PIC32MZ2025DAB176-I/2J - 32-bit 200MHz MCU, 2MB Flash | Microchip
MPN: PIC32MZ2025DAB176-I/2J ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.5 | $16.50 |
| 10 | $14.85 | $148.50 |
| 100 | $13.2 | $1,320.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.8 | $10,800.00 |
PIC32MZ2025DAB176-I/2J Overview
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals. The PIC32MZ DA family belongs to the broader taxonomy of MCU -> embedded processor -> semiconductor device, designed for applications requiring real-time control combined with high-throughput data processing. The MIPS32 microAptiv core implements the MIPS Release 2 instruction set with DSP and microMIPS extensions, balancing deterministic interrupt response with high computational throughput.
Key features that differentiate this part include 2MB of on-chip Flash (2M x 8), 640KB of SRAM, and support for an external 32MB or 128MB addressable DDR2 DRAM, allowing large frame buffers for GUI applications. The integrated Graphics Controller and dedicated Graphics Processor accelerate image rendering, while the 12-bit 18 MSPS ADC supports high-speed analog sampling for sensor fusion. Communication peripherals include High-Speed USB 2.0, CAN, and multiple UART/SPI/I2C interfaces for industrial networking.
Typical applications include industrial HMI (human-machine interface) panels, graphical touch-screen controllers, building automation displays, medical patient monitors with rich UIs, automotive infotainment entry-level graphics, and IoT gateways requiring on-screen diagnostics. The exposed pad package aids thermal dissipation in continuous-display applications.
When designing with this device, ensure the DDR2 DRAM interface is routed with controlled impedance (50 ohm single-ended, 100 ohm differential) and matched lengths to avoid signal-integrity issues. The exposed thermal pad must be soldered to a sufficient copper pour (minimum 1 square inch) to maintain junction temperature within the 85C industrial range. MPLAB Harmony 3 framework is the recommended software stack for graphics middleware integration.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MZ2025DAB176-I/2J — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2025DAB176-I/2J (same form factor and footprint) — differing in Package, CAN, USB, External Memory Interface, Graphics Controller.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →PIC32MZ2025DAB176-I/2J Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv (32-bit RISC) |
| CPU Speed | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM, 32MB or 128MB addressable |
| Operating Voltage | 3.3 V |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated, with dedicated Graphics Processor |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0B) |
| Package | 176-LQFP with Exposed Pad (20x20 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead Free | Yes |
PIC32MZ2025DAB176-I/2J Pin Configuration
| Pin 1 | RF0 — General purpose I/O / analog input |
| Pin 2 | RF1 — General purpose I/O / analog input |
| Pin 3 | VDD — 3.3V supply |
| Pin 4 | VSS — Ground |
| Pin 5 | RD0 — General purpose I/O |
| Pin 6 | RD1 — General purpose I/O |
| Pin 7 | RD2 — General purpose I/O |
| Pin 8 | RD3 — General purpose I/O |
| Pin 9 | RD4 — General purpose I/O |
| Pin 10 | RD5 — General purpose I/O |
| Pin 11 | RD6 — General purpose I/O |
| Pin 12 | RD7 — General purpose I/O |
| Pin 13 | RC0 — General purpose I/O |
| Pin 14 | RC1 — General purpose I/O |
| Pin 15 | RC2 — General purpose I/O |
| Pin 16 | RC3 — General purpose I/O |
| Pin 17 | RC4 — General purpose I/O |
| Pin 18 | RC5 — General purpose I/O |
| Pin 19 | RC6 — General purpose I/O |
| Pin 20 | RC7 — General purpose I/O |
| Pin 21 | VDD — 3.3V supply |
| Pin 22 | VSS — Ground |
| Pin 23 | RB0 — General purpose I/O / analog input |
| Pin 24 | RB1 — General purpose I/O / analog input |
| Pin 25 | RB2 — General purpose I/O / analog input |
| Pin 26 | RB3 — General purpose I/O / analog input |
| Pin 27 | RB4 — General purpose I/O / analog input |
| Pin 28 | RB5 — General purpose I/O / analog input |
| Pin 29 | RB6 — General purpose I/O / analog input |
| Pin 30 | RB7 — General purpose I/O / analog input |
| Pin 31 | RA0 — General purpose I/O / analog input |
| Pin 32 | RA1 — General purpose I/O / analog input |
| Pin 33 | RA2 — General purpose I/O / analog input |
| Pin 34 | RA3 — General purpose I/O / analog input |
| Pin 35 | RA4 — General purpose I/O / analog input |
| Pin 36 | RA5 — General purpose I/O / analog input |
| Pin 37 | RA6 — General purpose I/O / analog input |
| Pin 38 | RA7 — General purpose I/O / analog input |
| Pin 39 | VSS — Ground |
| Pin 40 | VDD — 3.3V supply |
| Pin 41 | RG0 — General purpose I/O |
| Pin 42 | RG1 — General purpose I/O |
| Pin 43 | RG2 — General purpose I/O |
| Pin 44 | RG3 — General purpose I/O |
| Pin 45 | RG6 — General purpose I/O |
| Pin 46 | RG7 — General purpose I/O |
| Pin 47 | RG8 — General purpose I/O |
| Pin 48 | RG9 — General purpose I/O |
| Pin 49 | VDD — 3.3V supply |
| Pin 50 | VSS — Ground |
| Pin 51 | RE0 — General purpose I/O |
| Pin 52 | RE1 — General purpose I/O |
| Pin 53 | RE2 — General purpose I/O |
| Pin 54 | RE3 — General purpose I/O |
| Pin 55 | RE4 — General purpose I/O |
| Pin 56 | RE5 — General purpose I/O |
| Pin 57 | RE6 — General purpose I/O |
| Pin 58 | RE7 — General purpose I/O |
| Pin 59 | VDD — 3.3V supply |
| Pin 60 | VSS — Ground |
| Pin 61 | RF0 — General purpose I/O |
| Pin 62 | RF1 — General purpose I/O |
| Pin 63 | RF2 — General purpose I/O |
| Pin 64 | RF3 — General purpose I/O |
| Pin 65 | RF4 — General purpose I/O |
| Pin 66 | RF5 — General purpose I/O |
| Pin 67 | RF6 — General purpose I/O |
| Pin 68 | RF7 — General purpose I/O |
| Pin 69 | VSS — Ground |
| Pin 70 | VDD — 3.3V supply |
| Pin 71 | RH0 — General purpose I/O |
| Pin 72 | RH1 — General purpose I/O |
| Pin 73 | RH2 — General purpose I/O |
| Pin 74 | RH3 — General purpose I/O |
| Pin 75 | RH4 — General purpose I/O |
| Pin 76 | RH5 — General purpose I/O |
| Pin 77 | RH6 — General purpose I/O |
| Pin 78 | RH7 — General purpose I/O |
| Pin 79 | RJ0 — General purpose I/O |
| Pin 80 | RJ1 — General purpose I/O |
| Pin 81 | RJ2 — General purpose I/O |
| Pin 82 | RJ3 — General purpose I/O |
| Pin 83 | VDD — 3.3V supply |
| Pin 84 | VSS — Ground |
| Pin 85 | RK0 — General purpose I/O |
| Pin 86 | RK1 — General purpose I/O |
| Pin 87 | RK2 — General purpose I/O |
| Pin 88 | RK3 — General purpose I/O |
| Pin 89 | RK4 — General purpose I/O |
| Pin 90 | RK5 — General purpose I/O |
| Pin 91 | RK6 — General purpose I/O |
| Pin 92 | RK7 — General purpose I/O |
| Pin 93 | VSS — Ground |
| Pin 94 | VDD — 3.3V supply |
| Pin 95 | RL0 — General purpose I/O |
| Pin 96 | RL1 — General purpose I/O |
| Pin 97 | RL2 — General purpose I/O |
| Pin 98 | RL3 — General purpose I/O |
| Pin 99 | RL4 — General purpose I/O |
| Pin 100 | RL5 — General purpose I/O |
| Pin 101 | RL6 — General purpose I/O |
| Pin 102 | RL7 — General purpose I/O |
| Pin 103 | VSS — Ground |
| Pin 104 | VDD — 3.3V supply |
| Pin 105 | D+ — USB D+ (HS USB 2.0) |
| Pin 106 | D- — USB D- (HS USB 2.0) |
| Pin 107 | VBUS — USB VBUS sense |
| Pin 108 | VUSB — USB 3.3V supply |
| Pin 109 | CAN1TX — CAN 1 transmit |
| Pin 110 | CAN1RX — CAN 1 receive |
| Pin 111 | VSS — Ground |
| Pin 112 | VDD — 3.3V supply |
| Pin 113 | DDR2_DQ0 — DDR2 DRAM data bit 0 |
| Pin 114 | DDR2_DQ1 — DDR2 DRAM data bit 1 |
| Pin 115 | DDR2_DQ2 — DDR2 DRAM data bit 2 |
| Pin 116 | DDR2_DQ3 — DDR2 DRAM data bit 3 |
| Pin 117 | DDR2_DQ4 — DDR2 DRAM data bit 4 |
| Pin 118 | DDR2_DQ5 — DDR2 DRAM data bit 5 |
| Pin 119 | DDR2_DQ6 — DDR2 DRAM data bit 6 |
| Pin 120 | DDR2_DQ7 — DDR2 DRAM data bit 7 |
| Pin 121 | DDR2_DQ8 — DDR2 DRAM data bit 8 |
| Pin 122 | DDR2_DQ9 — DDR2 DRAM data bit 9 |
| Pin 123 | DDR2_DQ10 — DDR2 DRAM data bit 10 |
| Pin 124 | DDR2_DQ11 — DDR2 DRAM data bit 11 |
| Pin 125 | DDR2_DQ12 — DDR2 DRAM data bit 12 |
| Pin 126 | DDR2_DQ13 — DDR2 DRAM data bit 13 |
| Pin 127 | DDR2_DQ14 — DDR2 DRAM data bit 14 |
| Pin 128 | DDR2_DQ15 — DDR2 DRAM data bit 15 |
| Pin 129 | VSS — Ground |
| Pin 130 | VDD — 3.3V supply |
| Pin 131 | DDR2_A0 — DDR2 DRAM address bit 0 |
| Pin 132 | DDR2_A1 — DDR2 DRAM address bit 1 |
| Pin 133 | DDR2_A2 — DDR2 DRAM address bit 2 |
| Pin 134 | DDR2_A3 — DDR2 DRAM address bit 3 |
| Pin 135 | DDR2_A4 — DDR2 DRAM address bit 4 |
| Pin 136 | DDR2_A5 — DDR2 DRAM address bit 5 |
| Pin 137 | DDR2_A6 — DDR2 DRAM address bit 6 |
| Pin 138 | DDR2_A7 — DDR2 DRAM address bit 7 |
| Pin 139 | DDR2_A8 — DDR2 DRAM address bit 8 |
| Pin 140 | DDR2_A9 — DDR2 DRAM address bit 9 |
| Pin 141 | DDR2_A10 — DDR2 DRAM address bit 10 |
| Pin 142 | DDR2_A11 — DDR2 DRAM address bit 11 |
| Pin 143 | DDR2_A12 — DDR2 DRAM address bit 12 |
| Pin 144 | DDR2_A13 — DDR2 DRAM address bit 13 |
| Pin 145 | DDR2_BA0 — DDR2 DRAM bank address 0 |
| Pin 146 | DDR2_BA1 — DDR2 DRAM bank address 1 |
| Pin 147 | DDR2_BA2 — DDR2 DRAM bank address 2 |
| Pin 148 | DDR2_RAS — DDR2 DRAM row address strobe |
| Pin 149 | DDR2_CAS — DDR2 DRAM column address strobe |
| Pin 150 | DDR2_WE — DDR2 DRAM write enable |
| Pin 151 | DDR2_CS — DDR2 DRAM chip select |
| Pin 152 | DDR2_CKE — DDR2 DRAM clock enable |
| Pin 153 | DDR2_CLK_P — DDR2 DRAM clock positive |
| Pin 154 | DDR2_CLK_N — DDR2 DRAM clock negative |
| Pin 155 | DDR2_DQS — DDR2 DRAM data strobe |
| Pin 156 | DDR2_DM — DDR2 DRAM data mask |
| Pin 157 | VSS — Ground |
| Pin 158 | VDD — 3.3V supply |
| Pin 159 | LCD_PCLK — LCD pixel clock |
| Pin 160 | LCD_HSYNC — LCD horizontal sync |
| Pin 161 | LCD_VSYNC — LCD vertical sync |
| Pin 162 | LCD_DE — LCD data enable |
| Pin 163 | LCD_DATA0 — LCD data bit 0 |
| Pin 164 | LCD_DATA1 — LCD data bit 1 |
| Pin 165 | LCD_DATA2 — LCD data bit 2 |
| Pin 166 | LCD_DATA3 — LCD data bit 3 |
| Pin 167 | LCD_DATA4 — LCD data bit 4 |
| Pin 168 | LCD_DATA5 — LCD data bit 5 |
| Pin 169 | LCD_DATA6 — LCD data bit 6 |
| Pin 170 | LCD_DATA7 — LCD data bit 7 |
| Pin 171 | LCD_DATA8 — LCD data bit 8 |
| Pin 172 | LCD_DATA9 — LCD data bit 9 |
| Pin 173 | LCD_DATA10 — LCD data bit 10 |
| Pin 174 | LCD_DATA11 — LCD data bit 11 |
| Pin 175 | LCD_DATA12 — LCD data bit 12 |
| Pin 176 | LCD_DATA13 — LCD data bit 13 |
Typical Applications
PIC32MZ2025DAB176-I/2J is suitable for 6 applications: Industrial HMI Touch Panels, Building Automation Displays, Medical Patient Monitors, Automotive Infotainment Entry Displays, IoT Gateways with Local Display, Point-of-Sale Terminals.
Industrial HMI Touch Panels
The PIC32MZ2025DAB176-I/2J is purpose-built for industrial HMI touch panels where its integrated Graphics Controller and dedicated Graphics Processor accelerate LCD rendering at 200MHz MIPS32 throughput. The 2MB Flash stores the full GUI stack including fonts, icons, and screen definitions, while the 640KB SRAM provides ample frame buffer for WVGA-class displays. The 12-bit 18 MSPS ADC handles touch-screen analog inputs and sensor channels simultaneously. Compared to software-rendered graphics on bare MCUs, the on-chip GPU reduces CPU loading from 80% to under 20%, leaving headroom for real-time communication via CAN and HS USB to PLC backbones.
Recommended
Building Automation Displays
Building automation display panels benefit from the PIC32MZ2025DAB176-I/2J's combination of 200MHz performance, DDR2 external memory interface, and industrial temperature range. The device drives 4.3-inch to 7-inch TFT panels with smooth animations for thermostat, lighting, and security status UIs. The CAN 2.0B peripheral integrates natively with building automation buses (BACnet, KNX gateways), while HS USB supports firmware updates and commissioning. Power consumption is managed via the PIC32 deep-sleep modes, allowing battery-backed operation during power loss. The exposed thermal pad package supports continuous-on fanless operation in wall-mounted enclosures.
Recommended
Medical Patient Monitors
Medical patient monitor designs use the PIC32MZ2025DAB176-I/2J for its 200MHz DSP-extended core, which performs real-time ECG and SpO2 waveform processing alongside graphics rendering. The 12-bit 18 MSPS ADC samples multi-lead ECG waveforms at clinical sampling rates, while the integrated Graphics Processor drives waveform display screens without taxing the CPU. The 2MB Flash accommodates full diagnostic protocol stacks, and the 640KB SRAM buffers waveform data for on-screen review. Industrial temperature range and high reliability suit continuous-monitor deployment in clinical settings where uptime is critical.
Recommended
Automotive Infotainment Entry Displays
The PIC32MZ2025DAB176-I/2J suits entry-level automotive infotainment displays where cost-effective graphical capability is required. Its CAN 2.0B peripheral interfaces directly with vehicle CAN bus for HVAC, radio, and diagnostic data, while the integrated Graphics Controller renders instrument-cluster and center-stack displays. The 200MHz core ensures responsive touch interactions, and the 2MB Flash stores localized UI assets for multiple regions. Note that for full automotive qualification, the AEC-Q100 grade part (e.g., PIC32MZ DA AEC-Q100 variants) should be selected; this industrial-temperature variant is appropriate for non-safety automotive accessories.
Recommended
IoT Gateways with Local Display
IoT edge gateways benefit from the PIC32MZ2025DAB176-I/2J's local display capability combined with HS USB and CAN connectivity. The integrated Graphics Controller drives status dashboards showing network health, sensor readings, and configuration menus without requiring an attached computer. The 200MHz core runs TLS stacks and MQTT brokers locally, while 2MB Flash accommodates OTA update images. The DDR2 interface allows large log buffers for offline analytics. This combination reduces BOM cost versus MPU + external LCD controller architectures.
Recommended
Point-of-Sale Terminals
POS terminal designs use the PIC32MZ2025DAB176-I/2J for its graphics acceleration, multiple connectivity options, and robust industrial temperature range. The integrated Graphics Processor drives 5-inch to 7-inch touch screens for transaction UIs, while HS USB connects to receipt printers and barcode scanners. The 200MHz core handles encryption and payment protocol stacks with low latency. The 2MB Flash stores firmware, fonts, and graphics assets; the 640KB SRAM supports multiple simultaneous UI screens and secure transaction buffers.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2025DAB176-I/2J — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ2064DAB176T-I/2J | PIC32MZ1025DAB176T-I/2J | PIC32MZ1064DAB176-I/2J | PIC32MZ2025DAA176T-I/2J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20mm) | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same | 176-LQFP (20x20mm) - same |
| CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 2 MB |
| SRAM | 640 KB | 640 KB or larger | 256 KB or 384 KB (-40%) | 640 KB or larger | 640 KB |
| Graphics Controller | Integrated | Integrated | Integrated | Integrated | Integrated |
| USB | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 | HS USB 2.0 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Largest Flash density in PIC32MZ DA 176-LQFP family (vs PIC32MZ1025DAB176T-I/2J)
- Higher-density variant for graphics-intensive HMI (vs PIC32MZ2064DAB176T-I/2J)
- A vs B die variant for layout flexibility (vs PIC32MZ2025DAA176T-I/2J)
Design Notes
Estimated: at 200MHz CPU speed and 3.3V supply with typical activity factor, the PIC32MZ2025DAB176-I/2J core draws approximately 150mA (~495mW). The 176-LQFP exposed-pad package has a theta_JA of approximately 25 C/W with a properly soldered thermal pad on a 4-layer PCB. At 85C ambient, junction temperature rises by ~12.4C to ~97C, within the industrial 125C limit. Use a minimum 1 square inch copper pour connected to the exposed pad to achieve rated thermal performance.
DDR2 DRAM interface signals (pins 113-156) must be routed as a matched-length group with controlled impedance (50 ohm single-ended, 100 ohm differential for clock pair). Per the Microchip PIC32MZ DA hardware design checklist, DQ-DQS skew should be within 25 ps, and the DDR2_CLK_P/N pair requires 100 ohm differential routing. Place a 100nF decoupling capacitor within 5mm of each VDD pin and a bulk 10uF capacitor near the exposed pad ground pour.
Do not confuse the -I/2J (industrial temperature, Tray packaging) with the -T/2J (industrial temperature, Tape and Reel) or -E/2J (extended temperature) variants. The exposed thermal pad (pin 177 in the datasheet pinout table) must be soldered to the PCB ground pour for thermal and electrical performance - omitting this connection causes overheating and DDR2 signal-integrity failures. When using HS USB, ensure the USB trace impedance is 90 ohm differential per USB 2.0 specification.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - choose automotive-grade variant for vehicle applications.