XC3090L-7TQ176C - XC3000L Low-Voltage FPGA | Xilinx | 176-pin TQFP
MPN: XC3090L-7TQ176C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $57.63 | $57.63 |
| 100 | $55.33 | $5,533.00 |
| 500 | $53.12 | $26,560.00 |
| 1,000 | $50.99 | $50,990.00 |
| 3,000 | $47.5 | $142,500.00 |
Drop-in alternatives for XC3090L-7TQ176C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC3090L-6TQ176C
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.95 / Unit
View Datasheet →XC3090L-8TQ176C
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.25 / Unit
View Datasheet →XC3090L-6TQ176I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$140 / Unit
View Datasheet →XC3090L-6TQG176C
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$63 / Unit
View Datasheet →XC3090L-6TQG176I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$21.4 / Unit
View Datasheet →XC3090L-7TQ176C Maximum Ratings & Electrical Characteristics
| Family | XC3000L Low-Voltage Logic Cell Array |
| Series | XC3000L |
| Speed Grade | -7 |
| Core Voltage | 3.3 V (low-voltage family) |
| Package | TQFP-176 |
| Operating Temperature | 0 °C to +85 °C (Commercial, "C" suffix) |
| Configuration Memory | SRAM (volatile, external config required) |
| Mounting Type | Surface Mount |
| Programming Interface | Xilinx XACTstep / Foundation toolchain |
XC3090L-7TQ176C tqfp-176 Pin Configuration Guide
Complete pinout information for XC3090L-7TQ176C (tqfp-176 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3090L-7TQ176C.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC3090L-7TQ176C is suitable for 6 applications: Legacy Telecom Interface Cards, Industrial Control and Instrumentation, Test and Measurement Equipment Glue Logic, Prototype ASIC Replacement, Educational and University Hardware Platforms, Aerospace and Defense Legacy Avionics.
Legacy Telecom Interface Cards
The XC3090L-7TQ176C remains in service on installed telecom interface cards where E1/T1 framing, HDLC controllers, and low-speed serial multiplexing are still implemented in XC3000L silicon. With its TQFP-176 footprint providing 100+ user I/O and SRAM-based re-programmability, the device handles parallel bus interfacing, glue logic between telecom framer ICs and backplane connectors, and small protocol-state machines. Unlike modern FPGAs, it draws higher quiescent current at 3.3 V (~50 mA idle) but offers drop-in compatibility for repair work. Pair with a Xilinx XC1700-series configuration PROM for power-on bitstream loading. Suitable for legacy PBX line cards, TDM switch backplanes, and SS7 link controllers still in field deployment.
Recommended
Industrial Control and Instrumentation
The XC3090L-7TQ176C supports industrial PLC expansion modules, motion-control front ends, and process-instrumentation signal conditioning where 3.3 V logic and moderate gate counts are sufficient. With its configurable logic blocks suitable for PID loops, quadrature decoder logic, and encoder interface state machines, the device bridges between 24 V field I/O and a backplane CPU. The commercial temperature suffix (C) limits deployment to controlled enclosures; choose XC3090L-7TQ176I for unprotected cabinet locations. The TQFP-176 footprint supports up to 144 user I/O, sufficient for parallel ADC/DAC interfacing and stepper/servo pulse-train generation. Sourcing from broker inventory is acceptable for long-life industrial deployments where redesign cost exceeds component cost.
Recommended
Test and Measurement Equipment Glue Logic
Test equipment such as legacy logic analyzers, oscilloscope front-end controllers, and protocol analyzers continues to use XC3090L-7TQ176C for custom trigger logic, bus-formatter state machines, and display multiplexer control. The device's moderate gate count (~9000 gates typical) is sufficient for these dedicated functions while consuming less than 1 W at full I/O toggle. Its SRAM-based configuration allows design revision without mask changes - valuable during product evolution. The TQFP-176 package is hand-solderable with care, supporting rework on legacy instrument mainboards. Engineers maintaining Agilent/HP 16500-series logic analyzers or Tektronix TDS-series scope adapters often source this part for repair.
Recommended
Prototype ASIC Replacement
The XC3090L-7TQ176C was historically used as a prototype vehicle for low-volume ASIC designs, particularly in industrial, medical, and military markets where ASIC NRE cost could not be amortized. The device's TQFP-176 footprint can be reused as the ASIC pinout for early production builds, then the FPGA replaced by the structured ASIC in higher volumes. Today, designers maintaining these prototype systems continue to source the part. Modern migration paths recommend transitioning to Spartan-6 or Artix-7 with a pin-compatible footprint adapter, but for systems where PCB redesign is impractical, the XC3090L remains the simplest drop-in answer.
Recommended
Educational and University Hardware Platforms
University digital-logic and computer-architecture courses use XC3090L-7TQ176C on legacy teaching boards (e.g., Xilinx XESS XS40, Digilab XL boards) where students learn VHDL/Verilog on first-generation FPGA silicon. The device's straightforward CLB architecture makes it pedagogically valuable for teaching fundamental FPGA concepts without the abstraction layers of modern toolchains. Educational boards continue to function decades later, requiring periodic part replacement. Sourcing from broker inventory keeps these platforms operational. The TQFP-176 footprint remains student-solderable under microscope, supporting lab exercises in surface-mount rework.
Recommended
Aerospace and Defense Legacy Avionics
Long-lifecycle aerospace and defense platforms (military radios, avionics subsystems, naval electronics) use XC3090L-7TQ176C for control-plane functions where design recertification cost prevents migration to modern silicon. The device is supported by DSCC (Defense Supply Center Columbus) and is available through QPL-listed brokers for defense programs. The commercial temperature suffix (C) restricts use to pressurized avionics bays; cockpit and unpressurized applications require the industrial (-I) variant. Continued sourcing is critical for maintaining airworthiness of aircraft with 20+ year service lives. Configuration management and counterfeit screening per AS5553 are essential for these deployments.
Recommended
Recommended Products Summary
Engineering reference data for XC3090L-7TQ176C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3090L-6TQ176C | XC3090L-8TQ176C | XC3090L-6TQ176I | XC3090L-6TQG176C | XC3090L-6TQG176I |
|---|---|---|---|---|---|---|
| Package | TQFP-176 | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -7 | -6 (slower) | -8 (faster) | -6 (slower) | -6 (slower) | -6 (slower) |
| Temperature Range | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | -40 to +100 °C (Industrial) | 0 to +85 °C (Commercial) | -40 to +100 °C (Industrial) |
| Lead Finish | SnPb (standard) | SnPb (standard) | SnPb (standard) | SnPb (standard) | Pb-free (RoHS) | Pb-free (RoHS) |
| Logic Family | XC3000L (3.3 V) | XC3000L (3.3 V) - same | XC3000L (3.3 V) - same | XC3000L (3.3 V) - same | XC3000L (3.3 V) - same | XC3000L (3.3 V) - same |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) - same | SRAM (volatile) - same | SRAM (volatile) - same | SRAM (volatile) - same | SRAM (volatile) - same |
| Approx. Unit Price (USD) | $57.63 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Balanced speed grade in middle of XC3090L family (vs XC3090L-6TQ176C)
- Commercial temperature range suitable for controlled-environment deployments (vs XC3090L-6TQ176I)
- Standard SnPb lead finish for legacy board compatibility (vs XC3090L-6TQG176C)
Design Notes
The XC3090L-7TQ176C requires a stable 3.3 V core supply with decoupling per Xilinx application note XAPP131. Place one 100 µF bulk tantalum and ten 0.1 µF ceramic capacitors around the package, with at least one 0.1 µF cap within 5 mm of each VCC/ground pair. SRAM-based configuration draws additional inrush current during power-on configuration - budget the regulator for 2x the steady-state load. The I/O bank supply (VCCIO) can be 3.3 V or 5 V tolerant depending on the chosen I/O standard; consult the XC3000L datasheet pin description before mixing voltage domains.
Configuration memory is volatile SRAM, so a non-volatile configuration source (XC17S00/XC17S00-series PROM, microcontroller bitstream load, or JTAG) is required on every power-up. Design the board with a JTAG header (TCK, TMS, TDI, TDO, optional TRST) for in-system programming - this is the only practical way to update bitstreams in fielded equipment. The DONE pin must be pulled high via external resistor to indicate successful configuration completion; failure to do so can cause downstream logic to operate on undefined states. Verify INIT pin behavior at cold-start; it should remain low during configuration and rise high once done.
The TQFP-176 package has 0.5 mm pitch gull-wing leads requiring careful PCB layout: use 0.15 mm trace/space rules, micro-via fanouts if using high-density interconnect, and a solder mask defined (SMD) pad shape with 0.05 mm solder-mask expansion beyond the copper pad. Recommended land pattern is per IPC-7351 nominal-density profile. Thermal management is minimal because the XC3090L dissipates less than 1 W even at full I/O toggle, but a small copper flood tied to the ground plane helps reduce ground-bounce noise on simultaneous switching outputs (SSO).
Compliance Information
RoHS, REACH, halogen-free status for XC3000L family not provided in Verified Web Data; the standard TQ176C suffix indicates SnPb lead finish (NOT lead-free), while the TQG176C suffix is the Pb-free RoHS variant. AEC-Q100 is not applicable to FPGAs.
