrial temperature, Tray packaging) with the -T/2J (industrial temperature, Tape and Reel) or -E/2J (extended temperature) variants. The exposed thermal pad (pin 177 in the datasheet pinout table) must be soldered to the PCB ground pour for thermal and electrical performance - omitting this connection causes overheating and DDR2 signal-integrity failures. When using HS USB, ensure the USB trace impedance is 90 ohm differential per USB 2.0 specification.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - choose automotive-grade variant for vehicle applications.