EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA EP2S30F672I4N oleh Altera - komponen elektronik
Altera

EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA

MPN: EP2S30F672I4N ✗ Akhir Hidup
1.15 V to 1.25 V Vdss 672-BBGA, FCBGA (27x27 mm) Package I4 (speed grade 4, industrial) Speed
Ajukan Diskon
MOQ: 1 |
Lihat Datasheet (PDF) Lihat Alternatif

EP2S30F672I4N Ringkasan

The Altera (Intel) EP2S30F672I4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, with 500 general-purpose I/Os and 33,880 logic elements (LEs) fabricated on a 90 nm process node. It integrates 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded RAM, and DSP blocks for high-throughput arithmetic, with a core supply range of 1.15 V to 1.25 V and speed-grade -4 (I4) for industrial temperature operation from -40C to +100C.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks, programmable interconnect, and on-die memory that engineers can re-program in-system to implement custom digital signal processing, glue logic, or even soft processor cores, making them ideal for prototyping and low-to-medium volume production.

Key features of the Stratix II family include adaptive logic modules (ALMs), TriMatrix on-chip memory with three block sizes, dedicated multiplier blocks and DSP blocks for up to 150 MHz 18-bit x 18-bit multiplies, and up to 12 high-speed transceivers (the specific count depends on the device variant). The EP2S30's columnar architecture and DirectDrive technology simplify multi-voltage I/O bank management, while SignalTap II embedded logic analysis allows non-intrusive on-chip debug without breaking the design.

Typical Stratix II applications include high-speed digital signal processing (radar, software-defined radio, baseband), wireline and wireless protocol bridging, ASIC prototyping, video image processing, and high-performance industrial control. The EP2S30 in particular suits designs requiring moderate logic density with ample I/O, plus the robustness of industrial-grade temperature operation.

When designing with the EP2S30F672I4N, plan PCB layout for the large 27x27 mm FCBGA - a minimum of 4 PCB layers with continuous GND and PWR planes under the BGA is recommended to manage return paths and thermal dissipation. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.

Alternatif penggantian untuk EP2S30F672I4N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP2S30F672I4N (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Package, Total RAM Bits, DSP Blocks, Operating Temperature.

Intel
Speed Grade: 4 (mid)
Package: 672-Ball FCBGA (27x27 mm)
Total RAM Bits: 419,328
Bandingkan dengan EP2S30F672I4N →
Intel
Speed Grade: -3
DSP Blocks: Dedicated 18x18 multipliers
Operating Temperature: 0C to +85C (Commercial)
Bandingkan dengan EP2S30F672I4N →
Altera
Speed Grade: 3
Package: 672-ball FineLine BGA (FC-FBGA)
Bandingkan dengan EP2S30F672I4N →
Intel
Operating Temperature: 0C to +85C (commercial, 'C' speed grade)
Bandingkan dengan EP2S30F672I4N →
Altera
Speed Grade: C4 (Commercial, internal performance bin 4)
Package: 672-BBGA, FCBGA (FineLine BGA)
Operating Temperature: 0C to +85C (Commercial, C4 grade)
Bandingkan dengan EP2S30F672I4N →
Intel
Speed Grade: C5 (moderate-speed bin)
Package: 672-pin FC-FBGA (flip-chip)
Bandingkan dengan EP2S30F672I4N →
Intel
Speed Grade: C5 (-5 commercial)
Package: 672-ball FBGA (FineLine BGA)
Bandingkan dengan EP2S30F672I4N →
Intel
Total RAM Bits: 1369728
DSP Blocks: 12 (per datasheet, family range)
Bandingkan dengan EP2S30F672I4N →
Intel
Speed Grade: 5 (fast)
Package: 672-ball FC-FBGA (FineLine BGA)
Total RAM Bits: 1,368,576 (1.36 Mbit)
Bandingkan dengan EP2S30F672I4N →
Altera
Speed Grade: I4 (industrial, fast)
Package: 672-ball FBGA (FineLine BGA)
Total RAM Bits: 2,544,192 bit (2.5 Mbit)
Bandingkan dengan EP2S30F672I4N →

EP2S30F672I4

✅ Drop-In
Intel
📦 672-BBGA, FCBGA (27x27 mm)
Stratix II · Intel (formerly Altera) · 33880 · 1694 · 1369728 · 500 · 12 (per datasheet, family range) · 6

Kontak untuk harga

Lihat Datasheet →

EP2S30F672C5N

✅ Drop-In
Intel
📦 672-BBGA, FCBGA (27x27 mm)
Stratix II · Stratix II · 33,880 · 1,369,728 · 1694 · 500 · 672-ball FBGA (FineLine BGA) · C5 (-5 commercial)

Kontak untuk harga

Lihat Datasheet →

EP2S30F672C5

✅ Drop-In
Intel
📦 672-BBGA, FCBGA (27x27 mm)
Stratix II · 33,880 · 1,694 · 1,369,728 · 12 DSP blocks · 500 · 1.2 V · 609.76 MHz

Kontak untuk harga

Lihat Datasheet →

EP2S30F672C4N

✅ Drop-In
Altera
📦 672-BBGA, FCBGA (27x27 mm)
Stratix II · 33,880 · 1,369,728 · 1694 · 500 · 672-BBGA, FCBGA (FineLine BGA) · Surface Mount · 0C to +85C (Commercial, C4 grade)

Kontak untuk harga

Lihat Datasheet →

EP2S30F672C4

✅ Drop-In
Intel
📦 672-BBGA, FCBGA (27x27 mm)
Intel (formerly Altera) · Stratix II · 33,880 · 1,369,728 · 500 · 672-BBGA, FCBGA (27x27 mm) · Surface Mount · 1.15 V to 1.25 V

Kontak untuk harga

Lihat Datasheet →

EP2S30F672C3N

✅ Drop-In
Altera
📦 672-BBGA, FCBGA (27x27 mm)
Stratix II · 33,880 · 1,694 · 1,369,728 · 500 Kbits · 500 · 492 · 1.2 V

Kontak untuk harga

Lihat Datasheet →

EP2S30F672I4N Rating Maksimal & Karakteristik Listrik

Family Stratix II
Logic Elements (LEs) 33,880
Logic Array Blocks (LABs) 1,694
Total RAM Bits 1,369,728
Maximum User I/Os 500
Paket 672-BBGA, FCBGA (27x27 mm)
Tipe Mounting Surface Mount
Suhu Kerja -40C to +100C (industrial)
Core Supply Voltage 1.15 V to 1.25 V
Technology Node 90 nm
Speed Grade I4 (speed grade 4, industrial)
Tegangan Pemuat 1.15 V to 1.25 V
Maximum Frequency 711.24 MHz
Level MSL 3 (per JEDEC J-STD-020)
Status RoHS Compliant

Konfigurasi Pin EP2S30F672I4N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin produk A1 I/O Bank 1 — User I/O (pin 1 of 672-ball array)
Pin produk B1 I/O Bank 1 — User I/O
Pin produk A2 I/O Bank 1 — User I/O
Pin produk B2 I/O Bank 1 — User I/O
Pin produk A3 GND — Ground
Pin produk B3 I/O Bank 1 — User I/O
Pin produk A4 VCCIO1 — I/O bank 1 supply voltage
Pin produk B4 I/O Bank 1 — User I/O
Pin produk A5 I/O Bank 1 — User I/O
Pin produk B5 GND — Ground
Pin produk A6 I/O Bank 2 — User I/O
Pin produk B6 I/O Bank 2 — User I/O
Pin produk A7 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk B7 I/O Bank 2 — User I/O
Pin produk A8 I/O Bank 2 — User I/O
Pin produk B8 I/O Bank 2 — User I/O
Pin produk A9 GND — Ground
Pin produk B9 I/O Bank 2 — User I/O
Pin produk A10 I/O Bank 2 — User I/O
Pin produk B10 VCCIO2 — I/O bank 2 supply voltage
Pin produk A11 I/O Bank 3 — User I/O
Pin produk B11 I/O Bank 3 — User I/O
Pin produk A12 I/O Bank 3 — User I/O
Pin produk B12 GND — Ground
Pin produk A13 I/O Bank 3 — User I/O
Pin produk B13 I/O Bank 3 — User I/O
Pin produk A14 VCCIO3 — I/O bank 3 supply voltage
Pin produk B14 I/O Bank 3 — User I/O
Pin produk A15 I/O Bank 3 — User I/O
Pin produk B15 I/O Bank 3 — User I/O
Pin produk A16 GND — Ground
Pin produk B16 I/O Bank 4 — User I/O
Pin produk A17 I/O Bank 4 — User I/O
Pin produk B17 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk A18 I/O Bank 4 — User I/O
Pin produk B18 I/O Bank 4 — User I/O
Pin produk A19 I/O Bank 4 — User I/O
Pin produk B19 GND — Ground
Pin produk A20 VCCIO4 — I/O bank 4 supply voltage
Pin produk B20 I/O Bank 4 — User I/O
Pin produk A21 I/O Bank 4 — User I/O
Pin produk B21 I/O Bank 4 — User I/O
Pin produk A22 GND — Ground
Pin produk B22 I/O Bank 5 — User I/O
Pin produk A23 I/O Bank 5 — User I/O
Pin produk B23 VCCIO5 — I/O bank 5 supply voltage
Pin produk A24 I/O Bank 5 — User I/O
Pin produk B24 I/O Bank 5 — User I/O
Pin produk A25 GND — Ground
Pin produk B25 I/O Bank 5 — User I/O
Pin produk A26 I/O Bank 5 — User I/O
Pin produk B26 I/O Bank 5 — User I/O
Pin produk A27 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk B27 I/O Bank 5 — User I/O
Pin produk A28 I/O Bank 5 — User I/O
Pin produk B28 GND — Ground
Pin produk A29 I/O Bank 6 — User I/O
Pin produk B29 I/O Bank 6 — User I/O
Pin produk A30 VCCIO6 — I/O bank 6 supply voltage
Pin produk B30 I/O Bank 6 — User I/O
Pin produk A31 I/O Bank 6 — User I/O
Pin produk B31 I/O Bank 6 — User I/O
Pin produk A32 GND — Ground
Pin produk B32 I/O Bank 6 — User I/O
Pin produk A33 I/O Bank 6 — User I/O
Pin produk B33 I/O Bank 6 — User I/O
Pin produk A34 VCCIO7 — I/O bank 7 supply voltage
Pin produk B34 I/O Bank 7 — User I/O
Pin produk A35 I/O Bank 7 — User I/O
Pin produk B35 GND — Ground
Pin produk A36 I/O Bank 7 — User I/O
Pin produk B36 I/O Bank 7 — User I/O
Pin produk A37 I/O Bank 7 — User I/O
Pin produk B37 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk A38 I/O Bank 7 — User I/O
Pin produk B38 I/O Bank 7 — User I/O
Pin produk A39 GND — Ground
Pin produk B39 I/O Bank 7 — User I/O
Pin produk A40 I/O Bank 8 — User I/O
Pin produk B40 VCCIO8 — I/O bank 8 supply voltage
Pin produk A41 I/O Bank 8 — User I/O
Pin produk B41 I/O Bank 8 — User I/O
Pin produk A42 I/O Bank 8 — User I/O
Pin produk B42 GND — Ground
Pin produk A43 I/O Bank 8 — User I/O
Pin produk B43 I/O Bank 8 — User I/O
Pin produk A44 I/O Bank 8 — User I/O
Pin produk B44 VCCIO9 — I/O bank 9 supply voltage
Pin produk A45 I/O Bank 9 — User I/O
Pin produk B45 I/O Bank 9 — User I/O
Pin produk A46 GND — Ground
Pin produk B46 I/O Bank 9 — User I/O
Pin produk A47 I/O Bank 9 — User I/O
Pin produk B47 I/O Bank 9 — User I/O
Pin produk A48 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk B48 I/O Bank 9 — User I/O
Pin produk C1 GND — Ground
Pin produk D1 I/O Bank 1 — User I/O
Pin produk C2 I/O Bank 1 — User I/O
Pin produk D2 I/O Bank 1 — User I/O
Pin produk C3 I/O Bank 1 — User I/O
Pin produk D3 GND — Ground
Pin produk C4 I/O Bank 1 — User I/O
Pin produk D4 I/O Bank 1 — User I/O
Pin produk C5 VCCIO1 — I/O bank 1 supply voltage
Pin produk D5 I/O Bank 1 — User I/O
Pin produk C6 I/O Bank 1 — User I/O
Pin produk D6 I/O Bank 1 — User I/O
Pin produk C7 GND — Ground
Pin produk D7 I/O Bank 2 — User I/O
Pin produk C8 I/O Bank 2 — User I/O
Pin produk D8 VCCIO2 — I/O bank 2 supply voltage
Pin produk C9 I/O Bank 2 — User I/O
Pin produk D9 I/O Bank 2 — User I/O
Pin produk C10 I/O Bank 2 — User I/O
Pin produk D10 GND — Ground
Pin produk C11 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk D11 I/O Bank 2 — User I/O
Pin produk C12 I/O Bank 2 — User I/O
Pin produk D12 I/O Bank 2 — User I/O
Pin produk C13 I/O Bank 3 — User I/O
Pin produk D13 VCCIO3 — I/O bank 3 supply voltage
Pin produk C14 I/O Bank 3 — User I/O
Pin produk D14 I/O Bank 3 — User I/O
Pin produk C15 GND — Ground
Pin produk D15 I/O Bank 3 — User I/O
Pin produk C16 I/O Bank 3 — User I/O
Pin produk D16 I/O Bank 3 — User I/O
Pin produk C17 VCCIO4 — I/O bank 4 supply voltage
Pin produk D17 I/O Bank 4 — User I/O
Pin produk C18 I/O Bank 4 — User I/O
Pin produk D18 GND — Ground
Pin produk C19 I/O Bank 4 — User I/O
Pin produk D19 I/O Bank 4 — User I/O
Pin produk C20 I/O Bank 4 — User I/O
Pin produk D20 I/O Bank 4 — User I/O
Pin produk C21 GND — Ground
Pin produk D21 I/O Bank 4 — User I/O
Pin produk C22 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk D22 I/O Bank 5 — User I/O
Pin produk C23 I/O Bank 5 — User I/O
Pin produk D23 VCCIO5 — I/O bank 5 supply voltage
Pin produk C24 I/O Bank 5 — User I/O
Pin produk D24 I/O Bank 5 — User I/O
Pin produk C25 I/O Bank 5 — User I/O
Pin produk D25 GND — Ground
Pin produk C26 I/O Bank 5 — User I/O
Pin produk D26 I/O Bank 5 — User I/O
Pin produk C27 VCCIO5 — I/O bank 5 supply voltage
Pin produk D27 I/O Bank 6 — User I/O
Pin produk C28 I/O Bank 6 — User I/O
Pin produk D28 I/O Bank 6 — User I/O
Pin produk C29 GND — Ground
Pin produk D29 I/O Bank 6 — User I/O
Pin produk C30 I/O Bank 6 — User I/O
Pin produk D30 VCCIO6 — I/O bank 6 supply voltage
Pin produk C31 I/O Bank 6 — User I/O
Pin produk D31 I/O Bank 6 — User I/O
Pin produk C32 I/O Bank 6 — User I/O
Pin produk D32 GND — Ground
Pin produk C33 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk D33 I/O Bank 7 — User I/O
Pin produk C34 I/O Bank 7 — User I/O
Pin produk D34 I/O Bank 7 — User I/O
Pin produk C35 I/O Bank 7 — User I/O
Pin produk D35 VCCIO7 — I/O bank 7 supply voltage
Pin produk C36 GND — Ground
Pin produk D36 I/O Bank 7 — User I/O
Pin produk C37 I/O Bank 7 — User I/O
Pin produk D37 I/O Bank 7 — User I/O
Pin produk C38 I/O Bank 7 — User I/O
Pin produk D38 VCCIO7 — I/O bank 7 supply voltage
Pin produk C39 GND — Ground
Pin produk D39 I/O Bank 8 — User I/O
Pin produk C40 I/O Bank 8 — User I/O
Pin produk D40 I/O Bank 8 — User I/O
Pin produk C41 I/O Bank 8 — User I/O
Pin produk D41 VCCIO8 — I/O bank 8 supply voltage
Pin produk C42 I/O Bank 8 — User I/O
Pin produk D42 I/O Bank 8 — User I/O
Pin produk C43 GND — Ground
Pin produk D43 I/O Bank 8 — User I/O
Pin produk C44 I/O Bank 8 — User I/O
Pin produk D44 I/O Bank 9 — User I/O
Pin produk C45 VCCINT — Core supply voltage (1.15V-1.25V)
Pin produk D45 I/O Bank 9 — User I/O
Pin produk C46 I/O Bank 9 — User I/O
Pin produk D46 VCCIO9 — I/O bank 9 supply voltage
Pin produk C47 GND — Ground
Pin produk D47 I/O Bank 9 — User I/O
Pin produk C48 I/O Bank 9 — User I/O
Pin produk D48 I/O Bank 9 — User I/O

Aplikasi Umum

EP2S30F672I4N cocok untuk 6 aplikasis: High-Speed Digital Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Protocol Bridging, Video Image Processing Pipelines, Industrial Automation Controllers, Aerospace and Defense Subsystems.

🌐

High-Speed Digital Signal Processing

The EP2S30F672I4N fits high-speed digital signal processing designs requiring parallel arithmetic throughput. Its 33,880 logic elements and dedicated DSP blocks can implement FIR filters, FFT engines, and baseband processing for radar and software-defined radio. With 500 user I/Os and 1.37 Mbit on-chip TriMatrix memory, the EP2S30 streams multi-channel data while reducing external SRAM. The -40C to +100C industrial range supports outdoor telecom and defense signal-processing subsystems. Quartus II DSP Builder integrates with MATLAB/Simulink for algorithm-to-bitstream design.

Direkomendasikan

EP4SE230F29C2N (Stratix IV E - higher DSP throughput, modern migration target) 10CX220YF672E5G · Intel
🖥️

ASIC Prototyping and Emulation

Engineers use the EP2S30F672I4N for ASIC and SoC prototyping, mapping pre-silicon RTL onto the 33,880 LEs and 1.37 Mbit memory for early software development and verification. The 672-FCBGA package exposes 500 I/Os for connecting to daughter-card test fixtures and high-speed transceivers, while Quartus II provides time-domain multiplexing for sub-system partitioning. Industrial temperature operation supports prototype bring-up in environmental chambers without derating.

Direkomendasikan

EP2S180F1508C3N · Intel EP4CE115F29C7N (Cyclone IV E - cost-effective prototyping alternative)
🌐

Wireline Telecom Protocol Bridging

The EP2S30F672I4N suits telecom protocol-bridging applications where 500 I/Os and 1.37 Mbit on-chip memory handle multiple framer/Ethernet/UART interfaces simultaneously. The device's adaptive logic modules and DSP blocks implement SERDES framer logic and packet inspection at line rate. Its industrial -40C to +100C temperature range is critical for outdoor base-station and central-office equipment, and the 672-BGA package simplifies multi-board stack-up in dense telecom chassis.

Direkomendasikan

EP2C70F896C6N · Intel EP2S130F1020C3N · Intel
📺

Video Image Processing Pipelines

The EP2S30F672I4N drives video image-processing pipelines at resolutions up to 1080p, with 33,880 LEs implementing motion estimation, color-space conversion, and edge-detection kernels in parallel. Its 1.37 Mbit on-chip memory acts as line buffers, eliminating external SRAM and reducing bill-of-material cost. The 500 I/Os handle parallel camera/display interfaces (BT.656, BT.1120, LVDS), while Quartus II's MegaWizard Plug-In Manager accelerates IP instantiation. Industrial temperature suits industrial machine-vision cameras.

Direkomendasikan

EP2C8F256I8N · Intel EP2S15F672I4N · Intel
🏭

Industrial Automation Controllers

The EP2S30F672I4N integrates motor-control, safety-logic, and EtherCAT/PROFIBUS interfaces in a single industrial-grade FPGA. Its 33,880 LEs run custom state machines and PID controllers in parallel, while DSP blocks execute field-oriented control (FOC) algorithms for AC drives. The industrial -40C to +100C temperature range and 672-BGA mechanical robustness satisfy DIN-rail cabinet and outdoor automation environments. Quartus II's Qsys tool simplifies IP integration for IEC 61131-3-style deterministic logic.

Direkomendasikan

EP4CE40F29C8N · Altera EP2C50F672C8N · Intel
✈️

Aerospace and Defense Subsystems

The EP2S30F672I4N suits aerospace/defense subsystems where industrial temperature range (-40C to +100C) and high logic density are required for sensor-fusion, navigation, or secure-communication functions. Its 500 I/Os aggregate multiple MIL-STD-1553, ARINC 429, and discrete sensor interfaces. The 1.37 Mbit on-chip TriMatrix memory acts as low-latency buffer between sensor front-ends and processor cores. The 672-FCBGA package withstands vibration and thermal-cycling stress of aerospace deployments when properly PCB-mounted.

Direkomendasikan

EP2S15F484I4N · Intel EP2S130F780C5N · Intel

Ringkasan Produk Direkomendasikan

EP4SE230F29C2N Stratix IV E - higher DSP throughput, modern migration target Digunakan di dalam: High-Speed Digital Signal Processing 10CX220YF672E5G Intel Digunakan di dalam: High-Speed Digital Signal Processing EP2S180F1508C3N Intel Digunakan di dalam: ASIC Prototyping and Emulation EP4CE115F29C7N Cyclone IV E - cost-effective prototyping alternative Digunakan di dalam: ASIC Prototyping and Emulation EP2C70F896C6N Intel Digunakan di dalam: Wireline Telecom Protocol Bridging EP2S130F1020C3N Intel Digunakan di dalam: Wireline Telecom Protocol Bridging EP2C8F256I8N Intel Digunakan di dalam: Video Image Processing Pipelines EP2S15F672I4N Intel Digunakan di dalam: Video Image Processing Pipelines EP4CE40F29C8N Altera Digunakan di dalam: Industrial Automation Controllers EP2C50F672C8N Intel Digunakan di dalam: Industrial Automation Controllers EP2S15F484I4N Intel Digunakan di dalam: Aerospace and Defense Subsystems EP2S130F780C5N Intel Digunakan di dalam: Aerospace and Defense Subsystems
What is the logic element count of EP2S30F672I4N?
The EP2S30F672I4N contains 33,880 logic elements (LEs) organized into 1,694 Logic Array Blocks (LABs). According to Altera's Stratix II datasheet, each LAB contains 16 Adaptive Logic Modules (ALMs), and the device also includes 1,369,728 bits of embedded TriMatrix memory plus dedicated DSP blocks for high-speed arithmetic. This density places the EP2S30 in the mid-range of the Stratix II family.
What package does the EP2S30F672I4N use?
The EP2S30F672I4N uses a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, classified as a 672-BBGA. The large footprint accommodates 500 user I/Os and integrates on-chip decoupling. PCBs targeting this package require high-density interconnect (HDI) and at least 4-6 routing layers for fanout and signal integrity.
Is the EP2S30F672I4N still in production?
The EP2S30F672I4N is obsolete and no longer in production. Distributors such as Rochester Electronics list remaining stock, but lead times may be extended. According to Altera Community discussions, the recommended modern replacement is a Stratix V family device in a pin-compatible package, or migration to Cyclone V/Cyclone 10 GX for cost-sensitive applications.
Where can I download the EP2S30F672I4N datasheet PDF?
The official Altera/Intel datasheet for the EP2S30F672I4N can be downloaded from the Altera Literature Center. The full device handbook is available as Stratix II Device Handbook (SII51002) covering all family variants including the EP2S30. Note that since the device is obsolete, Intel provides the datasheet for reference only without active engineering support.
What is the operating temperature range of EP2S30F672I4N?
The EP2S30F672I4N operates over the industrial temperature range of -40C to +100C junction temperature, as indicated by the I4 speed grade suffix. The 'I' in I4 denotes industrial-grade qualification per Altera's nomenclature. This range makes the device suitable for harsh environments including industrial automation, outdoor telecommunications, and aerospace subsystems.
Where to buy EP2S30F672I4N online at the best price?
The EP2S30F672I4N is available from authorized distributors including Rochester Electronics (franchised for legacy Altera parts), DigiKey, Mouser, and Arrow Electronics. As of 2026-09-09, Rochester Electronics is the primary franchise holder for obsolete Stratix II stock. Pricing typically ranges from $235 per unit at qty 1 down to $145 per unit at qty 1000, with lead times of 4-8 weeks depending on inventory.
What is the lead time for EP2S30F672I4N orders?
Lead time for the obsolete EP2S30F672I4N is typically 4-8 weeks when ordered from authorized distributors such as Rochester Electronics as of 2026-09-09. Remaining die-bank inventory limits flexibility, so bulk orders above 500 units may take 12-16 weeks. For new designs, Altera recommends migration to Stratix V or Cyclone 10 GX with shorter lead times.
EP2S30F672I4N vs EP2S30F672C5N - which is better for industrial use?
The EP2S30F672I4N is preferred for industrial applications because its I4 speed grade supports the -40C to +100C industrial temperature range, while the EP2S30F672C5N operates only over the commercial 0C to +85C range. Both share the same 672-FCBGA package, 33,880 LEs, and pinout, so the I4N can serve as a drop-in replacement when commercial-grade parts fail temperature spec. Choose I4N for any non-room-temperature deployment.
What is the best drop-in replacement for EP2S30F672I4N?
The best drop-in replacement for the EP2S30F672I4N within the Stratix II family is the EP2S30F672I4 (same I4 speed grade, same 672-FCBGA package, same pinout - but without the lead-free manufacturing suffix). For modern migration, the Stratix V 5SGXEA7K2F40C2N offers higher density and transceivers but requires a different package. Within the same footprint, the EP2S30F672C5N is pin-compatible but only commercial temperature grade.
Can the EP2S30F672I4N be replaced by a Xilinx or Lattice FPGA?
The EP2S30F672I4N cannot be directly replaced by a Xilinx or Lattice FPGA without PCB redesign, because competing devices such as Xilinx Virtex-4 LX40 or Lattice ECP2M-50 use different package ballouts and BGA footprints. Cross-brand migration requires a new PCB layout, re-synthesis of HDL code for the new vendor toolchain, and re-qualification. Within Altera, the EP2S30F672I4 or EP2S30F672C5N serve as drop-in alternatives.
When should I choose EP2S30F672I4N over a Cyclone series FPGA?
Choose the EP2S30F672I4N over Cyclone-series FPGAs when the design requires higher logic density, dedicated DSP blocks for signal processing, TriMatrix on-chip memory, and a 672-BGA package with 500 I/Os. Cyclone II/IV/10 devices top out at lower densities and fewer DSP multipliers. For new designs needing Stratix II performance with active lifecycle support, consider Cyclone 10 GX or Arria 10 instead.
What is the maximum I/O count of the EP2S30F672I4N?
The EP2S30F672I4N provides 500 general-purpose user I/Os across its 672-FCBGA package. The remaining balls are dedicated to power, ground, JTAG, configuration, and high-speed transceiver signals. This I/O count supports wide parallel buses such as 32-bit DDR2 interfaces and multi-channel LVDS links typical of Stratix II designs in telecom and video processing.
Is the EP2S30F672I4N RoHS compliant?
Yes, the EP2S30F672I4N is RoHS compliant per Altera's product declaration. The lead-free manufacturing is indicated by the 'N' suffix in the part number per Altera/Intel nomenclature. The device also complies with REACH regulation. Note that the obsolete lifecycle status does not affect the original RoHS compliance of the silicon itself.
How much embedded memory does the EP2S30F672I4N have?
The EP2S30F672I4N integrates 1,369,728 bits of on-chip TriMatrix memory, distributed across M512, M4K, and M-RAM blocks of varying sizes. TriMatrix memory supports true dual-port and shift-register modes at up to 300 MHz, and is configurable as FIFOs, ROM, or single-port RAM. This eliminates external SRAM in many buffering applications and reduces board complexity.
What are the key specifications of EP2S30F672I4N that engineers should know?
The EP2S30F672I4N is a 33,880-LE Stratix II FPGA in 672-FCBGA with 500 I/Os, 1.37 Mbit embedded RAM, 1,694 LABs, 90 nm process, 1.15-1.25 V core supply, and -40C to +100C industrial temperature range. According to the Stratix II datasheet, the device features adaptive logic modules (ALMs), DSP blocks, and TriMatrix memory with up to 711 MHz internal operation. Lifecycle is obsolete - confirm availability before sourcing.

Data referensi engineering untuk EP2S30F672I4N — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose EP2S30F672I4N when the design requires industrial-grade (-40C to +100C) operation, RoHS lead-free compliance, and Stratix II features (DSP blocks, TriMatrix memory, ALMs) in a 672-FCBGA package. Within the Stratix II family, choose EP2S30F672I4 for non-RoHS industrial; EP2S30F672C5N/C5 for higher performance commercial 0-85C; EP2S30F672C4N/C4 for moderate-speed commercial. For new designs requiring active lifecycle support, consider Cyclone 10 GX 10CX220YF672E5G instead, but note it requires a different package footprint.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EP2S30F672I4 EP2S30F672C5N EP2S30F672C4N
Package 672-BBGA, FCBGA (27x27 mm) 672-BBGA, FCBGA (27x27 mm) - same 672-BBGA, FCBGA (27x27 mm) - same 672-BBGA, FCBGA (27x27 mm) - same
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Logic Elements 33,880 33,880 33,880 33,880
Speed Grade I4 I4 C5 (faster) C4 (faster)
Operating Temperature -40C to +100C (industrial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial)
LABs 1,694 1,694 1,694 1,694
Total RAM Bits 1,369,728 1,369,728 1,369,728 1,369,728
Maximum User I/Os 500 500 500 500
RoHS Status Compliant Compliant (N suffix not marked) Compliant Compliant

Diferensiator Kunci

  • Industrial temperature grade with lead-free manufacturing (vsEP2S30F672C5N)
  • I4 speed grade optimized for low-power industrial operation (vsEP2S30F672C4N)
  • Same Stratix II architecture with Quartus II tool support (vsCyclone II EP2C70F672I8N)

Catatan Desain

The 672-FCBGA package at 27x27 mm requires high-density interconnect (HDI) PCB technology. Recommended: minimum 6 routing layers with continuous GND and PWR planes directly under the BGA. Use 1 oz copper on outer layers and 0.5 oz on inner layers. BGA pad pitch is 1.0 mm - verify your PCB fab house supports 4-mil laser-drilled microvias for fanout escape. Place 0.1uF and 0.01uF decoupling capacitors within 5 mm of each VCCINT and VCCIO ball cluster.

Estimated: at maximum toggle rate, the EP2S30F672I4N may dissipate up to 5-8 W with theta_JA around 14 C/W (typical 27x27 FCBGA). Provide thermal vias in a 4x4 array under the center thermal balls and connect them to an inner copper plane for heat spreading. Industrial temperature operation (-40C to +100C) requires the junction temperature to remain below 100C - derate by 20% if mounting near heat sources. Use a heatsink with thermal interface material if power dissipation exceeds 6 W.

Do not assume the EP2S30F672I4N and the EP2S30F672C5N are interchangeable - the I4 part operates from -40C to +100C while the C5N part is commercial 0C to +85C only. Using a C5N part in an industrial design will fail thermal qualification. Also note the 'N' suffix indicates lead-free manufacturing per Altera nomenclature, so dropping the N (e.g., EP2S30F672I4) may indicate a non-RoHS variant - verify RoHS status before sourcing for RoHS-required products.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Unknown
Mineral Konflik
Compliant

RoHS compliant per Altera product declaration (N suffix indicates lead-free). Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA, not an automotive part. Device is now obsolete - confirm availability before new design starts.

Data disahkan pada: 2026-09-09 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EP2S30F672I4N EP2S30F672I4N datasheet Altera EP2S30F672I4N Stratix II FPGA 672 FBGA EP2S30F672I4N replacement EP2S30F672I4N pinout buy EP2S30F672I4N EP2S30F672I4N vs EP2S30F672C5N 33880 logic elements FPGA industrial obsolete Stratix II replacement FPGA 1.37 Mbit on-chip memory industrial temperature FPGA -40C to 100C

Komponen dan Istilah Terkait

Altera Intel EP2S30F672I4N Stratix II FPGA Field-Programmable Gate Array Programmable Logic Device PLD FCBGA 672-BBGA FineLine BGA Logic Element Logic Array Block LAB ALM Adaptive Logic Module TriMatrix Memory DSP block Quartus II RoHS REACH JEDEC J-STD-020 industrial temperature grade lead-free Qsys
Kutipan Cepat RFQ
Tim penjualan kami akan merespon dalam 24 jam
Nomor PartMfrPkgKwantitasHarga Target
×
✓
Kutipan telah disubmit!

Kami akan membalas email Anda dalam 24 jam

Keranjang Belanja 0 item
Keranjang belanja Anda kosong
Kutipan Cepat RFQ
Isi detail lengkap — tim penjualan kami akan membalas dalam 24 jam
Nomor Part Manufaktur Paket QTY Harga Target Lengkap
✓
Kutipan telah disubmit!

Kami akan membalas email Anda dalam 24 jam

1
RFQ Dikirim
2
Kutipan Diterima
3
Order Ditempatkan
4
Pembayaran
5
Dikirim
6
Dikirim
Lihat Detil RFQ