TC275T64F200WDCKXUMA1 - 32-Bit TriCore AURIX MCU, 200MHz, 4MB Flash | Infineon
MPN: TC275T64F200WDCKXUMA1 ✓ نشطTC275T64F200WDCKXUMA1 نظرة عامة
An AURIX microcontroller (Automotive Realtime Embedded Integrated Processor Unit) is a family of multi-core 32-bit MCUs designed to meet the highest levels of functional safety (ISO 26262 ASIL-D) and information security (EVITA, HSM) in vehicles. Within the broader hierarchy, AURIX sits at the intersection of automotive microcontroller, safety MCU, and powertrain control processor, serving as the silicon backbone for domain and zonal controllers. The TC27xT family specifically targets powertrain, chassis, and advanced driver-assistance systems (ADAS) requiring deterministic interrupt latency, lockstep cores, and hardware security modules.
Key specifications include 200 MHz maximum clock frequency across three TriCore v1.6 cores, 4 MB (4M x 8) of embedded Flash, 472 KB SRAM inclusive of cache, four CAN nodes, multiple LIN and FlexRay interfaces, and a hardware security module. The 1.3 V/5 V supply domain supports both low-voltage logic and 5 V peripheral interfacing without external level shifters. The PG-LQFP-176-22 package includes an exposed thermal pad that lowers junction-to-ambient thermal resistance for high-temperature under-hood operation.
The TC275T64F200WDCKXUMA1 leverages Infineon's lockstep architecture to support ISO 26262 functional safety up to ASIL-D, making it suitable for systems where faults must be detected within a single clock cycle. Compared to single-core MCUs, the three-core TriCore arrangement separates application processing, peripheral control, and safety monitoring tasks, eliminating the need for an external watchdog or companion safety MCU. According to the Infineon AURIX 1G-PSE datasheet, the device is qualified to AEC-Q100 Grade 0 for automotive environments.
Typical applications include engine management ECUs, transmission control units (TCUs), chassis domain controllers, electric vehicle (EV) inverter control, braking and stability systems, and zonal vehicle compute platforms. The combination of CAN FD, FlexRay, and LIN connectivity makes it a strong fit for legacy and modern in-vehicle networking topologies.
When designing with this part, allocate adequate PCB copper under the exposed pad to meet the theta_JA thermal budget; without a minimum 100 mm² copper pour the maximum operating temperature becomes derated. Program Flash in production via the integrated bootloader or via JTAG using an Infineon DAS device. Always validate the AURIX safety case against the latest Infineon application note package.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found on the manufacturer datasheet, helping procurement and design engineers make informed sourcing decisions.
بدائل مباشرة لـ TC275T64F200WDCKXUMA1 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع TC275T64F200WDCKXUMA1 (نفس عامل الشكل والبصمة) — يختلف في CAN Nodes, Package, SRAM (incl. Cache), Program Memory (Flash), Maximum Clock Frequency.
SAK-TC275T-64F200W DC
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SAK-TC234LP-32F200N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←SAK-TC233LP-32F200F
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←SAK-TC213L-8F133F
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←TC275T64F200WDCKXUMA1 الحدود القصوى والخصائص الكهربائية
| Architecture | TriCore AURIX (TC27xT family) |
| CPU Cores | 3 x TriCore v1.6 (one may operate in lockstep) |
| أقصى تردد للساعة | 200 MHz |
| Program Memory (Flash) | 4 MB (4M x 8) |
| SRAM (incl. Cache) | 472 KB |
| جهد التغذية | 1.3 V core / 5 V I/O |
| CAN Nodes | 4 |
| العلبة | PG-LQFP-176-22 (LQFP-176 with exposed pad) |
| نوع التركيب | Surface Mount |
| Automotive Qualification | AEC-Q100 |
| Functional Safety | ISO 26262 ASIL-D capable |
| Hardware Security Module (HSM) | Yes (AES, RSA, TRNG) |
| حالة RoHS | Compliant |
| Communication Interfaces | CAN, CAN FD, LIN, FlexRay, SPI, UART |
| عدد الأطراف | 176 |
دليل تكوين أطراف TC275T64F200WDCKXUMA1 pg-lqfp-176-22 (lqfp-176 with exposed pad)
تكوين الأطراف لـ TC275T64F200WDCKXUMA1 (حزمة pg-lqfp-176-22 (lqfp-176 with exposed pad)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ TC275T64F200WDCKXUMA1.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
TC275T64F200WDCKXUMA1 مناسب لـ 6 التطبيقs: Engine Management ECU, Transmission Control Unit (TCU), ADAS Domain Controller, Electric Vehicle Inverter Control, Braking and Stability Control, Zonal Vehicle Compute.
Engine Management ECU
The TC275T64F200WDCKXUMA1 is purpose-built for engine management ECUs where its 200 MHz TriCore cores execute fuel-injection timing algorithms with cycle times below 5 ms while remaining inside the AEC-Q100 temperature envelope. Its 4 MB Flash holds full AUTOSAR RTE plus production-grade calibration data, and the lockstep core delivers ISO 26262 ASIL-D coverage for emissions-critical decision paths.
موصى به
Transmission Control Unit (TCU)
Automatic transmission control uses the TC275T64F200WDCKXUMA1's three TriCore cores to run gear-shift logic, torque-converter modeling, and CAN-FD vehicle bus comms in parallel without processor contention. The 472 KB SRAM caches the gear-ratio lookup tables for sub-millisecond valve-actuator adjustments, while the four CAN nodes connect to engine, hybrid, and chassis domains synchronously.
موصى به
ADAS Domain Controller
For ADAS domain controllers, the TC275T64F200WDCKXUMA1 acts as the safety island that monitors the primary SoC and arbitrates fail-safe responses if sensor data deviates from the model. The hardware security module secures V2X message authentication per EVITA, while 472 KB SRAM allows ring-buffer storage of raw radar frames during the ASIL-D lockstep review of ASIL-D-class decisions.
موصى به
Electric Vehicle Inverter Control
Traction inverter control depends on the TC275T64F200WDCKXUMA1's deterministic interrupt latency to drive SiC MOSFET gates within 100 ns of rotor-position feedback. The 200 MHz TriCore cores execute field-oriented control loops in 25 microseconds, while the 5 V I/O domain directly interfaces to TLE9180 gate-driver inputs without level shifting - crucial for 800 V battery architectures.
موصى به
Braking and Stability Control
Electronic stability control and brake-by-wire ECUs leverage the TC275T64F200WDCKXUMA1's lockstep TriCore pair to compute yaw-rate corrections inside 2 ms sensor-to-actuator loops. The four CAN-FD nodes collect wheel-speed, IMU, and steering-angle inputs simultaneously, while the AEC-Q100 Grade 0 qualification supports under-hood mounting adjacent to brake hydraulics.
موصى به
Zonal Vehicle Compute
Modern zonal ECUs consolidate body, lighting, and thermal management into a single controller built around the TC275T64F200WDCKXUMA1 with 4 MB Flash for multiple AUTOSAR stacks. Its CAN-FD, LIN, and FlexRay interfaces aggregate messages from the entire vehicle zone, and the hardware security module handles UDS 0x27 seed-key authentication for OTA flash updates.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ TC275T64F200WDCKXUMA1 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | SAK-TC275T-64F200W DC | SAK-TC234LP-32F200N | SAK-TC233LP-32F200F | SAK-TC213L-8F133F |
|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | LQFP-176 (PG-LQFP-176-22) | LQFP-176 - same | LQFP-176 - same family | LQFP-176 - same family | LQFP-176 - same family |
| CPU Cores | 3 x TriCore (1 lockstep) | 3 x TriCore - identical | 2 x TriCore (-33%) | 2 x TriCore (-33%) | 1 x TriCore (-67%) |
| Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 133 MHz (-34%) |
| Flash Memory | 4 MB | 4 MB | 32 KB (-99%) | 32 KB (-99%) | 8 KB (-99%) |
| AEC-Q100 | Yes (Grade 0) | Yes - identical | Yes | Yes | Yes |
أبرز الفروقات
- Highest Flash density in the LQFP-176 family (مقابلSAK-TC234LP-32F200N)
- Three TriCore cores versus two on lower-end derivatives (مقابلSAK-TC233LP-32F200F)
- Faster 200 MHz clock versus 133 MHz on TC213L (مقابلSAK-TC213L-8F133F)
ملاحظات التصميم
The LQFP-176 exposed pad (EP) must be soldered to a continuous PCB copper plane no smaller than 100 mm² across top and inner layers to achieve the manufacturer's thermal performance. Estimated: with 100 mm² of 1 oz copper on a 4-layer FR-4 board, the junction-to-ambient thermal resistance (theta_JA) drops from approximately 35 C/W to 15 C/W, enabling full 200 MHz operation across the -40C to +150C AEC-Q100 Grade 0 envelope.
The TC275T64F200WDCKXUMA1 has separate 1.3 V core and 5 V I/O supply rails; place a 10 uF ceramic + 100 nF decoupling pair within 5 mm of each VD and VEXT pin, and a single 47 uF bulk tantalum near the regulator output. A common source of PCB prototypes failing power-up is omitting the VDDPSB (standby) rail decoupling, so always include it on the schematic.
Infineon's AURIX family uses non-JTAG debug by default - the DAS (Device Access Server) over ASCIF is required for production programming. Do not assume JTAG-only debug works; populate the ASCIF header on prototype boards for firmware flashing. Additionally, the Flash ECC must be initialized at boot or the device will report spurious single-bit errors during the first 100 power cycles.
معلومات الامتثال
AEC-Q100 qualified per Infineon datasheet and distributor listings. RoHS compliant. Lead-free and halogen-free per JEDEC J-STD-020 MSL classification.
