XC3090L-7TQ176I - 3.3V Logic Cell Array FPGA, 176-pin TQFP | Xilinx
MPN： XC3090L-7TQ176I ✗ 停產XC3090L-7TQ176I 概覽
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic circuits after manufacturing. Within the semiconductor hierarchy, FPGAs sit between application-specific integrated circuits (ASICs) and small-scale programmable logic; they offer higher integration than discrete gate arrays and faster time-to-market than full ASICs, which is precisely why the XC3000L family was adopted across industrial, telecom, and embedded applications in the late 1990s and early 2000s.
Key differentiating features of the XC3090L include roughly 9000 system gates, 320 configurable logic blocks, a 5 ns pin-to-pin logic delay at the -7 speed grade, and 3.3V core operation with 5V-tolerant I/O options. The device supports on-chip configuration via serial or parallel modes and is in-system programmable through the Xilinx XC3000 configuration bitstream format. Boundary-scan (JTAG, IEEE 1149.1) compatibility is part of the family baseline.
Architecturally, the XC3090L uses SRAM configuration memory, meaning it is volatile and must be reconfigured at every power-up. The interconnect is a hierarchical routing matrix connecting CLBs through single-length, double-length, and long-line segments. This routing fabric, combined with the -7 speed grade, makes the part a credible choice for glue-logic, bus-interface bridges, and small state-machine controllers rather than high-throughput DSP.
Typical applications include industrial serial-protocol bridges (UART, SPI, I2C controllers), legacy peripheral interfaces in test and measurement equipment, glue logic between microprocessors and memory buses, low-density state-machine controllers in instrumentation, and ASIC prototyping where pin-compatibility with the TQFP-176 footprint is mandatory. Designers often pair this part with an external configuration PROM such as the XC1736.
One critical design consideration is that the XC3000L family is no longer recommended for new designs; Xilinx has issued multiple end-of-life notices across the XC3000L series, so longevity planning and last-time-buy inventory buffers should be considered. Engineers should verify the latest lifecycle status from Xilinx before committing the part to long-lifecycle products.
This page synthesizes distributor pricing snapshots, cross-reference observations, and practical design notes that are not collated in any single manufacturer document, providing a one-stop reference for engineers evaluating the XC3090L-7TQ176I for legacy or refurbishment projects.
直接替換替代品，適用於 XC3090L-7TQ176I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC3090L-7TQ176I （相同外形與佔位） — 差異在於 Package, Configuration Memory, Process Technology, Family, Usable Gates.
XC3090L-7TQ176C
✅ 直接替換聯絡詢價
查看資料表 →XC3090L-6TQ176I
✅ 直接替換聯絡詢價
查看資料表 →XC3090L-6TQG176I
✅ 直接替換聯絡詢價
查看資料表 →XC3090L-6TQ176C
✅ 直接替換聯絡詢價
查看資料表 →XC3090L-6TQG176C
✅ 直接替換聯絡詢價
查看資料表 →XC3090L-7TQ176I 最大額定值與電氣特性
| Family | XC3000L Low-Voltage Logic Cell Array |
| Logic Cells | 320 CLBs |
| System Gates | Approx. 9,000 |
| Core Voltage | 3.3 V |
| I/O Voltage | 3.3 V (5 V tolerant option) |
| Speed Grade | -7 |
| 封裝 | TQFP-176 |
| 腳位數 | 176 |
| Configuration Memory | SRAM (volatile) |
| Configuration Mode | Serial / Parallel / Express |
| Boundary Scan | JTAG (IEEE 1149.1) compatible |
| 工作溫度 | -40C to +100C (industrial, I suffix) |
| 安裝類型 | Surface Mount |
XC3090L-7TQ176I tqfp-176 腳位配置指南
XC3090L-7TQ176I（tqfp-176 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC3090L-7TQ176I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC3090L-7TQ176I 適用於 6 應用s: Legacy Industrial Bus Bridge, ASIC Prototyping Platform, Test and Measurement Instrumentation, Telecom Line-Card Glue Logic, Military and Avionics Refurbishment, Embedded Education and FPGA Training.
Legacy Industrial Bus Bridge
The XC3090L-7TQ176I serves as a protocol-translation bridge between legacy parallel buses (e.g., ISA or PC/104) and modern serial peripherals in industrial control cabinets. Its 320 CLBs and ~9,000 system gates are sufficient to implement UART, SPI, or I2C state machines alongside FIFO buffers. The 3.3V core and 5V-tolerant I/O simplify interface to existing 5V peripherals without level shifters. Compared with a CPLD, the XC3090L's hierarchical routing fabric handles wider datapaths and deeper state machines more efficiently. Engineers typically place an XC1736 configuration PROM adjacent to the FPGA so the bitstream reloads automatically at every power-on.
推薦
ASIC Prototyping Platform
Designers use the XC3090L-7TQ176I as a fast-turnaround prototype for ASIC designs targeting low-to-medium gate counts. The 176-pin TQFP package exposes 148 user I/Os, which is enough to bring out most ASIC pins for bench characterization. The SRAM-based fabric allows unlimited design iterations simply by reloading a new bitstream, while the -7 speed grade (around 5 ns pin-to-pin) approximates real-world ASIC timing. After validation, the design can be migrated to a HardCopy structured ASIC for production volume, retaining the same pinout. The Xilinx XC3000L datasheet describes the bitstream format used to load the configuration.
推薦
Test and Measurement Instrumentation
In bench-top instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators, the XC3090L-7TQ176I implements custom trigger sequencers, pattern generators, and timing controllers. Its JTAG boundary-scan (IEEE 1149.1) interface simplifies board-level testing of the surrounding analog and digital circuitry. The 3.3V core reduces power dissipation versus 5V predecessors, easing thermal design in compact enclosures. Industrial temperature grading (-40C to +100C) ensures operation in laboratory and field environments. The device's 320 CLBs comfortably handle 32-bit counters, address decoders, and multiplexing logic in parallel.
推薦
Telecom Line-Card Glue Logic
The XC3090L-7TQ176I performs glue-logic functions on legacy telecom line cards, including TDM bus multiplexing, framing, and alarm monitoring. Its low-voltage 3.3V operation aligns with the power tree of older T1/E1 framers and HDLC controllers, while 5V tolerance allows direct interface to backplane signals. The 176-pin TQFP provides sufficient I/O for multi-drop bus connections. Because the part is obsolete, telecom OEMs typically pair the XC3090L with second-source aftermarket suppliers to extend equipment service life. Long-lifecycle support and last-time-buy planning are essential for installed-base maintenance contracts.
推薦
Military and Avionics Refurbishment
Long-lifecycle defense and avionics programs continue to use the XC3090L-7TQ176I as a drop-in replacement for failed units in fielded equipment. The industrial temperature grade (-40C to +100C) and SRAM-based in-system programmability simplify depot-level repair workflows. Because the XC3000L family is obsolete, the U.S. Defense Logistics Agency and similar agencies maintain qualified parts lists with approved aftermarket sources. Engineers refurbishing these systems verify pin-to-pin compatibility, configuration PROM support, and bitstream integrity before reinstallation.
推薦
Embedded Education and FPGA Training
Universities and training laboratories use the XC3090L-7TQ176I on legacy development boards to teach fundamental FPGA concepts such as CLB utilization, programmable interconnect, and SRAM configuration. Although the architecture predates modern 7-series devices, the XC3000L exposes the same fundamental primitives (LUTs, flip-flops, programmable I/O) in a simpler package. The TQFP-176 footprint is hand-solderable for advanced lab work. Students benefit from understanding why the industry moved from 5V to 3.3V cores and from SRAM to flash-based configuration.
推薦
推薦產品摘要
工程參考資料，適用於 XC3090L-7TQ176I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC3090L-7TQ176C | XC3090L-6TQ176I | XC3090L-6TQG176I | XC3090L-6TQ176C | XC3090L-6TQG176C |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQFP-176 | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same |
| Speed Grade | -7 | -7 | -6 (slower) | -6 (slower) | -6 (slower) | -6 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +70C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +70C) | Commercial (0C to +70C) |
| Logic Cells (CLBs) | 320 | 320 | 320 | 320 | 320 | 320 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Industrial temperature grade in the same TQFP-176 footprint (對比XC3090L-7TQ176C)
- Faster -7 speed grade for timing-critical designs (對比XC3090L-6TQ176I)
- Pb-free option available within the same TQFP-176 footprint (對比XC3090L-6TQG176I)
設計說明
The XC3090L-7TQ176I requires a clean 3.3V core supply with decoupling per the Xilinx XC3090L datasheet recommendations. Place 0.1uF ceramic decoupling capacitors adjacent to every VCCINT and VCCO pin, and add bulk 10uF tantalum or ceramic capacitors near the package. During configuration the device draws peak current; ensure the regulator has at least 500 mA headroom. SRAM configuration memory is volatile, so VCCINT must remain stable during configuration load.
Route all clock and global buffer signals on the inner PCB layers with controlled impedance to avoid skew. The TQFP-176 package has fine-pitch leads; use 0.4 mm pad width and follow IPC-7351 land pattern guidelines. Keep JTAG signals (TCK, TMS, TDI, TDO) short and isolated from switching I/O to prevent scan-chain noise. Provide a solid ground plane under the device to improve thermal dissipation and signal integrity.
Because the XC3000L family is obsolete, verify configuration PROM compatibility (XC1736, XC1765, or XC17128) before commissioning a new design. Mixed voltage rails (3.3V core, 5V-tolerant I/O) can damage the part if VCCO exceeds the absolute maximum rating. Always confirm the bitstream CRC at power-up by reading the DONE pin status, and avoid hot-plugging the device into a live backplane because the SRAM configuration memory may latch invalid states.
合規資訊
RoHS/REACH compliance not stated in retrieved distributor data; obtain CoC from broker before shipping into EU markets. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). Conflict-minerals declaration not available in indexed sources.
