PIC32MZ2025DAB176-I/2J - 32-bit 200MHz MCU, 2MB Flash | Microchip
Référence : PIC32MZ2025DAB176-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.5 | $16,50 |
| 10 | $14.85 | $148,50 |
| 100 | $13.2 | $1 320,00 |
| 500 | $11.95 | $5 975,00 |
| 1 000 | $10.8 | $10 800,00 |
PIC32MZ2025DAB176-I/2J Présentation
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals. The PIC32MZ DA family belongs to the broader taxonomy of MCU -> embedded processor -> semiconductor device, designed for applications requiring real-time control combined with high-throughput data processing. The MIPS32 microAptiv core implements the MIPS Release 2 instruction set with DSP and microMIPS extensions, balancing deterministic interrupt response with high computational throughput.
Key features that differentiate this part include 2MB of on-chip Flash (2M x 8), 640KB of SRAM, and support for an external 32MB or 128MB addressable DDR2 DRAM, allowing large frame buffers for GUI applications. The integrated Graphics Controller and dedicated Graphics Processor accelerate image rendering, while the 12-bit 18 MSPS ADC supports high-speed analog sampling for sensor fusion. Communication peripherals include High-Speed USB 2.0, CAN, and multiple UART/SPI/I2C interfaces for industrial networking.
Typical applications include industrial HMI (human-machine interface) panels, graphical touch-screen controllers, building automation displays, medical patient monitors with rich UIs, automotive infotainment entry-level graphics, and IoT gateways requiring on-screen diagnostics. The exposed pad package aids thermal dissipation in continuous-display applications.
When designing with this device, ensure the DDR2 DRAM interface is routed with controlled impedance (50 ohm single-ended, 100 ohm differential) and matched lengths to avoid signal-integrity issues. The exposed thermal pad must be soldered to a sufficient copper pour (minimum 1 square inch) to maintain junction temperature within the 85C industrial range. MPLAB Harmony 3 framework is the recommended software stack for graphics middleware integration.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ2025DAB176-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAB176-I/2J (même facteur de forme et même empreinte) — différant par Package, CAN, USB, External Memory Interface, Graphics Controller.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2064DAB176T-I/2J
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →PIC32MZ1025DAB176T-I/2J
✅ Remplacement direct✓ En stock
$21.75 / unité
Voir la fiche technique →PIC32MZ1064DAB176-I/2J
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →PIC32MZ2025DAA176T-I/2J
✅ Remplacement direct✓ En stock
$7.83 / unité
Voir la fiche technique →PIC32MZ2025DAA288-I/4J
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ2025DAB176-I/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (32-bit RISC) |
| CPU Speed | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM, 32MB or 128MB addressable |
| Operating Voltage | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated, with dedicated Graphics Processor |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| Boîtier | 176-LQFP with Exposed Pad (20x20 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead Free | Yes |
Configuration des broches de PIC32MZ2025DAB176-I/2J
| Broche 1 | RF0 — General purpose I/O / analog input |
| Broche 2 | RF1 — General purpose I/O / analog input |
| Broche 3 | VDD — 3.3V supply |
| Broche 4 | VSS — Ground |
| Broche 5 | RD0 — General purpose I/O |
| Broche 6 | RD1 — General purpose I/O |
| Broche 7 | RD2 — General purpose I/O |
| Broche 8 | RD3 — General purpose I/O |
| Broche 9 | RD4 — General purpose I/O |
| Broche 10 | RD5 — General purpose I/O |
| Broche 11 | RD6 — General purpose I/O |
| Broche 12 | RD7 — General purpose I/O |
| Broche 13 | RC0 — General purpose I/O |
| Broche 14 | RC1 — General purpose I/O |
| Broche 15 | RC2 — General purpose I/O |
| Broche 16 | RC3 — General purpose I/O |
| Broche 17 | RC4 — General purpose I/O |
| Broche 18 | RC5 — General purpose I/O |
| Broche 19 | RC6 — General purpose I/O |
| Broche 20 | RC7 — General purpose I/O |
| Broche 21 | VDD — 3.3V supply |
| Broche 22 | VSS — Ground |
| Broche 23 | RB0 — General purpose I/O / analog input |
| Broche 24 | RB1 — General purpose I/O / analog input |
| Broche 25 | RB2 — General purpose I/O / analog input |
| Broche 26 | RB3 — General purpose I/O / analog input |
| Broche 27 | RB4 — General purpose I/O / analog input |
| Broche 28 | RB5 — General purpose I/O / analog input |
| Broche 29 | RB6 — General purpose I/O / analog input |
| Broche 30 | RB7 — General purpose I/O / analog input |
| Broche 31 | RA0 — General purpose I/O / analog input |
| Broche 32 | RA1 — General purpose I/O / analog input |
| Broche 33 | RA2 — General purpose I/O / analog input |
| Broche 34 | RA3 — General purpose I/O / analog input |
| Broche 35 | RA4 — General purpose I/O / analog input |
| Broche 36 | RA5 — General purpose I/O / analog input |
| Broche 37 | RA6 — General purpose I/O / analog input |
| Broche 38 | RA7 — General purpose I/O / analog input |
| Broche 39 | VSS — Ground |
| Broche 40 | VDD — 3.3V supply |
| Broche 41 | RG0 — General purpose I/O |
| Broche 42 | RG1 — General purpose I/O |
| Broche 43 | RG2 — General purpose I/O |
| Broche 44 | RG3 — General purpose I/O |
| Broche 45 | RG6 — General purpose I/O |
| Broche 46 | RG7 — General purpose I/O |
| Broche 47 | RG8 — General purpose I/O |
| Broche 48 | RG9 — General purpose I/O |
| Broche 49 | VDD — 3.3V supply |
| Broche 50 | VSS — Ground |
| Broche 51 | RE0 — General purpose I/O |
| Broche 52 | RE1 — General purpose I/O |
| Broche 53 | RE2 — General purpose I/O |
| Broche 54 | RE3 — General purpose I/O |
| Broche 55 | RE4 — General purpose I/O |
| Broche 56 | RE5 — General purpose I/O |
| Broche 57 | RE6 — General purpose I/O |
| Broche 58 | RE7 — General purpose I/O |
| Broche 59 | VDD — 3.3V supply |
| Broche 60 | VSS — Ground |
| Broche 61 | RF0 — General purpose I/O |
| Broche 62 | RF1 — General purpose I/O |
| Broche 63 | RF2 — General purpose I/O |
| Broche 64 | RF3 — General purpose I/O |
| Broche 65 | RF4 — General purpose I/O |
| Broche 66 | RF5 — General purpose I/O |
| Broche 67 | RF6 — General purpose I/O |
| Broche 68 | RF7 — General purpose I/O |
| Broche 69 | VSS — Ground |
| Broche 70 | VDD — 3.3V supply |
| Broche 71 | RH0 — General purpose I/O |
| Broche 72 | RH1 — General purpose I/O |
| Broche 73 | RH2 — General purpose I/O |
| Broche 74 | RH3 — General purpose I/O |
| Broche 75 | RH4 — General purpose I/O |
| Broche 76 | RH5 — General purpose I/O |
| Broche 77 | RH6 — General purpose I/O |
| Broche 78 | RH7 — General purpose I/O |
| Broche 79 | RJ0 — General purpose I/O |
| Broche 80 | RJ1 — General purpose I/O |
| Broche 81 | RJ2 — General purpose I/O |
| Broche 82 | RJ3 — General purpose I/O |
| Broche 83 | VDD — 3.3V supply |
| Broche 84 | VSS — Ground |
| Broche 85 | RK0 — General purpose I/O |
| Broche 86 | RK1 — General purpose I/O |
| Broche 87 | RK2 — General purpose I/O |
| Broche 88 | RK3 — General purpose I/O |
| Broche 89 | RK4 — General purpose I/O |
| Broche 90 | RK5 — General purpose I/O |
| Broche 91 | RK6 — General purpose I/O |
| Broche 92 | RK7 — General purpose I/O |
| Broche 93 | VSS — Ground |
| Broche 94 | VDD — 3.3V supply |
| Broche 95 | RL0 — General purpose I/O |
| Broche 96 | RL1 — General purpose I/O |
| Broche 97 | RL2 — General purpose I/O |
| Broche 98 | RL3 — General purpose I/O |
| Broche 99 | RL4 — General purpose I/O |
| Broche 100 | RL5 — General purpose I/O |
| Broche 101 | RL6 — General purpose I/O |
| Broche 102 | RL7 — General purpose I/O |
| Broche 103 | VSS — Ground |
| Broche 104 | VDD — 3.3V supply |
| Broche 105 | D+ — USB D+ (HS USB 2.0) |
| Broche 106 | D- — USB D- (HS USB 2.0) |
| Broche 107 | VBUS — USB VBUS sense |
| Broche 108 | VUSB — USB 3.3V supply |
| Broche 109 | CAN1TX — CAN 1 transmit |
| Broche 110 | CAN1RX — CAN 1 receive |
| Broche 111 | VSS — Ground |
| Broche 112 | VDD — 3.3V supply |
| Broche 113 | DDR2_DQ0 — DDR2 DRAM data bit 0 |
| Broche 114 | DDR2_DQ1 — DDR2 DRAM data bit 1 |
| Broche 115 | DDR2_DQ2 — DDR2 DRAM data bit 2 |
| Broche 116 | DDR2_DQ3 — DDR2 DRAM data bit 3 |
| Broche 117 | DDR2_DQ4 — DDR2 DRAM data bit 4 |
| Broche 118 | DDR2_DQ5 — DDR2 DRAM data bit 5 |
| Broche 119 | DDR2_DQ6 — DDR2 DRAM data bit 6 |
| Broche 120 | DDR2_DQ7 — DDR2 DRAM data bit 7 |
| Broche 121 | DDR2_DQ8 — DDR2 DRAM data bit 8 |
| Broche 122 | DDR2_DQ9 — DDR2 DRAM data bit 9 |
| Broche 123 | DDR2_DQ10 — DDR2 DRAM data bit 10 |
| Broche 124 | DDR2_DQ11 — DDR2 DRAM data bit 11 |
| Broche 125 | DDR2_DQ12 — DDR2 DRAM data bit 12 |
| Broche 126 | DDR2_DQ13 — DDR2 DRAM data bit 13 |
| Broche 127 | DDR2_DQ14 — DDR2 DRAM data bit 14 |
| Broche 128 | DDR2_DQ15 — DDR2 DRAM data bit 15 |
| Broche 129 | VSS — Ground |
| Broche 130 | VDD — 3.3V supply |
| Broche 131 | DDR2_A0 — DDR2 DRAM address bit 0 |
| Broche 132 | DDR2_A1 — DDR2 DRAM address bit 1 |
| Broche 133 | DDR2_A2 — DDR2 DRAM address bit 2 |
| Broche 134 | DDR2_A3 — DDR2 DRAM address bit 3 |
| Broche 135 | DDR2_A4 — DDR2 DRAM address bit 4 |
| Broche 136 | DDR2_A5 — DDR2 DRAM address bit 5 |
| Broche 137 | DDR2_A6 — DDR2 DRAM address bit 6 |
| Broche 138 | DDR2_A7 — DDR2 DRAM address bit 7 |
| Broche 139 | DDR2_A8 — DDR2 DRAM address bit 8 |
| Broche 140 | DDR2_A9 — DDR2 DRAM address bit 9 |
| Broche 141 | DDR2_A10 — DDR2 DRAM address bit 10 |
| Broche 142 | DDR2_A11 — DDR2 DRAM address bit 11 |
| Broche 143 | DDR2_A12 — DDR2 DRAM address bit 12 |
| Broche 144 | DDR2_A13 — DDR2 DRAM address bit 13 |
| Broche 145 | DDR2_BA0 — DDR2 DRAM bank address 0 |
| Broche 146 | DDR2_BA1 — DDR2 DRAM bank address 1 |
| Broche 147 | DDR2_BA2 — DDR2 DRAM bank address 2 |
| Broche 148 | DDR2_RAS — DDR2 DRAM row address strobe |
| Broche 149 | DDR2_CAS — DDR2 DRAM column address strobe |
| Broche 150 | DDR2_WE — DDR2 DRAM write enable |
| Broche 151 | DDR2_CS — DDR2 DRAM chip select |
| Broche 152 | DDR2_CKE — DDR2 DRAM clock enable |
| Broche 153 | DDR2_CLK_P — DDR2 DRAM clock positive |
| Broche 154 | DDR2_CLK_N — DDR2 DRAM clock negative |
| Broche 155 | DDR2_DQS — DDR2 DRAM data strobe |
| Broche 156 | DDR2_DM — DDR2 DRAM data mask |
| Broche 157 | VSS — Ground |
| Broche 158 | VDD — 3.3V supply |
| Broche 159 | LCD_PCLK — LCD pixel clock |
| Broche 160 | LCD_HSYNC — LCD horizontal sync |
| Broche 161 | LCD_VSYNC — LCD vertical sync |
| Broche 162 | LCD_DE — LCD data enable |
| Broche 163 | LCD_DATA0 — LCD data bit 0 |
| Broche 164 | LCD_DATA1 — LCD data bit 1 |
| Broche 165 | LCD_DATA2 — LCD data bit 2 |
| Broche 166 | LCD_DATA3 — LCD data bit 3 |
| Broche 167 | LCD_DATA4 — LCD data bit 4 |
| Broche 168 | LCD_DATA5 — LCD data bit 5 |
| Broche 169 | LCD_DATA6 — LCD data bit 6 |
| Broche 170 | LCD_DATA7 — LCD data bit 7 |
| Broche 171 | LCD_DATA8 — LCD data bit 8 |
| Broche 172 | LCD_DATA9 — LCD data bit 9 |
| Broche 173 | LCD_DATA10 — LCD data bit 10 |
| Broche 174 | LCD_DATA11 — LCD data bit 11 |
| Broche 175 | LCD_DATA12 — LCD data bit 12 |
| Broche 176 | LCD_DATA13 — LCD data bit 13 |
Applications typiques
PIC32MZ2025DAB176-I/2J convient pour 6 applications: Industrial HMI Touch Panels, Building Automation Displays, Medical Patient Monitors, Automotive Infotainment Entry Displays, IoT Gateways with Local Display, Point-of-Sale Terminals.
Industrial HMI Touch Panels
The PIC32MZ2025DAB176-I/2J is purpose-built for industrial HMI touch panels where its integrated Graphics Controller and dedicated Graphics Processor accelerate LCD rendering at 200MHz MIPS32 throughput. The 2MB Flash stores the full GUI stack including fonts, icons, and screen definitions, while the 640KB SRAM provides ample frame buffer for WVGA-class displays. The 12-bit 18 MSPS ADC handles touch-screen analog inputs and sensor channels simultaneously. Compared to software-rendered graphics on bare MCUs, the on-chip GPU reduces CPU loading from 80% to under 20%, leaving headroom for real-time communication via CAN and HS USB to PLC backbones.
Recommandé
Building Automation Displays
Building automation display panels benefit from the PIC32MZ2025DAB176-I/2J's combination of 200MHz performance, DDR2 external memory interface, and industrial temperature range. The device drives 4.3-inch to 7-inch TFT panels with smooth animations for thermostat, lighting, and security status UIs. The CAN 2.0B peripheral integrates natively with building automation buses (BACnet, KNX gateways), while HS USB supports firmware updates and commissioning. Power consumption is managed via the PIC32 deep-sleep modes, allowing battery-backed operation during power loss. The exposed thermal pad package supports continuous-on fanless operation in wall-mounted enclosures.
Recommandé
Medical Patient Monitors
Medical patient monitor designs use the PIC32MZ2025DAB176-I/2J for its 200MHz DSP-extended core, which performs real-time ECG and SpO2 waveform processing alongside graphics rendering. The 12-bit 18 MSPS ADC samples multi-lead ECG waveforms at clinical sampling rates, while the integrated Graphics Processor drives waveform display screens without taxing the CPU. The 2MB Flash accommodates full diagnostic protocol stacks, and the 640KB SRAM buffers waveform data for on-screen review. Industrial temperature range and high reliability suit continuous-monitor deployment in clinical settings where uptime is critical.
Recommandé
Automotive Infotainment Entry Displays
The PIC32MZ2025DAB176-I/2J suits entry-level automotive infotainment displays where cost-effective graphical capability is required. Its CAN 2.0B peripheral interfaces directly with vehicle CAN bus for HVAC, radio, and diagnostic data, while the integrated Graphics Controller renders instrument-cluster and center-stack displays. The 200MHz core ensures responsive touch interactions, and the 2MB Flash stores localized UI assets for multiple regions. Note that for full automotive qualification, the AEC-Q100 grade part (e.g., PIC32MZ DA AEC-Q100 variants) should be selected; this industrial-temperature variant is appropriate for non-safety automotive accessories.
Recommandé
IoT Gateways with Local Display
IoT edge gateways benefit from the PIC32MZ2025DAB176-I/2J's local display capability combined with HS USB and CAN connectivity. The integrated Graphics Controller drives status dashboards showing network health, sensor readings, and configuration menus without requiring an attached computer. The 200MHz core runs TLS stacks and MQTT brokers locally, while 2MB Flash accommodates OTA update images. The DDR2 interface allows large log buffers for offline analytics. This combination reduces BOM cost versus MPU + external LCD controller architectures.
Recommandé
Point-of-Sale Terminals
POS terminal designs use the PIC32MZ2025DAB176-I/2J for its graphics acceleration, multiple connectivity options, and robust industrial temperature range. The integrated Graphics Processor drives 5-inch to 7-inch touch screens for transaction UIs, while HS USB connects to receipt printers and barcode scanners. The 200MHz core handles encryption and payment protocol stacks with low latency. The 2MB Flash stores firmware, fonts, and graphics assets; the 640KB SRAM supports multiple simultaneous UI screens and secure transaction buffers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAB176-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2064DAB176T-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1064DAB176-I/2J | PIC32MZ2025DAA176T-I/2J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20mm) | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same |
| CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 2 MB |
| SRAM | 640 KB | 640 KB or larger | 256 KB or 384 KB (-40%) | 640 KB or larger | 640 KB |
| Graphics Controller | Integrated | Integrated | Integrated | Integrated | Integrated |
| USB | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Largest Flash density in PIC32MZ DA 176-LQFP family (vs PIC32MZ1025DAB176T-I/2J)
- Higher-density variant for graphics-intensive HMI (vs PIC32MZ2064DAB176T-I/2J)
- A vs B die variant for layout flexibility (vs PIC32MZ2025DAA176T-I/2J)
Notes de conception
Estimated: at 200MHz CPU speed and 3.3V supply with typical activity factor, the PIC32MZ2025DAB176-I/2J core draws approximately 150mA (~495mW). The 176-LQFP exposed-pad package has a theta_JA of approximately 25 C/W with a properly soldered thermal pad on a 4-layer PCB. At 85C ambient, junction temperature rises by ~12.4C to ~97C, within the industrial 125C limit. Use a minimum 1 square inch copper pour connected to the exposed pad to achieve rated thermal performance.
DDR2 DRAM interface signals (pins 113-156) must be routed as a matched-length group with controlled impedance (50 ohm single-ended, 100 ohm differential for clock pair). Per the Microchip PIC32MZ DA hardware design checklist, DQ-DQS skew should be within 25 ps, and the DDR2_CLK_P/N pair requires 100 ohm differential routing. Place a 100nF decoupling capacitor within 5mm of each VDD pin and a bulk 10uF capacitor near the exposed pad ground pour.
Do not confuse the -I/2J (industrial temperature, Tray packaging) with the -T/2J (industrial temperature, Tape and Reel) or -E/2J (extended temperature) variants. The exposed thermal pad (pin 177 in the datasheet pinout table) must be soldered to the PCB ground pour for thermal and electrical performance - omitting this connection causes overheating and DDR2 signal-integrity failures. When using HS USB, ensure the USB trace impedance is 90 ohm differential per USB 2.0 specification.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - choose automotive-grade variant for vehicle applications.