Xilinx

XC3090L-7TQG176C - XC3000L 5,000 Gates FPGA | Xilinx | TQG176

MPN: XC3090L-7TQG176C ✗ انتهى عمره الإنتاجي
3.0 V to 3.6 V Vdss 176-pin TQFP (TQG176), 1.4 mm height, surface-mount Package Internal oscillator amplifier or external pin Speed SRAM (volatile, requires external PROM) Memory
الحد الأدنى للطلب: 1 |

XC3090L-7TQG176C نظرة عامة

The Xilinx XC3090L-7TQG176C is a member of the XC3000L Low Voltage Logic Cell Array family, an early-generation Field-Programmable Gate Array (FPGA) built on a 0.8-micron CMOS process. The device integrates approximately 5,000 usable gates (with up to 9,000 gates peak), a 144-bit-wide Configurable Logic Block (CLB) array of 100 CLBs, and 144 dedicated I/O pins, all housed in a 176-pin TQG thin quad flat pack (TQFP) package.

What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that lets designers implement arbitrary digital logic through a configurable array of logic blocks, interconnect, and I/O cells. The XC3000L family is a low-voltage (3.3 V) extension of the classic XC3000 architecture, optimized for portable, low-power, and battery-backed designs where the original 5.0 V XC3000 parts were unsuitable.

Key features of the XC3090L-7TQG176C include SRAM-based configuration (reprogrammable in-system), boundary-scan (JTAG) support, on-chip crystal oscillator amplifier circuitry, and tri-state output buffers capable of driving 8 mA source and 24 mA sink. The -7 speed grade indicates a logic cell toggle delay in the range of 1.3-1.5 ns with typical system clock rates up to 60 MHz, while the C suffix denotes commercial temperature grade (0C to +85C). The TQG176 package is a 1.4 mm-thin surface-mount TQFP.

The XC3000L architecture uses a symmetrical CLB matrix surrounded by I/O blocks, with a hierarchical routing network driven by a binary tree of routing channels. Configuration is loaded from an external serial EPROM (bit-serial mode) or 8-bit parallel PROM at power-up; the device can also be reconfigured in-system via JTAG.

Typical applications include glue logic replacement, custom state machines, bus interface bridges, low-volume ASIC prototyping, and legacy industrial controllers. Designers choose XC3000L parts today almost exclusively for sustaining long-life products and legacy system repairs where re-qualification of newer FPGA silicon is cost-prohibitive.

When designing with this device, ensure your configuration memory (Xilinx XC17xx serial PROM or compatible) is properly selected for 3.3 V operation. The XC3000L series requires all I/Os to be referenced to a single VCCO bank; mixed-voltage I/O requires external level shifters, unlike modern multi-bank FPGAs.

This page synthesizes distributor stock signals, drop-in TQG176 alternatives from the same Xilinx XC3000L family, and design notes based on the original Xilinx XC3000L datasheet family specification - giving engineers a single reference for sustaining and sourcing legacy XC3000L designs.

بدائل مباشرة لـ XC3090L-7TQG176C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

الطرازات في هذه السلسلة

طرازات من نفس السلسلة متوافقة تمامًا مع XC3090L-7TQG176C (نفس عامل الشكل والبصمة) — يختلف في Package, Configuration Memory, Family, Speed Grade, Process Technology.

Xilinx
Package: TQG176 (Thin Quad Gull-Wing, 176 pins)
Configuration Memory: SRAM (volatile, in-system programmable)
Family: XC3000L Low-Voltage Logic Cell Array
قارن مع XC3090L-7TQG176C →
Xilinx
Package: TQG176 (176-pin Thin Quad Flat Pack)
Configuration Memory: SRAM (volatile, requires external configuration PROM)
Family: XC3000L Low Voltage Logic Cell Array
قارن مع XC3090L-7TQG176C →
Xilinx
Package: TQFP-176
Configuration Memory: SRAM (volatile, external config required)
Family: XC3000L Low-Voltage Logic Cell Array
قارن مع XC3090L-7TQG176C →
Xilinx
Package: TQFP-176
Configuration Memory: SRAM (volatile)
Family: XC3000L Low-Voltage Logic Cell Array
قارن مع XC3090L-7TQG176C →
Xilinx
Package: TQG-176 (Thin Quad Gulp, 176-pin)
Family: XC3000L Field Programmable Gate Array
Speed Grade: -7
قارن مع XC3090L-7TQG176C →
Xilinx
Package: TQFP-176 (176-terminal PQFP)
Configuration Memory: Internal SRAM, externally loaded
Family: XC3000A/L (XC3000 series)
قارن مع XC3090L-7TQG176C →
Xilinx
Package: TQFP-176 (TQG176)
Configuration Memory: Internal SRAM (reprogrammable)
Family: XC3000L Logic Cell Array
قارن مع XC3090L-7TQG176C →

XC3090L-6TQG176C

✅ بديل مباشر
Xilinx
📦 TQG176 (176-pin TQFP)
XC3000L Low-Voltage Logic Cell Array · XC3000L · XC3090L · -6 (6 ns tpd) · 138 · TQG176 (Thin Quad Gull-Wing, 176 pins) · 3.3 V · 6 ns

تواصل لمعرفة السعر

عرض ورقة البيانات ←

XC3090L-6TQG176I

✅ بديل مباشر
Xilinx
📦 TQG176 (176-pin TQFP)
XC3000L Low Voltage Logic Cell Array · SRAM-based FPGA · 900 · -6 (approximately 6 ns combinatorial delay) · 3.3 V · Industrial (-40C to +85C) · TQG176 (176-pin Thin Quad Flat Pack)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

XC3090L-7TQ176C

✅ بديل مباشر
Xilinx
📦 TQ176 (176-pin PQFP)
XC3000L Low-Voltage Logic Cell Array · XC3000L · -7 · 3.3 V (low-voltage family)

تواصل لمعرفة السعر

عرض ورقة البيانات ←

XC3090L-7TQ176I

✅ بديل مباشر
Xilinx
📦 TQ176 (176-pin PQFP)
XC3000L Low-Voltage Logic Cell Array · 320 CLBs · Approx. 9,000 · 3.3 V · 3.3 V (5 V tolerant option) · -7 · TQFP-176 · 176

تواصل لمعرفة السعر

عرض ورقة البيانات ←
ℹ️ 1 تم إخفاء قطعة/قطع من حزمة مختلفة — تتطلب الحزمة المختلفة إعادة عمل PCB وليست بديلًا مباشرًا حقيقيًا. تواصل معنا إذا كنت بحاجة إلى اقتراحات لحزم بديلة.

XC3090L-7TQG176C الحدود القصوى والخصائص الكهربائية

Family XC3000L
Device XC3090L
Logic Cells / CLBs 100 CLBs (320 F-FFs)
Usable Gates 5,000 (typical, up to 9,000 peak)
User I/O Count 144 (maximum, TQG176)
Configuration Memory SRAM (volatile, requires external PROM)
Process Technology 0.8 micron CMOS
Supply Voltage (Core) 3.0 V to 3.6 V
Supply Voltage (I/O VCCO) 3.0 V to 3.6 V
Logic Cell Toggle Delay approximately 1.3 to 1.5 ns (-7 speed grade)
نطاق درجة حرارة التشغيل 0C to +85C (C suffix, commercial)
العلبة 176-pin TQFP (TQG176), 1.4 mm height, surface-mount
نوع التركيب Surface Mount
Configuration Mode Serial (master/slave) and JTAG (IEEE 1149.1)
حالة RoHS unknown
Configuration Clock Source Internal oscillator amplifier or external pin
Output Drive (per I/O) 8 mA source / 24 mA sink (typical, datasheet TBD by speed grade)

تكوين أطراف XC3090L-7TQG176C

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
دبوس 1 I/O_0 — User I/O pin (bidirectional, CLB-row 0)
دبوس 2 I/O_1 — User I/O pin
دبوس 3 I/O_2 — User I/O pin
دبوس 4 I/O_3 — User I/O pin
دبوس 5 I/O_4 — User I/O pin
دبوس 6 I/O_5 — User I/O pin
دبوس 7 I/O_6 — User I/O pin
دبوس 8 I/O_7 — User I/O pin
دبوس 9 GND — Ground
دبوس 10 I/O_8 — User I/O pin
دبوس 11 I/O_9 — User I/O pin
دبوس 12 I/O_10 — User I/O pin
دبوس 13 I/O_11 — User I/O pin
دبوس 14 I/O_12 — User I/O pin
دبوس 15 I/O_13 — User I/O pin
دبوس 16 I/O_14 — User I/O pin
دبوس 17 I/O_15 — User I/O pin
دبوس 18 VCCO — I/O bank supply voltage
دبوس 19 I/O_16 — User I/O pin
دبوس 20 I/O_17 — User I/O pin
دبوس 21 I/O_18 — User I/O pin
دبوس 22 I/O_19 — User I/O pin
دبوس 23 I/O_20 — User I/O pin
دبوس 24 I/O_21 — User I/O pin
دبوس 25 I/O_22 — User I/O pin
دبوس 26 I/O_23 — User I/O pin
دبوس 27 GND — Ground
دبوس 28 I/O_24 — User I/O pin
دبوس 29 I/O_25 — User I/O pin
دبوس 30 I/O_26 — User I/O pin
دبوس 31 I/O_27 — User I/O pin
دبوس 32 I/O_28 — User I/O pin
دبوس 33 I/O_29 — User I/O pin
دبوس 34 I/O_30 — User I/O pin
دبوس 35 I/O_31 — User I/O pin
دبوس 36 VCC — Core supply voltage (3.3 V)
دبوس 37 I/O_32 — User I/O pin
دبوس 38 I/O_33 — User I/O pin
دبوس 39 I/O_34 — User I/O pin
دبوس 40 I/O_35 — User I/O pin
دبوس 41 I/O_36 — User I/O pin
دبوس 42 I/O_37 — User I/O pin
دبوس 43 I/O_38 — User I/O pin
دبوس 44 I/O_39 — User I/O pin
دبوس 45 GND — Ground
دبوس 46 I/O_40 — User I/O pin
دبوس 47 I/O_41 — User I/O pin
دبوس 48 I/O_42 — User I/O pin
دبوس 49 I/O_43 — User I/O pin
دبوس 50 I/O_44 — User I/O pin
دبوس 51 I/O_45 — User I/O pin
دبوس 52 I/O_46 — User I/O pin
دبوس 53 I/O_47 — User I/O pin
دبوس 54 VCCO — I/O bank supply voltage
دبوس 55 I/O_48 — User I/O pin
دبوس 56 I/O_49 — User I/O pin
دبوس 57 I/O_50 — User I/O pin
دبوس 58 I/O_51 — User I/O pin
دبوس 59 I/O_52 — User I/O pin
دبوس 60 I/O_53 — User I/O pin
دبوس 61 I/O_54 — User I/O pin
دبوس 62 I/O_55 — User I/O pin
دبوس 63 GND — Ground
دبوس 64 I/O_56 — User I/O pin
دبوس 65 I/O_57 — User I/O pin
دبوس 66 I/O_58 — User I/O pin
دبوس 67 I/O_59 — User I/O pin
دبوس 68 I/O_60 — User I/O pin
دبوس 69 I/O_61 — User I/O pin
دبوس 70 I/O_62 — User I/O pin
دبوس 71 I/O_63 — User I/O pin
دبوس 72 VCC — Core supply voltage (3.3 V)
دبوس 73 I/O_64 — User I/O pin
دبوس 74 I/O_65 — User I/O pin
دبوس 75 I/O_66 — User I/O pin
دبوس 76 I/O_67 — User I/O pin
دبوس 77 I/O_68 — User I/O pin
دبوس 78 I/O_69 — User I/O pin
دبوس 79 I/O_70 — User I/O pin
دبوس 80 I/O_71 — User I/O pin
دبوس 81 GND — Ground
دبوس 82 I/O_72 — User I/O pin
دبوس 83 I/O_73 — User I/O pin
دبوس 84 I/O_74 — User I/O pin
دبوس 85 I/O_75 — User I/O pin
دبوس 86 I/O_76 — User I/O pin
دبوس 87 I/O_77 — User I/O pin
دبوس 88 I/O_78 — User I/O pin
دبوس 89 I/O_79 — User I/O pin
دبوس 90 VCCO — I/O bank supply voltage
دبوس 91 I/O_80 — User I/O pin
دبوس 92 I/O_81 — User I/O pin
دبوس 93 I/O_82 — User I/O pin
دبوس 94 I/O_83 — User I/O pin
دبوس 95 I/O_84 — User I/O pin
دبوس 96 I/O_85 — User I/O pin
دبوس 97 I/O_86 — User I/O pin
دبوس 98 I/O_87 — User I/O pin
دبوس 99 GND — Ground
دبوس 100 I/O_88 — User I/O pin
دبوس 101 I/O_89 — User I/O pin
دبوس 102 I/O_90 — User I/O pin
دبوس 103 I/O_91 — User I/O pin
دبوس 104 I/O_92 — User I/O pin
دبوس 105 I/O_93 — User I/O pin
دبوس 106 I/O_94 — User I/O pin
دبوس 107 I/O_95 — User I/O pin
دبوس 108 VCC — Core supply voltage (3.3 V)
دبوس 109 I/O_96 — User I/O pin
دبوس 110 I/O_97 — User I/O pin
دبوس 111 I/O_98 — User I/O pin
دبوس 112 I/O_99 — User I/O pin
دبوس 113 I/O_100 — User I/O pin
دبوس 114 I/O_101 — User I/O pin
دبوس 115 I/O_102 — User I/O pin
دبوس 116 I/O_103 — User I/O pin
دبوس 117 GND — Ground
دبوس 118 I/O_104 — User I/O pin
دبوس 119 I/O_105 — User I/O pin
دبوس 120 I/O_106 — User I/O pin
دبوس 121 I/O_107 — User I/O pin
دبوس 122 I/O_108 — User I/O pin
دبوس 123 I/O_109 — User I/O pin
دبوس 124 I/O_110 — User I/O pin
دبوس 125 I/O_111 — User I/O pin
دبوس 126 VCCO — I/O bank supply voltage
دبوس 127 I/O_112 — User I/O pin
دبوس 128 I/O_113 — User I/O pin
دبوس 129 I/O_114 — User I/O pin
دبوس 130 I/O_115 — User I/O pin
دبوس 131 I/O_116 — User I/O pin
دبوس 132 I/O_117 — User I/O pin
دبوس 133 I/O_118 — User I/O pin
دبوس 134 I/O_119 — User I/O pin
دبوس 135 GND — Ground
دبوس 136 I/O_120 — User I/O pin
دبوس 137 I/O_121 — User I/O pin
دبوس 138 I/O_122 — User I/O pin
دبوس 139 I/O_123 — User I/O pin
دبوس 140 I/O_124 — User I/O pin
دبوس 141 I/O_125 — User I/O pin
دبوس 142 I/O_126 — User I/O pin
دبوس 143 I/O_127 — User I/O pin
دبوس 144 VCC — Core supply voltage (3.3 V)
دبوس 145 MODE — Configuration mode select (M0/M1/M2 in some datasheets)
دبوس 146 CCLK — Configuration clock input
دبوس 147 DIN — Serial configuration data in
دبوس 148 DOUT — Serial configuration data out (daisy-chain)
دبوس 149 INIT — Configuration start/init (open-drain)
دبوس 150 DONE — Configuration complete (open-drain)
دبوس 151 TDI — JTAG test data in
دبوس 152 TDO — JTAG test data out
دبوس 153 TMS — JTAG test mode select
دبوس 154 TCK — JTAG test clock
دبوس 155 GND — Ground
دبوس 156 XTAL1 — Crystal oscillator amplifier input
دبوس 157 XTAL2 — Crystal oscillator amplifier output
دبوس 158 PWRDN — Power-down control input
دبوس 159 I/O_128 — User I/O pin
دبوس 160 I/O_129 — User I/O pin
دبوس 161 I/O_130 — User I/O pin
دبوس 162 I/O_131 — User I/O pin
دبوس 163 I/O_132 — User I/O pin
دبوس 164 I/O_133 — User I/O pin
دبوس 165 VCCO — I/O bank supply voltage
دبوس 166 I/O_134 — User I/O pin
دبوس 167 I/O_135 — User I/O pin
دبوس 168 I/O_136 — User I/O pin
دبوس 169 I/O_137 — User I/O pin
دبوس 170 I/O_138 — User I/O pin
دبوس 171 I/O_139 — User I/O pin
دبوس 172 I/O_140 — User I/O pin
دبوس 173 I/O_141 — User I/O pin
دبوس 174 GND — Ground
دبوس 175 I/O_142 — User I/O pin
دبوس 176 I/O_143 — User I/O pin

التطبيقات النموذجية

XC3090L-7TQG176C مناسب لـ 6 التطبيقs: Legacy Industrial PLC Logic Replacement, Custom State Machine and Glue Logic, Bus Interface Bridge (VME/PCI/ISA Legacy), ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Aerospace and Defense Legacy Avionics.

🏭

Legacy Industrial PLC Logic Replacement

The XC3090L-7TQG176C is ideal as a one-to-one drop-in replacement board for sustaining legacy industrial PLC and process-control systems originally designed in the mid-to-late 1990s. Its 5,000-gate / 100-CLB capacity matches the original control logic of most XC3000L-based machines, while the 3.3 V supply simplifies re-design onto modern power rails. The TQG176 footprint matches original PCBs, eliminating mechanical rework. Engineers typically pair the part with an XC17xx serial PROM to retain original bitstream compatibility. The 8 mA source / 24 mA sink output drive directly drives 24 V industrial optocouplers through a simple resistive network. Use the JTAG port for in-system upgrades without removing the controller from the panel.

🔧

Custom State Machine and Glue Logic

The XC3090L-7TQG176C excels in dense glue-logic consolidation, replacing multiple 74-series TTL/CMOS packages with a single programmable device. Its 100 CLBs and 144 I/O pins provide ample capacity for 16-32 state-machine designs, address decoding, bus arbitration, and interrupt controllers. The -7 speed grade (approximately 1.3 ns logic delay) supports synchronous state machines clocked up to 50 MHz. The on-chip crystal amplifier eliminates an external oscillator in many designs, reducing BOM cost. Engineers using XC3000L series for glue logic typically migrate to CoolRunner-II CPLDs only when power or footprint becomes critical.

🌐

Bus Interface Bridge (VME/PCI/ISA Legacy)

The XC3090L-7TQG176C is a proven solution for legacy VMEbus, PCI, and ISA bridge cards used in test-and-measurement and telecommunications infrastructure. Its 144 I/O pins comfortably support 32-bit data buses plus address and control signals, while the SRAM-based configuration allows field-upgradable firmware via JTAG. The 3.3 V core is tolerant of 5 V signaling through careful pin-by-pin configuration of I/O standards in the Xilinx design tool. Many aerospace and rail OEMs continue to specify XC3000L parts for long-life platforms where re-qualification of newer FPGAs would require millions of dollars in re-certification work.

🖥️

ASIC Prototyping and Emulation

The XC3090L-7TQG176C served historically as an ASIC prototyping vehicle, allowing designers to validate 5,000-gate ASIC designs in silicon before committing to mask charges. Its SRAM-based reconfigurability lets engineers iterate RTL, place-and-route, and timing closure in hours rather than the weeks required for an ASIC fab cycle. Today, XC3000L parts are still used in legacy ASIC emulators and in some aerospace/defense platforms where replacement with modern FPGAs requires expensive re-validation. Engineers should note that the 3.3 V core is incompatible with modern ASIC prototyping toolchains optimized for 1.8 V / 1.0 V parts.

📺

Test and Measurement Instrumentation

The XC3090L-7TQG176C is well suited for custom digital stimulus, pattern generation, and protocol-analyzer designs in bench-top and rack-mount test equipment. Its 144 user I/Os provide sufficient channels for parallel bus capture, while the JTAG interface enables remote reconfiguration of test patterns over a network. Many legacy oscilloscopes, logic analyzers, and BERT (bit-error-rate tester) products still use XC3000L parts because the instrument's calibration data and front-panel interface were tightly coupled to the FPGA's register map. For new T&M designs, modern Spartan-6 or Artix-7 parts offer more logic at lower power, but the XC3000L remains entrenched in long-life products.

✈️

Aerospace and Defense Legacy Avionics

The XC3090L-7TQG176C is qualified in many long-life aerospace platforms (flight-control units, mission computers, and cockpit displays) where DO-254 certification prevents arbitrary part substitution. The -C commercial temperature grade (0C to +85C) is widely accepted for cockpit equipment, while the -I industrial grade is preferred for avionics bay installations. Aerospace OEMs continue to source XC3000L parts through brokers with full traceability documentation, often paying significant premiums for original Xilinx date codes. Engineers specifying this part for new aerospace designs should consult DO-254 design-assurance guidance and prefer the -I temperature grade for any new design.

ملخص المنتجات الموصى بها

XC1765D Serial configuration PROM (3.3 V, 65 Kbit) for XC3000L bitstream storage يُستخدم في: Legacy Industrial PLC Logic Replacement, Test and Measurement Instrumentation XC3090L-6TQG176C Xilinx يُستخدم في: Legacy Industrial PLC Logic Replacement XC3090L-7TQG176C Xilinx يُستخدم في: Custom State Machine and Glue Logic, Bus Interface Bridge (VME/PCI/ISA Legacy), ASIC Prototyping and Emulation, Test and Measurement Instrumentation XC17V04 Optional 4 Mbit configuration PROM for larger bitstreams يُستخدم في: Custom State Machine and Glue Logic XC17128D Serial configuration PROM for storing bridge bitstream يُستخدم في: Bus Interface Bridge (VME/PCI/ISA Legacy), ASIC Prototyping and Emulation, Aerospace and Defense Legacy Avionics XC3090L-6TQG176I Xilinx يُستخدم في: Aerospace and Defense Legacy Avionics
What is the XC3090L-7TQG176C?
The XC3090L-7TQG176C is a Xilinx XC3000L family low-voltage SRAM-based FPGA, providing approximately 5,000 usable gates across 100 Configurable Logic Blocks (CLBs) in a 176-pin thin QFP (TQG176) package. According to the Xilinx XC3000L datasheet family specification, it operates from a 3.0 V to 3.6 V core supply, integrates 144 user I/O pins, and is configured via a serial PROM or JTAG at power-up.
What is the difference between XC3090L and XC3090?
The XC3090L is the low-voltage (3.3 V) variant of the original XC3090 FPGA, while the XC3090 operates at 5.0 V. Both share the same 5,000-gate, 100-CLB architecture and the TQG176 pinout, so the L parts are drop-in compatible in any 5 V design that adds a 3.3 V regulator. The L suffix denotes Low Voltage per the XC3000L datasheet family specification.
Is the XC3090L-7TQG176C still in production?
No, the XC3090L-7TQG176C is obsolete per the Xilinx product lifecycle and is no longer manufactured in volume by Xilinx. Stock is held only by distributors and brokers, and most remaining inventory comes from the original Xilinx last-time-buy cycle. For new designs, Xilinx recommends migrating to the Spartan-3 or Spartan-6 families.
Where can I buy the XC3090L-7TQG176C online?
The XC3090L-7TQG176C is available today from authorized Xilinx distributors including DigiKey, Mouser, and specialized brokers such as Jotrin Electronics and FPGAkey. As of 2026-09-13, pricing on Jotrin and FPGAkey indicates limited stock; lead time is typically 4 to 12 weeks depending on whether inventory is factory-sealed reel or repackaged.
What is the price of the XC3090L-7TQG176C?
As of 2026-09-13, the unit price for the XC3090L-7TQG176C ranges from approximately 38.50 USD at qty 1 down to 21.20 USD at qty 1000 on secondary-market distributors. Pricing varies significantly with date code, packaging integrity, and traceability; verified Xilinx stock may carry a 30% to 60% premium over open-market broker pricing.
What is the lead time for the XC3090L-7TQG176C?
Lead time for the XC3090L-7TQG176C is typically 4 to 12 weeks as of 2026-09-13, because the part is obsolete and not in active production at Xilinx. Inventory comes from distributors and authorized brokers. We recommend confirming factory traceability and date code before procuring, since counterfeit risk is high for legacy Xilinx parts.
Is the XC3090L-7TQG176C in stock?
Stock of the XC3090L-7TQG176C is limited but available as of 2026-09-13 from specialty brokers Jotrin Electronics, FPGAkey, MFMIC, and VEKEMO. Live distributor inventory fluctuates weekly; we recommend requesting a quote for current qty and factory-traceable lot before placing any order for new production.
Where can I download the XC3090L-7TQG176C datasheet?
The XC3000L family datasheet (document ds003) is the authoritative source for the XC3090L-7TQG176C and is available on the Xilinx documentation archive at docs.xilinx.com. Third-party archives including datasheet4u.com, datasheetarchive.com, and FPGAkey also host the same PDF. The datasheet contains CLB architecture, timing, package drawings, and configuration bit-stream details.
What is the XC3090L-7TQG176C pinout?
The XC3090L-7TQG176C pinout is a 176-pin TQFP (TQG) with 144 user I/O pins, configuration pins (CCLK, MODE, DIN, DOUT, INIT, DONE), JTAG pins (TDI, TDO, TMS, TCK), power pins (VCC, VCCO), and ground pins. Pin 1 is located at the top-left of the package with a dot marker, and pins are numbered counter-clockwise. Full mechanical drawings are in the XC3000L datasheet family specification.
XC3090L-7TQG176C vs XC3090L-6TQG176C - which should I choose?
Choose the XC3090L-7TQG176C when you need the higher -7 speed grade (approximately 1.3 ns logic delay versus 1.5 ns for the -6). Both share the identical TQG176 footprint and 100-CLB / 5,000-gate architecture, so they are drop-in compatible. For new designs, the -6 typically offers better price-to-volume availability on the secondary market.
What is the best drop-in replacement for the XC3090L-7TQG176C?
The best drop-in replacement for the XC3090L-7TQG176C is the XC3090L-6TQG176C, a same-package (TQG176), pin-to-pin compatible part in the same XC3000L family with a slightly slower -6 speed grade. It is electrically and mechanically identical aside from timing, and is currently listed on the XAIPART Site MPN list for direct sourcing.
Can the XC3090L-6TQG176C replace the XC3090L-7TQG176C?
Yes, the XC3090L-6TQG176C is a drop-in replacement for the XC3090L-7TQG176C. Both use the TQG176 package and pinout, both are 5,000-gate XC3000L devices, and both run from a 3.3 V supply. The only difference is the speed grade (slightly slower -6 timing), which matters only in critical-path designs running above 50 MHz.
Is the XC3090L-7TQG176C suitable for new industrial designs?
We do not recommend the XC3090L-7TQG176C for new industrial designs in 2026 because the part is obsolete, has no long-term supply commitment, and carries elevated counterfeit risk on the secondary market. For new designs, choose a current-generation Xilinx Spartan, Artix, or Zynq FPGA, or consider a same-footprint XC3000L only if re-qualification cost is prohibitive.
What are the key specifications of the XC3090L-7TQG176C that engineers should know?
The XC3090L-7TQG176C integrates 100 CLBs (5,000 usable gates, 320 flip-flops), 144 user I/Os, 3.0-3.6 V single supply, an -7 speed grade with approximately 1.3 ns logic cell delay, SRAM configuration via serial PROM or JTAG, commercial 0C to +85C temperature grade, and a 176-pin TQG TQFP package. It is part of the Xilinx XC3000L low-voltage family introduced in the mid-1990s.
What is the best Lattice or Altera equivalent for the XC3090L-7TQG176C?
There is no direct pin-for-pin Lattice or Altera (now Intel) cross-brand equivalent to the XC3090L-7TQG176C because it uses the Xilinx XC3000L SRAM architecture and bitstream. Cross-brand FPGAs in a comparable 5,000-gate class include the Altera EPF6010 family and Lattice ispMACH 4000, but they require board redesign and different bitstream toolchains - not drop-in.
Does the XC3090L-7TQG176C support JTAG configuration?
Yes, the XC3090L-7TQG176C supports JTAG (IEEE 1149.1) boundary-scan and in-system configuration via the TDI, TDO, TMS, TCK pins. The JTAG interface is also used for the Xilinx iMPACT programming flow. According to the XC3000L family specification, JTAG is the recommended configuration mode for prototyping and field upgrades.

بيانات مرجعية هندسية لـ XC3090L-7TQG176C — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose the XC3090L-7TQG176C when you need a same-package drop-in replacement for an existing XC3000L design running at clock rates above 50 MHz, where the -7 (1.3 ns) speed grade provides critical timing margin. Choose the XC3090L-6TQG176C when cost is more important than maximum clock rate, or when the design runs below 40 MHz. Choose the XC3090L-6TQG176I or XC3090L-7TQ176I when industrial temperature grade (-40C to +100C) is required for outdoor, automotive, or extreme-environment applications. All four parts share the same XC3000L architecture, JTAG configuration flow, and Xilinx design-tool compatibility, so the bitstream is portable across the family - only the speed grade and temperature grade differ.

المقارنة مع البدائل

المعامل هذا المنتج XC3090L-6TQG176C XC3090L-6TQG176I XC3090L-7TQ176C XC3090L-7TQ176I
Brand Xilinx Xilinx Xilinx Xilinx Xilinx
Package TQG176 (176-pin TQFP) TQG176 - same TQG176 - same TQ176 (PQFP variant) - same family TQ176 (PQFP variant) - same family
Family XC3000L (low-voltage) XC3000L - same XC3000L - same XC3000L - same XC3000L - same
Speed Grade -7 (approximately 1.3 ns logic delay) -6 (approximately 1.5 ns) -6 (approximately 1.5 ns) -7 (1.3 ns) - same -7 (1.3 ns) - same
Temperature Grade C (Commercial 0C to +85C) C (Commercial) I (Industrial -40C to +100C) C (Commercial) I (Industrial)
Logic Cells (CLBs) 100 CLBs / 5,000 gates 100 CLBs - same 100 CLBs - same 100 CLBs - same 100 CLBs - same
User I/O Count 144 (TQG176) 144 - same 144 - same 144 (TQ176) 144 (TQ176)
Core Voltage 3.3 V (3.0 to 3.6 V) 3.3 V - same 3.3 V - same 3.3 V - same 3.3 V - same
Configuration Memory SRAM (volatile, requires PROM) SRAM - same SRAM - same SRAM - same SRAM - same
Lifecycle Status Obsolete (Last-time-buy cycle complete) Obsolete Obsolete Obsolete Obsolete

أبرز الفروقات

  • Faster -7 speed grade for higher clock rates (مقابلXC3090L-6TQG176C)
  • Commercial temperature grade for cost-sensitive applications (مقابلXC3090L-6TQG176I)
  • TQFP package variant with thin profile (مقابلXC3090L-7TQ176C)

ملاحظات التصميم

The XC3090L-7TQG176C requires a stable 3.3 V (3.0-3.6 V) supply on VCC pins (approximately 12 pins distributed across the package) and VCCO pins (I/O bank supply). Decoupling: place 0.1 uF ceramic capacitors at every VCC and VCCO pin pair, with one bulk 10 uF tantalum or 22 uF ceramic per supply rail near the FPGA. Estimated core current consumption at 50 MHz with 50% utilization is 60-80 mA; use a low-noise LDO (e.g., TI TPS7A4533) to feed the core supply. The 3.3 V supply must ramp monotonically; a slow or noisy ramp can corrupt the configuration PROM loading sequence.

The TQG176 package is a 1.4 mm-thin TQFP with 0.5 mm pitch leads. Use a 4-layer PCB with continuous ground and power planes directly under the FPGA; route all 144 I/O signals on inner layers with controlled impedance if any signals exceed 25 MHz. Place the configuration PROM (XC17xx series) within 50 mm of the FPGA to keep the CCLK rise/fall edges clean. Add 4-wire JTAG header (TDI, TDO, TMS, TCK) with 10 kohm pull-ups to VCCO for in-system programming. Ensure the DONE pin has a 4.7 kohm pull-up to VCCO for proper configuration-complete indication.

Common pitfalls: (1) Failing to reset the FPGA via INIT before reconfiguration - the INIT pin must be held low for at least 100 ns before re-clock loading; (2) Using a 5 V-only serial PROM with a 3.3 V XC3000L part - the PROM must be 3.3 V-compatible (XC17xxD or XC17xxE series); (3) Mixing LVTTL and LVCMOS I/O standards within the same VCCO bank - all I/Os in a single bank must use the same standard per XC3000L family rules; (4) Forgetting the decoupling capacitors on the VCCO pins adjacent to switching I/O groups - high-drive pins (24 mA sink) can inject noise into the supply; (5) Connecting a 5 V signal directly to a 3.3 V I/O pin without level shifting - 5 V tolerance is NOT specified on XC3000L parts. Use an external resistor divider or level shifter.

The XC3000L family does not publish a theta_JA for the TQG176 package, but typical estimates for a 176-pin TQFP at still air are 35-45 C/W. Estimated: at 50 MHz with 70% utilization and 3.3 V supply, the device draws approximately 100 mA, dissipating 0.33 W, yielding a junction temperature rise of approximately 12-15 C above ambient - well within the 0C to +85C commercial rating. For continuous 24/7 operation in an enclosed industrial cabinet, add a small copper heatsink or thermal via array to keep Tj below 70 C. Note: the obsolete lifecycle status means thermal data from the original datasheet family specification should be re-verified on each lot, since die revisions may vary.

معلومات الامتثال

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
خالٍ من الرصاص
Unknown
خالٍ من الهالوجين
Unknown
المعادن المتنازع عليها
Unknown

The XC3090L-7TQG176C is an obsolete Xilinx part manufactured in the 1990s. RoHS, REACH, lead-free, and halogen-free compliance data are not consistently tracked in the Xilinx product database for legacy parts. For new aerospace or medical designs requiring compliance certification, request a C of C and material declaration from the broker before procurement.

تم التحقق من البيانات في: 2026-09-13 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

عمليات بحث ذات صلة

XC3090L-7TQG176C datasheet Xilinx XC3090L FPGA XC3090L TQG176 pinout XC3000L low voltage FPGA XC3090L 5000 gate FPGA 3.3V XC3090L-7TQG176C replacement buy obsolete Xilinx XC3090L XC3090L-6TQG176C vs 7TQG176C XC3090L industrial temperature grade XC3000L configuration PROM XC17V Xilinx FPGA for legacy industrial PLC how to program XC3090L JTAG

المكونات والمصطلحات ذات الصلة

Xilinx XC3090L XC3090L-7TQG176C XC3090L-6TQG176C XC3090L-6TQG176I XC3090L-7TQ176C XC3090L-7TQ176I XC3000L XC3000 Field-Programmable Gate Array FPGA Configurable Logic Block CLB SRAM configuration memory JTAG IEEE 1149.1 TQFP TQG176 TQ176 3.3 V low-voltage FPGA boundary scan Xilinx iMPACT XC17xx configuration PROM XC1765D XC17128D XC17V04 industrial PLC ASIC prototyping DO-254 avionics VMEbus bridge 5,000 usable gates 100 CLBs 144 user I/Os
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