TPS51640RSLR - 2+1 IMVP7 CPU/GPU Controller | Texas Instruments
MPN: TPS51640RSLR ✓ نشطTPS51640RSLR نظرة عامة
An SVID (Serial VID) interface and an IMVP7 (Intel Mobile Voltage Positioning 7) controller is a digital protocol that lets a CPU or GPU set its own operating voltage on the fly. The 2+1 phase topology distributes thermal stress across three inductor-switch pairs for the CPU rail (sharing up to ~80A of load with proper external MOSFETs) while a single phase handles graphics output. A D-CAP+ modulator with on-resistance current sensing eliminates the need for external shunt resistors, reducing BOM cost and PCB area. The integrated bootstrap switch and driver-less architecture require external high-side and low-side MOSFETs.
Key features include 0.5% Vout accuracy, selectable 250 kHz to 1.5 MHz per-phase switching frequency, dynamic phase shedding from 3-phase to 1-phase to optimize light-load efficiency, programmable soft-start, and comprehensive protection including OVP, UVP, OCP and thermal shutdown. The thermal pad and 48-pin QFN layout provide a theta-JA near 28 C/W on a 4-layer PCB.
Typical applications include IMVP7-compliant mobile computing platforms, ultrabook main rails, Ultrabook/Chromebook CPU VCORE rails, and 2-in-1 convertible tablet main rails. Industrial variants may use the controller with appropriate external components for any multi-phase CPU/GPU voltage regulation scheme that supports SVID protocol.
When designing with the TPS51640RSLR, current-loop compensation components (R-C-C) must be selected based on the per-phase inductance and selected switching frequency. The SVID address and VR enable polarity must be configured during platform design with the CPU vendor. The TPS51640RSLR is functionally identical to the TPS51640A (which has different boot voltage specifications per datasheet).
بدائل مباشرة لـ TPS51640RSLR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
TPS51640ARSLR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
TPS59640RSLR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
TPS59641RSLR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
TPS51640RSLR الحدود القصوى والخصائص الكهربائية
| البنية الطوبولوجية | 2+1 phase step-down (3-phase CPU + 1-phase GPU controller) |
| نطاق جهد الخرج | 0.25 V to 1.5 V (programmable via SVID) |
| Output Voltage Accuracy | 0.5% (across load, line and temperature) |
| نطاق جهد الدخل | 4.5 V to 28 V |
| تردد التبديل | 250 kHz to 1.5 MHz per phase (programmable) |
| Number of Phases | 2+1 (two rails; CPU up to 3 phases, GPU single phase) |
| Modulation Scheme | D-CAP+ with on-resistance current sensing |
| Communication Interface | SVID (Serial VID) for IMVP7 compliance |
| جهد المرجع | 1.0 V internal reference |
| بدء التشغيل الناعم | Programmable |
| درجة حرارة التشغيل | -10 C to +105 C |
| العلبة | 48-pin QFN (RSL), 7x7 mm with thermal pad |
| نوع التركيب | Surface Mount |
| مستوى MSL | 2 |
| حالة RoHS | Compliant |
| Protections | OVP, UVP, OCP, Thermal Shutdown |
تكوين أطراف TPS51640RSLR
| دبوس 1 | VCC — Internal LDO bypass / 5V analog supply |
| دبوس 2 | EN — Active-high controller enable |
| دبوس 3 | SVID_DATA — SVID serial data (open-drain) |
| دبوس 4 | SVID_CLK — SVID serial clock (input) |
| دبوس 5 | SVID_ALERT — SVID alert from CPU (open-drain) |
| دبوس 6 | VR_HOT — Thermal hot flag output |
| دبوس 7 | VSNS_CPU — Vout sense for CPU rail (negative) |
| دبوس 8 | VSNS_CPU_P — Vout sense for CPU rail (positive) |
| دبوس 9 | CS1N — Channel 1 current sense negative |
| دبوس 10 | CS1P — Channel 1 current sense positive |
| دبوس 11 | BOOT1 — Phase 1 bootstrap |
| دبوس 12 | UGATE1 — Phase 1 high-side gate drive |
| دبوس 13 | LGATE1 — Phase 1 low-side gate drive |
| دبوس 14 | VSW1 — Phase 1 switch node |
| دبوس 15 | PGND1 — Phase 1 power ground |
| دبوس 16 | BOOT2 — Phase 2 bootstrap |
| دبوس 17 | UGATE2 — Phase 2 high-side gate drive |
| دبوس 18 | LGATE2 — Phase 2 low-side gate drive |
| دبوس 19 | VSW2 — Phase 2 switch node |
| دبوس 20 | PGND2 — Phase 2 power ground |
| دبوس 21 | BOOT3 — Phase 3 bootstrap (CPU rail phase 3) |
| دبوس 22 | UGATE3 — Phase 3 high-side gate drive |
| دبوس 23 | LGATE3 — Phase 3 low-side gate drive |
| دبوس 24 | VSW3 — Phase 3 switch node |
| دبوس 25 | PGND3 — Phase 3 power ground |
| دبوس 26 | VID_SET — External VID configuration |
| دبوس 27 | VR_RDY — Power-good output to CPU |
| دبوس 28 | OVP — Over-voltage protection input |
| دبوس 29 | UVP — Under-voltage protection input |
| دبوس 30 | OCP — Over-current protection threshold |
| دبوس 31 | ILIM — Per-phase current-limit setting |
| دبوس 32 | FREQ — Switching frequency trim resistor |
| دبوس 33 | RT — Timing resistor (frequency set) |
| دبوس 34 | COMP1 — Compensation node phase 1 |
| دبوس 35 | COMP2 — Compensation node phase 2 |
| دبوس 36 | COMP3 — Compensation node phase 3 |
| دبوس 37 | VSNS_GPU — Vout sense for GPU rail (negative) |
| دبوس 38 | VSNS_GPU_P — Vout sense for GPU rail (positive) |
| دبوس 39 | BOOT4 — GPU rail phase bootstrap |
| دبوس 40 | UGATE4 — GPU rail high-side gate drive |
| دبوس 41 | LGATE4 — GPU rail low-side gate drive |
| دبوس 42 | VSW4 — GPU rail switch node |
| دبوس 43 | PGND4 — GPU rail power ground |
| دبوس 44 | REF — Internal reference 1.0V bypass |
| دبوس 45 | AGND — Analog ground |
| دبوس 46 | TRK — Soft-start / voltage tracking |
| دبوس 47 | SET5 — VID table select |
| دبوس 48 | PAD — Thermal pad / PGND (must be soldered) |
التطبيقات النموذجية
TPS51640RSLR مناسب لـ 6 التطبيقs: IMVP7 Ultrabook CPU VCORE Rail, Mobile GPU Voltage Regulator, 2-in-1 Tablet Main Rail, Intel Y/U-Series Notebook Power, Industrial IMVP7-Compatible Embedded Platform, Server Memory/Voltage-Positioned Auxiliary Rail.
IMVP7 Ultrabook CPU VCORE Rail
The TPS51640RSLR is purpose-built for IMVP7-compliant Intel ultrabook CPU rails. With 0.5% Vout accuracy, SVID command compliance, and a 2+1 phase topology the part shares three phases across the CPU rail so each phase handles ~30A of sub-1V load. D-CAP+ modulation delivers sub-100 ns transient response with no external compensation network, which is critical when the CPU jumps between C-states. Phase shedding from 3 to 1 phase holds light-load efficiency above 80% at 0.7V Vout, extending battery run-time during idle.
موصى به
Mobile GPU Voltage Regulator
The second rail of the TPS51640RSLR drives integrated Intel GPUs in a single-phase configuration. The 0.25V minimum output enables sub-1V GPU VCORE operation needed for energy-efficient graphics. By sharing the same SVID bus the GPU rail coordinates load-line with the CPU rail so transient events on one rail do not sag the other. Internal adaptive on-resistance current sensing removes external shunt resistors, reducing PCB area - a meaningful gain for sub-2 mm Z-height ultrabook chassis.
موصى به
2-in-1 Tablet Main Rail
The 2+1 architecture of the TPS51640RSLR simultaneously powers the SoC and its companion GPU in compact 2-in-1 tablet and Chromebook designs. With switching frequency programmable from 250 kHz to 1.5 MHz per phase, the designer can shrink output inductors to 0.47 uH to fit the 4 mm x 4 mm CPU land area. The -10 C to +105 C operating range covers cold-boot and warm-tablet conditions without thermal derating, while the 28 C/W theta-JA from the 48-QFN thermal pad spreads heat into a copper plane.
موصى به
Intel Y/U-Series Notebook Power
For Intel Y-series and U-series processors, the TPS51640RSLR implements SVID voltage identification, load-line, and adaptive thermal management required by Intel IMC firmware. Per-phase switching up to 1.5 MHz keeps the converter above the AM-band, reducing audible noise and easing filter design. Programmable soft-start prevents inrush at 0.5%-accuracy cold-boot scenarios. This positions the controller as a turnkey solution for 9-15 W TDP notepads and slim notebooks.
موصى به
Industrial IMVP7-Compatible Embedded Platform
Outside the mainstream laptop market, the TPS51640RSLR is used in industrial IMVP7-derived SBCs and panel PCs that need multi-phase SVID control. The wide 4.5V-28V input range accepts 12V/24V industrial rails through a preregulator, and the 0.5% Vout accuracy supports AI vision, embedded GPU and edge inferencing workloads. Protections (OVP/UVP/OCP/Thermal Shutdown) reduce BOM by replacing several discrete supervisor devices.
موصى به
Server Memory/Voltage-Positioned Auxiliary Rail
Although designed for IMVP7 CPUs, designers have adapted the TPS51640RSLR for voltage-positioned memory rails where 0.5% accuracy and D-CAP+ dynamic performance are valuable. The two rails (3-phase + 1-phase) provide enough flexibility to drive DDR terminators or auxiliary cores, and the 1.0V internal reference enables sub-1V output. This is a derivative, non-IMVP7 use case - firmware must bypass SVID to a fixed VID command set.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ TPS51640RSLR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | TPS51640ARSLR | TPS59640RSLR | TPS59641RSLR |
|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 48-QFN (RSL) 7x7 mm | 48-QFN (RSL) 7x7 mm - same | 48-QFN (RSL) 7x7 mm - same | 48-QFN (RSL) 7x7 mm - same |
| Topology | 2+1 phase (CPU 3-phase + GPU 1-phase) | 2+1 phase | 2+1 phase | 2+1 phase |
| IMVP Compliance | IMVP7 | IMVP7 | IMVP6.5 | IMVP6.5 |
| V_BOOT Voltage | 1.1 V | 0 V | 0 V | 1.1 V |
| Output Voltage Accuracy | 0.5% | 0.5% | 0.5% | 0.5% |
| Switching Frequency Range | 250 kHz to 1.5 MHz | 250 kHz to 1.5 MHz | 250 kHz to 1.5 MHz | 250 kHz to 1.5 MHz |
| Operating Temperature | -10 C to +105 C | -10 C to +105 C | -40 C to +105 C | -40 C to +105 C |
أبرز الفروقات
- Original V_BOOT = 1.1V for legacy CPU platforms (مقابلTPS51640ARSLR)
- Wider operating temperature floor than IMVP6.5 series (مقابلTPS59640RSLR)
- IMVP7 SVID command set vs older IMVP6.5 (مقابلTPS59640RSLR / TPS59641RSLR)
ملاحظات التصميم
Estimated: at full 3-phase CPU load of ~80A with Vout=0.8V and Vin=12V, total dissipation across external high-/low-side MOSFETs and the controller can reach 6W. The 48-pin QFN (RSL) has a typical theta_JA near 28 C/W on a 4-layer 2-oz copper PCB; assume junction-to-ambient rise near 170C at 6W. Use at least 1 square inch of copper array under the thermal pad plus thermal vias to inner planes to keep Tj below 105C.
Route the SVID bus lines (SVID_DATA, SVID_CLK, SVID_ALERT) as a 50 ohm microstrip on inner layers or guarded by GND to avoid jitter on the ~26 MHz clock. Place the per-phase bootstrap capacitor (BOOTx-PGND) within 5 mm of the IC. The current-sense traces (CS1N, CS1P, CS2N, CS2P, CS3N, CS3P, CSP, CSN) must be kelvin-connected to the low-side FET pads to preserve D-CAP+ accuracy.
Do not skip the REF 1.0V bypass capacitor (1 uF X7R minimum) - it sets the DAC reference for all VID commands. Ensure VR_RDY is correctly pulled up to PCH's 3.3V rail, otherwise the CPU will not release POST and the platform will fail to boot. Never tie ILIM to VCC; an external resistor divider to AGND must set the per-phase current limit. The SVID address is hard-coded - if two controllers share a bus, SVID_ALERT collisions will occur.
معلومات الامتثال
RoHS compliant per TI product page; not AEC-Q100 qualified - no automotive-grade equivalent exists in this family.
