XC3090L-7TQ176I - 3.3V Logic Cell Array FPGA, 176-pin TQFP | Xilinx
MPN: XC3090L-7TQ176I ✗ انتهى عمره الإنتاجيXC3090L-7TQ176I نظرة عامة
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits after manufacturing. Within the semiconductor hierarchy, FPGAs sit between application-specific integrated circuits (ASICs) and small-scale programmable logic; they offer higher integration than discrete gate arrays and faster time-to-market than full ASICs, which is precisely why the XC3000L family was adopted across industrial, telecom, and embedded applications in the late 1990s and early 2000s.
Key differentiating features of the XC3090L include roughly 9000 system gates, 320 configurable logic blocks, a 5 ns pin-to-pin logic delay at the -7 speed grade, and 3.3V core operation with 5V-tolerant I/O options. The device supports on-chip configuration via serial or parallel modes and is in-system programmable through the Xilinx XC3000 configuration bitstream format. Boundary-scan (JTAG, IEEE 1149.1) compatibility is part of the family baseline.
Architecturally, the XC3090L uses SRAM configuration memory, meaning it is volatile and must be reconfigured at every power-up. The interconnect is a hierarchical routing matrix connecting CLBs through single-length, double-length, and long-line segments. This routing fabric, combined with the -7 speed grade, makes the part a credible choice for glue-logic, bus-interface bridges, and small state-machine controllers rather than high-throughput DSP.
Typical applications include industrial serial-protocol bridges (UART, SPI, I2C controllers), legacy peripheral interfaces in test and measurement equipment, glue logic between microprocessors and memory buses, low-density state-machine controllers in instrumentation, and ASIC prototyping where pin-compatibility with the TQFP-176 footprint is mandatory. Designers often pair this part with an external configuration PROM such as the XC1736.
One critical design consideration is that the XC3000L family is no longer recommended for new designs; Xilinx has issued multiple end-of-life notices across the XC3000L series, so longevity planning and last-time-buy inventory buffers should be considered. Engineers should verify the latest lifecycle status from Xilinx before committing the part to long-lifecycle products.
This page synthesizes distributor pricing snapshots, cross-reference observations, and practical design notes that are not collated in any single manufacturer document, providing a one-stop reference for engineers evaluating the XC3090L-7TQ176I for legacy or refurbishment projects.
بدائل مباشرة لـ XC3090L-7TQ176I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC3090L-7TQ176I (نفس عامل الشكل والبصمة) — يختلف في Package, Configuration Memory, Process Technology, Family, Usable Gates.
XC3090L-7TQ176C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3090L-6TQ176I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3090L-6TQG176I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3090L-6TQ176C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3090L-6TQG176C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3090L-7TQ176I الحدود القصوى والخصائص الكهربائية
| Family | XC3000L Low-Voltage Logic Cell Array |
| Logic Cells | 320 CLBs |
| System Gates | Approx. 9,000 |
| Core Voltage | 3.3 V |
| I/O Voltage | 3.3 V (5 V tolerant option) |
| Speed Grade | -7 |
| العلبة | TQFP-176 |
| عدد الأطراف | 176 |
| Configuration Memory | SRAM (volatile) |
| Configuration Mode | Serial / Parallel / Express |
| Boundary Scan | JTAG (IEEE 1149.1) compatible |
| درجة حرارة التشغيل | -40C to +100C (industrial, I suffix) |
| نوع التركيب | Surface Mount |
دليل تكوين أطراف XC3090L-7TQ176I tqfp-176
تكوين الأطراف لـ XC3090L-7TQ176I (حزمة tqfp-176). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC3090L-7TQ176I.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC3090L-7TQ176I مناسب لـ 6 التطبيقs: Legacy Industrial Bus Bridge, ASIC Prototyping Platform, Test and Measurement Instrumentation, Telecom Line-Card Glue Logic, Military and Avionics Refurbishment, Embedded Education and FPGA Training.
Legacy Industrial Bus Bridge
The XC3090L-7TQ176I serves as a protocol-translation bridge between legacy parallel buses (e.g., ISA or PC/104) and modern serial peripherals in industrial control cabinets. Its 320 CLBs and ~9,000 system gates are sufficient to implement UART, SPI, or I2C state machines alongside FIFO buffers. The 3.3V core and 5V-tolerant I/O simplify interface to existing 5V peripherals without level shifters. Compared with a CPLD, the XC3090L's hierarchical routing fabric handles wider datapaths and deeper state machines more efficiently. Engineers typically place an XC1736 configuration PROM adjacent to the FPGA so the bitstream reloads automatically at every power-on.
موصى به
ASIC Prototyping Platform
Designers use the XC3090L-7TQ176I as a fast-turnaround prototype for ASIC designs targeting low-to-medium gate counts. The 176-pin TQFP package exposes 148 user I/Os, which is enough to bring out most ASIC pins for bench characterization. The SRAM-based fabric allows unlimited design iterations simply by reloading a new bitstream, while the -7 speed grade (around 5 ns pin-to-pin) approximates real-world ASIC timing. After validation, the design can be migrated to a HardCopy structured ASIC for production volume, retaining the same pinout. The Xilinx XC3000L datasheet describes the bitstream format used to load the configuration.
موصى به
Test and Measurement Instrumentation
In bench-top instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators, the XC3090L-7TQ176I implements custom trigger sequencers, pattern generators, and timing controllers. Its JTAG boundary-scan (IEEE 1149.1) interface simplifies board-level testing of the surrounding analog and digital circuitry. The 3.3V core reduces power dissipation versus 5V predecessors, easing thermal design in compact enclosures. Industrial temperature grading (-40C to +100C) ensures operation in laboratory and field environments. The device's 320 CLBs comfortably handle 32-bit counters, address decoders, and multiplexing logic in parallel.
موصى به
Telecom Line-Card Glue Logic
The XC3090L-7TQ176I performs glue-logic functions on legacy telecom line cards, including TDM bus multiplexing, framing, and alarm monitoring. Its low-voltage 3.3V operation aligns with the power tree of older T1/E1 framers and HDLC controllers, while 5V tolerance allows direct interface to backplane signals. The 176-pin TQFP provides sufficient I/O for multi-drop bus connections. Because the part is obsolete, telecom OEMs typically pair the XC3090L with second-source aftermarket suppliers to extend equipment service life. Long-lifecycle support and last-time-buy planning are essential for installed-base maintenance contracts.
موصى به
Military and Avionics Refurbishment
Long-lifecycle defense and avionics programs continue to use the XC3090L-7TQ176I as a drop-in replacement for failed units in fielded equipment. The industrial temperature grade (-40C to +100C) and SRAM-based in-system programmability simplify depot-level repair workflows. Because the XC3000L family is obsolete, the U.S. Defense Logistics Agency and similar agencies maintain qualified parts lists with approved aftermarket sources. Engineers refurbishing these systems verify pin-to-pin compatibility, configuration PROM support, and bitstream integrity before reinstallation.
موصى به
Embedded Education and FPGA Training
Universities and training laboratories use the XC3090L-7TQ176I on legacy development boards to teach fundamental FPGA concepts such as CLB utilization, programmable interconnect, and SRAM configuration. Although the architecture predates modern 7-series devices, the XC3000L exposes the same fundamental primitives (LUTs, flip-flops, programmable I/O) in a simpler package. The TQFP-176 footprint is hand-solderable for advanced lab work. Students benefit from understanding why the industry moved from 5V to 3.3V cores and from SRAM to flash-based configuration.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC3090L-7TQ176I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC3090L-7TQ176C | XC3090L-6TQ176I | XC3090L-6TQG176I | XC3090L-6TQ176C | XC3090L-6TQG176C |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQFP-176 | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same |
| Speed Grade | -7 | -7 | -6 (slower) | -6 (slower) | -6 (slower) | -6 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Logic Cells (CLBs) | 320 | 320 | 320 | 320 | 320 | 320 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Industrial temperature grade in the same TQFP-176 footprint (مقابلXC3090L-7TQ176C)
- Faster -7 speed grade for timing-critical designs (مقابلXC3090L-6TQ176I)
- Pb-free option available within the same TQFP-176 footprint (مقابلXC3090L-6TQG176I)
ملاحظات التصميم
The XC3090L-7TQ176I requires a clean 3.3V core supply with decoupling per the Xilinx XC3090L datasheet recommendations. Place 0.1uF ceramic decoupling capacitors adjacent to every VCCINT and VCCO pin, and add bulk 10uF tantalum or ceramic capacitors near the package. During configuration the device draws peak current; ensure the regulator has at least 500 mA headroom. SRAM configuration memory is volatile, so VCCINT must remain stable during configuration load.
Route all clock and global buffer signals on the inner PCB layers with controlled impedance to avoid skew. The TQFP-176 package has fine-pitch leads; use 0.4 mm pad width and follow IPC-7351 land pattern guidelines. Keep JTAG signals (TCK, TMS, TDI, TDO) short and isolated from switching I/O to prevent scan-chain noise. Provide a solid ground plane under the device to improve thermal dissipation and signal integrity.
Because the XC3000L family is obsolete, verify configuration PROM compatibility (XC1736, XC1765, or XC17128) before commissioning a new design. Mixed voltage rails (3.3V core, 5V-tolerant I/O) can damage the part if VCCO exceeds the absolute maximum rating. Always confirm the bitstream CRC at power-up by reading the DONE pin status, and avoid hot-plugging the device into a live backplane because the SRAM configuration memory may latch invalid states.
معلومات الامتثال
RoHS/REACH compliance not stated in retrieved distributor data; obtain CoC from broker before shipping into EU markets. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). Conflict-minerals declaration not available in indexed sources.
