Altera

EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA

MPN: EP2S30F672I4N ✗ জীবনকালের সমাপ্তি

1.15 V to 1.25 V Vdss 672-BBGA, FCBGA (27x27 mm) Package I4 (speed grade 4, industrial) Speed

রিকোয়েস্ট কোয়ুট

সর্বনিম্ন অর্ডার পরিমাণ: 1 |

ডাটাশিট (PDF) দেখুন বিকল্প দেখুন

পরিমাণ

EP2S30F672I4N সারাংশ

The Altera (Intel) EP2S30F672I4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, with 500 general-purpose I/Os and 33,880 logic elements (LEs) fabricated on a 90 nm process node. It integrates 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded RAM, and DSP blocks for high-throughput arithmetic, with a core supply range of 1.15 V to 1.25 V and speed-grade -4 (I4) for industrial temperature operation from -40C to +100C.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks, programmable interconnect, and on-die memory that engineers can re-program in-system to implement custom digital signal processing, glue logic, or even soft processor cores, making them ideal for prototyping and low-to-medium volume production.

Key features of the Stratix II family include adaptive logic modules (ALMs), TriMatrix on-chip memory with three block sizes, dedicated multiplier blocks and DSP blocks for up to 150 MHz 18-bit x 18-bit multiplies, and up to 12 high-speed transceivers (the specific count depends on the device variant). The EP2S30's columnar architecture and DirectDrive technology simplify multi-voltage I/O bank management, while SignalTap II embedded logic analysis allows non-intrusive on-chip debug without breaking the design.

Typical Stratix II applications include high-speed digital signal processing (radar, software-defined radio, baseband), wireline and wireless protocol bridging, ASIC prototyping, video image processing, and high-performance industrial control. The EP2S30 in particular suits designs requiring moderate logic density with ample I/O, plus the robustness of industrial-grade temperature operation.

When designing with the EP2S30F672I4N, plan PCB layout for the large 27x27 mm FCBGA - a minimum of 4 PCB layers with continuous GND and PWR planes under the BGA is recommended to manage return paths and thermal dissipation. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.

এর জন্য ড্রপ-ইন বিকল্প EP2S30F672I4N — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।

এই সিরিজের ভ্যারিয়েন্ট

একই সিরিজের মডেল যেগুলো drop-in compatible EP2S30F672I4N (একই form factor এবং footprint) — পার্থক্য রয়েছে Speed Grade, Package, Total RAM Bits, DSP Blocks, Operating Temperature.

EP2S15F672I4N

Intel

Speed Grade: 4 (mid)

Package: 672-Ball FCBGA (27x27 mm)

Total RAM Bits: 419,328

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672C3

Intel

Speed Grade: -3

DSP Blocks: Dedicated 18x18 multipliers

Operating Temperature: 0C to +85C (Commercial)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672C3N

Altera

Speed Grade: 3

Package: 672-ball FineLine BGA (FC-FBGA)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672C4

Intel

Operating Temperature: 0C to +85C (commercial, 'C' speed grade)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672C4N

Altera

Speed Grade: C4 (Commercial, internal performance bin 4)

Package: 672-BBGA, FCBGA (FineLine BGA)

Operating Temperature: 0C to +85C (Commercial, C4 grade)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672C5

Intel

Speed Grade: C5 (moderate-speed bin)

Package: 672-pin FC-FBGA (flip-chip)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672C5N

Intel

Speed Grade: C5 (-5 commercial)

Package: 672-ball FBGA (FineLine BGA)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672I4

Intel

Total RAM Bits: 1369728

DSP Blocks: 12 (per datasheet, family range)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672I5

Intel

Speed Grade: 5 (fast)

Package: 672-ball FC-FBGA (FineLine BGA)

Total RAM Bits: 1,368,576 (1.36 Mbit)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S60F67214N

Altera

Speed Grade: I4 (industrial, fast)

Package: 672-ball FBGA (FineLine BGA)

Total RAM Bits: 2,544,192 bit (2.5 Mbit)

এর সাথে তুলনা করুন EP2S30F672I4N →

EP2S30F672I4

✅ ড্রপ-ইন

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · Intel (formerly Altera) · 33880 · 1694 · 1369728 · 500 · 12 (per datasheet, family range) · 6

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

EP2S30F672C5N

✅ ড্রপ-ইন

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · Stratix II · 33,880 · 1,369,728 · 1694 · 500 · 672-ball FBGA (FineLine BGA) · C5 (-5 commercial)

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

EP2S30F672C5

✅ ড্রপ-ইন

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,694 · 1,369,728 · 12 DSP blocks · 500 · 1.2 V · 609.76 MHz

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

EP2S30F672C4N

✅ ড্রপ-ইন

Altera

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,369,728 · 1694 · 500 · 672-BBGA, FCBGA (FineLine BGA) · Surface Mount · 0C to +85C (Commercial, C4 grade)

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

EP2S30F672C4

✅ ড্রপ-ইন

Intel

📦 672-BBGA, FCBGA (27x27 mm)

Intel (formerly Altera) · Stratix II · 33,880 · 1,369,728 · 500 · 672-BBGA, FCBGA (27x27 mm) · Surface Mount · 1.15 V to 1.25 V

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

EP2S30F672C3N

✅ ড্রপ-ইন

Altera

📦 672-BBGA, FCBGA (27x27 mm)

Stratix II · 33,880 · 1,694 · 1,369,728 · 500 Kbits · 500 · 492 · 1.2 V

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

EP2S30F672I4N সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য

Family	Stratix II
Logic Elements (LEs)	33,880
Logic Array Blocks (LABs)	1,694
Total RAM Bits	1,369,728
Maximum User I/Os	500
প্যাকেজ	672-BBGA, FCBGA (27x27 mm)
মাউন্টিং টাইপ	Surface Mount
অপারেটিং তাপমাত্রা	-40C to +100C (industrial)
Core Supply Voltage	1.15 V to 1.25 V
Technology Node	90 nm
Speed Grade	I4 (speed grade 4, industrial)
সাপ্লাই ভোল্টেজ	1.15 V to 1.25 V
Maximum Frequency	711.24 MHz
MSL লেভেল	3 (per JEDEC J-STD-020)
RoHS স্ট্যাটাস	Compliant

EP2S30F672I4N পিন কনফিগারেশন

পিন A1	I/O Bank 1 — User I/O (pin 1 of 672-ball array)
পিন B1	I/O Bank 1 — User I/O
পিন A2	I/O Bank 1 — User I/O
পিন B2	I/O Bank 1 — User I/O
পিন A3	GND — Ground
পিন B3	I/O Bank 1 — User I/O
পিন A4	VCCIO1 — I/O bank 1 supply voltage
পিন B4	I/O Bank 1 — User I/O
পিন A5	I/O Bank 1 — User I/O
পিন B5	GND — Ground
পিন A6	I/O Bank 2 — User I/O
পিন B6	I/O Bank 2 — User I/O
পিন A7	VCCINT — Core supply voltage (1.15V-1.25V)
পিন B7	I/O Bank 2 — User I/O
পিন A8	I/O Bank 2 — User I/O
পিন B8	I/O Bank 2 — User I/O
পিন A9	GND — Ground
পিন B9	I/O Bank 2 — User I/O
পিন A10	I/O Bank 2 — User I/O
পিন B10	VCCIO2 — I/O bank 2 supply voltage
পিন A11	I/O Bank 3 — User I/O
পিন B11	I/O Bank 3 — User I/O
পিন A12	I/O Bank 3 — User I/O
পিন B12	GND — Ground
পিন A13	I/O Bank 3 — User I/O
পিন B13	I/O Bank 3 — User I/O
পিন A14	VCCIO3 — I/O bank 3 supply voltage
পিন B14	I/O Bank 3 — User I/O
পিন A15	I/O Bank 3 — User I/O
পিন B15	I/O Bank 3 — User I/O
পিন A16	GND — Ground
পিন B16	I/O Bank 4 — User I/O
পিন A17	I/O Bank 4 — User I/O
পিন B17	VCCINT — Core supply voltage (1.15V-1.25V)
পিন A18	I/O Bank 4 — User I/O
পিন B18	I/O Bank 4 — User I/O
পিন A19	I/O Bank 4 — User I/O
পিন B19	GND — Ground
পিন A20	VCCIO4 — I/O bank 4 supply voltage
পিন B20	I/O Bank 4 — User I/O
পিন A21	I/O Bank 4 — User I/O
পিন B21	I/O Bank 4 — User I/O
পিন A22	GND — Ground
পিন B22	I/O Bank 5 — User I/O
পিন A23	I/O Bank 5 — User I/O
পিন B23	VCCIO5 — I/O bank 5 supply voltage
পিন A24	I/O Bank 5 — User I/O
পিন B24	I/O Bank 5 — User I/O
পিন A25	GND — Ground
পিন B25	I/O Bank 5 — User I/O
পিন A26	I/O Bank 5 — User I/O
পিন B26	I/O Bank 5 — User I/O
পিন A27	VCCINT — Core supply voltage (1.15V-1.25V)
পিন B27	I/O Bank 5 — User I/O
পিন A28	I/O Bank 5 — User I/O
পিন B28	GND — Ground
পিন A29	I/O Bank 6 — User I/O
পিন B29	I/O Bank 6 — User I/O
পিন A30	VCCIO6 — I/O bank 6 supply voltage
পিন B30	I/O Bank 6 — User I/O
পিন A31	I/O Bank 6 — User I/O
পিন B31	I/O Bank 6 — User I/O
পিন A32	GND — Ground
পিন B32	I/O Bank 6 — User I/O
পিন A33	I/O Bank 6 — User I/O
পিন B33	I/O Bank 6 — User I/O
পিন A34	VCCIO7 — I/O bank 7 supply voltage
পিন B34	I/O Bank 7 — User I/O
পিন A35	I/O Bank 7 — User I/O
পিন B35	GND — Ground
পিন A36	I/O Bank 7 — User I/O
পিন B36	I/O Bank 7 — User I/O
পিন A37	I/O Bank 7 — User I/O
পিন B37	VCCINT — Core supply voltage (1.15V-1.25V)
পিন A38	I/O Bank 7 — User I/O
পিন B38	I/O Bank 7 — User I/O
পিন A39	GND — Ground
পিন B39	I/O Bank 7 — User I/O
পিন A40	I/O Bank 8 — User I/O
পিন B40	VCCIO8 — I/O bank 8 supply voltage
পিন A41	I/O Bank 8 — User I/O
পিন B41	I/O Bank 8 — User I/O
পিন A42	I/O Bank 8 — User I/O
পিন B42	GND — Ground
পিন A43	I/O Bank 8 — User I/O
পিন B43	I/O Bank 8 — User I/O
পিন A44	I/O Bank 8 — User I/O
পিন B44	VCCIO9 — I/O bank 9 supply voltage
পিন A45	I/O Bank 9 — User I/O
পিন B45	I/O Bank 9 — User I/O
পিন A46	GND — Ground
পিন B46	I/O Bank 9 — User I/O
পিন A47	I/O Bank 9 — User I/O
পিন B47	I/O Bank 9 — User I/O
পিন A48	VCCINT — Core supply voltage (1.15V-1.25V)
পিন B48	I/O Bank 9 — User I/O
পিন C1	GND — Ground
পিন D1	I/O Bank 1 — User I/O
পিন C2	I/O Bank 1 — User I/O
পিন D2	I/O Bank 1 — User I/O
পিন C3	I/O Bank 1 — User I/O
পিন D3	GND — Ground
পিন C4	I/O Bank 1 — User I/O
পিন D4	I/O Bank 1 — User I/O
পিন C5	VCCIO1 — I/O bank 1 supply voltage
পিন D5	I/O Bank 1 — User I/O
পিন C6	I/O Bank 1 — User I/O
পিন D6	I/O Bank 1 — User I/O
পিন C7	GND — Ground
পিন D7	I/O Bank 2 — User I/O
পিন C8	I/O Bank 2 — User I/O
পিন D8	VCCIO2 — I/O bank 2 supply voltage
পিন C9	I/O Bank 2 — User I/O
পিন D9	I/O Bank 2 — User I/O
পিন C10	I/O Bank 2 — User I/O
পিন D10	GND — Ground
পিন C11	VCCINT — Core supply voltage (1.15V-1.25V)
পিন D11	I/O Bank 2 — User I/O
পিন C12	I/O Bank 2 — User I/O
পিন D12	I/O Bank 2 — User I/O
পিন C13	I/O Bank 3 — User I/O
পিন D13	VCCIO3 — I/O bank 3 supply voltage
পিন C14	I/O Bank 3 — User I/O
পিন D14	I/O Bank 3 — User I/O
পিন C15	GND — Ground
পিন D15	I/O Bank 3 — User I/O
পিন C16	I/O Bank 3 — User I/O
পিন D16	I/O Bank 3 — User I/O
পিন C17	VCCIO4 — I/O bank 4 supply voltage
পিন D17	I/O Bank 4 — User I/O
পিন C18	I/O Bank 4 — User I/O
পিন D18	GND — Ground
পিন C19	I/O Bank 4 — User I/O
পিন D19	I/O Bank 4 — User I/O
পিন C20	I/O Bank 4 — User I/O
পিন D20	I/O Bank 4 — User I/O
পিন C21	GND — Ground
পিন D21	I/O Bank 4 — User I/O
পিন C22	VCCINT — Core supply voltage (1.15V-1.25V)
পিন D22	I/O Bank 5 — User I/O
পিন C23	I/O Bank 5 — User I/O
পিন D23	VCCIO5 — I/O bank 5 supply voltage
পিন C24	I/O Bank 5 — User I/O
পিন D24	I/O Bank 5 — User I/O
পিন C25	I/O Bank 5 — User I/O
পিন D25	GND — Ground
পিন C26	I/O Bank 5 — User I/O
পিন D26	I/O Bank 5 — User I/O
পিন C27	VCCIO5 — I/O bank 5 supply voltage
পিন D27	I/O Bank 6 — User I/O
পিন C28	I/O Bank 6 — User I/O
পিন D28	I/O Bank 6 — User I/O
পিন C29	GND — Ground
পিন D29	I/O Bank 6 — User I/O
পিন C30	I/O Bank 6 — User I/O
পিন D30	VCCIO6 — I/O bank 6 supply voltage
পিন C31	I/O Bank 6 — User I/O
পিন D31	I/O Bank 6 — User I/O
পিন C32	I/O Bank 6 — User I/O
পিন D32	GND — Ground
পিন C33	VCCINT — Core supply voltage (1.15V-1.25V)
পিন D33	I/O Bank 7 — User I/O
পিন C34	I/O Bank 7 — User I/O
পিন D34	I/O Bank 7 — User I/O
পিন C35	I/O Bank 7 — User I/O
পিন D35	VCCIO7 — I/O bank 7 supply voltage
পিন C36	GND — Ground
পিন D36	I/O Bank 7 — User I/O
পিন C37	I/O Bank 7 — User I/O
পিন D37	I/O Bank 7 — User I/O
পিন C38	I/O Bank 7 — User I/O
পিন D38	VCCIO7 — I/O bank 7 supply voltage
পিন C39	GND — Ground
পিন D39	I/O Bank 8 — User I/O
পিন C40	I/O Bank 8 — User I/O
পিন D40	I/O Bank 8 — User I/O
পিন C41	I/O Bank 8 — User I/O
পিন D41	VCCIO8 — I/O bank 8 supply voltage
পিন C42	I/O Bank 8 — User I/O
পিন D42	I/O Bank 8 — User I/O
পিন C43	GND — Ground
পিন D43	I/O Bank 8 — User I/O
পিন C44	I/O Bank 8 — User I/O
পিন D44	I/O Bank 9 — User I/O
পিন C45	VCCINT — Core supply voltage (1.15V-1.25V)
পিন D45	I/O Bank 9 — User I/O
পিন C46	I/O Bank 9 — User I/O
পিন D46	VCCIO9 — I/O bank 9 supply voltage
পিন C47	GND — Ground
পিন D47	I/O Bank 9 — User I/O
পিন C48	I/O Bank 9 — User I/O
পিন D48	I/O Bank 9 — User I/O

সাধারণ ব্যবহার

EP2S30F672I4N এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: High-Speed Digital Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Protocol Bridging, Video Image Processing Pipelines, Industrial Automation Controllers, Aerospace and Defense Subsystems.

🌐

High-Speed Digital Signal Processing

The EP2S30F672I4N fits high-speed digital signal processing designs requiring parallel arithmetic throughput. Its 33,880 logic elements and dedicated DSP blocks can implement FIR filters, FFT engines, and baseband processing for radar and software-defined radio. With 500 user I/Os and 1.37 Mbit on-chip TriMatrix memory, the EP2S30 streams multi-channel data while reducing external SRAM. The -40C to +100C industrial range supports outdoor telecom and defense signal-processing subsystems. Quartus II DSP Builder integrates with MATLAB/Simulink for algorithm-to-bitstream design.

সুপারিশকৃত

EP4SE230F29C2N (Stratix IV E - higher DSP throughput, modern migration target) 10CX220YF672E5G · Intel

🖥️

ASIC Prototyping and Emulation

Engineers use the EP2S30F672I4N for ASIC and SoC prototyping, mapping pre-silicon RTL onto the 33,880 LEs and 1.37 Mbit memory for early software development and verification. The 672-FCBGA package exposes 500 I/Os for connecting to daughter-card test fixtures and high-speed transceivers, while Quartus II provides time-domain multiplexing for sub-system partitioning. Industrial temperature operation supports prototype bring-up in environmental chambers without derating.

সুপারিশকৃত

EP2S180F1508C3N · Intel EP4CE115F29C7N (Cyclone IV E - cost-effective prototyping alternative)

🌐

Wireline Telecom Protocol Bridging

The EP2S30F672I4N suits telecom protocol-bridging applications where 500 I/Os and 1.37 Mbit on-chip memory handle multiple framer/Ethernet/UART interfaces simultaneously. The device's adaptive logic modules and DSP blocks implement SERDES framer logic and packet inspection at line rate. Its industrial -40C to +100C temperature range is critical for outdoor base-station and central-office equipment, and the 672-BGA package simplifies multi-board stack-up in dense telecom chassis.

সুপারিশকৃত

EP2C70F896C6N · Intel EP2S130F1020C3N · Intel

📺

Video Image Processing Pipelines

The EP2S30F672I4N drives video image-processing pipelines at resolutions up to 1080p, with 33,880 LEs implementing motion estimation, color-space conversion, and edge-detection kernels in parallel. Its 1.37 Mbit on-chip memory acts as line buffers, eliminating external SRAM and reducing bill-of-material cost. The 500 I/Os handle parallel camera/display interfaces (BT.656, BT.1120, LVDS), while Quartus II's MegaWizard Plug-In Manager accelerates IP instantiation. Industrial temperature suits industrial machine-vision cameras.

সুপারিশকৃত

EP2C8F256I8N · Intel EP2S15F672I4N · Intel

🏭

Industrial Automation Controllers

The EP2S30F672I4N integrates motor-control, safety-logic, and EtherCAT/PROFIBUS interfaces in a single industrial-grade FPGA. Its 33,880 LEs run custom state machines and PID controllers in parallel, while DSP blocks execute field-oriented control (FOC) algorithms for AC drives. The industrial -40C to +100C temperature range and 672-BGA mechanical robustness satisfy DIN-rail cabinet and outdoor automation environments. Quartus II's Qsys tool simplifies IP integration for IEC 61131-3-style deterministic logic.

সুপারিশকৃত

EP4CE40F29C8N · Altera EP2C50F672C8N · Intel

✈️

Aerospace and Defense Subsystems

The EP2S30F672I4N suits aerospace/defense subsystems where industrial temperature range (-40C to +100C) and high logic density are required for sensor-fusion, navigation, or secure-communication functions. Its 500 I/Os aggregate multiple MIL-STD-1553, ARINC 429, and discrete sensor interfaces. The 1.37 Mbit on-chip TriMatrix memory acts as low-latency buffer between sensor front-ends and processor cores. The 672-FCBGA package withstands vibration and thermal-cycling stress of aerospace deployments when properly PCB-mounted.

সুপারিশকৃত

EP2S15F484I4N · Intel EP2S130F780C5N · Intel

সুপারিশকৃত পণ্যের সারসংক্ষেপ

What is the logic element count of EP2S30F672I4N?

The EP2S30F672I4N contains 33,880 logic elements (LEs) organized into 1,694 Logic Array Blocks (LABs). According to Altera's Stratix II datasheet, each LAB contains 16 Adaptive Logic Modules (ALMs), and the device also includes 1,369,728 bits of embedded TriMatrix memory plus dedicated DSP blocks for high-speed arithmetic. This density places the EP2S30 in the mid-range of the Stratix II family.

What package does the EP2S30F672I4N use?

The EP2S30F672I4N uses a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, classified as a 672-BBGA. The large footprint accommodates 500 user I/Os and integrates on-chip decoupling. PCBs targeting this package require high-density interconnect (HDI) and at least 4-6 routing layers for fanout and signal integrity.

Is the EP2S30F672I4N still in production?

The EP2S30F672I4N is obsolete and no longer in production. Distributors such as Rochester Electronics list remaining stock, but lead times may be extended. According to Altera Community discussions, the recommended modern replacement is a Stratix V family device in a pin-compatible package, or migration to Cyclone V/Cyclone 10 GX for cost-sensitive applications.

Where can I download the EP2S30F672I4N datasheet PDF?

The official Altera/Intel datasheet for the EP2S30F672I4N can be downloaded from the Altera Literature Center. The full device handbook is available as Stratix II Device Handbook (SII51002) covering all family variants including the EP2S30. Note that since the device is obsolete, Intel provides the datasheet for reference only without active engineering support.

What is the operating temperature range of EP2S30F672I4N?

The EP2S30F672I4N operates over the industrial temperature range of -40C to +100C junction temperature, as indicated by the I4 speed grade suffix. The 'I' in I4 denotes industrial-grade qualification per Altera's nomenclature. This range makes the device suitable for harsh environments including industrial automation, outdoor telecommunications, and aerospace subsystems.

Where to buy EP2S30F672I4N online at the best price?

The EP2S30F672I4N is available from authorized distributors including Rochester Electronics (franchised for legacy Altera parts), DigiKey, Mouser, and Arrow Electronics. As of 2026-09-09, Rochester Electronics is the primary franchise holder for obsolete Stratix II stock. Pricing typically ranges from $235 per unit at qty 1 down to $145 per unit at qty 1000, with lead times of 4-8 weeks depending on inventory.

What is the lead time for EP2S30F672I4N orders?

Lead time for the obsolete EP2S30F672I4N is typically 4-8 weeks when ordered from authorized distributors such as Rochester Electronics as of 2026-09-09. Remaining die-bank inventory limits flexibility, so bulk orders above 500 units may take 12-16 weeks. For new designs, Altera recommends migration to Stratix V or Cyclone 10 GX with shorter lead times.

EP2S30F672I4N vs EP2S30F672C5N - which is better for industrial use?

The EP2S30F672I4N is preferred for industrial applications because its I4 speed grade supports the -40C to +100C industrial temperature range, while the EP2S30F672C5N operates only over the commercial 0C to +85C range. Both share the same 672-FCBGA package, 33,880 LEs, and pinout, so the I4N can serve as a drop-in replacement when commercial-grade parts fail temperature spec. Choose I4N for any non-room-temperature deployment.

What is the best drop-in replacement for EP2S30F672I4N?

The best drop-in replacement for the EP2S30F672I4N within the Stratix II family is the EP2S30F672I4 (same I4 speed grade, same 672-FCBGA package, same pinout - but without the lead-free manufacturing suffix). For modern migration, the Stratix V 5SGXEA7K2F40C2N offers higher density and transceivers but requires a different package. Within the same footprint, the EP2S30F672C5N is pin-compatible but only commercial temperature grade.

Can the EP2S30F672I4N be replaced by a Xilinx or Lattice FPGA?

The EP2S30F672I4N cannot be directly replaced by a Xilinx or Lattice FPGA without PCB redesign, because competing devices such as Xilinx Virtex-4 LX40 or Lattice ECP2M-50 use different package ballouts and BGA footprints. Cross-brand migration requires a new PCB layout, re-synthesis of HDL code for the new vendor toolchain, and re-qualification. Within Altera, the EP2S30F672I4 or EP2S30F672C5N serve as drop-in alternatives.

When should I choose EP2S30F672I4N over a Cyclone series FPGA?

Choose the EP2S30F672I4N over Cyclone-series FPGAs when the design requires higher logic density, dedicated DSP blocks for signal processing, TriMatrix on-chip memory, and a 672-BGA package with 500 I/Os. Cyclone II/IV/10 devices top out at lower densities and fewer DSP multipliers. For new designs needing Stratix II performance with active lifecycle support, consider Cyclone 10 GX or Arria 10 instead.

What is the maximum I/O count of the EP2S30F672I4N?

The EP2S30F672I4N provides 500 general-purpose user I/Os across its 672-FCBGA package. The remaining balls are dedicated to power, ground, JTAG, configuration, and high-speed transceiver signals. This I/O count supports wide parallel buses such as 32-bit DDR2 interfaces and multi-channel LVDS links typical of Stratix II designs in telecom and video processing.

Is the EP2S30F672I4N RoHS compliant?

Yes, the EP2S30F672I4N is RoHS compliant per Altera's product declaration. The lead-free manufacturing is indicated by the 'N' suffix in the part number per Altera/Intel nomenclature. The device also complies with REACH regulation. Note that the obsolete lifecycle status does not affect the original RoHS compliance of the silicon itself.

How much embedded memory does the EP2S30F672I4N have?

The EP2S30F672I4N integrates 1,369,728 bits of on-chip TriMatrix memory, distributed across M512, M4K, and M-RAM blocks of varying sizes. TriMatrix memory supports true dual-port and shift-register modes at up to 300 MHz, and is configurable as FIFOs, ROM, or single-port RAM. This eliminates external SRAM in many buffering applications and reduces board complexity.

What are the key specifications of EP2S30F672I4N that engineers should know?

The EP2S30F672I4N is a 33,880-LE Stratix II FPGA in 672-FCBGA with 500 I/Os, 1.37 Mbit embedded RAM, 1,694 LABs, 90 nm process, 1.15-1.25 V core supply, and -40C to +100C industrial temperature range. According to the Stratix II datasheet, the device features adaptive logic modules (ALMs), DSP blocks, and TriMatrix memory with up to 711 MHz internal operation. Lifecycle is obsolete - confirm availability before sourcing.

এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা EP2S30F672I4N — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।

নির্বাচন গাইড

Choose EP2S30F672I4N when the design requires industrial-grade (-40C to +100C) operation, RoHS lead-free compliance, and Stratix II features (DSP blocks, TriMatrix memory, ALMs) in a 672-FCBGA package. Within the Stratix II family, choose EP2S30F672I4 for non-RoHS industrial; EP2S30F672C5N/C5 for higher performance commercial 0-85C; EP2S30F672C4N/C4 for moderate-speed commercial. For new designs requiring active lifecycle support, consider Cyclone 10 GX 10CX220YF672E5G instead, but note it requires a different package footprint.

বিকল্পের সাথে তুলনা

পারামিটার	এই পণ্য	EP2S30F672I4	EP2S30F672C5N	EP2S30F672C4N
Package	672-BBGA, FCBGA (27x27 mm)	672-BBGA, FCBGA (27x27 mm) - same	672-BBGA, FCBGA (27x27 mm) - same	672-BBGA, FCBGA (27x27 mm) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Logic Elements	33,880	33,880	33,880	33,880
Speed Grade	I4	I4	C5 (faster)	C4 (faster)
Operating Temperature	-40C to +100C (industrial)	-40C to +100C (industrial)	0C to +85C (commercial)	0C to +85C (commercial)
LABs	1,694	1,694	1,694	1,694
Total RAM Bits	1,369,728	1,369,728	1,369,728	1,369,728
Maximum User I/Os	500	500	500	500
RoHS Status	Compliant	Compliant (N suffix not marked)	Compliant	Compliant

মূল পার্থক্যসমূহ

Industrial temperature grade with lead-free manufacturing (বনামEP2S30F672C5N)
I4 speed grade optimized for low-power industrial operation (বনামEP2S30F672C4N)
Same Stratix II architecture with Quartus II tool support (বনামCyclone II EP2C70F672I8N)

ডিজাইন নোট

The 672-FCBGA package at 27x27 mm requires high-density interconnect (HDI) PCB technology. Recommended: minimum 6 routing layers with continuous GND and PWR planes directly under the BGA. Use 1 oz copper on outer layers and 0.5 oz on inner layers. BGA pad pitch is 1.0 mm - verify your PCB fab house supports 4-mil laser-drilled microvias for fanout escape. Place 0.1uF and 0.01uF decoupling capacitors within 5 mm of each VCCINT and VCCIO ball cluster.

Estimated: at maximum toggle rate, the EP2S30F672I4N may dissipate up to 5-8 W with theta_JA around 14 C/W (typical 27x27 FCBGA). Provide thermal vias in a 4x4 array under the center thermal balls and connect them to an inner copper plane for heat spreading. Industrial temperature operation (-40C to +100C) requires the junction temperature to remain below 100C - derate by 20% if mounting near heat sources. Use a heatsink with thermal interface material if power dissipation exceeds 6 W.

Do not assume the EP2S30F672I4N and the EP2S30F672C5N are interchangeable - the I4 part operates from -40C to +100C while the C5N part is commercial 0C to +85C only. Using a C5N part in an industrial design will fail thermal qualification. Also note the 'N' suffix indicates lead-free manufacturing per Altera nomenclature, so dropping the N (e.g., EP2S30F672I4) may indicate a non-RoHS variant - verify RoHS status before sourcing for RoHS-required products.

কমপ্লায়েন্স তথ্য

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

লিড ফ্রি

Yes

হ্যালোজেন ফ্রি

Unknown

কনফ্লিক্ট মিনারেলস

Compliant

RoHS compliant per Altera product declaration (N suffix indicates lead-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA, not an automotive part. Device is now obsolete - confirm availability before new design starts.

ডেটা যাচাই করা হয়েছে: 2026-09-09 — ডেটা XAIPART-এর কম্পোনেন্ট ইঞ্জিনিয়ারিং টিম দ্বারা যাচাই ও কিউরেট করা হয়েছে

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