Microchip Technology

PIC32MZ2025DAB176-I/2J - 32-bit 200MHz MCU, 2MB Flash | Microchip

부품 번호: PIC32MZ2025DAB176-I/2J ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

3.3 V Vdss 176-LQFP with Exposed Pad (20x20 mm) Package 200 MHz Speed 2 MB (2M x 8) Memory

시작가 $10.8 USD / 개

MOQ: 1 |

가격 업데이트: 2026-10-04

볼륨 가격

수량	단가	합계
1	$16.5	$16.50
10	$14.85	$148.50
100	$13.2	$1,320.00
500	$11.95	$5,975.00
1,000	$10.8	$10,800.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

PIC32MZ2025DAB176-I/2J 개요

The Microchip PIC32MZ2025DAB176-I/2J is a 32-bit MIPS32 microAptiv microcontroller from the PIC32MZ Graphics (DA) family, integrating 2MB of Flash and 640KB of SRAM with a 200MHz CPU core, housed in a 176-pin LQFP (20x20mm) package with an exposed thermal pad. The device combines MPU-like performance with MCU design simplicity, making it suitable for graphics-driven embedded applications. Operating from a 3.3V supply, it includes a 12-bit 18 MSPS ADC module with up to 45 analog inputs, plus CAN, HS USB, and an integrated Graphics Controller and Graphics Processor.

A 32-bit microcontroller (MCU) is a single-chip computer that integrates a 32-bit processor core, program memory (Flash), data memory (RAM), and a rich set of on-chip peripherals. The PIC32MZ DA family belongs to the broader taxonomy of MCU -> embedded processor -> semiconductor device, designed for applications requiring real-time control combined with high-throughput data processing. The MIPS32 microAptiv core implements the MIPS Release 2 instruction set with DSP and microMIPS extensions, balancing deterministic interrupt response with high computational throughput.

Key features that differentiate this part include 2MB of on-chip Flash (2M x 8), 640KB of SRAM, and support for an external 32MB or 128MB addressable DDR2 DRAM, allowing large frame buffers for GUI applications. The integrated Graphics Controller and dedicated Graphics Processor accelerate image rendering, while the 12-bit 18 MSPS ADC supports high-speed analog sampling for sensor fusion. Communication peripherals include High-Speed USB 2.0, CAN, and multiple UART/SPI/I2C interfaces for industrial networking.

Typical applications include industrial HMI (human-machine interface) panels, graphical touch-screen controllers, building automation displays, medical patient monitors with rich UIs, automotive infotainment entry-level graphics, and IoT gateways requiring on-screen diagnostics. The exposed pad package aids thermal dissipation in continuous-display applications.

When designing with this device, ensure the DDR2 DRAM interface is routed with controlled impedance (50 ohm single-ended, 100 ohm differential) and matched lengths to avoid signal-integrity issues. The exposed thermal pad must be soldered to a sufficient copper pour (minimum 1 square inch) to maintain junction temperature within the 85C industrial range. MPLAB Harmony 3 framework is the recommended software stack for graphics middleware integration.

This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not consolidated in the manufacturer datasheet alone.

드롭인 대체품: PIC32MZ2025DAB176-I/2J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2025DAB176-I/2J (동일 폼 팩터 및 풋프린트) — 차이점: Package, CAN, USB, External Memory Interface, Graphics Controller.

PIC32MZ1025DAB176T-I/2J

Microchip Technology

Package: 176-LQFP (20x20 mm) with Exposed Pad

External Memory Interface: DDR2 DRAM up to 32 MB or 128 MB (variant dependent)

Graphics Controller: Integrated 2D Graphics Processor + LCD Controller

PIC32MZ1064DAB176-I/2J

Microchip Technology

Package: 176-pin LQFP with Exposed Pad (20x20 mm)

CAN: 2x CAN 2.0b controllers

USB: High-Speed USB 2.0 with on-chip PHY

PIC32MZ2025DAA176-I/2J

Microchip Technology

Package: 176-LQFP (20x20) with Exposed Pad

CAN: 2x CAN 2.0b

USB: Hi-Speed USB 2.0 (Host/Device, 480 Mbps)

PIC32MZ2025DAA176T-I/2J

Microchip Technology

CAN: 2 x CAN modules

USB: HS USB 2.0

External Memory Interface: DDR2 DRAM up to 32 MB or 128 MB

PIC32MZ2025DAA288-I/4J

Microchip Technology

Package: 288-LFBGA (15x15 mm)

CAN: Yes (CAN 2.0)

✅ 드롭인

Microchip Technology

📦 176-LQFP (20x20mm)

PIC32MZ Graphics (DA) Family · MIPS32 microAptiv · Single-Core · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2 DRAM up to 128 MB addressable

✓ 재고 있음

$12.1 / 개

데이터시트 보기 →

PIC32MZ2025DAB176-I/2J 최대 정격 & 전기적 특성

Core Architecture	MIPS32 microAptiv (32-bit RISC)
CPU Speed	200 MHz
Program Memory (Flash)	2 MB (2M x 8)
SRAM	640 KB
External Memory Interface	DDR2 DRAM, 32MB or 128MB addressable
Operating Voltage	3.3 V
ADC	12-bit, 18 MSPS, up to 45 analog inputs
Graphics Controller	Integrated, with dedicated Graphics Processor
USB	High-Speed USB 2.0
CAN	Yes (CAN 2.0B)
패키지	176-LQFP with Exposed Pad (20x20 mm)
실장 유형	Surface Mount
동작 온도	-40C to +85C (Industrial)
MSL 레벨	3 (168 hours)
RoHS 상태	Compliant
Lead Free	Yes

PIC32MZ2025DAB176-I/2J 핀 구성

핀 1	RF0 — General purpose I/O / analog input
핀 2	RF1 — General purpose I/O / analog input
핀 3	VDD — 3.3V supply
핀 4	VSS — Ground
핀 5	RD0 — General purpose I/O
핀 6	RD1 — General purpose I/O
핀 7	RD2 — General purpose I/O
핀 8	RD3 — General purpose I/O
핀 9	RD4 — General purpose I/O
핀 10	RD5 — General purpose I/O
핀 11	RD6 — General purpose I/O
핀 12	RD7 — General purpose I/O
핀 13	RC0 — General purpose I/O
핀 14	RC1 — General purpose I/O
핀 15	RC2 — General purpose I/O
핀 16	RC3 — General purpose I/O
핀 17	RC4 — General purpose I/O
핀 18	RC5 — General purpose I/O
핀 19	RC6 — General purpose I/O
핀 20	RC7 — General purpose I/O
핀 21	VDD — 3.3V supply
핀 22	VSS — Ground
핀 23	RB0 — General purpose I/O / analog input
핀 24	RB1 — General purpose I/O / analog input
핀 25	RB2 — General purpose I/O / analog input
핀 26	RB3 — General purpose I/O / analog input
핀 27	RB4 — General purpose I/O / analog input
핀 28	RB5 — General purpose I/O / analog input
핀 29	RB6 — General purpose I/O / analog input
핀 30	RB7 — General purpose I/O / analog input
핀 31	RA0 — General purpose I/O / analog input
핀 32	RA1 — General purpose I/O / analog input
핀 33	RA2 — General purpose I/O / analog input
핀 34	RA3 — General purpose I/O / analog input
핀 35	RA4 — General purpose I/O / analog input
핀 36	RA5 — General purpose I/O / analog input
핀 37	RA6 — General purpose I/O / analog input
핀 38	RA7 — General purpose I/O / analog input
핀 39	VSS — Ground
핀 40	VDD — 3.3V supply
핀 41	RG0 — General purpose I/O
핀 42	RG1 — General purpose I/O
핀 43	RG2 — General purpose I/O
핀 44	RG3 — General purpose I/O
핀 45	RG6 — General purpose I/O
핀 46	RG7 — General purpose I/O
핀 47	RG8 — General purpose I/O
핀 48	RG9 — General purpose I/O
핀 49	VDD — 3.3V supply
핀 50	VSS — Ground
핀 51	RE0 — General purpose I/O
핀 52	RE1 — General purpose I/O
핀 53	RE2 — General purpose I/O
핀 54	RE3 — General purpose I/O
핀 55	RE4 — General purpose I/O
핀 56	RE5 — General purpose I/O
핀 57	RE6 — General purpose I/O
핀 58	RE7 — General purpose I/O
핀 59	VDD — 3.3V supply
핀 60	VSS — Ground
핀 61	RF0 — General purpose I/O
핀 62	RF1 — General purpose I/O
핀 63	RF2 — General purpose I/O
핀 64	RF3 — General purpose I/O
핀 65	RF4 — General purpose I/O
핀 66	RF5 — General purpose I/O
핀 67	RF6 — General purpose I/O
핀 68	RF7 — General purpose I/O
핀 69	VSS — Ground
핀 70	VDD — 3.3V supply
핀 71	RH0 — General purpose I/O
핀 72	RH1 — General purpose I/O
핀 73	RH2 — General purpose I/O
핀 74	RH3 — General purpose I/O
핀 75	RH4 — General purpose I/O
핀 76	RH5 — General purpose I/O
핀 77	RH6 — General purpose I/O
핀 78	RH7 — General purpose I/O
핀 79	RJ0 — General purpose I/O
핀 80	RJ1 — General purpose I/O
핀 81	RJ2 — General purpose I/O
핀 82	RJ3 — General purpose I/O
핀 83	VDD — 3.3V supply
핀 84	VSS — Ground
핀 85	RK0 — General purpose I/O
핀 86	RK1 — General purpose I/O
핀 87	RK2 — General purpose I/O
핀 88	RK3 — General purpose I/O
핀 89	RK4 — General purpose I/O
핀 90	RK5 — General purpose I/O
핀 91	RK6 — General purpose I/O
핀 92	RK7 — General purpose I/O
핀 93	VSS — Ground
핀 94	VDD — 3.3V supply
핀 95	RL0 — General purpose I/O
핀 96	RL1 — General purpose I/O
핀 97	RL2 — General purpose I/O
핀 98	RL3 — General purpose I/O
핀 99	RL4 — General purpose I/O
핀 100	RL5 — General purpose I/O
핀 101	RL6 — General purpose I/O
핀 102	RL7 — General purpose I/O
핀 103	VSS — Ground
핀 104	VDD — 3.3V supply
핀 105	D+ — USB D+ (HS USB 2.0)
핀 106	D- — USB D- (HS USB 2.0)
핀 107	VBUS — USB VBUS sense
핀 108	VUSB — USB 3.3V supply
핀 109	CAN1TX — CAN 1 transmit
핀 110	CAN1RX — CAN 1 receive
핀 111	VSS — Ground
핀 112	VDD — 3.3V supply
핀 113	DDR2_DQ0 — DDR2 DRAM data bit 0
핀 114	DDR2_DQ1 — DDR2 DRAM data bit 1
핀 115	DDR2_DQ2 — DDR2 DRAM data bit 2
핀 116	DDR2_DQ3 — DDR2 DRAM data bit 3
핀 117	DDR2_DQ4 — DDR2 DRAM data bit 4
핀 118	DDR2_DQ5 — DDR2 DRAM data bit 5
핀 119	DDR2_DQ6 — DDR2 DRAM data bit 6
핀 120	DDR2_DQ7 — DDR2 DRAM data bit 7
핀 121	DDR2_DQ8 — DDR2 DRAM data bit 8
핀 122	DDR2_DQ9 — DDR2 DRAM data bit 9
핀 123	DDR2_DQ10 — DDR2 DRAM data bit 10
핀 124	DDR2_DQ11 — DDR2 DRAM data bit 11
핀 125	DDR2_DQ12 — DDR2 DRAM data bit 12
핀 126	DDR2_DQ13 — DDR2 DRAM data bit 13
핀 127	DDR2_DQ14 — DDR2 DRAM data bit 14
핀 128	DDR2_DQ15 — DDR2 DRAM data bit 15
핀 129	VSS — Ground
핀 130	VDD — 3.3V supply
핀 131	DDR2_A0 — DDR2 DRAM address bit 0
핀 132	DDR2_A1 — DDR2 DRAM address bit 1
핀 133	DDR2_A2 — DDR2 DRAM address bit 2
핀 134	DDR2_A3 — DDR2 DRAM address bit 3
핀 135	DDR2_A4 — DDR2 DRAM address bit 4
핀 136	DDR2_A5 — DDR2 DRAM address bit 5
핀 137	DDR2_A6 — DDR2 DRAM address bit 6
핀 138	DDR2_A7 — DDR2 DRAM address bit 7
핀 139	DDR2_A8 — DDR2 DRAM address bit 8
핀 140	DDR2_A9 — DDR2 DRAM address bit 9
핀 141	DDR2_A10 — DDR2 DRAM address bit 10
핀 142	DDR2_A11 — DDR2 DRAM address bit 11
핀 143	DDR2_A12 — DDR2 DRAM address bit 12
핀 144	DDR2_A13 — DDR2 DRAM address bit 13
핀 145	DDR2_BA0 — DDR2 DRAM bank address 0
핀 146	DDR2_BA1 — DDR2 DRAM bank address 1
핀 147	DDR2_BA2 — DDR2 DRAM bank address 2
핀 148	DDR2_RAS — DDR2 DRAM row address strobe
핀 149	DDR2_CAS — DDR2 DRAM column address strobe
핀 150	DDR2_WE — DDR2 DRAM write enable
핀 151	DDR2_CS — DDR2 DRAM chip select
핀 152	DDR2_CKE — DDR2 DRAM clock enable
핀 153	DDR2_CLK_P — DDR2 DRAM clock positive
핀 154	DDR2_CLK_N — DDR2 DRAM clock negative
핀 155	DDR2_DQS — DDR2 DRAM data strobe
핀 156	DDR2_DM — DDR2 DRAM data mask
핀 157	VSS — Ground
핀 158	VDD — 3.3V supply
핀 159	LCD_PCLK — LCD pixel clock
핀 160	LCD_HSYNC — LCD horizontal sync
핀 161	LCD_VSYNC — LCD vertical sync
핀 162	LCD_DE — LCD data enable
핀 163	LCD_DATA0 — LCD data bit 0
핀 164	LCD_DATA1 — LCD data bit 1
핀 165	LCD_DATA2 — LCD data bit 2
핀 166	LCD_DATA3 — LCD data bit 3
핀 167	LCD_DATA4 — LCD data bit 4
핀 168	LCD_DATA5 — LCD data bit 5
핀 169	LCD_DATA6 — LCD data bit 6
핀 170	LCD_DATA7 — LCD data bit 7
핀 171	LCD_DATA8 — LCD data bit 8
핀 172	LCD_DATA9 — LCD data bit 9
핀 173	LCD_DATA10 — LCD data bit 10
핀 174	LCD_DATA11 — LCD data bit 11
핀 175	LCD_DATA12 — LCD data bit 12
핀 176	LCD_DATA13 — LCD data bit 13

일반적인 애플리케이션

PIC32MZ2025DAB176-I/2J 적합 용도: 6 애플리케이션s: Industrial HMI Touch Panels, Building Automation Displays, Medical Patient Monitors, Automotive Infotainment Entry Displays, IoT Gateways with Local Display, Point-of-Sale Terminals.

🏭

Industrial HMI Touch Panels

The PIC32MZ2025DAB176-I/2J is purpose-built for industrial HMI touch panels where its integrated Graphics Controller and dedicated Graphics Processor accelerate LCD rendering at 200MHz MIPS32 throughput. The 2MB Flash stores the full GUI stack including fonts, icons, and screen definitions, while the 640KB SRAM provides ample frame buffer for WVGA-class displays. The 12-bit 18 MSPS ADC handles touch-screen analog inputs and sensor channels simultaneously. Compared to software-rendered graphics on bare MCUs, the on-chip GPU reduces CPU loading from 80% to under 20%, leaving headroom for real-time communication via CAN and HS USB to PLC backbones.

추천

🧩

Building Automation Displays

Building automation display panels benefit from the PIC32MZ2025DAB176-I/2J's combination of 200MHz performance, DDR2 external memory interface, and industrial temperature range. The device drives 4.3-inch to 7-inch TFT panels with smooth animations for thermostat, lighting, and security status UIs. The CAN 2.0B peripheral integrates natively with building automation buses (BACnet, KNX gateways), while HS USB supports firmware updates and commissioning. Power consumption is managed via the PIC32 deep-sleep modes, allowing battery-backed operation during power loss. The exposed thermal pad package supports continuous-on fanless operation in wall-mounted enclosures.

추천

PIC32MZ1025DAB176T-I/2J · Microchip Technology PIC32MX795F512LT-80I/PT · Microchip Technology

💊

Medical Patient Monitors

Medical patient monitor designs use the PIC32MZ2025DAB176-I/2J for its 200MHz DSP-extended core, which performs real-time ECG and SpO2 waveform processing alongside graphics rendering. The 12-bit 18 MSPS ADC samples multi-lead ECG waveforms at clinical sampling rates, while the integrated Graphics Processor drives waveform display screens without taxing the CPU. The 2MB Flash accommodates full diagnostic protocol stacks, and the 640KB SRAM buffers waveform data for on-screen review. Industrial temperature range and high reliability suit continuous-monitor deployment in clinical settings where uptime is critical.

추천

PIC32MZ2025DAA176T-I/2J · Microchip Technology PIC32MX775F512L-80I/BG · Microchip Technology

🚗

Automotive Infotainment Entry Displays

The PIC32MZ2025DAB176-I/2J suits entry-level automotive infotainment displays where cost-effective graphical capability is required. Its CAN 2.0B peripheral interfaces directly with vehicle CAN bus for HVAC, radio, and diagnostic data, while the integrated Graphics Controller renders instrument-cluster and center-stack displays. The 200MHz core ensures responsive touch interactions, and the 2MB Flash stores localized UI assets for multiple regions. Note that for full automotive qualification, the AEC-Q100 grade part (e.g., PIC32MZ DA AEC-Q100 variants) should be selected; this industrial-temperature variant is appropriate for non-safety automotive accessories.

추천

PIC32MZ1064DAB176-I/2J · Microchip Technology PIC32MX695F512L-80I/BG · Microchip Technology

🌐

IoT Gateways with Local Display

IoT edge gateways benefit from the PIC32MZ2025DAB176-I/2J's local display capability combined with HS USB and CAN connectivity. The integrated Graphics Controller drives status dashboards showing network health, sensor readings, and configuration menus without requiring an attached computer. The 200MHz core runs TLS stacks and MQTT brokers locally, while 2MB Flash accommodates OTA update images. The DDR2 interface allows large log buffers for offline analytics. This combination reduces BOM cost versus MPU + external LCD controller architectures.

추천

PIC32MZ2064DAB176T-I/2J · Microchip Technology PIC32MX675F512L-80I/BG · Microchip Technology

💡

Point-of-Sale Terminals

POS terminal designs use the PIC32MZ2025DAB176-I/2J for its graphics acceleration, multiple connectivity options, and robust industrial temperature range. The integrated Graphics Processor drives 5-inch to 7-inch touch screens for transaction UIs, while HS USB connects to receipt printers and barcode scanners. The 200MHz core handles encryption and payment protocol stacks with low latency. The 2MB Flash stores firmware, fonts, and graphics assets; the 640KB SRAM supports multiple simultaneous UI screens and secure transaction buffers.

추천

PIC32MZ1025DAB176T-I/2J · Microchip Technology PIC32MX795F512L-80I/BG · Microchip Technology

추천 제품 요약

What is the CPU speed of PIC32MZ2025DAB176-I/2J?

The PIC32MZ2025DAB176-I/2J runs its MIPS32 microAptiv core at 200 MHz. According to the Microchip PIC32MZ DA family datasheet, this delivers 330 DMIPS and 3.28 CoreMark/MHz performance. The 200 MHz core combined with DSP and microMIPS extensions makes this part suitable for graphics rendering and signal-processing tasks in industrial HMI designs.

How much Flash and RAM does PIC32MZ2025DAB176-I/2J have?

The PIC32MZ2025DAB176-I/2J integrates 2 MB of Flash program memory (2M x 8) and 640 KB of on-chip SRAM. The Flash is large enough for embedded Linux-style applications or full GUI stacks, while the 640KB SRAM supports frame buffers without off-chip memory. Per Microchip documentation, the device also addresses external 32MB or 128MB DDR2 DRAM for larger graphical workloads.

What is the difference between PIC32MZ2025DAB176 and PIC32MZ2025DAA176?

Both belong to the PIC32MZ DA graphics family with 2MB Flash, 640KB SRAM, and 200MHz core. The 'B' suffix (DAB176) and 'A' suffix (DAA176) denote different internal memory configurations and pin-out subsets within the same package family. They share the 176-pin LQFP footprint but differ in specific peripheral routing; consult the Microchip device comparison tables for exact differences before substituting.

Where can I buy PIC32MZ2025DAB176-I/2J online?

As of 2026-10-04, the PIC32MZ2025DAB176-I/2J is in stock at DigiKey and Mouser with single-unit pricing around $16.50 USD. The part is also listed at Octopart across 8 distributors for real-time comparison. Lead time is typically 6-8 weeks from Microchip direct for large orders, while distributor stock is available for prototype quantities.

What is the price of PIC32MZ2025DAB176-I/2J in 100-piece quantity?

The PIC32MZ2025DAB176-I/2J is priced at approximately $13.20 USD per unit at 100-piece quantity as of 2026-10-04, based on DigiKey and Mouser listings. Volume pricing drops to roughly $10.80 at 1000 pieces. Pricing varies slightly between franchised distributors, so comparing Octopart listings before placing production orders is recommended.

What is the lead time for PIC32MZ2025DAB176-I/2J?

As of 2026-10-04, distributor stock for the PIC32MZ2025DAB176-I/2J ships within 1-3 business days from DigiKey and Mouser. For volume orders beyond distributor stock, Microchip direct lead time is approximately 8-12 weeks due to wafer-fab capacity for the 200mm MIPS32 microAptiv process. The industrial temperature grade (-40C to +85C) is in current production without any NRND or EOL notice.

Is PIC32MZ2025DAB176-I/2J in stock at major distributors?

Yes, the PIC32MZ2025DAB176-I/2J is in stock at DigiKey, Mouser, and Avnet as of 2026-10-04. Octopart confirms live inventory across 8 distributors. The -I/2J industrial temperature variant (Tray packaging) is the most readily available version; the -T/2J tape-and-reel variant may have shorter stock windows due to lower reorder volume.

PIC32MZ2025DAB176-I/2J vs PIC32MZ2064DAB176T-I/2J - which is better for HMI?

The PIC32MZ2025DAB176-I/2J has 2MB Flash and 640KB SRAM, while the PIC32MZ2064DAB176T-I/2J has 2MB Flash and a larger memory configuration in the same 176-LQFP package. For most HMI applications with frame buffers under 640KB, the 2025 variant is sufficient and lower cost. Choose the 2064 variant only if your application requires the larger RAM configuration or additional peripheral set.

When should I choose PIC32MZ2025DAB176-I/2J over a PIC32MX795?

Choose the PIC32MZ2025DAB176-I/2J when you need 200MHz CPU speed, 2MB Flash, 640KB SRAM, and an integrated Graphics Controller. The older PIC32MX795 series runs at 80MHz with only 512KB Flash and no graphics hardware. For new graphical HMI designs the MZ DA is the correct choice; for cost-sensitive non-graphical 32-bit designs the PIC32MX remains a valid option.

Is PIC32MZ2025DAB176-I/2J suitable for industrial HMI?

Yes, the PIC32MZ2025DAB176-I/2J is well-suited for industrial HMI applications. It integrates the dedicated Graphics Controller and Graphics Processor needed for LCD rendering, plus the 12-bit 18 MSPS ADC supports touch-screen and sensor inputs. The -40C to +85C industrial temperature rating and 200MHz performance make it appropriate for factory-floor displays and control panels.

What is the best drop-in replacement for PIC32MZ2025DAB176-I/2J?

The closest same-package drop-in alternatives are PIC32MZ1025DAB176T-I/2J (1MB Flash, 176-LQFP) and PIC32MZ1064DAB176-I/2J (1MB Flash, larger RAM). Both share the 176-LQFP footprint. Note these are not pin-identical in flash density - firmware size must be validated. For identical-spec replacement, the PIC32MZ2064DAB176T-I/2J is the closest match within the same family.

Can PIC32MZ1025DAB176T-I/2J replace PIC32MZ2025DAB176-I/2J?

The PIC32MZ1025DAB176T-I/2J shares the same 176-LQFP package footprint as the PIC32MZ2025DAB176-I/2J and is pin-compatible at the package level. However, it has only 1MB Flash versus the 2025 variant's 2MB Flash, so existing firmware must fit within 1MB. The 1025 variant also has reduced SRAM. Verify memory headroom and peripheral requirements before substituting.

Where to download PIC32MZ2025DAB176-I/2J datasheet PDF?

The official PIC32MZ2025DAB176-I/2J datasheet PDF is available from Microchip's website at the PIC32MZ Graphics DA Family product page. Direct datasheet links can also be found via distributor pages on DigiKey (7354755) and Mouser. The document covers electrical characteristics, pinout, memory map, and peripheral configuration for the entire PIC32MZ DA family including this specific variant.

Where to find PIC32MZ2025DAB176-I/2J pinout?

The pinout for the PIC32MZ2025DAB176-I/2J is documented in the Microchip PIC32MZ DA family datasheet, in the 'Pin Diagrams and Tables' section for the 176-LQFP package. The 176-pin LQFP (20x20mm) pin assignment covers all GPIO, ADC inputs, communication peripherals, and the DDR2 DRAM interface signals. The exposed thermal pad is pin 177 and must be soldered to the ground plane.

What are the key specifications of PIC32MZ2025DAB176-I/2J engineers should know?

Engineers evaluating the PIC32MZ2025DAB176-I/2J should know: 200MHz MIPS32 microAptiv core with 330 DMIPS; 2MB Flash and 640KB SRAM; integrated Graphics Controller and Graphics Processor; 12-bit 18 MSPS ADC with up to 45 inputs; High-Speed USB 2.0 and CAN 2.0B; external DDR2 DRAM interface up to 128MB; 3.3V single supply; -40C to +85C industrial range; 176-LQFP 20x20mm package with exposed thermal pad.

엔지니어링 참조 데이터: PIC32MZ2025DAB176-I/2J — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the PIC32MZ2025DAB176-I/2J when designing industrial HMI panels, building automation displays, or IoT gateways that require 2MB Flash, 640KB SRAM, and integrated graphics at 200MHz. Select this B-die variant when your firmware requires full 2MB Flash and you need the specific B-die peripheral pin mapping for PCB routing optimization. For cost-optimized designs with smaller firmware (under 1MB), choose PIC32MZ1025DAB176T-I/2J. For applications needing larger SRAM or different peripheral routing, choose PIC32MZ2064DAB176T-I/2J or PIC32MZ2025DAA176T-I/2J. All five variants share the same 176-LQFP (20x20mm) footprint, enabling PCB reuse across product variants.

대체품과의 비교

파라미터	이 제품	PIC32MZ2064DAB176T-I/2J	PIC32MZ1025DAB176T-I/2J	PIC32MZ1064DAB176-I/2J	PIC32MZ2025DAA176T-I/2J
Brand	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Package	176-LQFP (20x20mm)	176-LQFP (20x20mm) - same	176-LQFP (20x20mm) - same	176-LQFP (20x20mm) - same	176-LQFP (20x20mm) - same
CPU Speed	200 MHz	200 MHz	200 MHz	200 MHz	200 MHz
Flash Memory	2 MB	2 MB	1 MB (-50%)	1 MB (-50%)	2 MB
SRAM	640 KB	640 KB or larger	256 KB or 384 KB (-40%)	640 KB or larger	640 KB
Graphics Controller	Integrated	Integrated	Integrated	Integrated	Integrated
USB	HS USB 2.0	HS USB 2.0	HS USB 2.0	HS USB 2.0	HS USB 2.0
Operating Temperature	-40C to +85C	-40C to +85C	-40C to +85C	-40C to +85C	-40C to +85C

주요 차별점

Largest Flash density in PIC32MZ DA 176-LQFP family (vs PIC32MZ1025DAB176T-I/2J)
Higher-density variant for graphics-intensive HMI (vs PIC32MZ2064DAB176T-I/2J)
A vs B die variant for layout flexibility (vs PIC32MZ2025DAA176T-I/2J)

설계 노트

Estimated: at 200MHz CPU speed and 3.3V supply with typical activity factor, the PIC32MZ2025DAB176-I/2J core draws approximately 150mA (~495mW). The 176-LQFP exposed-pad package has a theta_JA of approximately 25 C/W with a properly soldered thermal pad on a 4-layer PCB. At 85C ambient, junction temperature rises by ~12.4C to ~97C, within the industrial 125C limit. Use a minimum 1 square inch copper pour connected to the exposed pad to achieve rated thermal performance.

DDR2 DRAM interface signals (pins 113-156) must be routed as a matched-length group with controlled impedance (50 ohm single-ended, 100 ohm differential for clock pair). Per the Microchip PIC32MZ DA hardware design checklist, DQ-DQS skew should be within 25 ps, and the DDR2_CLK_P/N pair requires 100 ohm differential routing. Place a 100nF decoupling capacitor within 5mm of each VDD pin and a bulk 10uF capacitor near the exposed pad ground pour.

Do not confuse the -I/2J (industrial temperature, Tray packaging) with the -T/2J (industrial temperature, Tape and Reel) or -E/2J (extended temperature) variants. The exposed thermal pad (pin 177 in the datasheet pinout table) must be soldered to the PCB ground pour for thermal and electrical performance - omitting this connection causes overheating and DDR2 signal-integrity failures. When using HS USB, ensure the USB trace impedance is 90 ohm differential per USB 2.0 specification.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

무연

Yes

무할로겐

Yes

분쟁 광물

Compliant

RoHS and REACH compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - choose automotive-grade variant for vehicle applications.

데이터 검증일: 2026-10-04 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Manufacturer Product Page, Octopart, Distributor, Manufacturer Product Page

PIC32MZ2025DAB176-I/2J - 32-bit 200MHz MCU, 2MB Flash | Microchip

PIC32MZ2025DAB176-I/2J 개요

이 시리즈의 변형

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

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PIC32MZ1064DAB176-I/2J

PIC32MZ2025DAA176T-I/2J

PIC32MZ2025DAA288-I/4J

추천 대체품 (동일 카테고리 & 패키지)

PIC32MZ2025DAB176-I/2J 핀 구성

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대체품과의 비교

주요 차별점

설계 노트

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